CN1910008A - Manufacture of a heat transfer system - Google Patents

Manufacture of a heat transfer system Download PDF

Info

Publication number
CN1910008A
CN1910008A CNA2004800391546A CN200480039154A CN1910008A CN 1910008 A CN1910008 A CN 1910008A CN A2004800391546 A CNA2004800391546 A CN A2004800391546A CN 200480039154 A CN200480039154 A CN 200480039154A CN 1910008 A CN1910008 A CN 1910008A
Authority
CN
China
Prior art keywords
wall
liquid
core
vapor barrier
evaporimeter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CNA2004800391546A
Other languages
Chinese (zh)
Other versions
CN100457379C (en
Inventor
爱德华·J·克罗里泽科
詹姆斯·S·云
迈克尔·尼基特金
老戴维·A·沃尔夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Northy Grumman Systems Inc
Nuoxi Gruman Innovation System Co ltd
Original Assignee
Swales and Associates Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Swales and Associates Inc filed Critical Swales and Associates Inc
Publication of CN1910008A publication Critical patent/CN1910008A/en
Application granted granted Critical
Publication of CN100457379C publication Critical patent/CN100457379C/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/043Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure forming loops, e.g. capillary pumped loops
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F2275/00Fastening; Joining
    • F28F2275/12Fastening; Joining by methods involving deformation of the elements
    • F28F2275/127Fastening; Joining by methods involving deformation of the elements by shrinking

Landscapes

  • Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Physics & Mathematics (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Heat-Exchange Devices With Radiators And Conduit Assemblies (AREA)
  • Vaporization, Distillation, Condensation, Sublimation, And Cold Traps (AREA)

Abstract

A method of making an evaporator includes orienting a vapor barrier wall, orienting a liquid barrier wall, and positioning a wick between the vapor barrier wall and the liquid barrier wall. The vapor barrier wall is oriented such that a heat-absorbing surface of the vapor barrier wall defines at least a portion of an exterior surface of the evaporator. The exterior surface is configured to receive heat. The liquid barrier wall is oriented adjacent the vapor barrier wall. The liquid barrier wall has a surface configured to confine liquid. A vapor removal channel is defined at an interface between the wick and the vapor barrier wall. A liquid flow channel is defined between the liquid barrier wall and the primary wick.

