AU4410499A - Target for pvd and similar processes - Google Patents
Target for pvd and similar processesInfo
- Publication number
- AU4410499A AU4410499A AU44104/99A AU4410499A AU4410499A AU 4410499 A AU4410499 A AU 4410499A AU 44104/99 A AU44104/99 A AU 44104/99A AU 4410499 A AU4410499 A AU 4410499A AU 4410499 A AU4410499 A AU 4410499A
- Authority
- AU
- Australia
- Prior art keywords
- pvd
- target
- similar processes
- processes
- similar
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
- C23C16/06—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material
- C23C16/18—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the deposition of metallic material from metallo-organic compounds
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
- C23C14/3414—Metallurgical or chemical aspects of target preparation, e.g. casting, powder metallurgy
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US8737198P | 1998-05-28 | 1998-05-28 | |
US60087371 | 1998-05-28 | ||
PCT/US1999/012085 WO1999061679A1 (en) | 1998-05-28 | 1999-05-28 | Target for pvd and similar processes |
Publications (1)
Publication Number | Publication Date |
---|---|
AU4410499A true AU4410499A (en) | 1999-12-13 |
Family
ID=22204788
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU44104/99A Abandoned AU4410499A (en) | 1998-05-28 | 1999-05-28 | Target for pvd and similar processes |
Country Status (2)
Country | Link |
---|---|
AU (1) | AU4410499A (en) |
WO (1) | WO1999061679A1 (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10760156B2 (en) | 2017-10-13 | 2020-09-01 | Honeywell International Inc. | Copper manganese sputtering target |
US11035036B2 (en) | 2018-02-01 | 2021-06-15 | Honeywell International Inc. | Method of forming copper alloy sputtering targets with refined shape and microstructure |
CN114231940A (en) * | 2021-12-08 | 2022-03-25 | 安徽光智科技有限公司 | Method for preparing molybdenum sputtering target material by using molybdenum carbonyl as precursor |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5055246A (en) * | 1991-01-22 | 1991-10-08 | L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude | Method of forming high purity metal silicides targets for sputtering |
DE4138926A1 (en) * | 1991-11-27 | 1993-06-03 | Leybold Ag | Prodn. of indium-tin oxide targets in CVD reactor - by depositing thermally decomposable tin and indium cpds. with addn. of oxygen@ onto substrate |
DE4418906B4 (en) * | 1994-05-31 | 2004-03-25 | Unaxis Deutschland Holding Gmbh | Process for coating a substrate and coating system for carrying it out |
-
1999
- 1999-05-28 AU AU44104/99A patent/AU4410499A/en not_active Abandoned
- 1999-05-28 WO PCT/US1999/012085 patent/WO1999061679A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO1999061679A1 (en) | 1999-12-02 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |