BR9816084B1 - catodo para evaporação catódica ou evaporação a arco e aparelho para revestimento ou implantação de ìons de substratos. - Google Patents
catodo para evaporação catódica ou evaporação a arco e aparelho para revestimento ou implantação de ìons de substratos.Info
- Publication number
- BR9816084B1 BR9816084B1 BRPI9816084-2A BR9816084A BR9816084B1 BR 9816084 B1 BR9816084 B1 BR 9816084B1 BR 9816084 A BR9816084 A BR 9816084A BR 9816084 B1 BR9816084 B1 BR 9816084B1
- Authority
- BR
- Brazil
- Prior art keywords
- evaporation
- cathode
- coating
- cathodic
- substrate ions
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/24—Vacuum evaporation
- C23C14/32—Vacuum evaporation by explosion; by evaporation and subsequent ionisation of the vapours, e.g. ion-plating
- C23C14/325—Electric arc evaporation
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
- C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US97910097A | 1997-11-26 | 1997-11-26 | |
CA002385393A CA2385393A1 (en) | 1997-11-26 | 2002-05-06 | Linear magnetron arc evaporation or sputtering source |
Publications (2)
Publication Number | Publication Date |
---|---|
BR9816084A BR9816084A (pt) | 2004-07-13 |
BR9816084B1 true BR9816084B1 (pt) | 2010-10-19 |
Family
ID=32714129
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BRPI9816084-2A BR9816084B1 (pt) | 1997-11-26 | 1998-11-26 | catodo para evaporação catódica ou evaporação a arco e aparelho para revestimento ou implantação de ìons de substratos. |
Country Status (13)
Country | Link |
---|---|
US (1) | US6350356B1 (pt) |
JP (1) | JP4253385B2 (pt) |
AU (1) | AU9410498A (pt) |
BR (1) | BR9816084B1 (pt) |
CA (1) | CA2254677C (pt) |
DE (1) | DE19853943B4 (pt) |
FR (1) | FR2772185B1 (pt) |
GB (1) | GB2331768B (pt) |
IL (1) | IL127236A0 (pt) |
IT (1) | IT1302881B1 (pt) |
PL (1) | PL329905A1 (pt) |
RU (1) | RU2168233C2 (pt) |
TW (1) | TW404986B (pt) |
Families Citing this family (30)
Publication number | Priority date | Publication date | Assignee | Title |
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US6679977B2 (en) * | 1997-12-17 | 2004-01-20 | Unakis Trading Ag | Method of producing flat panels |
US6093293A (en) * | 1997-12-17 | 2000-07-25 | Balzers Hochvakuum Ag | Magnetron sputtering source |
US6585870B1 (en) | 2000-04-28 | 2003-07-01 | Honeywell International Inc. | Physical vapor deposition targets having crystallographic orientations |
US20090090617A1 (en) * | 2005-07-14 | 2009-04-09 | Giauque Pierre H | Method and Apparatus for Producing Controlled Stresses and Stress Gradients in Sputtered Films |
US20070026205A1 (en) * | 2005-08-01 | 2007-02-01 | Vapor Technologies Inc. | Article having patterned decorative coating |
US7498587B2 (en) * | 2006-05-01 | 2009-03-03 | Vapor Technologies, Inc. | Bi-directional filtered arc plasma source |
WO2007131944A2 (de) * | 2006-05-16 | 2007-11-22 | Oerlikon Trading Ag, Trübbach | Arcquelle und magnetanordnung |
US7857948B2 (en) * | 2006-07-19 | 2010-12-28 | Oerlikon Trading Ag, Trubbach | Method for manufacturing poorly conductive layers |
DE102007009615A1 (de) * | 2007-02-26 | 2008-08-28 | Leybold Optics Gmbh | Anlage und Verfahren zur Vakuumbehandlung von bandförmigen Substraten |