Description

The manufacturing of heat transfer system
The cross reference of related application
This application requires the priority of the U.S. Provisional Application No.60/514670 of application on October 28th, 2003.This application is that the part of the U. S. application No.10/676265 of application on October 2nd, 2003 continues, and above-mentioned U. S. application No.10/676265 requires the priority of the U. S. application No.60/415424 of application on October 2nd, 2002.This application also is that the part of the U. S. application No.10/694387 of application on October 28th, 2003 continues, and above-mentioned U. S. application No.10/694387 requires the priority of the U.S. Provisional Application No.60/421737 of application on October 28th, 2002.This application also is that the part of the U. S. application No.10/602022 of application on June 24th, 2003 continues, above-mentioned U. S. application No.10/602022 require application on June 24th, 2002 U.S. Provisional Application No.60/391006 priority and be that the part of the U. S. application No.09/896561 of application on June 29 calendar year 2001 continues, above-mentioned U. S. application No.09/896561 requires the priority of the U.S. Provisional Application No.60/215588 of application on June 30th, 2000.All these applications in this combination as a reference.
Technical field
This specification relates to heat transfer system and makes the method for this heat transfer system.
Background technology
Heat transfer system is used for from a position (thermal source) to another position (radiator) transfer of heat.Heat transfer system can be used in land or the earth is used outward.For example, heat transfer system can be combined in zero degree with on the satellite equipment of operating in interior or the low-gravity environment.As another example, heat transfer system can be used in the electronic equipment that often needs cooling in operation.
Loop heat pipe (LHP) and capillary pump loop (CPL) are passive two-phase heat transfer systems.Each includes the evaporimeter that is thermally bonded on the thermal source, the fluid reservoir that is thermally bonded to condenser, the fluid that flows on the radiator and is used for fluid expansion between evaporimeter and condenser.Fluid in heat transfer system can be called working fluid.Evaporimeter comprises main core and comprises the core of fluid flowing passage.The heat that is obtained by evaporimeter is sent to condenser and is discharged by condenser.The capillary pressure that generates in the pore core of these system's utilizations in evaporimeter is so that promote from the evaporimeter to the condenser and the circulation of the working fluid of Returning evaporimeter.Main distinction feature between LHP and CPL is the position of storage loop, and this holder is used for being stored in the too much fluid that operating process is shifted from the loop.Generally, the holder of CPL is placed away from evaporimeter, and the holder of LHP and evaporimeter are placed jointly.
Summary of the invention
A general aspect, the method for making evaporimeter comprises directed vapor barrier wall, directed liquid barrier and locate core between vapor barrier wall and liquid obscures wall.Directed this vapor barrier wall makes the heat absorbing surface of vapor barrier wall limit at least a portion outer surface of evaporimeter.This outer surface is configured to receive heat.Directed liquid barrier is near the vapor barrier wall.This liquid obscures wall has the surface that is configured to confined liquid.At least one is included in the vapour removal of the qualification at the interface passage between core and the vapor barrier wall in directed vapor barrier wall, directed liquid barrier and the location core.At least one is included between liquid obscures wall and the main core and limits liquid flow path in directed vapor barrier wall, directed liquid barrier and the location core.
Embodiment can comprise one or more following aspects.For example, this method also can comprise formation vapor barrier wall and form the liquid obscures wall.Forming the vapor barrier wall can comprise the vapor barrier wall being formed flat shape and forming the liquid obscures wall and can comprise the liquid obscures wall is formed flat shape.Forming the vapor barrier wall can comprise the vapor barrier wall being formed annular shape and forming the liquid obscures wall and can comprise the liquid obscures wall is formed annular shape.
The location core is included in thermal contraction core on the vapor barrier wall.The location core is included in thermal contraction liquid obscures wall on the core.
The location can be included between the liquid limiting surface of vapor barrier wall and liquid obscures wall and locate core.
This method can comprise that the directed cooler that divides is near the liquid obscures wall.The directed cooler that divides can comprise minute cooler thermal contraction to the liquid obscures wall.
This method can comprise that electroetching, machined or photoetch vapour removal passage enter in the vapor barrier wall.This method can comprise vapour removal passage embedding in-core.
It is that matched edges cylindrical and the sealed steam barrier material form the vapor barrier wall that this method also can comprise by rolling vapor barrier material.It is that matched edges cylindrical and the seal fluid barrier material form the liquid obscures wall that this method can comprise by rolling liquid-barrier.
Directed liquid barrier can comprise thermal contraction liquid obscures wall.
This method can comprise formation liquid obscures wall, and the photoetch liquid flow path enters in the liquid obscures wall.
In another general aspect, the method of making evaporimeter comprises that orientation has the liquid obscures wall of annular shape, orientation has the vapor barrier wall of annular shape and locate core between liquid obscures wall and vapor barrier wall with the liquid obscures wall is coaxial, and this core is coaxial with the liquid obscures wall.
Embodiment can comprise one or more following aspects.For example, this method also can comprise formation vapor barrier wall and form the liquid obscures wall.
The location core can be included in thermal contraction core on the vapor barrier wall.The location core can be included in thermal contraction liquid obscures wall on the core.The location can be included between the liquid limiting surface of vapor barrier wall and liquid obscures wall and locate core.
This method can comprise that the directed cooler that divides is near the liquid obscures wall.The directed cooler that divides can comprise minute cooler thermal contraction to the liquid obscures wall.
This method can comprise that electroetching, machined or photoetch vapour removal passage enter in the vapor barrier wall.This method can comprise vapour removal passage embedding in-core.
It is that matched edges cylindrical and the sealed steam barrier material form the vapor barrier wall that this method also can comprise by rolling vapor barrier material.It is that matched edges cylindrical and the seal fluid barrier material form the liquid obscures wall that this method may further include by rolling liquid-barrier.
Directed liquid barrier can comprise thermal contraction liquid obscures wall.
From specification, accompanying drawing and claim, it is obvious that further feature and advantage will become.
Description of drawings
Fig. 1 be heat conveyance system schematic diagram.
Fig. 2 is the figure of the embodiment of the heat conveyance system that schematically shown by Fig. 1.
Fig. 3 is to use the flow chart of operation of the transfer of heat of heat conveyance system.
Fig. 4 is the chart that is illustrated in the temperature profile of the various assemblies of heat conveyance system in the technological process of Fig. 3.
Fig. 5 A is the figure at three port main evaporators shown in the heat conveyance system of Fig. 1.
Fig. 5 B is the cross-sectional view along the main evaporator of the 5B-5B intercepting of Fig. 5 A.
Fig. 6 is the figure that can be incorporated into four port main evaporators of heat conveyance system shown in Figure 1.
Fig. 7 is the schematic diagram of the embodiment of heat conveyance system.
Fig. 8 A, 8B, 9A and 9B are to use the perspective view of the application of heat conveyance system.
Fig. 8 C is the cross-sectional view along the fluid circuit of the 8C-8C intercepting of Fig. 8 A.
Fig. 8 D and 9C are respectively the schematic diagrames of embodiment of the heat conveyance system of Fig. 8 A and 9A.
Figure 10 is the cross-sectional view of plane evaporimeter.
Figure 11 is the axial cross-sectional view of annular evaporator.
Figure 12 is the radial cross-section figure of the annular evaporator of Figure 11.
Figure 13 is the enlarged drawing of a part of radial cross-section figure of the annular evaporator of Figure 12.
Figure 14 A is the perspective view of the annular evaporator of Figure 11.
Figure 14 B is the top and the partial sectional view of the annular evaporator of Figure 14 A.
Figure 14 C is the amplification cross-sectional view of a part of the annular evaporator of Figure 14 B.
Figure 14 D is the cross-sectional view of annular evaporator of Figure 14 B of 14D-14D along the line intercepting.
Figure 14 E and 14F are the enlarged drawings of part of the annular evaporator of Figure 14 D.
Figure 14 G is the perspective cut-away schematic view of the annular evaporator of Figure 14 A.
Figure 14 H is the detailed perspective cut-away schematic view of the annular evaporator of Figure 14 G.
Figure 15 A is the plane detailed view of vapor barrier wall of shell ring assembly that forms the annular evaporator of Figure 14 A.
Figure 15 B is the cross-sectional view of vapor barrier wall of Figure 15 A of 15B-15B along the line intercepting.
Figure 16 A is the perspective view of main core of the annular evaporator of Figure 14 A.
Figure 16 B is the vertical view of the main core of Figure 16 A.
Figure 16 C is the cross-sectional view of main core of Figure 16 B of 16C-16C along the line intercepting.
Figure 16 D is the enlarged drawing of a part of the main core of Figure 16 C.
Figure 17 A is the perspective view of liquid obscures wall of annular ring that forms the annular evaporator of Figure 14 A.
Figure 17 B is the vertical view of the vapor barrier wall of Figure 17 A.
Figure 17 C is the cross-sectional view of vapor barrier wall of Figure 17 B of 17C-17C along the line intercepting.
Figure 17 D is the enlarged drawing of a part of the vapor barrier wall of Figure 17 C.
Figure 18 A is the perspective view of circle that the liquid obscures wall of Figure 17 A is separated from the vapor barrier wall of Figure 15 A.
Figure 18 B is the vertical view of Figure 18 A.
Figure 18 C is the cross-sectional view of circle of Figure 18 B of 18C-18C along the line intercepting.
Figure 18 D is the enlarged drawing of a part of the circle of Figure 18 C.
Figure 19 A is the perspective view of circle of the annular evaporator of Figure 14 A.
Figure 19 B is the vertical view of Figure 19 A.
Figure 19 C is the cross-sectional view of circle of Figure 19 B of 19C-19C along the line intercepting.
Figure 19 D is the enlarged drawing of a part of the circle of Figure 19 C.
Figure 20 is the perspective view that can use the cycling hot exchange system of heat transfer system cooling.
Figure 21 is the cross-sectional view such as the cycling hot exchange system of the cycling hot exchange system of Figure 20.
Figure 22 is the side view such as the cycling hot exchange system of the cycling hot exchange system of Figure 20.
Figure 23 is the schematic diagram of first embodiment that comprises the thermodynamic system of cycling hot exchange system and heat transfer system.
Figure 24 is the schematic diagram of second embodiment that comprises the thermodynamic system of cycling hot exchange system and heat transfer system.
Figure 25 is to use the schematic diagram according to the heat transfer system of the evaporimeter of the principle design of Figure 10-13.
Figure 26 is the Function Decomposition figure of the heat transfer system of Figure 25.
Figure 27 is the detailed view of the partial cross-section of the evaporimeter that uses in the heat transfer system of Figure 25.
Figure 28 is the perspective view of the heat exchanger that uses in the heat transfer system of Figure 25.
Figure 29 is the temperature chart of the surf zone at the interface between the thermal source of heat transfer system and cycling hot exchange system relatively of the thermal source of cycling hot exchange system.
Figure 30 is the top plan view around the heat transfer system of a part of cycling hot exchange system encapsulation.
Figure 31 is around the partial cross-section front view of the heat transfer system of the cycling hot exchange system encapsulation of Figure 30 (31-31 intercepting along the line).
Figure 32 is the partial cross-section front view (in the intercepting of details 3200 places) at the interface between the cycling hot exchange system of heat transfer system and Figure 30.
Figure 33 is the perspective upper view that is installed to the heat transfer system on the cycling hot exchange system.
Figure 34 is the lower perspective view that is installed to the heat transfer system on the cycling hot exchange system of Figure 33.
Figure 35 is the partial cross section view at the interface between the evaporimeter of heat transfer system and cycling hot exchange system, and wherein evaporimeter is clamped on the cycling hot exchange system.
Figure 36 is the side view that is used for evaporimeter is clamped to the anchor clamps on the cycling hot exchange system of Figure 35.
Figure 37 is the partial cross section view at the interface between the evaporimeter of heat transfer system and cycling hot exchange system, and wherein this interface forms by the interference engagement between evaporimeter and cycling hot exchange system.
Figure 38 is the partial cross section view at the interface between the evaporimeter of heat transfer system and cycling hot exchange system, and wherein this interface is by integrally forming evaporimeter with the cycling hot exchange system.
Figure 39 is the top plan view of the condenser of heat transfer system.
Figure 40 is the partial cross section view along the line 40-40 intercepting of the condenser of Figure 39.
Figure 41-the 43rd has the detailed cross sectional view of the condenser of lit-par-lit structure.
Figure 44 is the detailed cross sectional view with condenser of compressional structure.
Figure 45 is that the perspective with condenser of compressional structure reaches cross-sectional view in detail.
Figure 46 is the cross-sectional view around a side of the heat transfer system of cycling hot exchange system encapsulation.
Figure 47 comprises the perspective view of the thermodynamic system of cycling hot exchange system and heat transfer system.
Figure 48 is the schematic diagram of a part of the heat transfer system of Figure 47.
Figure 49 is the perspective view of a part of the heat transfer system of Figure 47.
Figure 50 is the side perspective view of the thermodynamic system of Figure 47.
Figure 51 is the schematic diagram of a part of the thermodynamic system of Figure 47.
Figure 52 is the perspective view of the thermodynamic system of Figure 47.
Figure 53 A is the perspective view of core subassembly, the part of the evaporimeter of the heat transfer system that this core subassembly is Figure 47.
Figure 53 B is the perspective view of a part of the core subassembly of Figure 53 A.
Figure 53 C is the perspective view of liquid obscures wall, the part of the evaporimeter of the heat transfer system that this liquid obscures wall is Figure 47.
Figure 53 D is the perspective view of branch cooler, this minute cooler be the part of evaporimeter of the heat transfer system of Figure 47.
Figure 53 E is the perspective view of evaporimeter of the heat transfer system of Figure 47.
Figure 54 is the flow chart of operation that is used to make the thermodynamic system of Figure 47, comprises the operation of the heat transfer system that is used to make Figure 47.
Figure 55 is the flow chart of operation that is used for the core subassembly of set-up dirgram 53A and 53B.
Figure 56 A-56E is the perspective view that is illustrated in the step in the operation of Figure 55.
Figure 57 is the flow chart of operation that is used for the liquid obscures wall of set-up dirgram 53C.
Figure 58 A-58E is the perspective view that is illustrated in the step in the operation of Figure 57.
Figure 59 is the flow chart of operation of external packet part of evaporimeter that is used to prepare the heat transfer system of Figure 47.
Figure 60 A-60G is the perspective view that is illustrated in the step in the operation of Figure 59.
Figure 61 is the flow chart that is used for operation that the external packet part is combined with the core subassembly of the evaporimeter of the heat transfer system of Figure 47.
Figure 62 A-62E is the perspective view that is illustrated in the step in the operation of Figure 61.
Figure 63 is the flow chart that is used for finishing the operation of the vaporizer body that the operation process at Figure 61 forms.
Figure 64 A is the side cross-sectional view that is illustrated in the vaporizer body of the step in the operation of Figure 63.
Figure 65 is the flow chart that the evaporimeter that is used for finishing in the operation of Figure 63 is attached to the operation on the cycling hot exchange system of Figure 47.
Figure 66 A and 66B are the stereograms that the step in the operation of Figure 65 is shown.
Reference numeral identical in different accompanying drawings is indicated components identical.
The specific embodiment
As mentioned above, in loop heat pipe (LHP), holder and evaporimeter are put together, thereby the pipeline of this holder by similar heat pipe carries out heat with holder and be connected with hydraulic pressure.In this way, can be drawn onto evaporimeter by pump from the liquid of holder, thus the main core of guaranteeing evaporimeter fully wetting or " perfusion " in start-up course.In addition, the design of LHP also reduces in heat transfer system the loss that comes the liquid of flash-pot master core in the stable state of evaporimeter or instantaneous operating process.And the steam of noncondensable gas (NCG bubble) and/or bubble are discharged from the core of evaporimeter by the pipeline of heat pipe shape and are entered in the holder.
Tradition LHP needs liquid to be present in the holder before in startup (also promptly, applying the evaporimeter of power to LHP).Yet if the working fluid in LHP was in supercriticality before LHP starts, liquid will not be present in the holder before starting.Supercriticality is the state that the temperature of wherein LHP is higher than the critical-temperature of working fluid.The critical-temperature of fluid is the maximum temperature that fluid can show liquid-balance of steam.For example, LHP can be in supercriticality, if working fluid is the fluid that cryogen also promptly has the boiling point that is lower than-150 ℃, if perhaps working fluid is the fluid that the fluid that is lower than room temperature also promptly has the boiling point of the environment temperature that is lower than the LHP operation.
Tradition LHP also needs the liquid of Returning evaporimeter cold excessively, also promptly is cooled to the temperature lower than the boiling point of working fluid.This constraint makes it unactual at the temperature operation LHP that is lower than room temperature.For example, if working fluid is a cryogen, LHP may operate in the environment that has greater than the temperature of fluid boiling point.
With reference to Fig. 1, heat conveyance system 100 is designed to overcome the limitation of traditional LHP.Heat conveyance system 100 comprises heat transfer system 105 and filling system 110.This filling system 110 is configured to the fluid in the heat transfer system 105 is converted to liquid, thus perfusion heat transfer system 105.As employed term " fluid " in this specification is generic term, and it refers at the saturation balance state is the material of liquid and steam.
Heat transfer system 105 comprises main evaporator 115 and is attached to condenser 120 on the main evaporator 115 by liquid line 125 and steam pipework 130.Condenser 120 and radiator 165 thermal communications, and main evaporator 115 and thermal source Qin 116 thermal communications.If desired, system 105 also can comprise thermal storage device 147, and this thermal storage device 147 is attached on the steam pipework 130, as extra pressure vessel.Especially, the volume of thermal storage device 147 increase systems 100.When if working fluid is in the above temperature of its critical-temperature (also being the maximum temperature that working fluid can demonstrate liquid-balance of steam), its pressure is the quality (loading) in the system 100 and be inversely proportional to the volume of system in proportion to.The volume that increases thermal storage device 147 reduces stuffing pressure.
