BR8701784A - Memoria de fabricacao de estruturas de ceramica de multiplas camadas que possuem uma distribuicao interna de condutores a base de cobre e composicao de materia para a producao de metalurgia a base de cobre - Google Patents

Memoria de fabricacao de estruturas de ceramica de multiplas camadas que possuem uma distribuicao interna de condutores a base de cobre e composicao de materia para a producao de metalurgia a base de cobre

Info

Publication number
BR8701784A
BR8701784A BR8701784A BR8701784A BR8701784A BR 8701784 A BR8701784 A BR 8701784A BR 8701784 A BR8701784 A BR 8701784A BR 8701784 A BR8701784 A BR 8701784A BR 8701784 A BR8701784 A BR 8701784A
Authority
BR
Brazil
Prior art keywords
copper
manufacture
memory
production
material composition
Prior art date
Application number
BR8701784A
Other languages
English (en)
Portuguese (pt)
Inventor
Herbert Rudolph Anderson
Renuka Shastri Divakaruni
Joseph Michael Dynys
Steven Michael Kandezke
Daniel Patrick Kirby
Raj N Master
Jon Alfred Casey
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Publication of BR8701784A publication Critical patent/BR8701784A/pt

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H10W70/098—Applying pastes or inks, e.g. screen printing
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W70/00—Package substrates; Interposers; Redistribution layers [RDL]
    • H10W70/01—Manufacture or treatment
    • H10W70/05—Manufacture or treatment of insulating or insulated package substrates, or of interposers, or of redistribution layers
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0306—Inorganic insulating substrates, e.g. ceramic, glass
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H05K1/092—Dispersed materials, e.g. conductive pastes or inks
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/46—Manufacturing multilayer circuits
    • H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
    • H05K3/4626—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials
    • H05K3/4629—Manufacturing multilayer circuits by laminating two or more circuit boards characterised by the insulating layers or materials laminating inorganic sheets comprising printed circuits, e.g. green ceramic sheets
BR8701784A 1986-05-01 1987-04-14 Memoria de fabricacao de estruturas de ceramica de multiplas camadas que possuem uma distribuicao interna de condutores a base de cobre e composicao de materia para a producao de metalurgia a base de cobre BR8701784A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US06/858,488 US4885038A (en) 1986-05-01 1986-05-01 Method of making multilayered ceramic structures having an internal distribution of copper-based conductors

Publications (1)

Publication Number Publication Date
BR8701784A true BR8701784A (pt) 1988-02-09

Family

ID=25328430

Family Applications (1)

Application Number Title Priority Date Filing Date
BR8701784A BR8701784A (pt) 1986-05-01 1987-04-14 Memoria de fabricacao de estruturas de ceramica de multiplas camadas que possuem uma distribuicao interna de condutores a base de cobre e composicao de materia para a producao de metalurgia a base de cobre

Country Status (7)

Country Link
US (1) US4885038A (enExample)
EP (1) EP0243626B1 (enExample)
JP (1) JPS62261197A (enExample)
BR (1) BR8701784A (enExample)
CA (1) CA1326789C (enExample)
DE (1) DE3750684T2 (enExample)
ES (1) ES2062972T3 (enExample)