DE102007019981B4 (de) * | 2007-04-23 | 2011-04-14 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Anode für die Bildung eines Plasmas durch Ausbildung elektrischer Bogenentladungen |
US7772571B2 (en) | 2007-10-08 | 2010-08-10 | Advanced Ion Beam Technology, Inc. | Implant beam utilization in an ion implanter |
WO2009052544A1 (en) * | 2007-10-26 | 2009-04-30 | Steven Arnold Sesselmann | Ion implantation device |
US9175383B2 (en) | 2008-01-16 | 2015-11-03 | Applied Materials, Inc. | Double-coating device with one process chamber |
EP2081212B1 (en) * | 2008-01-16 | 2016-03-23 | Applied Materials, Inc. | Double-Coating Device with one Process Chamber |
US8574410B2 (en) * | 2008-04-22 | 2013-11-05 | The Regents Of The University Of California | Method and apparatus for improved high power impulse magnetron sputtering |
US9153422B2 (en) * | 2011-08-02 | 2015-10-06 | Envaerospace, Inc. | Arc PVD plasma source and method of deposition of nanoimplanted coatings |
CA2846177C (en) | 2013-03-15 | 2019-09-17 | Vapor Technologies, Inc. | Low pressure arc plasma immersion coating vapor deposition and ion treatment |
DE102013206210B4 (de) * | 2013-04-09 | 2017-05-04 | Von Ardenne Gmbh | Vakuumbeschichtungsvorrichtung und Verfahren zur Mehrfachbeschichtung |
RU2532779C1 (ru) * | 2013-04-19 | 2014-11-10 | Федеральное государственное бюджетное образовательное учреждение высшего профессионального образования "Московский государственный технический университет имени Н.Э. Баумана" (МГТУ им. Н.Э. Баумана) | Способ и устройство для ускоренного азотирования деталей машин с использованием импульсов электромагнитного поля |
AT13830U1 (de) * | 2013-04-22 | 2014-09-15 | Plansee Se | Lichtbogenverdampfungs-Beschichtungsquelle |
UA86105U (uk) * | 2013-07-09 | 2013-12-10 | Общество С Ограниченной Ответственностью "Грэсэм Иновейшн" | Плазмово-дуговий пристрій формування покриттів |
CA2867451C (en) | 2013-10-28 | 2021-06-29 | Vapor Technologies, Inc. | Low pressure arc plasma immersion coating vapor deposition and ion treatment |
JP6403269B2 (ja) * | 2014-07-30 | 2018-10-10 | 株式会社神戸製鋼所 | アーク蒸発源 |
DE102015004856A1 (de) * | 2015-04-15 | 2016-10-20 | Oerlikon Metaplas Gmbh | Bipolares Arc-Beschichtungsverfahren |
KR102140598B1 (ko) * | 2016-07-12 | 2020-08-03 | 어플라이드 머티어리얼스, 인코포레이티드 | 스퍼터 증착 소스, 스퍼터 증착 장치 및 스퍼터 증착 소스를 동작시키는 방법 |
US11322338B2 (en) * | 2017-08-31 | 2022-05-03 | Taiwan Semiconductor Manufacturing Co., Ltd. | Sputter target magnet |
US11053670B2 (en) | 2018-08-23 | 2021-07-06 | Spectrum Brands, Inc. | Faucet spray head alignment system |
CN112639227B (zh) | 2018-08-23 | 2023-02-28 | 品谱股份有限公司 | 水龙头喷头对准系统 |
RU2685828C1 (ru) * | 2018-09-26 | 2019-04-23 | Акционерное общество "Научно-производственное объединение "Центральный научно-исследовательский институт технологии машиностроения", АО "НПО "ЦНИИТМАШ" | Устройство для нанесения покрытия вакуумно-дуговым испарением |
CN114823252B (zh) * | 2022-04-29 | 2023-07-14 | 电子科技大学 | 一种基于冷阴极的双向多注行波级联放大器 |
Family Cites Families (67)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3793179A (en) * | 1971-07-19 | 1974-02-19 | L Sablev | Apparatus for metal evaporation coating |
GB1391842A (en) * | 1971-08-04 | 1975-04-23 | Elektromat Veb | Apparatus for coating substrates by cathode sputtering and for cleaning by ion bombardment in the same vacuum vessel |