Main evaporator 115 comprises the container 117 that holds main core 140, limits core 135 in this main core 140.Main evaporator 115 comprises insertion pipe 142 and second core 145 in core 135.Insert pipe 142, main core 140 and second core 145 and limit fluid passage 143, first steam channel 144 and second steam channel 146.Second core 145 provides control mutually, and also promptly the liquid/vapor in core 135 is separated, and as what tell about in the U. S. application No.09/896561 of application on June 29 calendar year 2001, its full text of this application in this combination as a reference.As shown, main evaporator 115 has three ports, and liquid-inlet 137 enters fluid passage 143, and steam (vapor) outlet 132 comes out to enter steam pipework 130 from second steam channel 146, and fluid issuing 139 comes out from fluid passage 143 (as described below, and may first steam channel 144).The further details of the structure of three port evaporimeters is told about below with respect to Fig. 5 A and 5B.
Filling system 110 comprises the holder 155 that is attached to second on the steam pipework 130 or pours into evaporimeter 150 and put together with second evaporimeter 150.This holder 155 is attached on the core 135 of main evaporator 115 by second fluid circuit 160 and second condenser 122.Second fluid circuit 160 is attached on the fluid issuing 139 of main evaporator 115.Filling system 110 also comprises the controlled thermal source Qsp 151 with second evaporimeter, 150 thermal communications.
Second evaporimeter 150 comprises the container 152 that holds main core 190, limits core 185 in this main core 190.Second evaporimeter 150 comprises and inserts pipe 153 and extend through pipeline 175 and enter second core 180 in the holder 155 from core 185.The capillary that second core 180 is provided between the holder 155 and second evaporimeter 150 connects.Insert that pipe 153, main core 190 and second core 180 limit first steam channel 181 of fluid passage 182 in conjunction with fluid circuit 160, Associative Storage 155 and in conjunction with second steam channel 183 of steam pipework 130.Holder 155 is by fluid passage 182, second core 180 and first steam channel, 181 thermal and the hydraulic pressure core 185 in conjunction with second evaporimeter 150.Cleaned by first steam channel 181 to holder 155 from the steam of the core 185 of second evaporimeter 150 and/or NCG bubble, and condensable liquid returns second evaporimeter 150 by second core 180 from holder 155.Main core 190 will be connected to thermal source Qsp 151 at the liquid hydraulic pressure in the core 185, allow liquid in main core 190 outer surface to evaporate in second steam channel 183 when heat imposes on second evaporimeter 150 and form steam.
Holder 155 is cold biasings, thereby and, it cools off by cooling source, if this cooling source will allow holder 155 not heat at the temperature operation that is lower than heat transfer system 105 operating temperatures.In one embodiment, holder 155 and second condenser 122 and radiator 165 thermal communications that are thermally bonded on the condenser 120.For example, holder 155 can use current divider 170 to be installed on the radiator 165, and this current divider 170 can be made by aluminium or any Heat Conduction Material.In this way, the temperature of holder 155 is followed the tracks of the temperature of condenser 120.
Fig. 2 illustrates the example of the embodiment of heat conveyance system 100.In this embodiment, condenser 120 and 122 is installed on the cryocooler 200 as refrigerator, from condenser 120,122 transfer of heat to radiator 165.In addition, in the embodiment of Fig. 2, pipeline 125,130,160 twines so that reduce the required space of heat conveyance system 100.
Although not shown in Fig. 1 and 2, can be equipped with the temperature sensor that can be used in diagnosis or test purpose such as the element of for example holder 155 and main evaporator 115.
Simultaneously with reference to Fig. 3, system 100 carry out be used for from thermal source Qin 116 transfer of heat and be used to guarantee main evaporator 115 before starting by the wetting operation 300 of liquid.This operation 300 is useful especially when heat transfer system 105 is in supercriticality.Before operation 300 beginnings, system 100 is filled with working fluid, is in the specified pressure that is called " stuffing pressure ".
Originally, holder 155 is for example by holder 155 being installed on the radiator 165 and cold biasing (step 305).Holder 155 can coldly be biased to the temperature below the critical-temperature of working fluid, and this critical-temperature is the maximum temperature that working fluid can show liquid-balance of steam as what tell about.For example, if fluid is the ethane with 33 ℃ of critical-temperatures, holder 155 is cooled to below 33 ℃.Because the temperature of holder 155 drops to below the critical-temperature of working fluid, the holder 155 local liquid condensate that form by working fluid of filling.The main core 190 (step 310) of wetting second core 180 of the formation of liquid and second evaporimeter 150 in holder 155.
Simultaneously, power is imposed on filling system 110, so that improve or the fluid circulation of beginning in heat transfer system 105 by applying heat (step 315) to second evaporimeter 150 from thermal source Qsp151.Because the capillary pressure at the interface between the main core 190 and second steam channel 183 is inhaled by steam pipework 130 and by condenser 120 (step 320) by pump by the steam of second evaporimeter, 150 outputs.When steam arrived condenser 120, it was converted into liquid (step 325).The liquid pump that forms in condenser 120 is drawn onto the main evaporator 115 (step 330) of heat transfer system 105.When main evaporator 115 is in than the higher temperature of the critical-temperature of fluid, enter the liquid evaporation and the cooling main evaporator 115 of main evaporator 115.This process (step 315-330) continues, and causes that main evaporator 115 arrives set point temperatures (step 335), can liquid hold-up and wetted and operate as capillary pump at this some place main evaporator.In one embodiment, this set point temperatures is the temperature that holder 155 has been cooled.In another kind of embodiment, this set point temperatures is the following temperature of critical-temperature of working fluid.In a further embodiment, this set point temperatures is the above temperature of temperature that holder 155 has been cooled.
If arrived set point temperatures (step 335), (step 340) operated by system 100 in holotype, and wherein the heat from the thermal source Qin 116 that is applied to main evaporator 115 is transmitted by heat transfer system 105.Specifically, in holotype, main evaporator 115 produces capillary pump so that promote the circulation of working fluid by heat transfer system 105.Simultaneously, in holotype, the set point temperatures of holder 155 reduces.The speed that heat transfer system 105 cools down in the holotype process depends on the cold biasing of holder 155, because the temperature of main evaporator 115 is closely followed the temperature of holder 155.In addition, although do not need, can use heater further to control or be adjusted at the temperature of holder 155 in the holotype process.And, in holotype, impose on the power reduction of second evaporimeter 150, thereby make heat transfer system 105 drop to the normal running temperature of fluid by thermal source Qsp 151.For example, in holotype, remain on the numerical value of the hot situation that equals or exceeds following qualification from the thermal force of thermal source Qsp 151 to second evaporimeters 150.In one embodiment, from the thermal force of thermal source Qsp remain from thermal source Qin 116 impose on main evaporator 115 thermal force about 5 to 10%.
In this particular example, by determining that having arrived set point temperatures (step 335) triggers holotype.In another kind of embodiment, holotype can be At All Other Times or owing to other triggering begins.For example, holotype can begin afterwards or in the cold biasing of holder (step 305) afterwards in filling system wetting (step 310).
Random time in operating process, heat transfer system 105 can experience following hot situation: such as by the heat conduction that strides across main core 140 with impose on the situation that the parasitic heat of liquid line 125 causes.Two kinds of situations all cause the formation of steam on the hydraulic fluid side of evaporimeter.Specifically, the heat conduction that strides across main core 140 can cause that the liquid in core 135 forms steam bubble, if these steam bubbles are stayed the liquid supply that will grow up and stop up main core 140 in the core 135, thereby causes that main evaporator 115 damages.Parasitic heat (being called " parasitic heat flow gain ") in the input liquid line 125 can cause that the liquid in liquid line 125 forms steam.
Unfavorable impact for the hot situation that reduces as above to tell about, filling system 110 is in power level Qsp 151 operations more than or equal to the summation of this hot situation and parasitic heat flow gain, as mentioned above, for example, filling system can be with the 5-10% operation of the power of heat transfer system 105.Especially, comprise that the fluid of the combination of steam bubble and liquid cleans out core 135, be used to discharge and enter in second fluid circuit 160 of guiding second condenser 122 into.Especially, the steam that forms in core 135 is advanced around insertion pipe 143 and is directly entered fluid issuing port 139.The steam that forms in first steam channel 144 enters in the fluid issuing port 139 by the opening of advancing by second core 145 (if the hole dimension of second core 145 is large enough to hold steam bubble) or the place, end by near second core 145 outlet port 139, and above-mentioned opening provides from first steam channel 144 to the open conduit that exports port 139.Second condenser 122 is condensate in bubble in the fluid and propelling fluid to holder 155, is used for introducing in the heat transfer system 105 again.
Similarly, in order to reduce to be input to the parasitic heat of liquid line 125, second fluid circuit 160 and liquid line 125 can form coaxial configuration, and second fluid circuit 160 is around liquid line 125 and with liquid line 125 and ambient heat insulation.Further tell about this embodiment below with reference to Fig. 8 A and 8B.As the result of this structure, ambient heat can cause that steam bubble forms in second fluid circuit 160, rather than forms in liquid line 125.As tell about, by the capillarity that works at second core, 145 places, fluid flow to second condenser 122 from main evaporator 115.This fluid flows and the low relatively temperature of second condenser 122 causes cleaning by the steam bubble of condenser 122 in second fluid circuit 160, is condensed into liquid and holder 155 is gone in the pump inspiration at condenser 122 place's steam bubbles.
As shown in Figure 4, data from test run are shown.In this embodiment, before temperature 410 started main evaporator 115, the temperature 400 of main evaporator 115 was significantly higher than the temperature 405 of holder 155, the cold set point temperatures (step 305) that is biased to of this holder 155.Because filling system 110 wetted (step 310), power Qsp450 is applied to second evaporimeter 150 (step 315) in the times 452, cause that liquid is pumped in to main evaporator 115 (step 330), the temperature 400 of main evaporator 115 descends up to it till the time 410 arrives the temperature 405 of holder 155.When system 100 when the LHP pattern is operated (step 340), power Qin 460 imposes on main evaporator 115 in the time 462.As shown, low relatively to power input Qin 460 maintenances of main evaporator 115, main evaporator 115 cools down simultaneously.What illustrate respectively simultaneously is the temperature 470 and 475 of second fluid circuit 160 and liquid line 125.After the time 410, temperature 470 and 475 temperature 400 of following the tracks of main evaporator 115.And because the thermal communication between second evaporimeter 150 and holder 155, the temperature 415 of second evaporimeter 150 is closely followed with the temperature 405 of holder 155.
As described, in one embodiment, ethane can be as the fluid in the heat transfer system 105.Although the critical-temperature of ethane is 33 ℃, for reason as described above roughly, this system 100 can start from the supercriticality that system 100 be in 70 ℃ temperature.Because power Qsp is applied to second evaporimeter 150, the temperature of condenser 120 and holder 155 descend fast (between time 452 and 410).The temperature of repairing heater (trim heater) thereby can be used in control holder 155 and condenser 120 arrives-10 ℃.For the supercritical temperature from 70 ℃ starts main evaporator 115, the thermal force of 10W or power input Qsp are applied to second evaporimeter 150.In case perfusion main evaporator 115, the input of power from thermal source Qsp151 to second evaporimeter 150 and be applied to and the power by the finishing heater both all be reduced to the nominal operation temperature that makes that the temperature of system 100 drops to approximately-50 ℃.For example, in the holotype process,, import Qsp to the power of second evaporimeter 150 and can be reduced to about 3W, simultaneously-45 ℃ of operations so that by hot situation (as mentioned above) mitigation 3W loss if the power of 40W input Qin imposes on main evaporator 115.As another example, the temperature 405 that main evaporator 115 can impose on second evaporimeter 150 and holder 155 at the power from about 10W to about 40W input Qin, with 5W is in approximately under-45 ℃ the situation operates.
With reference to Fig. 5 A and 5B, in one embodiment, main evaporator 115 is designed to three port evaporimeters 500 (it is design shown in Figure 1).Generally, in three port evaporimeters 500, liquid influent import 505 enters the core 510 that is limited by main core 540, and flow to cold biasing holder (for example holder 155) from the fluid of core 510 from fluid issuing 512.Fluid and core 510 are contained in the container for example made of aluminum 515.Especially, the fluid that flows into core 510 from liquid-inlet 505 flows through insertion pipe 520, enters the fluid passage 521 that flows through and center on insertion pipe 520.Fluid can flow through second core of being made by core material 530 and ring main 535 525 (for example second core 145 of evaporimeter 115).Core material 530 is from first steam channel, 560 separable ring mains 535, because the power from thermal source Qin116 imposes on evaporimeter 500, liquid from core 510 enters main core 540 and evaporation, formation flows freely and comes out to enter the steam of steam pipework 130 from steam (vapor) outlet 550 along second steam channel 565 that comprises one or more steam grooves 545.The steam bubble that forms in first steam channel 560 of core 510 cleans and enters fluid issuing 512 by first steam channel 560 from core 510.As mentioned above, if the hole dimension of second core 525 is big to being large enough to hold steam bubble, the steam bubble in first steam channel 560 can pass through second core 525.Replacedly, perhaps extraly, the steam bubble in first steam channel 560 can pass through along the opening of second core 525 at second core 525 of any appropriate location formation, so that enter fluid passage 521 or fluid issuing 512.
With reference to Fig. 6, in another kind of embodiment, main evaporator 115 is designed to four port evaporimeters 600, and it is the design of describing in the U. S. application No.09/896561 of application on June 29 calendar year 2001.In brief, and focus on the aspect that is different from three port evaporimeters structure, liquid is by in fluid inlet 605 inflow evaporators 600, by inserting pipe 610 and entering core 615.Liquid in core 615 enters main core 620 and evaporation and forms the steam that flows freely and come out to enter in the steam pipework 130 from steam (vapor) outlet 630 along steam groove 625.Second core 633 in core 615 is separated the liquid in core mutually with steam or bubble (producing when the liquid in core 615 heats) in core.Be loaded with the liquid effluent fluid outlet 640 of the bubble that in the first fluid passage 635 of second core, 633 inside, forms, and steam that in the steam channel 642 between second core 633 and main core 620, forms or bubble outflow steam (vapor) outlet 645.
Also with reference to Fig. 7, heat conveyance system 700 is shown, wherein main evaporator is four port evaporimeters 600.This system 700 comprises one or more heat transfer systems 705 and filling system 710, and this filling system 710 is configured to the fluid in heat transfer system 705 is converted into liquid, so that perfusion heat transfer system 705.Four port evaporimeters 600 are attached on one or more condensers 715 by steam pipework 720 and fluid circuit 725.This filling system 710 comprises hydraulic pressure and is thermally connected to the cold offset memory 730 of pouring on the evaporimeter 735.
The design of heat conveyance system 100 consider to comprise main evaporator 115 from the management of the startup of supercriticality, parasitic heat leakage, stride across the heat transmission of main core 140, the cold biasing of cold holder 155, and at P-V greater than the ambient temperature of the critical-temperature of the working fluid in the heat transfer system 105.Consider that in order to adapt to these designs evaporimeter 115 or 150 main body or container (for example container 515) can be made and main core 140 and/or 190 can be made by the pore core by 6063 aluminium of extruding.In one embodiment, evaporimeter 115 or 150 overall diameter are about 0.625 inch, and the length of this container is about 6 inches.Holder 155 uses aluminium current divider 170 coldly to be biased on the end plate of radiator 165.And heater (for example Cape Town heater) can be installed at the sidepiece place of holder 155.
In one embodiment, steam pipework 130 is by having 3/16 " the smooth walls stainless steel pipe of external diameter (OD) make, and liquid line 125 and second fluid circuit 160 are by having 1/8 " the smooth walls stainless steel pipe of OD make.Pipeline 125,130,160 can be crooked and gold-plated so that reduce the parasitic heat flow gain with the route that crawls.Extraly, pipeline 125,130,160 can be enclosed in the stainless steel case with heater, so that the specific environment of simulation in test process.The stainless steel case can be insulated by multilevel insulator (MLI), so that reduce the heat leakage by the panel of radiator 165.
In one embodiment, the condenser 122 and second fluid circuit 160 are made by the tubing with 0.25 inch OD.This tubing for example uses adhering with epoxy resin to the panel of radiator 165.Each panel of radiator 165 is 8 * 19 inches direct condensation aluminum radiators, and it uses 1/16 inch thick face thin plate.The Cape Town heater can be connected on the panel of radiator 165, near condenser 120 so that prevent the freezing unintentionally of working fluid.In operating process, the temperature sensor such as thermocouple can be used in the temperature of monitoring whole system 100.
Heat conveyance system 100 can realize in any environment that wherein the critical-temperature of the working fluid of heat transfer system 105 is lower than the environment temperature of system's 100 operations.Heat conveyance system 100 can be used in cooling needs subcooled assembly.
With reference to Fig. 8 A-8D, heat conveyance system 100 can be realized in miniaturization cryogenics system 800.In miniaturized system 800, pipeline 125,130,160 is made by flexible material so that allow to save the coil structure 805 in space.This miniaturized system 800 can use the neon fluid-238 ℃ of operations.The defeated Qin 116 of power is about 0.3 to 2.5W.On the sub-cooled source that this miniaturized system 800 is thermally bonded to cryogenic assembly (perhaps needing subcooled thermal source) 816 such as subcolling condenser 810, this subcolling condenser 810 is in conjunction with being used for cooler condenser 120,122.
But when comparing with traditional hot-swap, vibration isolation system, this miniaturized system 800 reduces quality, increases flexible and the hot-swap ability is provided.But traditional hot-swap, vibration isolation system need two flexible conductions to connect (FCL), cryogenic heat switch (CTSW) and conducting rod (CB), and they form loop so that conduct heat to the sub-cooled source from cryogenic assembly.In miniaturized system 800, hot property improves because therefore the quantity of mechanical interface reduce.But the hot situation at the mechanical interface place accounts for the big ratio of thermal enhancement in traditional hot-swap, vibration isolation system.CB and two FCL and the low quality that is used for the coil structure 805 of miniaturized system 800, flexible, thin-walled pipeline are changed.