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US5147484A (en) * 1987-10-19 1992-09-15 International Business Machines Corporation Method for producing multi-layer ceramic substrates with oxidation resistant metalization
JPH0728128B2 (ja) * 1988-03-11 1995-03-29 松下電器産業株式会社 セラミック多層配線基板とその製造方法
US5194294A (en) * 1989-02-20 1993-03-16 L'air Liquide, Societe Anonyme Pour L'etude Et L'exploitation Des Procedes Georges Claude Process for preparing electrical connection means, in particular interconnection substances of hybrid circuits
US5208066A (en) * 1989-03-18 1993-05-04 Hitachi, Ltd. Process of forming a patterned polyimide film and articles including such a film
EP0444216A4 (en) * 1989-09-19 1992-04-08 Fujitsu Limited Via-forming ceramics composition
US5326643A (en) * 1991-10-07 1994-07-05 International Business Machines Corporation Adhesive layer in multi-level packaging and organic material as a metal diffusion barrier
US5682018A (en) * 1991-10-18 1997-10-28 International Business Machines Corporation Interface regions between metal and ceramic in a metal/ceramic substrate
JP3422233B2 (ja) * 1997-09-26 2003-06-30 株式会社村田製作所 バイアホール用導電性ペースト、およびそれを用いた積層セラミック基板の製造方法
JP2000244123A (ja) * 1999-02-19 2000-09-08 Hitachi Ltd 多層セラミック回路基板
DE20022469U1 (de) * 2000-07-11 2002-01-31 Robert Bosch Gmbh, 70469 Stuttgart Gesinterter, elektrisch leitfähiger Werkstoff
GB2374205B (en) * 2001-04-04 2004-12-22 Rolls Royce Plc An electrical conductor winding and a method of manufacturing an electrical conductor winding
JP5275342B2 (ja) 2007-05-11 2013-08-28 エスディーシー マテリアルズ インコーポレイテッド 粒子生産システム及び粒子生産方法
US8507401B1 (en) 2007-10-15 2013-08-13 SDCmaterials, Inc. Method and system for forming plug and play metal catalysts
US9126191B2 (en) 2009-12-15 2015-09-08 SDCmaterials, Inc. Advanced catalysts for automotive applications
US8470112B1 (en) 2009-12-15 2013-06-25 SDCmaterials, Inc. Workflow for novel composite materials
US9119309B1 (en) * 2009-12-15 2015-08-25 SDCmaterials, Inc. In situ oxide removal, dispersal and drying
US8557727B2 (en) 2009-12-15 2013-10-15 SDCmaterials, Inc. Method of forming a catalyst with inhibited mobility of nano-active material
US8545652B1 (en) 2009-12-15 2013-10-01 SDCmaterials, Inc. Impact resistant material
US8803025B2 (en) 2009-12-15 2014-08-12 SDCmaterials, Inc. Non-plugging D.C. plasma gun
US9149797B2 (en) 2009-12-15 2015-10-06 SDCmaterials, Inc. Catalyst production method and system
US8652992B2 (en) 2009-12-15 2014-02-18 SDCmaterials, Inc. Pinning and affixing nano-active material
US8669202B2 (en) 2011-02-23 2014-03-11 SDCmaterials, Inc. Wet chemical and plasma methods of forming stable PtPd catalysts
HK1199222A1 (en) 2011-08-19 2015-06-26 SDCmaterials, Inc. Coated substrates for use in catalysis and catalytic converters and methods of coating substrates with washcoat compositions
US9511352B2 (en) 2012-11-21 2016-12-06 SDCmaterials, Inc. Three-way catalytic converter using nanoparticles
US9156025B2 (en) 2012-11-21 2015-10-13 SDCmaterials, Inc. Three-way catalytic converter using nanoparticles
CN105592921A (zh) 2013-07-25 2016-05-18 Sdc材料公司 用于催化转化器的洗涂层和经涂覆基底及其制造和使用方法
CA2926135A1 (en) 2013-10-22 2015-04-30 SDCmaterials, Inc. Compositions of lean nox trap
CN106061600A (zh) 2013-10-22 2016-10-26 Sdc材料公司 用于重型柴油机的催化剂设计
US9687811B2 (en) 2014-03-21 2017-06-27 SDCmaterials, Inc. Compositions for passive NOx adsorption (PNA) systems and methods of making and using same

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4079156A (en) * 1975-03-07 1978-03-14 Uop Inc. Conductive metal pigments
JPS559643A (en) * 1978-07-07 1980-01-23 Asahi Chem Ind Co Ltd Production of heat-resistant resin paste
DE3011047C2 (de) * 1979-03-23 1982-12-16 Nippondenso Co., Ltd., Kariya, Aichi Wärmebeständiger, isolierter elektrischer Leitungsdraht und Verfahren zu dessen Herstellung
US4234367A (en) * 1979-03-23 1980-11-18 International Business Machines Corporation Method of making multilayered glass-ceramic structures having an internal distribution of copper-based conductors
US4517155A (en) * 1982-05-18 1985-05-14 Union Carbide Corporation Copper base metal termination for multilayer ceramic capacitors
JPS59995A (ja) * 1982-06-16 1984-01-06 富士通株式会社 銅導体多層構造体の製造方法
US4474731A (en) * 1983-03-28 1984-10-02 International Business Machines Corporation Process for the removal of carbon residues during sintering of ceramics
US4511601A (en) * 1983-05-13 1985-04-16 North American Philips Corporation Copper metallization for dielectric materials
US4671928A (en) * 1984-04-26 1987-06-09 International Business Machines Corporation Method of controlling the sintering of metal particles
JPS60250686A (ja) * 1984-05-25 1985-12-11 日本碍子株式会社 セラミツク配線基板の製造方法
JPS60254697A (ja) * 1984-05-31 1985-12-16 富士通株式会社 多層セラミック回路基板および製法

Also Published As

Publication number Publication date
ES2062972T3 (es) 1995-01-01
JPH0567077B2 (enExample) 1993-09-24
US4885038A (en) 1989-12-05
DE3750684T2 (de) 1995-05-18
EP0243626B1 (en) 1994-10-26
EP0243626A2 (en) 1987-11-04
DE3750684D1 (de) 1994-12-01
EP0243626A3 (en) 1989-11-08
JPS62261197A (ja) 1987-11-13
CA1326789C (en) 1994-02-08

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Legal Events

Date Code Title Description
B15K Others concerning applications: alteration of classification

Ipc: H01L 21/48 (2006.01), H05K 1/03 (2006.0