BR7608831A - Cartao portante para sistema de tratamento de sinais eletricos e processo de fabricacao deste cartao - Google Patents

Cartao portante para sistema de tratamento de sinais eletricos e processo de fabricacao deste cartao

Info

Publication number
BR7608831A
BR7608831A BR7608831A BR7608831A BR7608831A BR 7608831 A BR7608831 A BR 7608831A BR 7608831 A BR7608831 A BR 7608831A BR 7608831 A BR7608831 A BR 7608831A BR 7608831 A BR7608831 A BR 7608831A
Authority
BR
Brazil
Prior art keywords
card
manufacturing process
electric signal
treatment system
signal treatment
Prior art date
Application number
BR7608831A
Other languages
English (en)
Portuguese (pt)
Inventor
K Kurzweil
B Badet
F Guillaume
Original Assignee
Cii Honeywell Bull
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Cii Honeywell Bull filed Critical Cii Honeywell Bull
Publication of BR7608831A publication Critical patent/BR7608831A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H01L23/49855—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers for flat-cards, e.g. credit cards
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07718—Constructional details, e.g. mounting of circuits in the carrier the record carrier being manufactured in a continuous process, e.g. using endless rolls
    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06K—GRAPHICAL DATA READING; PRESENTATION OF DATA; RECORD CARRIERS; HANDLING RECORD CARRIERS
    • G06K19/00—Record carriers for use with machines and with at least a part designed to carry digital markings
    • G06K19/06—Record carriers for use with machines and with at least a part designed to carry digital markings characterised by the kind of the digital marking, e.g. shape, nature, code
    • G06K19/067—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components
    • G06K19/07—Record carriers with conductive marks, printed circuits or semiconductor circuit elements, e.g. credit or identity cards also with resonating or responding marks without active components with integrated circuit chips
    • G06K19/077—Constructional details, e.g. mounting of circuits in the carrier
    • G06K19/07745—Mounting details of integrated circuit chips
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L24/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/81—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a bump connector
    • H01L2224/818—Bonding techniques
    • H01L2224/81801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01033—Arsenic [As]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/0105—Tin [Sn]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01058—Cerium [Ce]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01063—Europium [Eu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01079—Gold [Au]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01082—Lead [Pb]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/01—Chemical elements
    • H01L2924/01094—Plutonium [Pu]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/10—Details of semiconductor or other solid state devices to be connected
    • H01L2924/11—Device type
    • H01L2924/14—Integrated circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/1517—Multilayer substrate
    • H01L2924/15172—Fan-out arrangement of the internal vias
    • H01L2924/15173—Fan-out arrangement of the internal vias in a single layer of the multilayer substrate
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10681—Tape Carrier Package [TCP]; Flexible sheet connector

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Theoretical Computer Science (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Credit Cards Or The Like (AREA)
  • Handling Of Sheets (AREA)
  • Control Of Vending Devices And Auxiliary Devices For Vending Devices (AREA)
  • Audible And Visible Signals (AREA)
  • Financial Or Insurance-Related Operations Such As Payment And Settlement (AREA)
BR7608831A 1975-12-31 1976-12-30 Cartao portante para sistema de tratamento de sinais eletricos e processo de fabricacao deste cartao BR7608831A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
FR7540361A FR2337381A1 (fr) 1975-12-31 1975-12-31 Carte portative pour systeme de traitement de signaux electriques et procede de fabrication de cette carte

Publications (1)

Publication Number Publication Date
BR7608831A true BR7608831A (pt) 1977-10-25

Family

ID=9164418

Family Applications (1)

Application Number Title Priority Date Filing Date
BR7608831A BR7608831A (pt) 1975-12-31 1976-12-30 Cartao portante para sistema de tratamento de sinais eletricos e processo de fabricacao deste cartao

Country Status (11)

Country Link
JP (2) JPS5283132A (nl)
BR (1) BR7608831A (nl)
CA (1) CA1083714A (nl)
CH (1) CH619310A5 (nl)
DE (1) DE2659573C2 (nl)
ES (1) ES454567A1 (nl)
FR (1) FR2337381A1 (nl)
GB (1) GB1567784A (nl)
IT (1) IT1124741B (nl)
NL (1) NL190131C (nl)
SE (1) SE415304B (nl)