And this miniaturized system 800 can have the function of the hot transmitting range of wide region, the structure that this allows cooling source (for example subcolling condenser 810) to place away from cryogenic assembly 816.This coil structure 805 has low quality and low surface area, thereby reduces the parasitic heat flow gain by pipeline 125 and 160.The structure of the cooling source 810 in this miniaturized system 800 makes things convenient for the integrated of system 800 and encapsulation, and reduces the vibration on cooling source 810, this particular importance that becomes in application of infrared transducer.In one embodiment, use neon to test this miniaturized system 800, operate at 25-40K.
With reference to Fig. 9 A-9C, heat conveyance system 100 can be realized in can regulating system 1005 installation or that universal joint is housed, main evaporator 115 and a part of pipeline 125,160 and 130 are installed so that in ± 45 ° of scopes, rotate in this system 1005, and a part of pipeline 125,160 and 130 are installed so that in ± 220 ° of scopes, rotate around azimuth axis 1025 around elevation axis 1020.Pipeline 125,160 and 130 is formed by thin-wall pipes, and reels around each rotating shaft.This system 1005 will be on the sub-cooled source that the cryogenic assembly the telescopical sensor of low temperature (perhaps needing subcooled thermal source) 1016 is attached to such as subcolling condenser 1010, and this subcolling condenser 1010 is in conjunction with being used for cooler condenser 120,122.This cooling source 1010 is positioned at static spacecraft 1060, thereby reduces quality at low temperature telescope place.Be used for the demand of power demand control spacecraft 1060 of motor torsional moment, the system 1005 of the rotation of control piper 125,160,130, and improve the pointing accuracy of sensor 1016.Subcolling condenser 1010 and radiator or radiator 165 can move away sensor 1016, reduce the vibration in sensor 1016.In one embodiment, when working fluid was nitrogen, system 1005 was tested at the interior operation of scope of 70-115K.
Heat transfer system 105 can be used in medical application, and perhaps equipment must be cooled to the following application of environment temperature.As another example, heat transfer system 105 can be used for infrared (IR) sensor, and it is operated so that reduce ambient noise at cryogenic temperature.Heat transfer system 105 can be used to cool off vending machine, and it often holds preferred freezing to the article that are lower than environment temperature.This heat transfer system 105 can be used to cool off such as the display of computer or the assembly the hard disk drive, for example laptop computer, handheld computer or desktop computer.This heat transfer system 105 can be used in the one or more assemblies in the transporting equipment cooling such as automobile or the aircraft.
Within the scope of other embodiment claim below.For example, condenser 120 and radiator 165 can be designed to total system, for example radiator.Similarly, second condenser 122 and radiator 165 can be made up of radiator.Radiator 165 can be the subcolling condenser of passive radiator (for example radiator) or positive cooler condenser 120,122.
In another embodiment, use the temperature of heater control holder 155.In further embodiment, use parasitic heat heating holder 155.
In another embodiment, the coaxial circle of insulator forms and is placed between the liquid line 125 and second fluid circuit 160, and it is around the insulator circle.
Evaporator designs
Evaporimeter is the black box in the two-phase heat transfer system.For example, shown in above Fig. 5 A and 5B, evaporimeter 500 comprises and main core 540 contacted vaporizer body or container 515 that this main core 540 is around core 510.This core 510 limits the flow channel of working fluid.Main core 540 is centered on by a plurality of peripheral flow channels or steam groove 545 at its periphery.The at the interface collection steam of passage 545 between core 540 and vaporizer body 515.Passage 545 contacts with the steam (vapor) outlet 550 that is fed into steam pipework, and above-mentioned steam pipework is fed in the condenser so that make the discharge of steam that forms in evaporimeter 115.
Evaporimeter 500 and other above-mentioned evaporimeter often have the cylindrical geometry shape, and also, the core of evaporimeter forms the cylindrical channel that working fluid passes through.The cylindrical geometry shape of evaporimeter is useful on wherein, and heat obtains the cooling application that the surface is a cylinder hollow.Many cooling application need heats transmit and leave the thermal source with plane surface.In these classes were used, evaporimeter can be revised as and comprise that plane conduction saddle is so that coupling has the footprint of the thermal source of plane surface.This design example is as shown in the U.S. Patent No. 6382309.
The convenient thermodynamic restriction with LHP operation (also promptly, entering minimizing of the interior heat leak of holder) of the cylindrical geometry shape of evaporimeter is consistent.The constraint of this LHP operation came from the quantity of cold LHP demand, so that produce normal balancing run.In addition, the cylindrical shape of evaporimeter is relatively easily made, processing, machined and processing.
Yet as after this described, evaporimeter can design has plane form so that be installed to more naturally on the thermal source of plane.
Planar design
With reference to Figure 10, the evaporimeter 1000 that is used for heat transfer system comprises vapor barrier wall 1005, liquid obscures wall 1010, the main core 1015 between the inboard of vapor barrier wall and liquid obscures wall 1010, vapour removal path 10 20 and liquid flow path 1025.
Vapor barrier wall 1005 and main core 1015 intimate contacts.Liquid obscures wall 1010 comprises working fluid on the inboard of liquid obscures wall 1010, make working fluid only along the flows inside of liquid obscures wall 1010.Liquid obscures wall 1010 closed evaporator shells and help tissue and distribution working fluid are by liquid flow path 1025.Vapour removal path 10 20 is located at the evaporating surface 1017 of main core 1015 and the interface between the vapor barrier wall 1005.Liquid flow path 1025 is between liquid obscures wall 1010 and main core 1015.
Vapor barrier wall 1005 obtains the surface as the heat of thermal source.Vapor barrier wall 1005 is made by the heat conducting material of for example sheet metal.Selection is used for the internal pressure that the material of vapor barrier wall 1005 can bear working fluid usually.
Vapour removal path 10 20 is designed to enter main core 1015 and the flowed friction of balance channel 1020 via the heat conduction by vapor barrier wall 1005.Path 10 20 can electroetching, machined or form the surface by any method easily.
Vapour removal path 10 20 is shown in the groove of vapor barrier wall 1005 inboards.Yet the design approach that depends on selection, the vapour removal passage can design and be provided with in several different modes.For example according to other embodiment, vapour removal path 10 20 is made groove or is embedded in the main core 1015 in the outer surface of main core 1015, make them below the surface of main core.The design of selection vapour removal path 10 20 increases the easiness and the convenience of manufacturing, and closely near one or more following criterions.
At first, the hydraulic diameter of vapour removal path 10 20 should be sufficient to handle the vapor stream that produces on the evaporating surface 1017 of main core 1015, and does not have significant pressure to descend.The second, the contact surface between vapor barrier wall 1005 and main core 1015 should maximize, so that effective heat transfer of the evaporating surface from thermal source to main core 1015 is provided.The 3rd, the thickness 1030 of the vapor barrier wall 1005 that contacts with main core 1015 should minimize.Because thickness 1030 increases, the evaporation in the surface of main core 1015 reduces, and the steam by vapour removal path 10 20 transmits and reduces.
Evaporimeter 1000 can be by independent parts assembling.Replacedly, evaporimeter 1000 can be made for single parts in the following way: have between two walls of specific axle on-the-spot sintering master core 1015 so that form passage on the both sides at core.
Main core 1015 provides evaporating surface 1017 and the atimodometer face-pumping from liquid flow path 1025 to main core 1015 is inhaled or supply with working fluid.
The size of main core 1015 and design comprise several considerations.The pyroconductivity of main core 1015 should be hanged down and enough be reduced from evaporating surface 1017 by main core 1015 and to the heat leak of liquid flow path 1025.Heat leak also can be by the linear dimension influence of main core 1015.For this reason, the linear dimension of main core 1015 should suitably be optimized so that reduce heat leak.For example, the increase of the thickness 1019 of main core 1015 can reduce heat leak.Yet the thickness 1019 that increases can increase the flowed friction that flows of 1015 pairs of working fluids of main core.In work LHP design, because the flowed friction of the working fluid that main core 1015 causes can be remarkable, and the appropriate balance of these factors is important.
The power of the working fluid of driving or pump suction heat transfer system is steam and temperature between the hydraulic fluid side or the pressure differential at main core.This pressure differential is supported by main core and it is kept by entering the thermally equilibrated suitable management of working fluid.
Pass through liquid return pipeline and cold a little excessively from the liquid of condenser Returning evaporimeter.Cross the biasing of cold degree by main core heat leak and from around enter heat leak in the holder in the liquid return pipeline.The cold excessively thermal balance of keeping holder of liquid.Yet exist other useful method to keep the thermal balance of holder.
A kind of method is the heat exchange that is organized between holder and the environment.For the evaporimeter with planar design, for example through being usually used in those evaporimeters that use on land, this heat transfer system is included on the holder and/or the heat-exchange fin on the liquid obscures wall 1010 of evaporimeter 1000.Provided cold and reduced stress on the holder of condenser and heat transfer system in the power of free convection on these fins.
The temperature of holder or the temperature difference support performance fluid between the evaporating surface 1017 of holder and main core 1015 are by the circulation of heat transfer system.Some heat transfer systems can need the cold excessively of additional quantity.Even this condenser stops up fully, the amount that needed amount also can produce greater than condenser.
In design evaporimeter 1000, three variablees need management.At first, the tissue of liquid flow path 1025 and design need be determined.The second, discharging from the steam of liquid flow path 1025 needs to consider.The 3rd, evaporimeter 1000 should be designed to guarantee liquid filling liquid flow channel 1025.These three variablees are interrelated, thereby and should be considered and optimize together so that form effective heat transfer system.
As described, importantly obtain appropriate balance between the pump energy-absorbing power of the heat leak of the hydraulic fluid side that enters evaporimeter and main core.This equilibrium process can not be independent of the optimization of the condenser that provided cold and carry out, because allow big more heat leak in the design of evaporimeter, need produce many more cold excessively in condenser.The condenser time is long more, in fluid circuit hydraulic slip big more, this can have the different core material of better pump energy-absorbing power.
In operation, owing to be applied to evaporimeter 1000, enter main core 1015 and evaporation, form along vapour removal path 10 20 free-pouring steam from the liquid of liquid flow path 1025 from the power of thermal source.Provide the liquid that enters evaporimeter 1000 stream by liquid flow path 1025.Liquid flow path 1025 is the enough liquid of main core 1015 supplies, so that change the evaporated liquid on the hydraulic fluid side of main core 1015 in evaporated liquid on the steam side of main core 1015 and replacing.
Evaporimeter 1000 can comprise second core 1040, and it is provided at the management mutually on the hydraulic fluid side of evaporimeter 1000, and is supported in the supply of (as mentioned above) main core 1015 in the critical conduction mode of operation.Second core 1040 forms between liquid flow path 1025 and main core 1015.Second core can be mesh screen (as shown in figure 10), perhaps senior and main line complexity, perhaps plate cored structure.In addition, evaporimeter 1000 can be between the main core 1015 and second core 1040 comprises steam passing away 1045 at the interface.
Heat conduction by main core 1015 can beginning errors present-near liquid flow path 1025 or inside on the hydraulic fluid side of evaporimeter 1000-the evaporation of working fluid.The undesired steam of steam passing away 1045 transmission leaves from core and enters the two-phase holder.
The pore structure of main core 1015 can produce the remarkable flow resistance of liquid.Therefore, importantly optimize quantity, geometry and the design of liquid flow path 1025.The target of this optimization is to support evenly or approaching supply flow uniformly.Supply flows to evaporating surface 1017 and goes.And because the thickness 1019 of main core 1015 reduces, liquid flow path 1025 can be farther spaced apart.
Evaporimeter 1000 can need steam pressure significantly in case in evaporimeter 1000 by specific working fluid operation.Use with working fluid of vapor pressure can cause the several problems aspect the P-V of steam shell.The evaporimeter of wall for example thicken to(for) the traditional scheme of P-V problem is always ineffective.For example in having the plane evaporimeter of remarkable plane domain, the wall very thick temperature difference that makes that becomes increases, and the evaporimeter heat conductivity reduces.In addition, because the biasing of the microcosmic of the wall that P-V causes causes the contact loss between wall and main core.This contact loss influence is by the heat transfer of evaporimeter.And the biasing of the microcosmic of wall is created in the difficulty at the interface between evaporimeter and thermal source and any external refrigeration equipment.
Annular design
With reference to Figure 10-13, annular evaporator 1100 forms by effective rolling plane evaporimeter 1000, winner's core 1015 is entered backward self become ring and form annular shape.Evaporimeter 1100 can be used in the application that thermal source has the cylinder exterior contour, perhaps can be configured as in the application of cylinder at thermal source.Annular shape will be used for the intensity and the curved interface combination that is used for preferably may contacting with cylindrical heat source of the cylinder of P-V.
Evaporimeter 1100 comprises vapor barrier wall 1105, liquid obscures wall 1110, be positioned over main core 1115, vapour removal passage 1120 and liquid flow path 1125 between the inboard of vapor barrier wall 1105 and liquid obscures wall 1110.Liquid obscures wall 1110 is coaxial with main core 1115 and vapor barrier wall 1105.
Vapor barrier wall 1105 is the main core 1115 of contact closely.Liquid obscures wall 1110 is included in the working fluid on the inboard of liquid obscures wall 1110, makes this working fluid only along the flows inside of liquid obscures wall 1110.The shell of these liquid obscures wall 1110 closed evaporimeters and help tissue and distribution working fluid are by liquid flow path 1125.
Vapour removal passage 1120 is located between the evaporating surface 1117 of main core 1115 and the vapor barrier wall 1105 at the interface.Liquid flow path 1125 is between liquid obscures wall 1110 and main core 1115.Vapor barrier wall 1105 obtains steam surperficial and that produce as heat and removes by vapour removal passage 1120 on this surface.
Main core 1115 is filled in the volume between the liquid obscures wall 1110 of vapor barrier wall 1105 and evaporimeter 1100, so that reliably opposite meniscus evaporation is provided.
Evaporimeter 1100 also can be equipped with heat-exchange fin 1150, and these fin 1150 contact liq barriers 1110 are so that cold biasing liquid obscures wall 1110.The liquid that liquid flow path 1125 receives from liquid-inlet 1155, and vapour removal passage 1120 extends to steam (vapor) outlet 1160 and provide steam to steam (vapor) outlet 1160.
Evaporimeter 1100 can be used in the heat transfer system of the annular reservoir 1165 that comprises close main core 1115.This holder 1165 can be by the heat-exchange fin 1150 cold biasings that extend across holder 1165.The cold biasing of holder 1165 allows to utilize whole condenser area, and need not produce cold at the condenser place.The sub-cooled compensation that provides by cold biasing holder 1165 and evaporimeter 1100 enters the parasitic heat leakage in the hydraulic fluid side of evaporimeter 1100 by main core 1115.
Among another embodiment, evaporator designs can be changed and evaporate feature and can be placed on the outer perimeter, and the liquid backout feature can be placed on the interior girth.
The annular shape of evaporimeter 1100 can provide one and a plurality of below with extra advantage.At first, in annular evaporator 1100, the problem of P-V can reduce or eliminate.Secondly, main core 1115 can be at inner sintering, thereby provides more spaces for the steam of main core 1115 and the more somewhat complex design of hydraulic fluid side.
Also with reference to Figure 14 A-H, annular evaporator 1400 is shown has liquid-inlet 1455 and steam (vapor) outlet 1460, this annular evaporator 1400 comprises that vapor barrier wall 1700 (Figure 14 G, 14H and 17A-D, liquid obscures wall 1500 (Figure 14 G, 14H and 17A-17D), is placed on main core 1600 (Figure 14 G, 14H and 16A-D) vapour removal passage 1465 (Figure 14 H, 15A, 15B) and liquid flow path 1505 (Figure 14 H) between the inboard of vapor barrier wall 1700 and liquid obscures wall 1500.This annular evaporator 1400 also comprises the circle 1800 (Figure 14 G and 18A-D) of guaranteeing the interval between vapor barrier wall 1700 and liquid obscures wall 1500 and is provided for liquid obscures wall 1500 and the circle 1900 (Figure 14 G, 14H and 19A-D) at the base position of evaporimeter 1400 of the supporter of main core 1600.Vapor barrier wall 1700, liquid obscures wall 1500, circle 1800, circle 1900 and core 1600 are preferably formed by stainless steel.
The top of evaporimeter 1400 (also promptly at core more than 1600) comprises bulked volume 1470 (Figure 14 H).The liquid flow path 1505 that forms in liquid obscures wall 1500 is supplied with by liquid-inlet 1455.Core 1600 separates liquid flow path 1505 with vapour removal passage 1465, above-mentioned vapour removal passage 1465 is guided steam into by the steam anchor ring 1475 (Figure 14 H) that forms and gone out 1460 in circle 1900.Steam channel 1465 can enter in the surface of vapor barrier wall 1700 in photoetch, as below in greater detail.
Evaporimeter disclosed herein can be with any combination operation of material, size and layout, as long as they comprise as above-mentioned feature.Except the criterion mentioned here without limits; This evaporimeter can be made for arbitrary shape size and material.It is compatible each other and consider that the generation and the life problems of condensable gases are selected working fluid for structural limitations, burn into that only design is limited in suitable material.
Many land are used and LHP can be combined with annular evaporator 1100.The direction of the annular evaporator in gravitational field pre-determines by application characteristic and hot surface shape.
The cycling hot exchange system
The cycling hot exchange system can be configured with one or more heat transfer systems, so that be controlled at the temperature of heat-exchange system location.This cycling hot exchange system can be to use any system of thermodynamic cycle operation, for example cycling hot exchange system, Stirling (Stirling) heat-exchange system (also being known as the Stirling engine) or air-conditioning system.
With reference to Figure 20, Stirling heat-exchange system 2000 is utilized the environmental friendliness and the effective refrigerant cycles of known type.This Stirling heat-exchange system 2000 works by four corresponding operations by guiding working fluid (for example helium); The heat that also is steady temperature is added the thermal exclusion operation of operation, constant volume, the thermal exclusion operation of steady temperature and the heat interpolation operation of constant volume.