US4031424A (en) * | 1971-09-07 | 1977-06-21 | Telic Corporation | Electrode type glow discharge apparatus |
US3783231A (en) | 1972-03-22 | 1974-01-01 | V Gorbunov | Apparatus for vacuum-evaporation of metals under the action of an electric arc |
CH551498A (de) * | 1972-05-09 | 1974-07-15 | Balzers Patent Beteilig Ag | Anordnung zur aufstaeubung von stoffen auf unterlagen mittels einer elektrischen niederspannungsentladung. |
US4116806A (en) | 1977-12-08 | 1978-09-26 | Battelle Development Corporation | Two-sided planar magnetron sputtering apparatus |
SU711787A1 (ru) * | 1978-06-17 | 1980-10-07 | Предприятие П/Я В-8851 | Электродуговой испаритель металлов |
US4162954A (en) * | 1978-08-21 | 1979-07-31 | Vac-Tec Systems, Inc. | Planar magnetron sputtering device |
US4194962A (en) * | 1978-12-20 | 1980-03-25 | Advanced Coating Technology, Inc. | Cathode for sputtering |
GB2058142B (en) * | 1979-07-31 | 1983-08-10 | Nordiko Ltd | Sputtering electrodes |
US4457825A (en) * | 1980-05-16 | 1984-07-03 | Varian Associates, Inc. | Sputter target for use in a sputter coating source |
US4404077A (en) | 1981-04-07 | 1983-09-13 | Fournier Paul R | Integrated sputtering apparatus and method |
US4428259A (en) * | 1981-07-28 | 1984-01-31 | Toyota Jidosha Kabushiki Kaisha | Fail safe automatic transmission lock up clutch control system |
GB2110719B (en) * | 1981-11-30 | 1985-10-30 | Anelva Corp | Sputtering apparatus |
US4486289A (en) * | 1982-02-05 | 1984-12-04 | University Of British Columbia, Canada | Planar magnetron sputtering device |
CH646459A5 (de) * | 1982-03-22 | 1984-11-30 | Balzers Hochvakuum | Rechteckige targetplatte fuer kathodenzerstaeubungsanlagen. |
AT376460B (de) * | 1982-09-17 | 1984-11-26 | Kljuchko Gennady V | Plasmalichtbogeneinrichtung zum auftragen von ueberzuegen |
US4581118A (en) | 1983-01-26 | 1986-04-08 | Materials Research Corporation | Shaped field magnetron electrode |
JPS59200761A (ja) * | 1983-04-28 | 1984-11-14 | Toshiba Corp | スパツタリングタ−ゲツト支持装置 |
US4559121A (en) | 1983-09-12 | 1985-12-17 | Vac-Tec Systems, Inc. | Method and apparatus for evaporation arc stabilization for permeable targets |
US4515675A (en) | 1983-07-06 | 1985-05-07 | Leybold-Heraeus Gmbh | Magnetron cathode for cathodic evaportion apparatus |
US4448659A (en) * | 1983-09-12 | 1984-05-15 | Vac-Tec Systems, Inc. | Method and apparatus for evaporation arc stabilization including initial target cleaning |
DE3429988A1 (de) * | 1983-12-05 | 1985-06-13 | Leybold-Heraeus GmbH, 5000 Köln | Magnetronkatode zum zerstaeuben ferromagnetischer targets |
US4478702A (en) * | 1984-01-17 | 1984-10-23 | Ppg Industries, Inc. | Anode for magnetic sputtering apparatus |
US4600489A (en) | 1984-01-19 | 1986-07-15 | Vac-Tec Systems, Inc. | Method and apparatus for evaporation arc stabilization for non-permeable targets utilizing permeable stop ring |
US4673477A (en) * | 1984-03-02 | 1987-06-16 | Regents Of The University Of Minnesota | Controlled vacuum arc material deposition, method and apparatus |
US4724058A (en) * | 1984-08-13 | 1988-02-09 | Vac-Tec Systems, Inc. | Method and apparatus for arc evaporating large area targets |
CH664768A5 (de) * | 1985-06-20 | 1988-03-31 | Balzers Hochvakuum | Verfahren zur beschichtung von substraten in einer vakuumkammer. |
