BR112021017538A2 - Composição de resina para uso de solda, composição de solda, fluxo de solda com núcleo, fluxo e pasta de solda - Google Patents
Composição de resina para uso de solda, composição de solda, fluxo de solda com núcleo, fluxo e pasta de soldaInfo
- Publication number
- BR112021017538A2 BR112021017538A2 BR112021017538A BR112021017538A BR112021017538A2 BR 112021017538 A2 BR112021017538 A2 BR 112021017538A2 BR 112021017538 A BR112021017538 A BR 112021017538A BR 112021017538 A BR112021017538 A BR 112021017538A BR 112021017538 A2 BR112021017538 A2 BR 112021017538A2
- Authority
- BR
- Brazil
- Prior art keywords
- solder
- flux
- composition
- resin
- soldering
- Prior art date
Links
- 229910000679 solder Inorganic materials 0.000 title abstract 9
- 230000004907 flux Effects 0.000 title abstract 6
- 239000011342 resin composition Substances 0.000 title abstract 6
- 238000005476 soldering Methods 0.000 title abstract 6
- 239000000203 mixture Substances 0.000 title abstract 3
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 abstract 3
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 abstract 3
- 229920005989 resin Polymers 0.000 abstract 3
- 239000011347 resin Substances 0.000 abstract 3
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 abstract 3
- 239000004925 Acrylic resin Substances 0.000 abstract 2
- 229920000178 Acrylic resin Polymers 0.000 abstract 2
- 238000004949 mass spectrometry Methods 0.000 abstract 2
- 229920005678 polyethylene based resin Polymers 0.000 abstract 2
- 229920005673 polypropylene based resin Polymers 0.000 abstract 2
- 230000001351 cycling effect Effects 0.000 abstract 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/3612—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest with organic compounds as principal constituents
- B23K35/3613—Polymers, e.g. resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/10—Homopolymers or copolymers of methacrylic acid esters
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0244—Powders, particles or spheres; Preforms made therefrom
- B23K35/025—Pastes, creams, slurries
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/36—Selection of non-metallic compositions, e.g. coatings, fluxes; Selection of soldering or welding materials, conjoint with selection of non-metallic compositions, both selections being of interest
- B23K35/362—Selection of compositions of fluxes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/04—Homopolymers or copolymers of ethene
- C08L23/06—Polyethene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L23/00—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers
- C08L23/02—Compositions of homopolymers or copolymers of unsaturated aliphatic hydrocarbons having only one carbon-to-carbon double bond; Compositions of derivatives of such polymers not modified by chemical after-treatment
- C08L23/10—Homopolymers or copolymers of propene
- C08L23/12—Polypropene
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L33/00—Compositions of homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and only one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides or nitriles thereof; Compositions of derivatives of such polymers
- C08L33/04—Homopolymers or copolymers of esters
- C08L33/06—Homopolymers or copolymers of esters of esters containing only carbon, hydrogen and oxygen, which oxygen atoms are present only as part of the carboxyl radical
- C08L33/08—Homopolymers or copolymers of acrylic acid esters
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L93/00—Compositions of natural resins; Compositions of derivatives thereof
- C08L93/04—Rosin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/08—Non-ferrous metals or alloys
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Organic Chemistry (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
composição de resina para uso de solda, composição de solda, fluxo de solda com núcleo, fluxo e pasta de solda. são fornecidos: uma composição de resina para uso em soldagem, que tem excelente compatibilidade com uma resina à base de colofónia e excelente confiabilidade de ciclo de temperatura e, portanto, é adequada para um fluxo para uso em soldagem; e uma composição de solda e um fluxo de solda com núcleo, em cada uma das quais a composição de resina para uso de solda é usada. a composição de resina para uso de solda compreende: uma resina acrílica tendo um peso molecular médio numérico de 500 ou mais e menos do que 2.000 conforme determinado por espectrometria de massa usando um espectrômetro de massa de tempo de voo; e uma resina à base de colofónia, uma resina à base de polietileno ou uma resina à base de polipropileno. alternativamente, a composição de resina para uso de solda compreende: uma resina acrílica com um peso molecular médio ponderal de 500 ou mais e menos do que 2000, conforme determinado por espectrometria de massa usando um espectrômetro de massa de tempo de voo; e uma resina à base de colofónia, uma resina à base de polietileno ou uma resina à base de polipropileno.
