KR200361492Y1 - Heat sink applied plate type Heat Pipe - Google Patents

Heat sink applied plate type Heat Pipe Download PDF

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Publication number
KR200361492Y1
KR200361492Y1 KR20-2004-0017021U KR20040017021U KR200361492Y1 KR 200361492 Y1 KR200361492 Y1 KR 200361492Y1 KR 20040017021 U KR20040017021 U KR 20040017021U KR 200361492 Y1 KR200361492 Y1 KR 200361492Y1
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South Korea
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heat
heat transfer
heat pipe
heat sink
pipe
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KR20-2004-0017021U
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Korean (ko)
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장혁
이성봉
최유진
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티티엠주식회사
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427—Cooling by change of state, e.g. use of heat pipes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367—Cooling facilitated by shape of device
    • H01L23/3672—Foil-like cooling fins or heat sinks
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
    • H05K7/20136—Forced ventilation, e.g. by fans
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/20—Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
    • H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Chemical & Material Sciences (AREA)
  • Materials Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)

Abstract

본 고안은 평판형 히트파이프가 결합된 히트싱크에 관한 것으로, 다수개의 평판형 히트파이프가 반도체 칩(100) 등의 발열체로부터 1차적 열전달을 받는 전열블럭(10)과 결합하여 일체형 구조를 가지는 히트싱크에 관한 것이다.The present invention relates to a heat sink in which a flat plate heat pipe is combined, and a plurality of flat plate heat pipes are combined with a heat transfer block 10 receiving primary heat transfer from a heating element such as a semiconductor chip 100 to have an integrated structure. It's about sinking.

본 고안에 의한 히트싱크는 칩(100)등의 발열체로부터 대기로의 열전달에 있어, 열전달 성능이 매우 우수한 히트파이프를 이용하고, 또한 그 히트파이프가 핀역할을 동시에 수행하기 때문에 고성능 히트싱크를 제공할 수 있다.The heat sink according to the present invention uses a heat pipe having excellent heat transfer performance in heat transfer from a heating element such as a chip 100 to the atmosphere, and provides a high performance heat sink since the heat pipe simultaneously performs a fin role. can do.

Description

평판형 히트파이프가 결합된 히트싱크{Heat sink applied plate type Heat Pipe}Heat sink applied plate type Heat Pipe}

본 고안은 반도체 칩 등의 발열체로부터의 열을 흡수하여 대기로 방열하는 히트싱크에 관한 것으로, 보다 구체적으로는 칩(100) 등의 발열체로부터 1차적 열전달을 받는 전열블럭(10) 상면에 접합성과 전열성을 증가하기 위한 슬릿홈(10-1)을 형성하고, 그 형성된 슬릿홈(10-1)에 평판형 히트파이프(20)를 결합한 히트싱크에 관한 것이다.The present invention relates to a heat sink that absorbs heat from a heating element such as a semiconductor chip and dissipates it into the atmosphere. More specifically, the present invention relates to the upper surface of the heat transfer block 10 receiving primary heat transfer from a heating element such as the chip 100. The present invention relates to a heat sink in which a slit groove (10-1) for increasing heat transfer property is formed and a flat plate heat pipe (20) is coupled to the formed slit groove (10-1).

최근 기술의 급격한 발전은 기계장치의 고성능화, 소형화를 가속시키고 있다. 이러한 소형ㆍ고성능 장치에서 주요기능을 담당하는 반도체 칩 등이 고집적화 되면서 단위 부피당 발열량이 증가하는 추세에 있다. 이에 대하여 그 발열량을 소화해 내기 위한 다양한 방열체들이 등장하고 있다.Recent rapid development of technology has accelerated the high performance and miniaturization of machinery. As semiconductor chips, which play a major role in such small and high-performance devices, are becoming highly integrated, the amount of heat generated per unit volume is increasing. On the other hand, various radiators have emerged to extinguish the calorific value.