DE3527626A1 (de) * | 1985-08-01 | 1987-02-05 | Leybold Heraeus Gmbh & Co Kg | Zerstaeubungskatode nach dem magnetronprinzip |
US4717968A (en) * | 1985-09-16 | 1988-01-05 | Eastman Kodak Company | Video player with power-down capability |
FR2596920A1 (fr) * | 1986-04-03 | 1987-10-09 | Saint Roch Sa Glaceries | Cathode de pulverisation |
US5215640A (en) | 1987-02-03 | 1993-06-01 | Balzers Ag | Method and arrangement for stabilizing an arc between an anode and a cathode particularly for vacuum coating devices |
NL8700620A (nl) * | 1987-03-16 | 1988-10-17 | Hauzer Holding | Kathode boogverdampingsinrichting alsmede werkwijze voor het bedrijven daarvan. |
DE4017111C2 (de) * | 1990-05-28 | 1998-01-29 | Hauzer Holding | Lichtbogen-Magnetron-Vorrichtung |
US4812217A (en) * | 1987-04-27 | 1989-03-14 | American Telephone And Telegraph Company, At&T Bell Laboratories | Method and apparatus for feeding and coating articles in a controlled atmosphere |
FR2619247A1 (fr) * | 1987-08-05 | 1989-02-10 | Realisations Nucleaires Et | Implanteur d'ions metalliques |
JPH01290765A (ja) * | 1988-05-16 | 1989-11-22 | Toshiba Corp | スパッタリングターゲット |
US4892633A (en) * | 1988-11-14 | 1990-01-09 | Vac-Tec Systems, Inc. | Magnetron sputtering cathode |
US4915805A (en) * | 1988-11-21 | 1990-04-10 | At&T Bell Laboratories | Hollow cathode type magnetron apparatus construction |
EP0462902B1 (en) * | 1990-06-20 | 1996-09-18 | Sumitomo Electric Industries, Ltd. | Process and apparatus for preparing superconducting thin films. |
DE4042286C1 (pt) | 1990-12-31 | 1992-02-06 | Leybold Ag, 6450 Hanau, De | |
US5269898A (en) * | 1991-03-20 | 1993-12-14 | Vapor Technologies, Inc. | Apparatus and method for coating a substrate using vacuum arc evaporation |
JPH06508001A (ja) * | 1991-04-19 | 1994-09-08 | サーフィス ソリューションズ インコーポレーテッド | 線形磁電管スパッタリング方法及び装置 |
GB9108553D0 (en) * | 1991-04-22 | 1991-06-05 | Ion Coat Ltd | Ionised vapour source |
US5451308A (en) * | 1991-04-29 | 1995-09-19 | Novatech | Electric arc metal evaporator |
US5364518A (en) * | 1991-05-28 | 1994-11-15 | Leybold Aktiengesellschaft | Magnetron cathode for a rotating target |
DE4123274C2 (de) | 1991-07-13 | 1996-12-19 | Leybold Ag | Vorrichtung zum Beschichten von Bauteilen bzw. Formteilen durch Kathodenzerstäubung |
FR2680799B1 (fr) * | 1991-09-03 | 1993-10-29 | Elf Aquitaine Ste Nale | Element de cible pour pulverisation cathodique, procede de preparation dudit element et cibles, notamment de grande surface, realisees a partir de cet element. |
US5482611A (en) * | 1991-09-30 | 1996-01-09 | Helmer; John C. | Physical vapor deposition employing ion extraction from a plasma |
DE4135939A1 (de) | 1991-10-31 | 1993-05-06 | Leybold Ag, 6450 Hanau, De | Zerstaeubungskathode |
JP3025095B2 (ja) * | 1992-03-25 | 2000-03-27 | 三菱重工業株式会社 | 長尺電子ビーム発生装置 |
US5277779A (en) | 1992-04-14 | 1994-01-11 | Henshaw William F | Rectangular cavity magnetron sputtering vapor source |
US5262028A (en) | 1992-06-01 | 1993-11-16 | Sierra Applied Sciences, Inc. | Planar magnetron sputtering magnet assembly |
JP3365643B2 (ja) * | 1992-07-06 | 2003-01-14 | 株式会社神戸製鋼所 | イオン注入装置 |
US5403457A (en) | 1992-08-24 | 1995-04-04 | Matsushita Electric Industrial Co., Ltd. | Method for making soft magnetic film |
