KR102219183B1 - Heat sink having 3d-radial shape - Google Patents

Abstract

The present invention relates to a heat sink having a 3D-radial shape. In the present invention, the external appearance and the skeleton of the heat sink (10) having a 3D-radial shape are formed by first and second evaporation vessels (100, 200). The first evaporation vessel (100) has a radial shape, has a heating element (H) in contact with a lower portion thereof, and is formed in a direction in which the diameter thereof gradually increases from the lower portion to an upper portion. The second evaporation vessel (200) forms an evaporation chamber (210) in a vacuum state together with the first evaporation vessel (100), and a heat dissipation space (220) is formed therein. An evaporation wick (300) is positioned on a lower inner surface of the first evaporation vessel (100) at a position corresponding to the heating element (H). In addition, a working fluid (W) is accommodated in the evaporation chamber (210) at a predetermined height. When the working fluid (W) is heated by the heating element (H), the heated working fluid (W) is evaporated and moved toward an upper portion of the evaporation chamber (210) by the pressure difference to dissipate heat to the outside of the first and second evaporation vessels (100, 200), and is condensed and moved toward a lower portion of the evaporation chamber (210) along the inner surface of the evaporation chamber (210) in a liquid state. According to the present invention having such a configuration, the effect of increasing heat dissipation and the heat transfer effect of the evaporation vessel itself can be obtained at the same time. In addition, the structure thereof is simple, such that there is an advantage of easy manufacture.

Description

3D radial heat sink {HEAT SINK HAVING 3D-RADIAL SHAPE}

The present invention relates to a three-dimensional radial heat sink, and more specifically, a heating element is in contact with the lower portion, and the cooling is configured to be efficiently performed through a radial evaporation vessel formed in a direction gradually increasing in diameter from the lower to the upper portion. It relates to a three-dimensional radial heat sink.

In general, optical communication components, electrical and electronic components include high-performance semiconductor devices. Since these semiconductor devices are vulnerable to heat, cooling and constant temperature are absolutely necessary.

In particular, it is known that the lifetime of the semiconductor device decreases by 50% or more each time the operating temperature of the semiconductor device is 10°C or more higher than the design temperature. Therefore, the development of various cooling technologies capable of removing high heat flux while keeping the temperature of the semiconductor device low determines the life of the electronic device.

Currently, cooling devices for high-performance semiconductor devices can be classified into air-cooling, performance, heat pipes, and cooling devices using thermoelectric devices, and air-cooled cooling devices have limitations in application to high-heat semiconductor devices because cooling is not uniform. The water cooling type requires a separate device for continuous supply of cooling water, and there is a risk of causing fatal defects in electronic parts when the water inner liquid leaks, and the thermoelectric cooling type has the disadvantage of accompanying an additional cooling device for cooling on one surface. .

In addition, the heat pipe method is used as a cooling device for electronic components and semiconductor devices in various ways, but for cooling of high-heating electronic components due to high integration, it is a problem of the complex heat pipe piping structure and radiated heat. There are no special alternatives other than how to make it.

Therefore, a heat sink that has a simple configuration and can improve the evaporation area is required.

Republic of Korea Utility Model Publication No. 20-0361492 (registered on August 31, 2004)

The present invention was invented to improve the above-described problems, and an object to be solved by the present invention is to provide a three-dimensional radial heat sink that has a simple structure and is configured to improve heat dissipation performance.

The technical problem of the present invention is not limited to those mentioned above, and another technical problem that is not mentioned will be clearly understood by those skilled in the art from the following description.

According to the three-dimensional radial heat sink according to an embodiment of the present invention in order to achieve the above object, the heating element is in contact with the lower, the radial first evaporation container formed in a direction gradually increasing in diameter from the bottom to the top; A second evaporation container that is formed to be spaced apart from the inside of the first evaporation container by a predetermined interval to form an evaporation chamber in a vacuum state together with the first evaporation container, and a heat dissipation space inside the first evaporation container; An evaporation wick positioned on a lower inner surface of the first evaporation container at a position corresponding to the heating element; And a working fluid accommodated in the evaporation chamber at a predetermined height, and when the working fluid is heated by the heating element, the heated working fluid is evaporated and moves toward the top of the evaporation chamber due to a pressure difference. After dissipating heat to the outside of the first evaporation vessel and the second evaporation vessel, it is condensed and moved toward a lower portion of the evaporation chamber along the inner surface of the evaporation chamber in a liquid state.