Families Citing this family (88)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2379949A1 (fr) * 1977-02-07 1978-09-01 Cii Honeywell Bull Dispositif de controle d'un contact insere entre un circuit emetteur et un circuit recepteur pour la transmission de signaux electriques
FR2415378A1 (fr) * 1978-01-24 1979-08-17 Moreno Roland Procede et dispositif pour connecter electriquement un objet amovible notamment une carte electronique portative
FR2439478A1 (fr) * 1978-10-19 1980-05-16 Cii Honeywell Bull Boitier plat pour dispositifs a circuits integres
JPS5562591A (en) * 1978-10-30 1980-05-12 Fujitsu Ltd Memory card
DE2919649A1 (de) * 1979-05-16 1980-11-20 Bbc Brown Boveri & Cie Sicherheitspapier
DE2920012C2 (de) * 1979-05-17 1988-09-29 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit IC-Baustein und Verfahren zur Herstellung einer derartigen Ausweiskarte
DE2926867C2 (de) * 1979-07-03 1986-01-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Schaltungseinheit
FR2477303B1 (fr) * 1980-02-28 1986-09-26 Dassault Electronique Dispositif de lecture de cartes electroniques
FR2480008A1 (fr) * 1980-04-04 1981-10-09 Flonic Sa Perfectionnements aux cartes a memoire
DE3019206A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Verfahren zur kontaktierung von galvanischen kontakten einer ausweiskarte mit eingebettetem ic-baustein
DE3019207A1 (de) * 1980-05-20 1981-11-26 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-chip
FR2486685B1 (fr) * 1980-07-09 1985-10-31 Labo Electronique Physique Carte de paiement electronique et procede de realisation
DE3051195C2 (de) * 1980-08-05 1997-08-28 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
DE3029939A1 (de) * 1980-08-07 1982-03-25 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit ic-baustein und verfahren zu ihrer herstellung
DE3033881A1 (de) * 1980-09-09 1982-04-15 Siemens AG, 1000 Berlin und 8000 München Gehaeuseloses schaltungsmodul und verfahren zu seiner herstellung
US4549247A (en) * 1980-11-21 1985-10-22 Gao Gesellschaft Fur Automation Und Organisation Mbh Carrier element for IC-modules
DE3123198C2 (de) * 1980-12-08 1993-10-07 Gao Ges Automation Org Trägerelemente für einen IC-Baustein
JPS57123555U (nl) * 1981-01-26 1982-08-02
JPS57123556U (nl) * 1981-01-26 1982-08-02
DE3111516A1 (de) * 1981-03-24 1982-12-23 GAO Gesellschaft für Automation und Organisation mbH, 8000 München "ausweiskarte mit ic-baustein"
NL191959B (nl) * 1981-03-24 1996-07-01 Gao Ges Automation Org Identificatiekaart met IC-bouwsteen en dragerelement voor een IC-bouwsteen.
DE3131216C3 (de) * 1981-04-14 1994-09-01 Gao Ges Automation Org Ausweiskarte mit IC-Baustein
JPS57209578A (en) * 1981-06-19 1982-12-22 Fujitsu Ltd Card
DE3130324A1 (de) * 1981-07-31 1983-02-17 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Traegerelement fuer einen ic-baustein
FR2511544A1 (fr) * 1981-08-14 1983-02-18 Dassault Electronique Module electronique pour carte de transactions automatiques et carte equipee d'un tel module
JPS5888892A (ja) * 1981-11-20 1983-05-27 Hitachi Ltd バブルメモリカセツト
JPS5892597A (ja) * 1981-11-28 1983-06-01 大日本印刷株式会社 Ｉｃカ−ドの製造方法
DE3151408C1 (de) * 1981-12-24 1983-06-01 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Ausweiskarte mit einem IC-Baustein
FR2520541A1 (fr) * 1982-01-22 1983-07-29 Flonic Sa Procede d'insertion d'un circuit integre dans une carte a memoire et carte obtenue suivant ce procede
JPS58110474U (ja) * 1982-01-22 1983-07-27 凸版印刷株式会社 カ−ド
FR2523335A1 (fr) * 1982-03-10 1983-09-16 Flonic Sa Procede pour surelever les plages de contact electrique d'une carte a memoire
JPS58187858U (ja) * 1982-06-08 1983-12-13 セイコーインスツルメンツ株式会社 Ｉｃカ−ド
JPS58221478A (ja) * 1982-06-16 1983-12-23 Kyodo Printing Co Ltd Ｉｃカ−ド
JPS5944067U (ja) * 1982-09-16 1984-03-23 大日本印刷株式会社 Ｉｃカ−ド
DE3235650A1 (de) * 1982-09-27 1984-03-29 Philips Patentverwaltung Gmbh, 2000 Hamburg Informationskarte und verfahren zu ihrer herstellung
JPS5958949U (ja) * 1982-10-08 1984-04-17 凸版印刷株式会社 Ｉｃ等を内蔵するカ−ド
DE3313414A1 (de) * 1983-04-13 1984-10-18 Hubert 8958 Füssen Schweiger Verwendung eines programmierbaren, in einen ausweis integrierten festwertspeicherbausteines zur speicherung von informationen fuer mikroprozessor gesteuertes lesegeraet
FR2555780B1 (fr) * 1983-11-29 1986-04-11 Flonic Sa Procede de fabrication de cartes a memoire et cartes obtenues suivant ce procede
DE3466108D1 (en) * 1983-06-09 1987-10-15 Flonic Sa Method of producing memory cards, and cards obtained thereby
FR2548409B1 (fr) * 1983-06-29 1985-11-15 Sligos Procede pour la fabrication de cartes a memoire, installation et cartes a memoire obtenues
FR2548857B1 (fr) * 1983-07-04 1987-11-27 Cortaillod Cables Sa Procede de fabrication en continu d'une carte imprimee
JPS6084686A (ja) * 1983-10-17 1985-05-14 Toshiba Corp 情報記録媒体の記録方式
DE3338597A1 (de) * 1983-10-24 1985-05-02 GAO Gesellschaft für Automation und Organisation mbH, 8000 München Datentraeger mit integriertem schaltkreis und verfahren zur herstellung desselben
FR2554275B1 (fr) * 1983-10-26 1986-09-05 Radiotechnique Compelec Dispositif de connexion pour un semi-conducteur de puissance
JPS59108580A (ja) * 1983-11-17 1984-06-23 株式会社ソフイア 遊技装置の遊技情報管理媒体