DE4230291C2 (de) | 1992-09-10 | 1999-11-04 | Leybold Ag | Mikrowellenunterstützte Zerstäubungsanordnung |
US5380421A (en) | 1992-11-04 | 1995-01-10 | Gorokhovsky; Vladimir I. | Vacuum-arc plasma source |
JP2970317B2 (ja) * | 1993-06-24 | 1999-11-02 | 松下電器産業株式会社 | スパッタリング装置及びスパッタリング方法 |
US5407551A (en) * | 1993-07-13 | 1995-04-18 | The Boc Group, Inc. | Planar magnetron sputtering apparatus |
US5480527A (en) | 1994-04-25 | 1996-01-02 | Vapor Technologies, Inc. | Rectangular vacuum-arc plasma source |
DE19537267C1 (de) * | 1994-10-19 | 1996-07-04 | Grc Glass Refining Center Ges | Verfahren zum Aufbringen von dünnen farbigen Schichten auf Substrate mit gekrümmten Oberflächen, insbesondere auf rotationssymmetrische Substrate, sowie Vorrichtung zur Durchführung des Verfahrens |
US5587207A (en) * | 1994-11-14 | 1996-12-24 | Gorokhovsky; Vladimir I. | Arc assisted CVD coating and sintering method |
US5597459A (en) | 1995-02-08 | 1997-01-28 | Nobler Technologies, Inc. | Magnetron cathode sputtering method and apparatus |
US5518597A (en) * | 1995-03-28 | 1996-05-21 | Minnesota Mining And Manufacturing Company | Cathodic arc coating apparatus and method |
US5589039A (en) | 1995-07-28 | 1996-12-31 | Sony Corporation | In-plane parallel bias magnetic field generator for sputter coating magnetic materials onto substrates |
US5804041A (en) | 1996-06-10 | 1998-09-08 | Sony Corporation | Method and apparatus for forming a magnetically oriented thin film |
US5997705A (en) * | 1999-04-14 | 1999-12-07 | Vapor Technologies, Inc. | Rectangular filtered arc plasma source |
-
1998
- 1998-11-24 AU AU94104/98A patent/AU9410498A/en not_active Abandoned
- 1998-11-24 DE DE19853943A patent/DE19853943B4/de not_active Expired - Lifetime
- 1998-11-24 IL IL12723698A patent/IL127236A0/xx unknown
- 1998-11-25 RU RU98121225/09A patent/RU2168233C2/ru active
- 1998-11-25 CA CA002254677A patent/CA2254677C/en not_active Expired - Lifetime
- 1998-11-25 JP JP37537698A patent/JP4253385B2/ja not_active Expired - Lifetime
- 1998-11-26 PL PL98329905A patent/PL329905A1/xx unknown
- 1998-11-26 FR FR9814895A patent/FR2772185B1/fr not_active Expired - Lifetime
- 1998-11-26 BR BRPI9816084-2A patent/BR9816084B1/pt not_active IP Right Cessation
- 1998-11-26 IT IT1998RM000725A patent/IT1302881B1/it active IP Right Grant
- 1998-11-26 GB GB9825775A patent/GB2331768B/en not_active Expired - Lifetime
-
1999
- 1999-02-12 TW TW087119657A patent/TW404986B/zh not_active IP Right Cessation
- 1999-04-14 US US09/291,343 patent/US6350356B1/en not_active Expired - Lifetime
Also Published As
Publication number | Publication date |
---|---|
FR2772185A1 (fr) | 1999-06-11 |
CA2254677A1 (en) | 1999-05-26 |
IT1302881B1 (it) | 2000-10-10 |
GB2331768A (en) | 1999-06-02 |
ITRM980725A1 (it) | 2000-05-26 |
TW404986B (en) | 2000-09-11 |
JP4253385B2 (ja) | 2009-04-08 |
GB2331768B (en) | 2003-03-05 |
AU9410498A (en) | 1999-06-17 |
DE19853943A1 (de) | 1999-07-15 |
RU2168233C2 (ru) | 2001-05-27 |
BR9816084A (pt) | 2004-07-13 |
CA2254677C (en) | 2002-10-01 |
DE19853943B4 (de) | 2006-04-20 |
PL329905A1 (en) | 1999-06-07 |
FR2772185B1 (fr) | 2003-06-27 |
GB9825775D0 (en) | 1999-01-20 |
US6350356B1 (en) | 2002-02-26 |
IL127236A0 (en) | 1999-09-22 |
JP2000026966A (ja) | 2000-01-25 |
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