It is provided on the inner surface of the heat dissipation space, characterized in that it comprises a heat dissipating member that receives heat from the surface of the second evaporation container to emit heat to the outside.

The heat dissipation member has a wire shape, is installed around the inner surface of the heat dissipation space, and the arrangement interval is gradually increased from the top to the bottom of the second evaporation container.

On the other hand, the heat dissipation member may have a pipe shape, and a plurality of radiating members may be disposed radially around the center of the second evaporation container.

A suction fan is rotatably installed above the heat dissipation space.

One side is connected to the upper edge of the first evaporation container, the other side is characterized in that it comprises a connection member connected to the upper edge of the second evaporation container.

The connecting member is characterized in that it is formed integrally with the first evaporation container and the second evaporation container.

One end is connected to a position adjacent to the upper outer surface of the second evaporation container, the other end is characterized in that it comprises a guide column extending toward the evaporation chamber to guide the movement of the condensed working fluid.

The guide pillar is characterized in that it is provided radially around the center of the second evaporation container.

The first evaporation container and the second evaporation container are formed of a metal material.

Details of other embodiments are included in the detailed description and drawings.

According to the three-dimensional radial heat sink according to an embodiment of the present invention, external air is contacted by first and second evaporation vessels formed in a radial shape and evaporating chambers in which evaporation and condensation of the working fluid are repeatedly evaporated and condensed. As the area increases, the heat dissipation increase effect and the heat transfer effect of the evaporation container itself can be obtained at the same time, thereby providing a high-performance heat sink.

In addition, according to the three-dimensional radial heat sink according to an embodiment of the present invention, since the structure is simpler than that of the existing heat pipe, manufacturing is easy, and the volume reduction and weight reduction of the heat sink can be achieved by improving the heat treatment capability. There is also an effect that can be saved.

The effects of the present invention are not limited to the effects mentioned above, and other effects that are not mentioned will be clearly understood by those skilled in the art from the description of the claims.

1 is a perspective view showing the configuration of a three-dimensional radial heat sink according to an embodiment of the present invention.
2 is a cross-sectional view showing the configuration of a three-dimensional radial heat sink according to an embodiment of the present invention.
3 is a plan view showing the configuration of a three-dimensional radial heat sink according to an embodiment of the present invention.
4 is a perspective view showing the configuration of a three-dimensional radial heat sink according to another embodiment of the present invention.
5 is a graph showing temperature according to a measurement position of a three-dimensional radial heat sink according to an embodiment of the present invention.

Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings to the extent that those of ordinary skill in the art can easily implement the present invention.

In describing the embodiments, descriptions of technical contents that are well known in the technical field to which the present invention pertains and are not directly related to the present invention will be omitted. This is to more clearly convey the gist of the present invention by omitting unnecessary description.

For the same reason, some components in the accompanying drawings are exaggerated, omitted, or schematically illustrated. In addition, the size of each component does not fully reflect the actual size. The same reference numerals are assigned to the same or corresponding components in each drawing.

1 is a perspective view showing a configuration of a three-dimensional radial heat sink according to an embodiment of the present invention, and FIG. 2 is a cross-sectional view illustrating a configuration of a three-dimensional radial heat sink according to an embodiment of the present invention.

1 and 2, the three-dimensional radial heat sink 10 is for absorbing heat from a heating element H such as a semiconductor device and releasing it to the outside. In this embodiment, the three-dimensional radial heat sink 10 is formed by the first and second evaporation vessels (100, 200) and a skeleton.

As shown in FIGS. 1 and 3, the first evaporation container 100 is radial, and is formed in a direction in which the diameter gradually increases from the bottom to the top. That is, the first evaporation container 100 is formed in a direction in which the area gradually increases from the bottom to the top when viewed from the front based on FIG. 1. That is, as the external air contact area is configured to gradually increase, the heat dissipation increase effect and the heat transfer effect of the evaporation container itself may be improved.