This Stirling heat-exchange system 2000 is designed to free-piston Stirling cooler (FPSC), and for example global refrigerating mode M100B (manufacturing company can obtain from whole world cooling, 94N.Columbus Rd., and Athens, Ohio).This FPSC2000 comprises linear motor part 2005, and this linear motor part 2005 is held the linear motor (not shown) that receives AC power input 2010.This FPSC2000 comprises hot receiver 2015, refrigerator 2020 and heat extraction device 2025.This FPSC2000 comprises being attached in linear motor part and divides balance mass 2030 on the main body of the linear motor in 2005, so that be absorbed in the vibration in the FPSC operating process.This FPSC2000 also comprises charging port 2035.This FPSC2000 comprises intraware, for example at shown in the FPSC2100 of Figure 21 those.
This FPSC2100 comprises and is contained in linear motor part 2110 inner linear motors 2105.This linear motor part 2110 is held and at one end is attached on the leaf spring 2120 and is attached to piston 2115 on the displacer 2125 at the other end.This displacer 2125 is attached to expansive space 2130 and the compression stroke 2135 that forms the hot side of cold-peace respectively.Hot receiver 2015 is installed to cold side 2130 and the heat extraction device is installed to hot side 2135.This FPSC2100 also comprises the balance mass 2140 that is attached on the linear motor part 2110, so that be absorbed in the vibration in the FPSC2100 operating process.
Also with reference to Figure 22, in one embodiment, FPSC 2200 comprises heat extraction device of being made by copper sleeve 2205 and the hot receiver of being made by copper sleeve 2210.Heat extraction device 2205 has the external diameter (OD) of about 100mm and the width of about 53mm, provides when operating in 20-70 ℃ temperature range with box lunch 6W/cm can be provided 2The 166cm of flux 2The thermal exclusion surface.Hot receiver 2210 has the OD of about 100mm and the about width of 37mm, and providing in-30-5 ℃ temperature range the time with box lunch to provide 5.2W/cm 2The 115cm of flux 2Hot joining is received the surface.
In brief, FPSC is filled with refrigerant (for example helium) in operation, and front and back are reciprocal by the motion of built-up piston and displacer for this refrigerant.In ideal system, thermal energy is discharged in the environment by the heat extraction device, and refrigerant compresses by piston, and thermal energy extracts and the refrigerant expansion from environment by hot receiver.
With reference to Figure 23, thermodynamic system 2300 comprises the cycling hot exchange system of cycling hot exchange system 2305 (for example system 2000,2100,2200) for example and is thermally bonded to heat transfer system 2310 on the part 2315 of cycling hot exchange system 2305.This cycling hot exchange system 2305 be cylinder and heat transfer system 2310 be configured as a part 2315 around cycling hot exchange system 2305 so that from these part 2315 heat extractions.In this embodiment, this part 2315 is hot sides (also being the heat extraction device) of cycling hot exchange system 2305.Thermodynamic system 2300 also comprises the fan 2320 of the hot side that is positioned at cycling hot exchange system 2305, thereby so that forced air also provides extra convection current cooling to the condenser of heat transfer system 2310.
The cold side 2335 of cycling hot exchange system 2305 (also being hot receiver) is thermally bonded to the CO of thermal siphon 2345 2On the return channel 2340.This thermal siphon 2345 comprises the cold side heat exchanger 2350 that is configured to the air in the heat of cooling mechanical system 2300, and above-mentioned air is compelled to stride across heat exchanger 2350 by fan 2355.Thermal siphon is to be connected to cooling engine (closed-system of) pipe in this case, heat exchanger 2350, above-mentioned cooling engine allows the Natural Circulation and the cooling of liquid in return channel.
With reference to Figure 24, in another embodiment, thermodynamic system 2400 comprises the cycling hot exchange system of cycling hot exchange system 2405 (for example system 2000,2100,2200) for example and is thermally bonded to heat transfer system 2410 on the hot side 2415 of cycling hot exchange system 2405.This thermodynamic system 2400 comprises the heat transfer system 2420 on the cold side 2425 that is thermally bonded to this cycling hot exchange system 2405.This thermodynamic system 2400 also comprises fan 2430,2435.Fan 2430 is positioned at hot side 2415, so that forced air is by the condenser of heat transfer system 2410.Fan 2435 is positioned at cold side 2425, so that forced air is by the condenser of heat transfer system 2420.
With reference to Figure 25, in one embodiment, thermodynamic system 2500 comprises the heat transfer system 2505 on the cycling hot exchange system that is attached to cycling hot exchange system 2510 for example.This heat transfer system 2505 is used for the hot side 2515 of cool cycles heat-exchange system 2510.This heat transfer system 2505 comprises annular evaporator 2520, and it comprises bulked volume (or holder) 2525, be provided at the liquid return pipeline 2530 of the fluid communication between the liquid-inlet of the liquid outlet 2535 of condenser 2540 and evaporimeter 2520.This heat transfer system 2505 also comprises the steam pipework 2545 of the fluid communication between the steam inlet 2550 of the steam (vapor) outlet that is provided at evaporimeter 2520 and condenser 2540.
Condenser 2540 forms and is equipped with heat-exchange fin 2555 or fin piece by smooth walls tubing structure, so that strengthen heat exchange on the outside of tubing.
Evaporimeter 2520 comprises the main core 2560 that is clipped between vapor barrier wall 2565 and the liquid obscures wall 2570 and separates liquid and steam.The heat-exchange fin 2575 cold biasings that liquid obscures wall 2570 forms by the outer surface along wall 2565.Heat-exchange fin 2575 provided cold for the whole liquid side of holder 2525 and evaporimeter 2520.The heat-exchange fin 2575 of evaporimeter 2520 can be designed separately by the heat-exchange fin 2555 of condenser 2540.
Liquid return pipeline 2530 extends into and is positioned at the holder 2525 of main core more than 2560, if any, enter holder 2525 discharging from the steam bubble of liquid return pipeline 2530 and vapour removal passage at the interface of main core 2560 and vapor barrier wall 2565.The exemplary operation fluid that is used for heat transfer system 2505 includes, but is not limited to methyl alcohol, butane, CO 2, propylene and ammonia.
Evaporimeter 2520 is installed on the hot side 2515 of cycling hot exchange system 2510.In one embodiment, this installation is whole, and it is that evaporimeter 2520 is integral parts of cycling hot exchange system 2510.In another kind of embodiment, installation can be a non-integral, and it is that evaporimeter 2520 can be clamped on the outer surface of hot side 2510.Heat transfer system 2505 is by being cooled off by the forced convection radiator that simple fan 2580 provides.Replacedly, heat transfer system 2505 is by nature or ventilating convection cooling.
At first, the liquid of working fluid is collected in the bottom of evaporimeter 2520, liquid return pipeline 2530 and condenser 2540.Core 2560 is moistening because capillary is advocated.As long as apply heat (for example cycling hot exchange system 2510 is opened), main core 2560 begins to produce steam, this steam is advanced by the vapour removal passage of evaporimeter 2520 (being similar to the vapour removal passage 1120 of evaporimeter 1100), the steam (vapor) outlet by evaporimeter 2520 and enter steam pipework 2545.
Steam enters condenser 2540 at the place, top of condenser 2540 then.Condenser 2540 condensed steams are that liquid and this liquid are collected at place, condenser 2540 bottoms.Because this liquid of pressure differential between the bottom of holder 2525 and condenser 2540 is pushed into holder 2525.Enter the liquid flow path of evaporimeter 2520 from the liquid of holder 2525.The liquid flow path of evaporimeter 2520 is configured to the passage 1125 of similar evaporimeter 1100, and suitably sizing and location so that replace for evaporated liquid provides sufficient liquid.The capillary pressure that is produced by main core 2560 enough bears whole LHP pressure and descends and prevent that steam bubble from advancing by main core 2560 towards liquid flow path.
If above-mentioned cold biasing is sufficient to compensate the heat leak of the increase that strides across main core 2560, above-mentioned heat leak causes that by the increase of the surface area of the relative liquid flow path of surface area of the heat exchange surface of ring body then the liquid flow path of evaporimeter 2520 can be changed by simple ring body.
With reference to Figure 26-28, heat transfer system 2600 comprises evaporimeter 2605 that is attached on the cycling hot exchange system 2610 and the bulked volume 2615 that is attached on the evaporimeter 2605.The steam channel of evaporimeter 2605 supplies to steam pipework 2620, and this steam pipework 2620 is supplied with the series of passages 2625 of condenser 2630.Condensed fluid from condenser 2630 is collected in the fluid return passageway 2635.Heat transfer system 2600 also comprises the fin piece 2640 that is thermally bonded on the condenser 2630.
Evaporimeter 2605 comprises vapor barrier wall 2700, liquid obscures wall 2705, the main core 2710 between the inboard of vapor barrier wall 2700 and liquid obscures wall 2705, vapour removal passage 2715 and liquid flow path 2720.Liquid obscures wall 2705 is coaxial with main core 2710 and vapor barrier wall 2700.Liquid flow path 2720 is supplied with by fluid return passageway 2725 and vapour removal passage 2715 is fed into steam (vapor) outlet 2730.
Vapor barrier wall 2700 is the main core 2710 of contact closely.Liquid obscures wall 2705 comprises working fluid on the inboard of liquid obscures wall 2705, make working fluid only along the flows inside of liquid obscures wall 2705.Liquid obscures wall 2705 closed evaporator shells and help tissue and distribution working fluid are by liquid flow path 2720.
In one embodiment, evaporimeter 2605 about 2 " height and bulked volume 2615 about height 1 ".Evaporimeter 2605 and bulked volume 2615 is around having 4 " a part of cycling hot exchange system 2610 of external diameter twines.Steam pipework 2620 has 1/8 " radius.Cycling hot exchange system 2610 comprises about 58 condenser passages 2625, and each condenser passages 2625 has 2 " length and 0.012 " radius, passage 2625 launches to make that the width of condenser 2630 is about 40 ".Fluid return passageway 2725 has 1/16 " radius.Heat exchanger 2800 (it comprises condenser 2630 and fin piece 2640) is about 40 " long and be wound up as in and external rings (referring to Figure 30,33 and 34) so that generation has about 8 " recycle heat exchanger of external diameter.Evaporimeter 2605 has about 1/8 " cross-sectional width 2750, it is limited by evaporimeter barrier 2700 and liquid obscures wall 2705.Vapour removal passage 2715 has about 0.020 " width and about 0.020 " the degree of depth, and be separated from each other about 0.020 " so that per inch produces 25 passages.
As above-mentioned, heat transfer system (for example system 2310) is thermally bonded on the part (for example part 2315) of cycling hot exchange system.Thermal between heat transfer system and this part can be by the method for any appropriate.In one embodiment, if the evaporimeter of heat transfer system is thermally bonded on the hot side of cycling hot exchange system, this evaporimeter can center on and contact this hot side, and can make it possible to produce thermal by the hot lubricating grease compound that applies between hot side and evaporimeter.In another kind of embodiment, if the evaporimeter of heat transfer system is thermally bonded on the hot side of cycling hot exchange system, evaporimeter can by form steam channel directly enter the cycling hot exchange system hot side and with the hot side unitary construction of cycling hot exchange system.
With reference to Figure 30-32, heat transfer system 3000 is around 3005 encapsulation of cycling hot exchange system.This heat transfer system 3000 comprises the condenser 3010 around evaporimeter 3015.The working fluid that has evaporated comes out from evaporimeter 3015 by the steam (vapor) outlet 3020 that is connected on the condenser 3010.This condenser 3010 becomes ring and doubling to enter self at joint 3025 places.
This cycling hot exchange system 3005 is surrounded by evaporimeter 3015 around its thermal exclusion surface 3100.Evaporimeter 3015 closely contacts with thermal exclusion surface 3100.Refrigerating assembly (it is the combination of cycling hot exchange system 3005 and heat transfer system 3000) is installed in the pipe 3205, and fan 3210 is installed in the place, end of pipe 3205, so that forced air is passed through the fin 3030 of condenser 3010 to exhaust passage 3035.
Evaporimeter 3015 has core 3215, and wherein working fluid absorbs heat and covert from liquid to steam from thermal exclusion surface 3100.Heat transfer system 3000 is included in the holder 3220 at the place, top of the evaporimeter 3015 that bulked volume is provided.Simple in order to illustrate, evaporimeter 3015 is illustrated as the simple hacures piece that interior details is not shown in this mode.These interior details are told about in other place of this specification.
The working fluid of evaporation comes out and enters the steam pipework 3040 of condenser 3010 from evaporimeter 3015 by steam (vapor) outlet 3020.Working fluid flows downward from steam pipework 3040, and the passage 3045 by condenser 3010 is to liquid return pipeline 3050.Because working fluid flows through the passage 3045 of condenser 3010, its loses heat is gone by the air of fin 3030 to process between fin, thereby covert from steam to liquid.The air of the fin 3030 by condenser 3010 flows and leaves by exhaust passage 3035.Liquefied working fluid (and some uncooled steam of possibility) is returned port 3055 by liquid and is flowed back into evaporimeter 3015 from liquid return pipeline 3050.
With reference to Figure 33 and 34, heat conveyance system 3300 is around a part of cycling hot exchange system 3302, and this cycling hot exchange system 3302 is centered on by exhaust passage 3305 successively.Heat conveyance system 3300 comprises the evaporimeter 3310 that has around the top of cycling hot exchange system 3302.Steam port 3315 is connected to evaporimeter 3310 on the steam pipework 3312 of condenser 3320.This steam pipework 3312 comprise around evaporimeter 3310 around the perimeter, and be in from doubling on one's body at joint 3325 subsequently, so that form in the opposite direction interior zone around evaporimeter 3310 wraparounds.This heat conveyance system 3300 is also included within the cooling fins 3330 on the condenser 3320.
This heat conveyance system 3300 comprises that also liquid returns port 3400, and it provides the path for the working fluid from the condensation of the liquid line 3405 of condenser 3320, so that Returning evaporimeter 3310.
As above-mentioned, can be according to the interface between the thermal exclusion surface that is implemented in evaporimeter 3310 and cycling hot exchange system 3302 one of in several alternative embodiments.
With reference to Figure 35, in one embodiment, evaporimeter 3500 slides on the thermal exclusion surface 3502 of cycling hot exchange system 3505.Evaporimeter 3500 comprises vapor barrier wall 3510, liquid obscures wall 3515 and is clipped in core 3520 between wall 3510 and 3515.This core 3520 is equipped with steam channel 3525, and liquid flow path 3530 is for concisely forming at liquid obscures wall 3515 places with demonstration form.
Evaporimeter 3500 slides on cycling hot exchange system 3050 and can remain in position by use anchor clamps 3600 (shown in Figure 36).In order to help to conduct heat, heat conduction lubricating grease 3535 is placed between the vapor barrier wall 3510 of cycling hot exchange system 3050 and evaporimeter 3500.In alternative embodiment, steam channel 3525 forms at vapor barrier wall 3510 rather than in core 3520.
With reference to Figure 37, in another kind of embodiment, evaporimeter 3700 is assemblied on the thermal exclusion surface 3702 of cycling hot exchange system 3705 by interference engagement.This evaporimeter 3700 comprises vapor barrier wall 3710, liquid obscures wall 3715 and is clipped in core 3720 between wall 3710 and 3715.Evaporimeter 3700 is sized to the interference engagement that has with the thermal exclusion surface 3702 of cycling hot exchange system 3705.
Heating fumigators 3700 makes its internal diameter expansion so that allow it to slide on the thermal exclusion surface 3702 of not heating.Because evaporimeter 3700 coolings, its contraction is so that be fixed on the cycling hot exchange system 3705 with the interference engagement relation.Because the compactness of assembling does not need heat conduction lubricating grease to improve heat transfer.Core 3720 is equipped with steam channel 3725.In alternative embodiment, steam channel forms at vapor barrier wall 3710 rather than in core 3720.Liquid flow path 3730 is for concisely forming at liquid obscures wall 3715 places with demonstration form.
With reference to Figure 38, in another kind of embodiment, evaporimeter 3800 is assemblied on the thermal exclusion surface 3802 of cycling hot exchange system 3805, and the feature of design whole formation in thermal exclusion surface 3802 now formerly in evaporimeter 3800.Especially, this evaporimeter 3800 and thermal exclusion surface 3802 are configured to black box together.Be revised as on thermal exclusion surface 3802 has steam channel 3825; In this way, this thermal exclusion surface 3802 is as the vapor barrier wall of evaporimeter 3800.
Evaporimeter 3800 comprises core 3820 and the liquid obscures wall 3815 that forms around the thermal exclusion surface 3802 of revising, and this core 3820 and liquid obscures wall 3815 integral body are attached on the thermal exclusion surface 3802 so that form the evaporimeter 3800 of sealing.Liquid flow path 3830 is for concisely describing with demonstration form.In this mode, formation has the mixing circulation heat-exchange system of whole evaporimeter.This unitary construction is compared with clamp structure and interference fit structure the hot property of enhancing is provided, because the thermal resistance between the core of cycling hot exchange system and evaporimeter reduces.
With reference to Figure 29, chart 2900 and 2905 is illustrated in by the maximum temperature on the surface of the described part of the cycling hot exchange system of heat transfer system cooling and the relation between the surface area at the interface between the described part of heat transfer system and the cycling hot exchange system that is cooled.The maximum of maximum temperature indication thermal exclusion.In chart 2900, the interface between described part and heat transfer system is finished by hot lubricating grease compound.In chart 2905, heat transfer system and described part are made integral body.
As shown, under the situation that the air of 300CFM flows, if the interface is hot lubricating grease interface, then the maximum of thermal exclusion will drop on and have heat exchange surface area 2910 (100ft for example 2) maximum heat repel in the surface temperature 2907 (for example 70 ℃).When by directly forming steam channel in the thermal exclusion surface when evaporimeter and described part unitary construction, this thermal exclusion surface will be operated below having the maximum heat repulsion surface temperature at the remarkable hot lubricating grease interface of littler heat exchange surface area.
With reference to Figure 39, condenser 3900 is formed by fin 3905, and fin 3905 is provided at the thermal communication between the steam pipework 3910 of air or environment and condenser 3900.This steam pipework 3910 is attached on the steam (vapor) outlet 3915, and this steam (vapor) outlet 3915 connects the evaporimeter 3920 that is positioned at condenser 3900.
With reference to Figure 40-43, in one embodiment, condenser 3900 is stacked and formed by flow channel, and above-mentioned flow channel extends through the flat board 4000 of condenser 3900 between steam head 3925 and liquid head 3930.Copper is the suitable material that is used to make stacked condenser.The condenser 3900 of this lit-par-lit structure comprises the bottom 4200 of the fluid flowing passage 4205 (shade illustrates) that forms within it, and top layer 4210 is attached on the bottom 4200 so that cover and fluid-encapsulated flow channel 4205.Fluid flowing passage 4205 is designed in bottom 4200 to form and at the ditch of top layer 4210 with lower seal.The ditch that is used for fluid flowing passage 4205 can form by chemical etching, chemical etching, machining or discharge process.
With reference to Figure 44 and 45, in another embodiment, condenser 3900 extruding forms and little flow channel 4400 extends through the flat board 4405 of condenser 3900.Aluminium is the suitable material that is used for this extruding condenser.Extruding microchannel flat board 4405 extends between steam head 4410 and liquid head 4415.And corrugated fin piece 4420 is attached on the both sides of (for example soldering or adhering with epoxy resin) dull and stereotyped 4405.