도1은 종래 방열체 중 가장 기본적인 구조를 나타내었다. 열전도성이 우수한 금속을 사용하며, 전열블럭(200)에 방열 효율을 증가시키기 위한 핀(300,300-1)이 일체로 가공 되거나 브레이징 등의 접합방법으로 성형되어진다. 도1의 (a)는 플레이트(plate)-핀(fin) 형태의 히트싱크이고, (b)는 핀(pin)-핀(fin)형태의 히트싱크이다. 두 형태의 열전달 능력은 강제대류의 유발수단인 팬의 부착형태와 풍량조건에 따라서 각각 우열이 있다. 상기에서 설명한 고전적인 방열체는 칩 등으로부터 증가되고 있는 발열량을 처리하기 위하여 부피가 점점커지고 있으나, 전자장비의 공간 한정과 장비의 컴팩트 디자인 요구에 대응하기에는 한계가 있다. 이러한 것을 극복하기 위하여, 상변화를 통한 열전달 매체인 히트파이프가 등장하였다. 한 예로 동일 부피에서, 히트파이프는 순수구리 비하여 몇십배의 열전달 성능을 얻을 수 있다. 이처럼 고 열처리 능력을 가지므로, 고발열량에 대응하기 위하여 방열체로 적용하는 사례가 꾸준히 증가하고 있는 추세이다.Figure 1 shows the most basic structure of a conventional heat sink. A metal having excellent thermal conductivity is used, and the fins 300 and 300-1 for increasing heat radiation efficiency on the heat transfer block 200 are integrally processed or molded by a bonding method such as brazing. (A) of FIG. 1 is a heat sink in the form of a plate-fin, and (b) is a heat sink in the form of a pin-fin. Both types of heat transfer capacity are superior to each other depending on the fan type and the airflow conditions, which are the means of forced convection. The classical heat sink described above is getting larger in order to deal with the heat generation that is increased from the chip, etc., but there is a limit to meet the space limitation of the electronic equipment and the compact design requirements of the equipment. To overcome this, a heat pipe, a heat transfer medium through phase change, has emerged. For example, at the same volume, heat pipes can achieve tens of times the heat transfer performance of pure copper. As it has a high heat treatment capability, there is a trend of increasing the number of applications as a heat sink to cope with high heat generation.

종래는 전열블럭에 히트파이프를 삽입한 방열구조체가 많이 제안되고 있다.도1 (b)의 핀(pin)-핀(fin)형태를 히트파이프로 응용한 것으로 국내 공개특허 2003-87369에 공보되어 있다.Conventionally, many heat dissipation structures in which heat pipes are inserted into heat transfer blocks have been proposed. A pin-fin form shown in FIG. 1 (b) is applied as a heat pipe and is disclosed in Korean Patent Laid-Open Publication No. 2003-87369. have.

본 고안은 종래 플레이트-핀형 히트싱크의 열전달 성능을 향상시키기 위하여핀(fin)을 일반금속 판재를 사용하는 대신에 판형구조의 히트파이프를 사용하였다.판형 히트파이프를 핀으로 사용하는 히트싱크는 히트파이프 외표면의 핀(fin)역활에 의한 방열증가효과와 히트파이프 자체의 열전달효과라는 두가지 전열효과를 동시에 얻을 수 있어, 고성능 방열체를 제공할 수 있을 것이며, 열처리 능력의 향상으로 방열체의 부피저감과 경량화에도 기여할 수 있다.In order to improve the heat transfer performance of a conventional plate-fin heatsink, the present invention uses a plate-type heat pipe instead of a general metal plate. The heat dissipation effect by the fin role of the outer surface of the pipe and the heat transfer effect of the heat pipe itself can be obtained at the same time, thereby providing a high-performance heat dissipation. It can also contribute to reduction and weight reduction.

도1은 종래의 히트싱크를 나타내는 사시도.1 is a perspective view showing a conventional heat sink.

도2는 본 고안의 평판형 히트파이프가 결합된 히트싱크를 나타내는 사시도.Figure 2 is a perspective view showing a heat sink coupled to the flat heat pipe of the present invention.

도3은 본 고안의 또 다른 바람직한 실시예를 나타내는 히트싱크의 사시도.Figure 3 is a perspective view of a heat sink showing another preferred embodiment of the present invention.

도4는 본 고안의 전열블럭에 결합되는 평판형 히트파이프를 나타내는 사시도.Figure 4 is a perspective view showing a flat heat pipe coupled to the heat transfer block of the present invention.

도5는 종래의 히트파이프 동작원리를 함께 표현한 히트 파이프 내부 단면도.Figure 5 is a cross-sectional view inside the heat pipe representing the conventional principle of heat pipe operation.