A heating element (H) is in contact with the lower portion of the first evaporation container 100. The heating element H may be a semiconductor device of an electronic product. Heat generated from the heating element (H) can be quickly removed through the three-dimensional radial heat sink (10).

In this embodiment, as shown in FIG. 2, a heat spreader HS may be provided between the lower portion of the first evaporation container 100 and the heating element H. The heat spread HS is formed of a metal plate. The heat spread HS is to prevent the heat generated from the heating element H from concentrating to one part, and serves to dissipate heat. It also protects semiconductor devices and reduces the generation of electromagnetic waves.

Meanwhile, as shown in FIG. 2, the second evaporation container 200 is formed at a predetermined interval from the inside of the first evaporation container 100. Like the first evaporation vessel 100, the second evaporation vessel 200 is radially formed in a direction in which the diameter gradually increases from the bottom to the top. That is, the second evaporation container 200 is formed in a direction in which the area gradually increases from the bottom to the top when viewed from the front based on FIG. 1. That is, as the external air contact area is configured to gradually increase, the heat dissipation increase effect and the heat transfer effect of the evaporation container itself may be improved.

The second evaporation vessel 200 forms an evaporation chamber 210 in a vacuum state together with the first evaporation vessel 100. That is, the evaporation chamber 210 is formed between the first and second evaporation containers 100 and 200. The evaporation chamber 210 is a portion in which the working fluid W is cooled by repeatedly evaporating and condensing the working fluid W, which will be described below. In this embodiment, the width of the upper portion of the evaporation chamber 210 is preferably 3 mm or more. This is to prevent clogging of the passage through which the vapor moves due to the influence of the surface tension.

A heat dissipation space 220 is formed inside the second evaporation container 200. The heat dissipation space 220 is formed to have one side open toward the top. The heat dissipation space 220 is a part that discharges heat transferred from the surface of the second evaporation container 200 to the outside.

As shown in FIG. 2, a guide pillar 230 may be disposed at a position adjacent to the upper portion of the evaporation chamber 210. In this embodiment, the guide column 230 has one end connected to a position adjacent to the upper outer surface of the second evaporation container 200, and the other end toward the evaporation chamber 210, that is, the first evaporation container It is formed extending toward (100). A plurality of guide pillars 230 may be provided radially around the second evaporation container 200. A plurality of guide pillars 230 may be provided at predetermined intervals toward the lower portion of the evaporation chamber 210.

At this time, the guide pillar 230 is preferably provided so that the working fluid (W) is not immersed. The guide column 230 serves to guide the movement of the condensed liquid working fluid W.

In this embodiment, an injection hole (not shown) may be formed at a lower side of the evaporation chamber 210. The injection port is formed to be open and close. Therefore, the working fluid W can be injected through the injection port.

Meanwhile, as shown in FIGS. 1 to 3, a connection member 240 is provided between an upper edge of the first evaporation container 100 and an upper edge of the second evaporation container 200. One side of the connection member 240 is connected to an upper edge of the first evaporation container 100, and the other side is connected to an upper edge of the second evaporation container 200. In this embodiment, the connection member 240 may be integrally formed with the first evaporation vessel 100 and the second evaporation vessel 200. The connecting member 240 serves to form an evaporation chamber 210 together with the first and second evaporation containers 100 and 200.

As shown in FIG. 2, a working fluid W is accommodated in the evaporation chamber 210 at a predetermined height. The amount of the working fluid W may be filled between 50% and 60% of the volume of the evaporation chamber 210. It is preferably between 40% and 55%. This is to secure a space in which the working fluid W sufficiently evaporates. In this embodiment, it is preferable that the working fluid W is accommodated at a height where the guide column 230 does not reach. The working fluid W may be composed of any one of distilled water, acetone, ethanol, and methanol so that evaporation and condensation can easily occur.

In this embodiment, when the working fluid (W) is distilled water, evaporation begins to occur gradually at 45°C, and in the case of acetone, evaporation begins to occur gradually from 38°C to 40°C. Accordingly, the working fluid W can be selected according to conditions such as the material of the evaporation tube and the degree of vacuum.

