BR7410982D0 - Camada intermediaria para dispositivos eletricos encerrados em capsulas - Google Patents

Camada intermediaria para dispositivos eletricos encerrados em capsulas

Info

Publication number
BR7410982D0
BR7410982D0 BR10982/74A BR1098274A BR7410982D0 BR 7410982 D0 BR7410982 D0 BR 7410982D0 BR 10982/74 A BR10982/74 A BR 10982/74A BR 1098274 A BR1098274 A BR 1098274A BR 7410982 D0 BR7410982 D0 BR 7410982D0
Authority
BR
Brazil
Prior art keywords
capsules
intermediate layer
electric devices
devices enclosed
enclosed
Prior art date
Application number
BR10982/74A
Other languages
English (en)
Portuguese (pt)
Inventor
G Voyles
W Davies
Original Assignee
Mallory & Co Inc P R
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mallory & Co Inc P R filed Critical Mallory & Co Inc P R
Publication of BR7410982D0 publication Critical patent/BR7410982D0/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12—Protection against corrosion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00—Constructional details common to different types of electric apparatus
    • H05K7/005—Constructional details common to different types of electric apparatus arrangements of circuit components without supporting structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
  • Insulating Bodies (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
BR10982/74A 1974-01-10 1974-12-30 Camada intermediaria para dispositivos eletricos encerrados em capsulas BR7410982D0 (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US05/432,181 US4001655A (en) 1974-01-10 1974-01-10 Compressible intermediate layer for encapsulated electrical devices

Publications (1)

Publication Number Publication Date
BR7410982D0 true BR7410982D0 (pt) 1975-04-01

Family

ID=23715083

Family Applications (1)

Application Number Title Priority Date Filing Date
BR10982/74A BR7410982D0 (pt) 1974-01-10 1974-12-30 Camada intermediaria para dispositivos eletricos encerrados em capsulas

Country Status (6)

Country Link
US (1) US4001655A (cg-RX-API-DMAC7.html)
BR (1) BR7410982D0 (cg-RX-API-DMAC7.html)
CA (1) CA1010978A (cg-RX-API-DMAC7.html)
DE (1) DE2500789A1 (cg-RX-API-DMAC7.html)
FR (1) FR2258083B3 (cg-RX-API-DMAC7.html)
GB (1) GB1493322A (cg-RX-API-DMAC7.html)

Families Citing this family (50)