상기 목적을 달성하기 위한 본 고안의 대표도를 도2에 나타내었다. 반도체 칩(100) 등의 발열체로에 직접 결합되어 1차적 열전달을 받는 전열블럭(10)의 상면에 평판형 히트파이프(20)가 잘 지지되고 접합을 효과적으로 수행하기 위하여 윗면이 개방되고 적어도 1면 이상을 갖는 슬릿홈(10-1)을 형성시키고 그 슬릿홈으로 다수개의 평판형 히트파이프(20)를 결합시킨 후, 그 결합된 면을 브레이징 등의 방법으로 접합시킨다. 히트파이프 응축부의 열교환을 증가시키고, 강제대류 효과를 유발하기 위한 수단으로 팬(30)이 전열블럭(10)에 접합된 히트파이프(20)군 연직상방에 장착되어진다. 수나사(31)는 팬 모서리 홀을 관통하여 하부로 연장된 후 전열블럭의 네 모서리에 형성되어 있는 암나사(31-1)에 결합한다.히트파이프(20)군의 연직상방에 장착되어지는 팬(30)은 히트싱크 부착 위치나 용도에 따라 상부가 아닌 측면에 장착되어 질 수도 있다.Representative diagram of the present invention for achieving the above object is shown in FIG. The flat plate heat pipe 20 is well supported on the upper surface of the heat transfer block 10 which is directly coupled to a heating element path such as the semiconductor chip 100 and receives the primary heat transfer. After forming the slit grooves 10-1 having the above and joining the plurality of flat heat pipes 20 to the slit grooves, the joined surfaces are joined by a method such as brazing. As a means for increasing the heat exchange of the heat pipe condensation unit and causing a forced convection effect, the fan 30 is mounted above the heat pipe 20 group vertically bonded to the heat transfer block 10. The male screw 31 extends downwardly through the fan corner hole and is coupled to the female screw 31-1 formed at the four corners of the heat transfer block. A fan mounted vertically above the heat pipe 20 group ( 30) may be mounted on the side rather than on the top, depending on the heat sink attachment location or application.

도3는 본 고안의 또 다른 바람직한 실시예를 나타내는 것으로, 전열블럭(10)의 상면에 슬릿홈이 전열블럭(10)의 길이 방향으로 전체가 관통되는 것이 아니라 일정한 크기를 가지고 단락되어 형성되고, 그 슬릿홈(10a-1)으로 평판형 히트파이프(20a)가 결합되어 진다.Figure 3 shows another preferred embodiment of the present invention, the slit groove is formed on the upper surface of the heat transfer block 10 is short-circuited with a constant size rather than penetrating the whole in the longitudinal direction of the heat transfer block 10, The flat heat pipe 20a is coupled to the slit groove 10a-1.

도4은 본 고안에 사용되어지는 평판형 히트파이프를 나타내는 사시도이며, 도5는 히트파이프의 동작원리를 함께 표현하는 히트파이프의 내부 단면도이다.본 고안에 사용되는 평판형 히트파이프는 일정한 두께를 갖는 금속판재 내부에 인발 등의 가공방법으로 다수개의 채널(20-1)을 형성시키고, 그 형성된 채널(20-1)내부에 모세관력을 유발시키기 위한 윅(4)을 형성시키고 채널(20-1)에 증류수 등의 작동유체를 진공 봉입하여 제조한다.Figure 4 is a perspective view showing a flat heat pipe used in the present invention, Figure 5 is an internal cross-sectional view of the heat pipe representing the operating principle of the heat pipe. The flat heat pipe used in the present invention has a constant thickness. A plurality of channels 20-1 are formed in a metal sheet having a metal by a drawing method, and a wick 4 for inducing capillary force is formed in the formed channel 20-1. It is prepared by vacuum sealing a working fluid such as distilled water in 1).

칩(100) 등의 발열체로부터 방출된 열은 전열블럭(10)을 통하여 평판형 히트파이프 증발부(1)로 전달되며, 그 전달된 열에 의하여 채널(20-1)내부의 작동유체가 기체로 상변화 하여 열을 응축부(3)로 이송하고, 이송된 열은 응축부(3)에서 대기로 방출되어 기체상태의 작동유체는 응축된다. 응축된 작동유체는 윅(4)구조에 의한 모세관력에 의하여 다시 증발부로 귀환하게 된다. 이러한 반복적 동작에 의하여 칩(100) 등으로부터 방출되는 열이 대기로 이동하게 된다.Heat emitted from the heating element such as the chip 100 is transferred to the flat heat pipe evaporator 1 through the heat transfer block 10, and the working fluid in the channel 20-1 is converted into gas by the transferred heat. The phase change transfers heat to the condensation unit 3, and the transferred heat is discharged from the condensation unit 3 to the atmosphere so that the working fluid in the gas state is condensed. The condensed working fluid is returned to the evaporation unit again by capillary force by the wick structure 4. By this repetitive operation, heat emitted from the chip 100 is transferred to the atmosphere.