Meanwhile, an evaporation wick 300 is provided in the evaporation chamber 210. The evaporation wick 300 may be provided in plurality. In this embodiment, the evaporation wick 300 may be located on the lower inner surface of the first evaporation container 100 at a position corresponding to the heating element H. The evaporation wick 300 may be provided to extend parallel to the heating element H in a horizontal direction.

In the present embodiment, the evaporation wick 300 may have a processed structure having a surface of about 1.0mm in width X 1.0mm in length X 1.0mm in height at regular intervals. The evaporation wick 300 serves to improve the evaporation area of the working fluid W, that is, to promote the generation of bubbles for evaporation. To this end, the evaporation wick 300 is a copper sintered body having a radial structure, a metal fiber sintered body, a metal foam of a metal such as copper or nickel, a metal wire mesh such as felt, or a copper-carbon composite It may be made of a porous material composed of a material or the like. In this embodiment, the evaporation wick 300 may be attached while maintaining the porosity of 70% or more.

In this embodiment, the first evaporation vessel 100, the second evaporation vessel 200, and the connection member 240 may be formed of a metal material. For example, it may be formed of stainless steel. This is because durability and corrosion resistance are excellent.

And in this embodiment, the diameters and lengths of the first evaporation vessel 100 and the second evaporation vessel 200 may be varied according to the size of the heating element H and the heating temperature.

Meanwhile, as shown in FIGS. 1 and 3, a heat dissipation member 400 may be provided on an inner surface of the heat dissipation space 220 of the second evaporation container 200. The heat dissipation member 400 serves to receive heat from the surface of the second evaporation container 200 and release heat to the outside.

In this embodiment, the heat dissipation member 400 has a wire shape and is installed around the inner surface of the heat dissipation space. The heat dissipation member 400 may be made of a metal having high thermal conductivity, for example, copper, aluminum, a copper alloy, or an aluminum alloy.

In this embodiment, it is preferable that the heat dissipation member 400 gradually increases in an arrangement interval from the top to the bottom of the second evaporation container 200. That is, by narrowing the arrangement interval of the heat dissipation member 400 installed on the upper side of the second evaporation container 200, the evaporated working fluid W is rapidly condensed, and the second evaporation container 200 This is to minimize interference by heat dissipation when the working fluid W is heated and evaporated by relatively widening the arrangement interval of the heat dissipating member 400 installed on the lower side.

In this embodiment, the heat dissipation member 400 is formed in a wire shape, but is not limited thereto. For example, the heat dissipation member 400 ′ may be formed in a pipe shape, as shown in FIG. 4. One end of the heat dissipating member 400 ′ may be connected to the inner surface of the heat dissipating space 220 and the other end may be formed to extend toward the center of the heat dissipating space 220. A plurality of radiating members 400 ′ may be disposed radially around the center of the second evaporation container 200. The heat dissipation member 400 ′ may be made of a metal having high thermal conductivity, for example, copper, aluminum, a copper alloy, or an aluminum alloy.

Meanwhile, in FIG. 5, the temperature according to the measurement position of the three-dimensional radial heat sink according to an embodiment of the present invention is shown as a graph.

In this embodiment, the three-dimensional radial heat sink 10 is formed of a stainless steel material. As shown in FIG. 5, the temperature for three points is displayed with the upper surface center of the first and second evaporation vessels 100 and 200, and the upper portion of the second evaporation vessel 200 The surface was observed to be higher than the upper surface of the first evaporation container 100, because condensation proceeds due to the contact of the steam inside the connecting member 240. And since the condensed working fluid (W) flows inside the first evaporation vessel 100, the temperature of the surface of the first evaporation vessel 100 is lower than the upper surface of the second evaporation vessel 200. do.

Meanwhile, although not shown, a heat dissipation fan may be rotatably provided on the upper portion of the two evaporation vessels 200. The heat dissipation fan serves to suck heat emitted from the surfaces of the heat dissipation member 400 and the second evaporation container 200 and rapidly discharge the heat to the outside.

Next, an operation process of the three-dimensional radial heat sink of this embodiment will be described with reference to FIG. 2.

When heat is generated from the heating element H and the working fluid accommodated in the evaporation chamber 210 is heated, the heated working fluid evaporates and rapidly moves upward toward the connecting member 240. At this time, as the working fluid moves upward, heat is discharged to the outside of the first and second evaporation containers 100 and 200.