With reference to Figure 46, be attached to the cross section of a side of the heat transfer system 4600 on the cycling hot exchange system 4605.This view illustrates the relative size of the special compact package that heat transfer system is provided.In this view, be depicted as from phase place 90 degree that come out in order to be easy to illustrate fin 4610.In order to cool off the thermal exclusion surface 4615 of the cycling hot exchange system 4605 with 4 inch diameters, evaporimeter 4620 has 0.25 inch thickness and the radial thickness of condenser is 1.75 inches.This is provided at the overall dimensions that is used to encapsulate (combination of the cycling hot exchange system 4605 of heat transfer system 4600 and 8 inches).
As described, the evaporimeter that uses in heat transfer system is equipped with core.Because core adopts in the evaporimeter inside of heat transfer system, condenser can be placed on any position with respect to evaporimeter and with respect to gravity.For example, condenser can be placed on evaporimeter above (with respect to the gravity pulling), below evaporimeter (with respect to the gravity pulling) or near evaporimeter, thereby equally with evaporimeter experiences identical gravity pulling.
Other embodiment is within the scope of claim subsequently.
Especially, term Stirling engine, the Stirling heat exchange series free-piston Stirling cooler of unifying carries out reference in above several embodiment.Yet feature of describing with respect to those embodiment and principle also can be applied to can be on other engine of changing between mechanical energy and the heat energy.
And feature described above and principle can be applied on any heat engine, and it is the thermodynamic system that can bear circulation, and above-mentioned circulation also promptly finally turns back to the transforming sequence of its original state.If each conversion is reversible in circulation, this circulating and reversible and heat transfer in the opposite direction take place and the amount of finishing the work switch flag.The simplest Reversible Cycle is the Carnot circulation, and it is by two thermal storage device heat-shifts.
Make
With reference to Figure 47, thermodynamic system 4700 comprises the thermal source of cycling hot exchange system 4705 for example and is thermally bonded to heat transfer system 4710 on the part 4715 of cycling hot exchange system 4705.Heat transfer system 4710 designs have annular evaporator 4713, for example annular evaporator 1100 of Figure 11.This evaporimeter 4713 is configured as around the part 4715 of cycling hot exchange system 4705 so that from these part 4715 heat extractions.Thermodynamic system 4700 also comprises fan 4720, this fan 4720 be positioned forced air along the path 5100 (Figure 51) at the condenser of heat transfer system 4710 more than 4712, thereby and provide extra convection current cooling.
Also with reference to Figure 48-51, heat transfer system 4710 comprises entering the liquid line 4800 in the evaporimeter 4713 and supplying with steam from condenser 4712 pump imbibition bodies and enters steam pipework 4805 in the condenser 4712.Telling about above of the operation of heat transfer system provides and no longer repetition here.If desired, heat transfer system 4710 can comprise that also the holder 4810 that is attached on the steam pipework 4805 by port 4812 is used for extra P-V.Especially, holder 4810 increases the volume of heat transfer system 4710, also as mentioned above.
As shown, this cycling hot exchange system 4705 is cylinders.This cycling hot exchange system 4705 comprises cold side 4735 (also being hot receiver) and hot side (also heat extraction device or the part 4715 that is promptly centered on by evaporimeter 4713).
Also with reference to Figure 52, the cold side 4735 of cycling hot exchange system 4705 can be thermally bonded to the return channel 4740 of thermal siphon 4745.This thermal siphon 4745 comprises cold side heat exchanger 4750, it is configured to cool off the air in thermodynamic system 4700, above-mentioned air is compelled to stride across heat exchanger 4750 by thermal siphon fan (not shown in Figure 50 and 52, as still to install near heat exchanger 4750).This thermal siphon fan 5000 is blown into air in the thermal siphon and 5005 (Figure 50) blow out thermal siphon with air along the path along the path.This thermal siphon comprises from return channel 4740 to heat exchanger 4750 steam pipework 5200 and 4740 the liquid line 5205 from heat exchanger 4750 to return channel.Steam in cold side 4735 places heating flows through heat exchanger from pipeline 5200, its condensation herein and by the thermal siphon fan coolling, and the liquid of condensation returns return channel 4740 by pipeline 5205.
Also with reference to Figure 53 A-E, evaporimeter 4713 comprises the core subassembly 5300 that is centered on by outer subassembly with reference to Figure 48.Outer subassembly comprises outer ring or liquid obscures wall 5305 and divides cooler 5310.This minute, cooler 5310 was the fin row that help to disperse from liquid obscures wall 5305 heat.Core subassembly 5300 comprises inner ring or vapor barrier wall 5315, for example the vapor barrier wall 1700 of Figure 14 A-H, 15A, 15B and 17A-D.Core subassembly 5300 also comprises core 5320, for example the core 1600 of Figure 14 G, 14H and 16A-D.Vapor barrier wall 5315 comprises vapour removal passage 5325, for example the passage 1465 of Figure 14 A-H, 15A, 15B and 17A-D.Vapor barrier wall 5315 is centered on by core 5320.
With respect to evaporimeter 1400 as mentioned above, in one embodiment, core 5320 and vapor barrier wall 5315 are made by stainless steel.Before making, core 5320 has about 9.8 micron pore size, about 4.141 inches external diameter, about 3.985 inches internal diameter and about 1.75 inches length.Vapor barrier wall 5315 has for example 186 vapour removal passages 5325, and each passage 5325 forms the semicircle (Figure 53 B) with about 0.025 inch radius.Vapor barrier wall 5315 has about 0.035 inch thickness.
Liquid obscures wall 5305 comprises one or more liquid flow paths 5330, for example the liquid flow path 1505 of the wall 1500 of Figure 14 A-H.Liquid flow path 5330 forms along the inner surface of wall 5305.Liquid obscures wall 5305 also can comprise the cooling bath 5335 that forms along the outer surface of wall 5305, so that cool off for liquid provides extra convection current.Liquid obscures wall 5305 also comprises the fluid port 5340 that is used to receive from the liquid of liquid line 4800.
Liquid obscures wall 5305 can be made and can be had seven liquid flow paths 5330 by stainless steel, and each passage 5330 all has about 0.030 inch radius.Liquid obscures wall 5305 can have about 4.24 inches external diameter, about 4.13 inches internal diameter and about 1.69 inches length before making.
Divide cooler 5310 to comprise around the array of the fin 5345 of inside subject 5350.Fin 5345 and inside subject 5350 comprise be used for steam pipework 4805 open 5355 and be used for the opening 5360 of holder port 4812.Divide cooler 5310 to make by copper or other any suitable heat-transfer metal.Divide cooler 5310 to design and have for example 119 fins.Inside subject 5350 for example can have 4.25 inches external diameter and have 1.57 inches length.
Evaporimeter 4713 also comprises the holder plate 5365 (Figure 53 E) at the edge that is sealed to liquid obscures wall 5305, illustrates in more detail below.This holder plate 5365 and holder 4810 and steam pipework 4805 fluid communication.
With reference to Figure 54, carry out the thermodynamic system 4700 that operation 5400 is used to make Figure 47.At first, prepare core subassembly 5300 (also being vapor barrier wall 5315 and core 5320) (steps 5405).Below, prepare liquid obscures wall 5305 (steps 5410).Prepare outer subassembly (also being liquid obscures wall 5305 and branch cooler 5310) (step 5415) then, and the outer subassembly of preparing is connected so that form vaporizer body (step 5420) with the core subassembly.Below, finish vaporizer body so that form evaporimeter 4713 (step 5425), and evaporimeter 4713 is attached to thermal source (for example, cycling hot exchange system) upward (step 5430).
With reference to Figure 55, carry out operation 5405 and be used to prepare core subassembly 5300.At first, assembling core subassembly 5300 (steps 5500).The assembling of core subassembly 5300 comprises formation vapour removal passage 5325 materials, and this material will form vapor barrier wall 5315 (Figure 15 A and 15B illustrate the material that is used to form vapor barrier wall 5315).For example, vapour removal passage 5325 can enter in the material in photoetch.This photoetch material is rolled into cylindrical form and welds so that form vapor barrier wall 5315 at its edge.Core 5320 is formed by core material, and this core material cuts into appropriate length, rolling and form around vapor barrier wall 5315.Core 5320 mechanical presses so that improve in the cooperation between core 5320 and the vapor barrier wall 5315 and reduce space between core 5320 and wall 5315, thereby improve the heat transfer between core 5320 and vapor barrier wall 5315 on vapor barrier wall 5315.Below, core welds so that form complete cylindrical form at its seam place.
In another embodiment, core 5320 also can be lower than as the temperature below the fusing point of the material of core 5320 and wall 5315, by heating core 5320 and wall 5315, sintering on vapor barrier wall 5315.In this heating process, pressure can be applied on core 5320 and the wall 5315, so that help to form sinter bonded.Sintering can be used in the heat transfer of further raising between core 5320 and vapor barrier wall 5315.
In assembling core subassembly 5300 (steps 5500) afterwards, the core subassembly carries out thermal contraction, so that guarantee that it is round as required, so that suitably combine with outer subassembly in step 5420.At first in the thermal contraction process, heating core subassembly 5300 (step 5505).In one embodiment, subassembly 5300 is placed on subassembly is heated in 460 ℃ ± 15 ℃ the stove 5600 (shown in Figure 56 A and B).Below, also shown in Figure 56 A, temperature controll block 5605 is cooled to the temperature (step 5510) of its external diameter less than the internal diameter of the subassembly 5300 of heating.This temperature controll block 5605 can be used cooled with liquid nitrogen.Also with reference to Figure 56 C and D, the temperature controll block 5605 of cooling is inserted the core subassembly 5300 interior (step 5515) of heating.Below, shown in Figure 56 E, when inserting controll block 5605 (step 5515), heat is removed from temperature controll block 5605 from 5300 removals of core subassembly and cooling, thereby allows the temperature stabilization (step 5520) of core subassembly 5300.After the temperature stabilization of core subassembly 5300 (step 5520), check this core subassembly 5300 so that guarantee the external diameter of this core subassembly 5300 and the same circle (step 5525) that needs.
With reference to Figure 57, carry out operation 5410 and be used to prepare liquid obscures wall 5305.At first, by rolling stock and form liquid obscures wall 5305 (step 5700) at seam place welding material to form approximately cylindrical shape (Figure 53 C) subsequently.Then, the surperficial within it glazing etching of the material after the welding in case form liquid flow path 5330 and on its outer surface photoetch so that form cooling bath 5335 (Figure 53 C).
Liquid obscures wall 5305 thermal contractions that are shaped are so that guarantee that it is round as required, so as outside step 5415 suitably to be prepared subassembly.At first in the thermal contraction process, heating liquid barrier 5305 (step 5705).In one embodiment, liquid obscures wall 5305 is placed on wall 5305 is heated in 460 ℃ ± 15 ℃ the stove 5800 (shown in Figure 58 A and B).Below, also shown in Figure 58 A, temperature controll block 5805 is cooled to the temperature (step 5710) of its external diameter less than the internal diameter of vapor barrier wall 5305.This temperature controll block 5805 can be used cooled with liquid nitrogen.Also with reference to Figure 58 C and D, the temperature controll block 5605 of cooling is inserted in the heated liquid barrier 5305 (step 5715).Below, shown in Figure 58 E, when inserting controll block 5805, heat is removed from temperature controll block 5805 from 5305 removals of liquid obscures wall and cooling, thereby allows the temperature stabilization (step 5720) of liquid obscures wall 5305.After the temperature stabilization of liquid obscures wall 5305, check this liquid obscures wall 5305 so that guarantee the external diameter of wall 5305 and the same circle (step 5725) that needs.
With reference to Figure 59, carry out operation 5415 and be used to prepare outer subassembly, also be liquid obscures wall 5305 and branch cooler 5310.At first, heating divides cooler 5310 (step 5900).In one embodiment, dividing cooler 5310 to be placed on is heated to minute cooler 5310 in 235 ℃ ± 15 ℃ the stove 6000 (shown in Figure 60 A and B).Below, also shown in Figure 60 A and B, temperature controll block 5805 and the liquid obscures wall 5305 that is thermally bonded on the piece 5805 are cooled to the temperature (step 5905) of the external diameter of wall 5305 less than the internal diameter of minute cooler 5310.For example, this liquid obscures wall 5305 can be cooled to approximately below-120 ℃.This temperature controll block 5805 can be used cooled with liquid nitrogen.Also with reference to Figure 60 C, the temperature controll block 5805 of cooling and liquid obscures wall 5305 insert in the branch cooler 5310 that heats so that form outer subassembly 6001 (step 5910).Below, shown in Figure 60 D, when inserting controll block 5805 (step 5910), heat is removed from temperature controll block 5805 from 5310 removals of minute cooler and cooling, thereby allows the temperature stabilization (step 5915) of outer subassembly 6001.After the temperature stabilization of subassembly 6001 (step 5915), temperature controll block 5805 is removed (step 5920) from liquid obscures wall 5305, shown in Figure 60 E outside.
Below, also with reference to Figure 60 F and G, different parts are assembled to outer subassembly 6001 (step 5925).At first, shown in Figure 60 F, holder plate 6005 is installed on the liquid obscures wall 5305 and the close cooler 5310 that divides.Can be by plate 6005 being welded on the wall 5305 so that form weld seam 6010 installing plate 6005.The second, shown in Figure 60 G, liquid line 4800 for example arrives liquid obscures wall 5305 by welded seal.After assembling is finished, check that outer subassembly is round as needs with the internal diameter of guaranteeing seal-weld and wall 5305 with all welding points so that in the back in the processing with core subassembly cooperatively interact (step 5930).
With reference to Figure 61, carry out operation 5420 and be used for outer subassembly 6001 is combined so that form vaporizer body with the core subassembly.Generally, in this process, the thermal contraction on core subassembly 5300 of outer subassembly 6001 is so that guarantee the suitable combination of each part.At first, heating outer subassembly 6001 (step 6100).In one embodiment, outer subassembly 6001 is placed on outer subassembly 6001 is heated in 350 ℃ ± 10 ℃ the stove 6200 (shown in Figure 62 A).Below, also shown in Figure 62 B, temperature controll block 5605 is cooled to the temperature (step 6105) of the external diameter of core subassembly 5300 less than the internal diameter of the outer subassembly 6001 of heating.This temperature controll block 5605 can be used cooled with liquid nitrogen.Also with reference to Figure 62 C and D, the temperature controll block 5605 of cooling and core subassembly 5300 insert in the outer subassembly 6001 of heating, so that form vaporizer body 6101 (step 6110).Below, shown in Figure 62 D, when inserting controll block 5605 and core subassembly 5300, heat is removed from temperature controll block 5605 from outer subassembly 6001 removals and cooling, thereby allows the temperature stabilization (step 6115) of vaporizer body 6101.With reference to Figure 62 E, after the temperature of vaporizer body 6101 is stable, can check that this vaporizer body 6101 processes successfully so that guarantee thermal contraction.
With reference to Figure 63, carry out operation 5425 and be used to finish vaporizer body 6101, thereby form evaporimeter 4713.With reference to Figure 49 and 64, different parts are assembled on the vaporizer body 6101 (step 6300) now.For example, volume plate 6400 is pinned on the liquid obscures wall 5305, and core 5320 and pipe are welded on holder plate 6005 and the volume plate 6400.Holder 4810 is welded on the holder plate 6005 and vapor barrier plate 6405 is welded on holder plate 6005 and the core subassembly 5300.Cap 6410 and 6415 is placed on respectively on volume plate 6400 and the vapor barrier plate 6405.Below, inspection and test evaporator main body 6101 (step 6305) and extra subsequently parts are installed on the vaporizer body 6101 (step 6310).For example, steam pipework 4805 is welded on the cap 6410, and since in welding process possible bending and as the required work hat 6410 that adds.Cap 6410 is welded on volume plate 6400 and the vapor barrier wall 5315, and cap 6415 is welded on holder plate 6005 and the vapor barrier wall 5315.Below, be vaporizer body 6101 leak checks (step 635).
With reference to Figure 65, carry out operation 5430 and be used for evaporimeter 4713 is attached to thermal source or cycling hot exchange system 4705.At first, as the external diameter (step 6500) of required processing thermal source, will on thermal source, cooperate so that guarantee evaporimeter 4713.Below, also with reference to Figure 66 A and B, by being welded to steam and liquid line on the vaporizer body and using suitable alignment that evaporimeter 4713 is alignd with system 4705 subsequently and prepare evaporimeter 4713 (step 6505).
Then, evaporimeter 4713 thermal contraction in system 4705 is so that guarantee the suitable combination of each part.At first, heating fumigators 4713 (step 6510).In one embodiment, evaporimeter 4713 is placed on evaporimeter 4713 is heated in about 375 ℃ stove 6600 (shown in Figure 66 A and B).Below, system 4705 and especially hot junction 4715 external diameter that is cooled to hot junction 4715 less than the temperature (step 6515) of the internal diameter of the evaporimeter 4713 of heating.This system 4705 can use cooled with liquid nitrogen.The system 4705 of cooling inserts the evaporimeter 4713 interior (step 6520) of heating.When inserting the system 4705 of cooling, heat is removed from system 4705 from evaporimeter 4713 removals and cooling, thereby allows the temperature stabilization (step 6525) of evaporimeter 4713 and system 4705.
Also with reference to Figure 47, after temperature is stable (step 6525), the removal from alignment and stove are provided with of evaporimeter 4713 and system 4705, and assemble heat transfer system 4710 (step 6530).For example, liquid line 4800 and steam pipework 4805 are connected to condenser 4712.Heat transfer system 4710 and cycling hot exchange system 4705 are installed in the housing 5090 then, shown in Figure 50 and 52 (step 6535).
Other embodiment is within the scope of claim subsequently.For example, core subassembly 5300 can assemble in step 5500 by thermal contraction core 5320 on vapor barrier wall 5315.In this embodiment, core 5320 is formed by core material, this core material be cut into appropriate length, rolling for cylindrical form and subsequently in its matched edges welding so that form cylinder.Cylindrical core 5320 is heated then and is placed on the vapor barrier wall 5315.After cylindrical core 5320 coolings, between core 5320 and vapor barrier wall 5315, form hot interface.At this some place, can use sintering further to improve heat transfer between core 5320 and vapor barrier wall 5315 then.
The parts of core subassembly and outer subassembly can be made by other material, as long as can obtain thermo-contact by these other materials.For example, divide cooler 5310 to make or liquid obscures wall 5305 and vapor barrier wall 5315 can be made of copper by stainless steel.
Heat can be removed from controll block 5605 from 5300 removals of core subassembly and cooling before inserting controll block 5605.Equally, heat can be removed from controll block 5805 from 5305 removals of liquid obscures wall and cooling before controll block 5805 is inserted liquid obscures wall 5305.Similarly, before the subassembly 6001, heat can be removed and cool off from outer subassembly 6001 can be from 5605 removals of temperature controll block outside inserting controll block 5605 and 5300 insertions of core subassembly.At last, before system 4705 inserted the evaporimeter 4713 of heating, heat can be removed and cool off from evaporimeter 4713 can be from system's 4705 removals.