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2019068336A JP6638840B1 (ja) | 2019-03-29 | 2019-03-29 | フラックス及びソルダペースト |
JP2019068335A JP6638839B1 (ja) | 2019-03-29 | 2019-03-29 | はんだ付け用樹脂組成物、はんだ組成物及びやに入りはんだ |
JP2019068337A JP6638841B1 (ja) | 2019-03-29 | 2019-03-29 | フラックス及びソルダペースト |
PCT/JP2020/014082 WO2020203794A1 (ja) | 2019-03-29 | 2020-03-27 | はんだ付け用樹脂組成物、はんだ組成物及びやに入りはんだ、フラックス及びソルダペースト |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112021017538A2 true BR112021017538A2 (pt) | 2021-11-09 |
Family
ID=72668150
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112021017538A BR112021017538A2 (pt) | 2019-03-29 | 2020-03-27 | Composição de resina para uso de solda, composição de solda, fluxo de solda com núcleo, fluxo e pasta de solda |
Country Status (8)
Country | Link |
---|---|
US (1) | US20220127445A1 (pt) |
EP (1) | EP3950983A4 (pt) |
CN (1) | CN113614259B (pt) |
BR (1) | BR112021017538A2 (pt) |
MX (1) | MX2021010426A (pt) |
MY (1) | MY197995A (pt) |
TW (1) | TWI720859B (pt) |
WO (1) | WO2020203794A1 (pt) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP3834980B1 (de) * | 2019-12-10 | 2023-02-22 | Heraeus Deutschland GmbH & Co. KG | Lotpaste |
Family Cites Families (17)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS59193993A (ja) * | 1983-04-19 | 1984-11-02 | Ube Ind Ltd | 石炭脱灰装置 |
JPS61199598A (ja) * | 1985-02-28 | 1986-09-04 | Sony Corp | はんだ付用フラツクス及びクリ−ムはんだ |
JP3619972B2 (ja) * | 1995-10-27 | 2005-02-16 | 日本アルミット株式会社 | はんだ付用フラックス組成物 |
JP3378139B2 (ja) * | 1996-03-19 | 2003-02-17 | 株式会社デンソー | はんだ付け用のフラックス |
JP2000029212A (ja) * | 1998-07-10 | 2000-01-28 | Taiyo Ink Mfg Ltd | 光硬化性・熱硬化性樹脂組成物及び樹脂絶縁パターン形成方法 |
JP2002224881A (ja) * | 2001-02-05 | 2002-08-13 | Hitachi Metals Ltd | はんだボール |
JP2006181637A (ja) * | 2004-12-03 | 2006-07-13 | Tamura Seisakusho Co Ltd | フラックス及びこれを用いたはんだ付方法 |
JP5289328B2 (ja) | 2007-01-04 | 2013-09-11 | フライズ・メタルズ・インコーポレイテッド | フラックス配合物 |
TW200846429A (en) * | 2007-03-22 | 2008-12-01 | Arakawa Chem Ind | Polymelyzed rosin, polymerized rosin ester, these hydride, manufacturing process thereof, soldering flux, solder paste, tackifier resin, tackifier resin emulsion, and adhesive composition of matter |
EP2243592B1 (en) * | 2008-02-22 | 2020-04-01 | Harima Chemicals, Inc. | Solder bonding structure and solder paste |
JP5486282B2 (ja) * | 2009-12-08 | 2014-05-07 | 荒川化学工業株式会社 | はんだペースト用フラックス及びはんだペースト |
JP5486281B2 (ja) * | 2009-12-08 | 2014-05-07 | 荒川化学工業株式会社 | はんだペースト |
JP2012004347A (ja) * | 2010-06-17 | 2012-01-05 | Harima Chem Inc | はんだバンプ形成方法 |
JP2016150344A (ja) * | 2015-02-16 | 2016-08-22 | 三菱マテリアル株式会社 | ハンダペースト用水溶性フラックス及びハンダペースト |
WO2016136982A1 (ja) * | 2015-02-27 | 2016-09-01 | 株式会社クラレ | (メタ)アクリル系重合体組成物およびその製造方法 |
JP6176417B2 (ja) * | 2015-02-27 | 2017-08-09 | 千住金属工業株式会社 | フラックス |
JP6460198B1 (ja) | 2017-10-11 | 2019-01-30 | 千住金属工業株式会社 | フラックス及びソルダペースト |
-
2020
- 2020-03-27 WO PCT/JP2020/014082 patent/WO2020203794A1/ja unknown
- 2020-03-27 EP EP20784202.2A patent/EP3950983A4/en active Pending
- 2020-03-27 MY MYPI2021004455A patent/MY197995A/en unknown
- 2020-03-27 US US17/429,724 patent/US20220127445A1/en active Pending
- 2020-03-27 BR BR112021017538A patent/BR112021017538A2/pt unknown
- 2020-03-27 MX MX2021010426A patent/MX2021010426A/es unknown
- 2020-03-27 CN CN202080022611.XA patent/CN113614259B/zh active Active
- 2020-03-27 TW TW109110690A patent/TWI720859B/zh active
Also Published As
Publication number | Publication date |
---|---|
TW202100277A (zh) | 2021-01-01 |
CN113614259B (zh) | 2022-07-05 |
US20220127445A1 (en) | 2022-04-28 |
MY197995A (en) | 2023-07-25 |
TWI720859B (zh) | 2021-03-01 |
EP3950983A1 (en) | 2022-02-09 |
CN113614259A (zh) | 2021-11-05 |
WO2020203794A1 (ja) | 2020-10-08 |
EP3950983A4 (en) | 2023-04-19 |
MX2021010426A (es) | 2021-09-14 |
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B06W | Patent application suspended after preliminary examination (for patents with searches from other patent authorities) chapter 6.23 patent gazette] | ||
B07A | Application suspended after technical examination (opinion) [chapter 7.1 patent gazette] |