* Cited by examiner, † Cited by third party
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DE2534232C3 (de) * 1975-07-29 1983-05-26 Westermann, Wolfgang, Dipl.-Ing., 6800 Mannheim In Epoxidharz eingebettete oder damit umhüllte regenerierfähige Kondensatoren und Verfahren zu ihrer Herstellung
NL7511173A (nl) * 1975-09-23 1977-03-25 Philips Nv Zelfregelend verwarmingselement.
US4118595A (en) * 1977-06-06 1978-10-03 Bell Telephone Laboratories, Incorporated Crossovers and method of fabrication
DE2728487C2 (de) * 1977-06-24 1987-04-23 Peter 7530 Pforzheim Hofsäss Verfahren zum Ummanteln eines Gehäuses eines elektrischen Bauelements mit Isolierstoff
US4326238A (en) * 1977-12-28 1982-04-20 Fujitsu Limited Electronic circuit packages
US4176142A (en) * 1978-05-22 1979-11-27 Western Electric Company, Inc. Powder coating composition
US4331970A (en) * 1978-09-18 1982-05-25 General Electric Company Use of dispersed solids as fillers in polymeric materials to provide material for semiconductor junction passivation
US4229403A (en) * 1979-02-01 1980-10-21 S&C Electric Company Method of assembling a fault limiter by molding a rigid housing about a non-rigid subassembly
US4273803A (en) * 1979-07-02 1981-06-16 Draloric Electronic Gmbh Process for covering or coating electrical components
JPS5717153A (en) * 1980-07-04 1982-01-28 Asahi Glass Co Ltd Sealing method of electronic parts
JPS6018145B2 (ja) * 1980-09-22 1985-05-09 株式会社日立製作所 樹脂封止型半導体装置
DE3231577A1 (de) * 1982-08-25 1984-03-01 Siemens AG, 1000 Berlin und 8000 München Umhuellter regenerierfaehiger elektrischer schichtkondensator
JPS61216417A (ja) * 1985-03-22 1986-09-26 利昌工業株式会社 コンデンサ
US4868637A (en) * 1985-11-26 1989-09-19 Clements James R Electronic device including uniaxial conductive adhesive and method of making same
US4720740A (en) * 1985-11-26 1988-01-19 Clements James R Electronic device including uniaxial conductive adhesive and method of making same
NL8602642A (nl) * 1986-10-22 1988-05-16 Philips Nv Elektronische component zonder aansluitdraden, droge elektrolytische condensator en werkwijze voor een vervaardiging daarvan.
US4780796A (en) * 1987-01-13 1988-10-25 The Japan Carlit Co., Ltd. Solid electrolytic capacitor
US4804805A (en) * 1987-12-21 1989-02-14 Therm-O-Disc, Incorporated Protected solder connection and method
US4891734A (en) * 1988-06-15 1990-01-02 Quantum Solutions, Inc. Vibration mount for electronic assemblies
US5130780A (en) * 1989-02-07 1992-07-14 Fujitsu Limited Dual in-line packaging with improved moisture resistance
US5219795A (en) * 1989-02-07 1993-06-15 Fujitsu Limited Dual in-line packaging and method of producing the same
US5030796A (en) * 1989-08-11 1991-07-09 Rockwell International Corporation Reverse-engineering resistant encapsulant for microelectric device
US5300459A (en) * 1989-12-28 1994-04-05 Sanken Electric Co., Ltd. Method for reducing thermal stress in an encapsulated integrated circuit package
US5287247A (en) * 1990-09-21 1994-02-15 Lsi Logic Corporation Computer system module assembly
US5307508A (en) * 1991-05-13 1994-04-26 Motorola, Inc. Shock isolation for selective call receivers
US5153368A (en) * 1991-05-28 1992-10-06 Ici Americas, Inc. Filtered electrical connection assembly using potted ferrite element
GB9116523D0 (en) * 1991-07-31 1991-09-11 Raychem Sa Nv Electrical component
US5886400A (en) * 1995-08-31 1999-03-23 Motorola, Inc. Semiconductor device having an insulating layer and method for making
JPH09155918A (ja) * 1995-12-07 1997-06-17 Matsushita Electric Ind Co Ltd 樹脂封止電子製品の製造方法
US6079332A (en) * 1996-11-01 2000-06-27 The Ensign-Bickford Company Shock-resistant electronic circuit assembly
AU752691B2 (en) * 1997-10-09 2002-09-26 Detnet South Africa (Pty) Ltd Shock-resistant electronic circuit assembly
JP3355122B2 (ja) 1998-01-08 2002-12-09 富士通株式会社 光モジュールの封止方法
US6087200A (en) * 1998-08-13 2000-07-11 Clear Logic, Inc. Using microspheres as a stress buffer for integrated circuit prototypes
US6324051B1 (en) * 1999-10-29 2001-11-27 Matsushita Electric Industrial Co., Ltd. Solid electrolytic capacitor
DE10026257A1 (de) * 2000-05-26 2001-12-06 Epcos Ag Elektrisches Bauelement und Verfahren zu dessen Herstellung
DE10042636C1 (de) * 2000-08-30 2002-04-11 Epcos Ag Elektrisches Bauelement und Verfahren zu dessen Herstellung
DE10062293A1 (de) * 2000-12-14 2002-07-04 Epcos Ag Elektrisches Bauelement und Verfahren zu dessen Herstellung
KR100471193B1 (ko) * 2002-09-18 2005-03-10 스마트전자 주식회사 보호막이 형성된 소자와 그 보호막 형성방법
DE10303449B4 (de) * 2003-01-29 2007-04-26 Siemens Ag Verfahren zum Umhüllen eines elektronischen Bauelementes
US6970360B2 (en) * 2004-03-18 2005-11-29 International Business Machines Corporation Tamper-proof enclosure for a circuit card
DE102007051870A1 (de) * 2007-10-30 2009-05-07 Robert Bosch Gmbh Modulgehäuse und Verfahren zur Herstellung eines Modulgehäuses
JP4964102B2 (ja) * 2007-11-26 2012-06-27 三洋電機株式会社 固体電解コンデンサ
KR101146343B1 (ko) * 2008-03-18 2012-05-21 다이요 유덴 가부시키가이샤 전기화학 디바이스
JP5274340B2 (ja) * 2009-03-31 2013-08-28 三洋電機株式会社 固体電解コンデンサ
JP2012051609A (ja) * 2010-08-31 2012-03-15 Furuno Electric Co Ltd 断熱庫、航海データ記録ユニット及び航海データ記録装置
US9236192B2 (en) * 2013-08-15 2016-01-12 Avx Corporation Moisture resistant solid electrolytic capacitor assembly
KR20200127181A (ko) * 2018-03-30 2020-11-10 에이브이엑스 코포레이션 장벽층을 구비하는 슈퍼 커패시터 어셈블리
WO2020179170A1 (ja) * 2019-03-05 2020-09-10 株式会社村田製作所 電解コンデンサ
KR102700118B1 (ko) 2019-04-25 2024-08-28 교세라 에이브이엑스 컴포넌츠 (방콕) 리미티드 고체 전해 콘덴서
WO2024226808A2 (en) * 2023-04-25 2024-10-31 Simplifyber, Inc. Soft goods from a system of molding and pressing using a slurry containing fibers with a second element at least partially embedded therein

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Publication number Priority date Publication date Assignee Title
GB910063A (en) * 1960-03-09 1962-11-07 Westinghouse Electric Corp Semi-conductor devices
US3152293A (en) * 1960-12-16 1964-10-06 Ruben Samuel Sealed semiconductor device and mounting means therefor
US3254282A (en) * 1963-12-18 1966-05-31 Gen Electric Encapsulated electrical capacitor
US3440589A (en) * 1966-04-01 1969-04-22 Brunswick Corp Resistor unit and method of making same
DE1614587B2 (de) * 1967-08-24 1976-05-13 Siemens AG, 1000 Berlin und 8000 München Gehaeuse fuer ein halbleiterbauelement
US3670091A (en) * 1971-05-20 1972-06-13 Sqrague Electric Co Encapsulated electrical components with protective pre-coat containing collapsible microspheres
US3824328A (en) * 1972-10-24 1974-07-16 Texas Instruments Inc Encapsulated ptc heater packages

Also Published As

Publication number Publication date
GB1493322A (en) 1977-11-30
FR2258083B3 (cg-RX-API-DMAC7.html) 1977-09-30
FR2258083A1 (cg-RX-API-DMAC7.html) 1975-08-08
US4001655A (en) 1977-01-04
DE2500789A1 (de) 1975-07-17
CA1010978A (en) 1977-05-24

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