JPS59108581A (ja) * 1983-11-17 1984-06-23 株式会社ソフイア カ−ド式パチンコ機
FR2557715B1 (fr) * 1983-12-30 1987-07-17 Bull Sa Procede et systeme pour traiter de facon confidentielle des informations stockees sur une piste d'enregistrement a lecture optique d'un support portatif
JPS60126864U (ja) * 1984-01-30 1985-08-26 共同印刷株式会社 Ｉｃカ−ド
JPS60126863U (ja) * 1984-01-30 1985-08-26 共同印刷株式会社 Ｉｃカ−ド
FR2575566B1 (fr) * 1984-12-28 1990-06-22 Bull Sa Procede pour personnaliser des supports portatifs tels que des cartes
FR2581480A1 (fr) * 1985-04-10 1986-11-07 Ebauches Electroniques Sa Unite electronique notamment pour carte a microcircuits et carte comprenant une telle unite
JPS61248184A (ja) * 1985-04-26 1986-11-05 Kyodo Printing Co Ltd Ｉｃモジユ−ル
JPS61188871U (nl) * 1985-05-16 1986-11-25
FR2584236B1 (fr) * 1985-06-26 1988-04-29 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
FR2584235B1 (fr) * 1985-06-26 1988-04-22 Bull Sa Procede de montage d'un circuit integre sur un support, dispositif en resultant et son application a une carte a microcircuits electroniques
FR2584862B1 (fr) * 1985-07-12 1988-05-20 Eurotechnique Sa Procede de fabrication en continu de micromodules pour cartes contenant des composants, bande continue de micromodules et micromodules realises selon un tel procede
DE3689094T2 (de) * 1985-07-27 1994-03-10 Dainippon Printing Co Ltd IC-Karte.
FR2590051B1 (fr) * 1985-11-08 1991-05-17 Eurotechnique Sa Carte comportant un composant et micromodule a contacts de flanc
FR2590052B1 (fr) * 1985-11-08 1991-03-01 Eurotechnique Sa Procede de recyclage d'une carte comportant un composant, carte prevue pour etre recyclee
US4755661A (en) * 1986-01-10 1988-07-05 Ruebsam Herrn H Connection of electronic components in a card
FR2599165A1 (fr) * 1986-05-21 1987-11-27 Michot Gerard Objet associe a un element electronique et procede d'obtention
JPS63185688A (ja) * 1987-01-29 1988-08-01 大日本印刷株式会社 Ｉｃカ−ドの製造方法
DE3723547C2 (de) * 1987-07-16 1996-09-26 Gao Ges Automation Org Trägerelement zum Einbau in Ausweiskarten
US4931623A (en) * 1987-11-14 1990-06-05 Kabushiki Kaisha Toshiba Portable storage medium
JPH01152098A (ja) * 1988-09-08 1989-06-14 Dainippon Printing Co Ltd Ｉｃカード用カード基材
DE3924439A1 (de) * 1989-07-24 1991-04-18 Edgar Schneider Traegerelement mit wenigstens einem integrierten schaltkreis, insbesondere zum einbau in chip-karten, sowie verfahren zur herstellung dieser traegerelemente
JP2543235B2 (ja) * 1990-06-29 1996-10-16 松下電器産業株式会社 Ｉｃカ―ドアダプタ
DE9100665U1 (de) * 1991-01-21 1992-07-16 TELBUS Gesellschaft für elektronische Kommunikations-Systeme mbH, 85391 Allershausen Trägerelement für integrierte Halbleiter-Schaltkreise, insbesondere zum Einbau in Chip-Karten
DE9113601U1 (de) * 1991-10-31 1993-03-04 Schneider, Edgar, 8057 Günzenhausen Multifunktionaler Schutzschild für mikroelektronische Schaltungen und Sensoren insbesondere für sog. Chip-Karten
DE4209184C1 (nl) * 1992-03-21 1993-05-19 Orga Kartensysteme Gmbh, 6072 Dreieich, De
JPH07164787A (ja) * 1992-03-26 1995-06-27 Dainippon Printing Co Ltd Ｉｃカードの製造方法
US5497140A (en) * 1992-08-12 1996-03-05 Micron Technology, Inc. Electrically powered postage stamp or mailing or shipping label operative with radio frequency (RF) communication
USRE42773E1 (en) 1992-06-17 2011-10-04 Round Rock Research, Llc Method of manufacturing an enclosed transceiver
US5776278A (en) 1992-06-17 1998-07-07 Micron Communications, Inc. Method of manufacturing an enclosed transceiver
DE4345610B4 (de) * 1992-06-17 2013-01-03 Micron Technology Inc. Verfahren zur Herstellung einer Hochfrequenz-Identifikationseinrichtung (HFID)
US7158031B2 (en) 1992-08-12 2007-01-02 Micron Technology, Inc. Thin, flexible, RFID label and system for use
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DE4340847A1 (de) * 1993-11-26 1995-06-01 Optosys Gmbh Berlin Chipmodul und Verfahren zur Herstellung eines Chipmoduls
JPH071877A (ja) * 1993-12-28 1995-01-06 Dainippon Printing Co Ltd カード記録方法
DE19539181C2 (de) * 1995-10-20 1998-05-14 Ods Gmbh & Co Kg Chipkartenmodul sowie entsprechendes Herstellungsverfahren
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US5988510A (en) * 1997-02-13 1999-11-23 Micron Communications, Inc. Tamper resistant smart card and method of protecting data in a smart card
DE19708617C2 (de) * 1997-03-03 1999-02-04 Siemens Ag Chipkartenmodul und Verfahren zu seiner Herstellung sowie diesen umfassende Chipkarte
US6329213B1 (en) 1997-05-01 2001-12-11 Micron Technology, Inc. Methods for forming integrated circuits within substrates
US6339385B1 (en) 1997-08-20 2002-01-15 Micron Technology, Inc. Electronic communication devices, methods of forming electrical communication devices, and communication methods
FR2769130B1 (fr) * 1997-09-30 2001-06-08 Thomson Csf Procede d'enrobage d'une puce electronique et carte electronique comportant au moins une puce enrobee selon ce procede
US6273339B1 (en) 1999-08-30 2001-08-14 Micron Technology, Inc. Tamper resistant smart card and method of protecting data in a smart card
US6427918B1 (en) * 2000-11-29 2002-08-06 Palm, Inc. Apparatus for storing auxiliary add-in cards for a portable electronic system