Claims (31)

1. method of making evaporimeter, this method comprises:
Directed vapor barrier wall makes the heat absorbing surface of vapor barrier wall limit at least a portion outer surface of evaporimeter, and this outer surface is configured to receive heat;
Directed liquid barrier is near the vapor barrier wall, and wherein the liquid obscures wall has the surface that is configured to confined liquid;
Between vapor barrier wall and liquid obscures wall, locate core;
Wherein, at least one is included in the vapour removal of the qualification at the interface passage between core and the vapor barrier wall in directed vapor barrier wall, directed liquid barrier and the location core; And
Wherein, at least one is included between liquid obscures wall and the main core and limits liquid flow path in directed vapor barrier wall, directed liquid barrier and the location core.
2. the method for claim 1 further comprises forming the vapor barrier wall and forming the liquid obscures wall.
3. method as claimed in claim 2 wherein forms the vapor barrier wall and comprises the vapor barrier wall is formed flat shape, and forms the liquid obscures wall and comprise the liquid obscures wall is formed flat shape.
4. method as claimed in claim 2 wherein forms the vapor barrier wall and comprises the vapor barrier wall is formed annular shape, and forms the liquid obscures wall and comprise the liquid obscures wall is formed annular shape.
5. method as claimed in claim 4 is wherein located core and is included in thermal contraction core on the vapor barrier wall.
6. method as claimed in claim 4 is wherein located core and is included in thermal contraction liquid obscures wall on the core.
7. the method for claim 1 is wherein located between the liquid limiting surface that is included in vapor barrier wall and liquid obscures wall and is located core.
8. the method for claim 1 comprises that further the directed cooler that divides is near the liquid obscures wall.
9. method as claimed in claim 8, wherein directed branch cooler comprises minute cooler thermal contraction to the liquid obscures wall.
10. the method for claim 1 further comprises:
Form the vapor barrier wall, and
Electroetching vapour removal passage enters in the vapor barrier wall.
11. the method for claim 1 further comprises:
Form the vapor barrier wall, and
Machined vapour removal passage enters in the vapor barrier wall.
12. the method for claim 1 further comprises the vapour removal passage is embedded in-core.
13. the method for claim 1 further comprises:
Form the vapor barrier wall, and
Photoetch vapour removal passage enters in the vapor barrier wall.
14. the method for claim 1 further comprises by rolling vapor barrier material being that matched edges cylindrical and the sealed steam barrier material form the vapor barrier wall.
15. the method for claim 1 further comprises by rolling liquid-barrier being that matched edges cylindrical and the seal fluid barrier material form the liquid obscures wall.
16. the method for claim 1, wherein directed liquid barrier comprises thermal contraction liquid obscures wall.
17. the method for claim 1 further comprises:
Form the liquid obscures wall, and
The photoetch liquid flow path enters in the liquid obscures wall.
18. a method of making evaporimeter, this method comprises:
Orientation has the liquid obscures wall of annular shape;
Directed coaxial, as to have annular shape vapor barrier wall with the liquid obscures wall; And
Locate core between liquid obscures wall and vapor barrier wall, this core is coaxial with the liquid obscures wall.
19. method as claimed in claim 18 further comprises forming the vapor barrier wall and forming the liquid obscures wall.
20. method as claimed in claim 18 is wherein located core and is included in thermal contraction core on the vapor barrier wall.
21. method as claimed in claim 18 is wherein located core and is included in thermal contraction liquid obscures wall on the core.
22. method as claimed in claim 18 is wherein located between the liquid limiting surface that is included in vapor barrier wall and liquid obscures wall and is located core.
23. method as claimed in claim 18 comprises that further the directed cooler that divides is near the liquid obscures wall.
24. method as claimed in claim 23, wherein directed branch cooler comprises minute cooler thermal contraction to the liquid obscures wall.
25. method as claimed in claim 18 further comprises:
Form the vapor barrier wall, and
Electroetching vapour removal passage enters in the vapor barrier wall.
26. method as claimed in claim 18 further comprises:
Form the vapor barrier wall, and
Machined vapour removal passage enters in the vapor barrier wall.
27. method as claimed in claim 18 further comprises the vapour removal passage is embedded in-core.
28. method as claimed in claim 18 further comprises:
Form the vapor barrier wall, and
Photoetch vapour removal passage enters in the vapor barrier wall.
29. method as claimed in claim 18 further comprises by rolling vapor barrier material being that matched edges cylindrical and the sealed steam barrier material form the vapor barrier wall.
30. method as claimed in claim 18 further comprises by rolling liquid-barrier being that matched edges cylindrical and the seal fluid barrier material form the liquid obscures wall.
31. method as claimed in claim 18, wherein directed liquid barrier comprises thermal contraction liquid obscures wall.
CNB2004800391546A 2003-10-28 2004-10-28 Manufacture of a heat transfer system Active CN100457379C (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US51467003P 2003-10-28 2003-10-28
US60/514,670 2003-10-28