As the heat is discharged in this way, the working fluid W that has moved toward the connecting member 240 is condensed again to become a liquid state, and along the inner surface of the evaporation chamber 210, toward the bottom surface of the evaporation chamber 210. It moves and returns to its original position. In this case, the condensed working fluid W in a liquid state may move along the guide column 230 and easily return to the original position into the evaporation chamber 210.

In this way, the working fluid W rapidly discharges heat generated from the heating element H to the outside by repeatedly performing the evaporation and condensation processes as described above. In this case, heat may be dissipated more quickly through the heat dissipating member 400 installed in the heat dissipating space 220.

According to the present embodiment configured as described above, the first and second evaporation vessels 100 and 200 are formed in a radial shape and in which evaporation chambers 210 in which evaporation and condensation of the working fluid W are repeatedly evaporated and condensed are formed. As a result of the increase in the external air contact area, there is an effect of simultaneously obtaining a heat dissipation increase effect and a heat transfer effect of the evaporation container itself.

In addition, since the structure is simpler than that of the existing heat pipe, it is easy to manufacture, and it is possible to reduce the volume and weight of the heat sink by improving the heat treatment capability, thereby reducing the cost.

Meanwhile, the present specification and drawings disclose preferred embodiments of the present invention, and although specific terms are used, these are merely used in a general meaning to easily explain the technical content of the present invention and to aid understanding of the present invention. It is not intended to limit the scope of the invention. It is obvious to those of ordinary skill in the art that other modifications based on the technical idea of the present invention can be implemented in addition to the embodiments disclosed herein.

10: 3D radial heatsink
100: first evaporation container
200: second evaporation container 210: evaporation chamber
220: heat dissipation space 230: guide column
240: connecting member
300: evaporation wick
400, 400': heat dissipation member
H: heating element HS: heat spreader
W: working fluid

Claims (10)

A radial first evaporation container formed in a direction in which the heating element is in contact with the lower portion and the diameter gradually increases from the lower portion to the upper portion;
A second evaporation container formed to be spaced apart from the inside of the first evaporation container by a predetermined interval to form an evaporation chamber in a vacuum state together with the first evaporation container, and a heat dissipation space inside the first evaporation container;
An evaporation wick positioned on a lower inner surface of the first evaporation container at a position corresponding to the heating element; And
And a working fluid accommodated at a predetermined height in the evaporation chamber,
When the working fluid is heated by the heating element, the heated working fluid is evaporated and moved toward the upper portion of the evaporation chamber due to a pressure difference to release heat to the outside of the first evaporation container and the second evaporation container, and then condensation. Is moved toward the lower portion of the evaporation chamber along the inner surface of the evaporation chamber in a liquid state,
It is provided on the inner surface of the heat dissipation space, and configured to include a heat dissipation member that receives heat from the surface of the second evaporation container and releases heat to the outside,
The heat dissipation member has a wire shape and is installed around the inner surface of the heat dissipation space, and the arrangement interval gradually increases from the top to the bottom of the second evaporation container,
One end is connected to a position adjacent to the upper outer surface of the second evaporation container, and the other end is formed to extend toward the evaporation chamber and comprises a guide column to guide the movement of the condensed working fluid,
The three-dimensional radial heat sink, characterized in that a plurality of guide pillars are provided at predetermined intervals toward the lower portion of the evaporation chamber.
delete delete delete The method of claim 1,
A three-dimensional radial heat sink, characterized in that a suction fan is rotatably installed above the heat dissipation space.
The method of claim 1,
3D radial heat sink, characterized in that one side is connected to the upper edge of the first evaporation container, and the other side is connected to the upper edge of the second evaporation container.
The method of claim 6,
The connecting member is a three-dimensional radial heat sink, characterized in that formed integrally with the first evaporation vessel and the second evaporation vessel.
delete The method of claim 7,
The guide pillar is a three-dimensional radial heat sink, characterized in that provided radially around the center of the second evaporation container.
The method of claim 1,
The first evaporation vessel and the second evaporation vessel is a three-dimensional radial heat sink, characterized in that formed of a metal material.

Images