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4004133A (en) * 1974-12-30 1977-01-18 Rca Corporation Credit card containing electronic circuit
FR2299724A1 (fr) * 1975-01-29 1976-08-27 Honeywell Bull Soc Ind Perfectionnements aux supports de conditionnement de micro-plaquettes de circuits integres
FR2311406A1 (fr) * 1975-05-13 1976-12-10 Honeywell Bull Soc Ind Perfectionnements aux procedes de fabrication de supports de conditionnement de micro-plaquettes de circuits integres
JPS591463B2 (ja) * 1976-07-01 1984-01-12 鐘淵化学工業株式会社 起泡性組成物

Also Published As

Publication number Publication date
SE7614622L (sv) 1977-07-02
GB1567784A (en) 1980-05-21
NL7614637A (nl) 1977-07-04
JPS625894A (ja) 1987-01-12
DE2659573C2 (de) 1986-02-27
FR2337381B1 (nl) 1979-07-06
FR2337381A1 (fr) 1977-07-29
CH619310A5 (en) 1980-09-15
NL190131B (nl) 1993-06-01
IT1124741B (it) 1986-05-14
JPS6313840B2 (nl) 1988-03-28
NL190131C (nl) 1993-11-01
SE415304B (sv) 1980-09-22
CA1083714A (fr) 1980-08-12
ES454567A1 (es) 1977-12-16
JPS5283132A (en) 1977-07-11
DE2659573A1 (de) 1977-07-14
JPS6130315B2 (nl) 1986-07-12

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