Publications (2)

Publication Number Publication Date
CN1910008A true CN1910008A (en) 2007-02-07
CN100457379C CN100457379C (en) 2009-02-04

Family

ID=34549344

Family Applications (1)

Application Number Title Priority Date Filing Date
CNB2004800391546A Active CN100457379C (en) 2003-10-28 2004-10-28 Manufacture of a heat transfer system

Country Status (7)

Country Link
EP (1) EP1682309B1 (en)
JP (1) JP5060785B2 (en)
CN (1) CN100457379C (en)
AU (1) AU2004286255B2 (en)
BR (1) BRPI0416000B1 (en)
MX (1) MXPA06004692A (en)
WO (1) WO2005043059A2 (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102466379A (en) * 2010-11-12 2012-05-23 杨泰和 Temperature regulation system with hybrid refrigerant supply and regulation
CN107677155A (en) * 2017-11-03 2018-02-09 中国科学院理化技术研究所 A kind of flat heat pipe radiator

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7931072B1 (en) 2002-10-02 2011-04-26 Alliant Techsystems Inc. High heat flux evaporator, heat transfer systems
US8047268B1 (en) 2002-10-02 2011-11-01 Alliant Techsystems Inc. Two-phase heat transfer system and evaporators and condensers for use in heat transfer systems
US8109325B2 (en) 2000-06-30 2012-02-07 Alliant Techsystems Inc. Heat transfer system
US8136580B2 (en) 2000-06-30 2012-03-20 Alliant Techsystems Inc. Evaporator for a heat transfer system
US8944155B2 (en) * 2010-07-15 2015-02-03 Dana Canada Corporation Annular axial flow ribbed heat exchanger
KR102219183B1 (en) * 2019-10-25 2021-02-23 충북대학교 산학협력단 Heat sink having 3d-radial shape
CN111757656B (en) * 2020-08-10 2021-07-06 西安电子科技大学 Conformal countercurrent liquid cooling radiator

Family Cites Families (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1275946A (en) * 1969-01-28 1972-06-01 Messerschmitt Boelkow Blohm Apparatus for the conduction or exchange of heat
US3803688A (en) * 1971-07-13 1974-04-16 Electronic Communications Method of making a heat pipe
DE2204589A1 (en) * 1972-02-01 1973-08-16 Siemens Ag COOLING ARRANGEMENT FOR FLAT SEMICONDUCTOR COMPONENTS
US4005297A (en) * 1972-10-18 1977-01-25 Westinghouse Electric Corporation Vacuum-type circuit interrupters having heat-dissipating devices associated with the contact structures thereof
JPS62175586A (en) * 1986-01-29 1987-08-01 Toshiba Corp Closed loop type heat pipe
US4883116A (en) * 1989-01-31 1989-11-28 The United States Of America As Represented By The Administrator Of The National Aeronautics And Space Administration Ceramic heat pipe wick
RU2098733C1 (en) 1995-03-07 1997-12-10 Институт теплофизики Уральского отделения РАН Evaporation chamber of loop heat pipe
FR2752291B1 (en) * 1996-08-12 1998-09-25 Centre Nat Etd Spatiales HAIR EVAPORATOR FOR DIPHASIC LOOP OF TRANSFER OF ENERGY BETWEEN A HOT SOURCE AND A COLD SOURCE
JP3450148B2 (en) * 1997-03-07 2003-09-22 三菱電機株式会社 Loop type heat pipe
JP2000222070A (en) * 1999-01-29 2000-08-11 Mitsubishi Electric Corp Information device
JP2001033179A (en) * 1999-07-22 2001-02-09 Showa Alum Corp Tubular heat exchanger and its manufacture
US6293333B1 (en) * 1999-09-02 2001-09-25 The United States Of America As Represented By The Secretary Of The Air Force Micro channel heat pipe having wire cloth wick and method of fabrication
WO2001033153A1 (en) * 1999-11-04 2001-05-10 Swales Aerospace Starter for loop heat pipe
ATE319972T1 (en) * 2000-06-30 2006-03-15 Swales Aerospace PHASE CONTROL IN A CAPILLARY EVAPORATOR
AU2001277174A1 (en) 2000-07-27 2002-02-13 Advanced Technologies Limited High-efficiency computer thermal management apparatus and method
FR2813662B1 (en) * 2000-09-05 2003-01-24 Astrium Sas HAIR EVAPORATOR FOR TRANSFER LOOP
US6474074B2 (en) * 2000-11-30 2002-11-05 International Business Machines Corporation Apparatus for dense chip packaging using heat pipes and thermoelectric coolers
JP2002195769A (en) * 2000-12-22 2002-07-10 Mitsubishi Electric Corp System and method for producing evaporator
JP2003172589A (en) * 2001-12-06 2003-06-20 Mitsubishi Electric Corp Loop-type heat pipe and evaporator
BR0202997A (en) * 2002-07-16 2004-05-25 Brasil Compressores Sa Refrigeration system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102466379A (en) * 2010-11-12 2012-05-23 杨泰和 Temperature regulation system with hybrid refrigerant supply and regulation
CN107677155A (en) * 2017-11-03 2018-02-09 中国科学院理化技术研究所 A kind of flat heat pipe radiator

Also Published As

Publication number Publication date
CN100457379C (en) 2009-02-04
EP1682309A4 (en) 2009-11-04
JP5060785B2 (en) 2012-10-31
BRPI0416000A (en) 2007-01-02
JP2007510125A (en) 2007-04-19
WO2005043059A3 (en) 2005-12-29
WO2005043059A2 (en) 2005-05-12
EP1682309A2 (en) 2006-07-26
BRPI0416000B1 (en) 2019-10-15
AU2004286255A1 (en) 2005-05-12
MXPA06004692A (en) 2008-10-08
EP1682309B1 (en) 2018-12-19
AU2004286255B2 (en) 2010-04-08

Similar Documents

Publication Publication Date Title
US8109325B2 (en) Heat transfer system
US7708053B2 (en) Heat transfer system
US7251889B2 (en) Manufacture of a heat transfer system
US9273887B2 (en) Evaporators for heat transfer systems
CN1135344C (en) Thermoelectric conversion arrangement
CN1910008A (en) Manufacture of a heat transfer system
MXPA05008465A (en) Coolant penetrating cold-end pressure vessel.
CN1227334A (en) Air conditioner
CN1149364C (en) Refrigerator
CN101059259A (en) Heat-storing air conditioner
CN1243199A (en) Oil-less compressor integrated with pulse tube refrigerator
WO2005008160A1 (en) Loop type thermo syphone, heat radiation system, heat exchange system, and stirling cooling chamber
CN1699727A (en) Steam engine
CN1771421A (en) Heat transfer system
JP4998933B2 (en) Heat transfer system
CN1776329A (en) Expansion device
EP1549897B1 (en) Evaporator for a heat transfer system
CN1564926A (en) Refrigeration system and its condensing apparatus
CN100357674C (en) Water-cooling inside superposed refrigerating system
US20240093916A1 (en) Dilution refrigeration device and method
EP3775717A2 (en) Heat station for cooling a circulating cryogen
JP2017067304A (en) Gas liquid separator and refrigeration cycle device
JP2004163038A (en) Staring refrigerator

Legal Events

Date Code Title Description
C06 Publication
PB01 Publication
C10 Entry into substantive examination
SE01 Entry into force of request for substantive examination
C14 Grant of patent or utility model
GR01 Patent grant
CP01 Change in the name or title of a patent holder

Address after: The University of Minnesota

Patentee after: Rail ATK Co.,Ltd.

Address before: The University of Minnesota

Patentee before: ALLIANT TECHSYSTEMS Inc.

CP01 Change in the name or title of a patent holder
TR01 Transfer of patent right

Effective date of registration: 20180418

Address after: The University of Minnesota

Patentee after: ALLIANT TECHSYSTEMS Inc.

Address before: Maryland USA

Patentee before: SWALES & ASSOCIATES, Inc.

TR01 Transfer of patent right
CP01 Change in the name or title of a patent holder

Address after: The University of Minnesota

Patentee after: Norway Grumman Innovation Systems Inc.

Address before: The University of Minnesota

Patentee before: Rail ATK Co.,Ltd.

CP01 Change in the name or title of a patent holder
CP03 Change of name, title or address

Address after: American Virginia

Patentee after: Nuoxi Gruman Innovation System Co.,Ltd.

Address before: Minnesota,USA

Patentee before: Norway Grumman Innovation Systems Inc.

CP03 Change of name, title or address
TR01 Transfer of patent right

Effective date of registration: 20220111

Address after: American Virginia

Patentee after: Northy Grumman Systems Inc.

Address before: American Virginia

Patentee before: Nuoxi Gruman Innovation System Co.,Ltd.

TR01 Transfer of patent right