전열블럭(10) 및 평판형 히트파이프는 열전달을 효과적으로 이루어 내기 위하여 열전도성이 우수한 은 또는 은합금, 구리 또는 구리합금, 알루미늄 또는 알루미늄 합금을 사용하며, 전열블럭(10)과 평판형 히트파이프(20)의 접합은 브레이징 등의 접합 기술이 이용된다.The heat transfer block 10 and the flat heat pipe are made of silver or silver alloy, copper or copper alloy, aluminum or aluminum alloy having excellent thermal conductivity in order to effectively achieve heat transfer, and the heat transfer block 10 and the flat heat pipe ( 20) is used for joining techniques such as brazing.

상기에서 설명한 바와 같이, 종래 플레이트-핀형 히트싱크의 열전달 성능을 향상시키기 위하여 핀(fin)을 일반금속 판재 대신에 판형구조의 히트파이프를 사용하여, 히트파이프 외표면의 핀(fin)역활에 의한 방열증가효과와 히트파이프 자체의 열전달효과라는 두가지 전열효과를 동시에 얻을 수 있어, 고성능 방열체를 제공할 수 있을 것이며, 열처리 능력의 향상으로 방열체의 부피저감과 경량화에도 기여할 수 있다.As described above, in order to improve the heat transfer performance of a conventional plate-fin heatsink, fins are used instead of a general metal plate to form a fin of the outer surface of the heat pipe. Two heat transfer effects such as heat dissipation increase effect and heat transfer effect of heat pipe itself can be obtained at the same time, thereby providing a high performance heat dissipation, and improving heat treatment capacity can also contribute to volume reduction and weight reduction of heat dissipation.

Claims (3)

반도체 칩(100) 등의 발열체 외측에 설치되는 히트싱크에 있어서,In a heat sink provided outside the heating element such as the semiconductor chip 100, 상기 발열체와 접촉되는 절열블럭(10)과 그 상면에 일정한 두께를 갖고 내부에 적어도 1개 이상의 채널(20-1)이 형성된 평판형 히트파이프가 적어도 하나 이상 결합되어지는 것을 특징으로 하는 평판형 히트파이프가 결합된 히트싱크.Plate heat, characterized in that the heat blocking block 10 in contact with the heating element and at least one plate heat pipe having a predetermined thickness on the upper surface and the at least one channel 20-1 is formed therein are combined. Heatsink with combined pipes. 제 1항에 있어서, 전열블럭(10) 상면에 윗면이 개방되고 1 면이상을 갖는 홈(10-1)이 적어도 하나 이상 형성된 것을 특징으로 하는 평판형 히트파이프가 결합된 히트싱크.The heat sink of claim 1, wherein at least one groove (10-1) having a top surface is opened and at least one groove is formed on an upper surface of the heat transfer block (10). 제 1항에 있어서, 열전달 촉진 수단인 팬(20)이 히트파이프 연직 상부 또는 측면에 적어도 하나 이상 구비되어지는 것을 특징으로 하는 평판형 히트파이프가 결합된 히트싱크.The heat sink with flat plate heat pipes as claimed in claim 1, wherein at least one fan (20) as a heat transfer promoting means is provided at the top or side of the heat pipe vertical.
KR20-2004-0017021U 2004-06-17 2004-06-17 Heat sink applied plate type Heat Pipe KR200361492Y1 (en)

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102219183B1 (en) 2019-10-25 2021-02-23 충북대학교 산학협력단 Heat sink having 3d-radial shape
KR102219184B1 (en) 2019-10-25 2021-02-23 충북대학교 산학협력단 Heat sink having 3d-circular shape

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102219183B1 (en) 2019-10-25 2021-02-23 충북대학교 산학협력단 Heat sink having 3d-radial shape
KR102219184B1 (en) 2019-10-25 2021-02-23 충북대학교 산학협력단 Heat sink having 3d-circular shape

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