BR112018009890A2 - composição de resina para encapsulação, e dispositivo semicondutor - Google Patents
composição de resina para encapsulação, e dispositivo semicondutorInfo
- Publication number
- BR112018009890A2 BR112018009890A2 BR112018009890-6A BR112018009890A BR112018009890A2 BR 112018009890 A2 BR112018009890 A2 BR 112018009890A2 BR 112018009890 A BR112018009890 A BR 112018009890A BR 112018009890 A2 BR112018009890 A2 BR 112018009890A2
- Authority
- BR
- Brazil
- Prior art keywords
- resin composition
- silica
- encapsulation
- semiconductor device
- ga2o3
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
- H01L23/293—Organic, e.g. plastic
- H01L23/295—Organic, e.g. plastic containing a filler
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/34—Silicon-containing compounds
- C08K3/36—Silica
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L101/00—Compositions of unspecified macromolecular compounds
- C08L101/02—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups
- C08L101/025—Compositions of unspecified macromolecular compounds characterised by the presence of specified groups, e.g. terminal or pendant functional groups containing nitrogen atoms
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L79/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing nitrogen with or without oxygen or carbon only, not provided for in groups C08L61/00 - C08L77/00
- C08L79/04—Polycondensates having nitrogen-containing heterocyclic rings in the main chain; Polyhydrazides; Polyamide acids or similar polyimide precursors
- C08L79/08—Polyimides; Polyester-imides; Polyamide-imides; Polyamide acids or similar polyimide precursors
- C08L79/085—Unsaturated polyimide precursors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
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- H—ELECTRICITY
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- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
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- H01L23/00—Details of semiconductor or other solid state devices
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- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
- H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
- H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
- H01L23/3128—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation the substrate having spherical bumps for external connection
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0856—Iron
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0862—Nickel
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- C—CHEMISTRY; METALLURGY
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- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
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- C08K2003/0881—Titanium
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K2201/00—Specific properties of additives
- C08K2201/002—Physical properties
- C08K2201/005—Additives being defined by their particle size in general
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2203/00—Applications
- C08L2203/20—Applications use in electrical or conductive gadgets
- C08L2203/206—Applications use in electrical or conductive gadgets use in coating or encapsulating of electronic parts
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2205/00—Polymer mixtures characterised by other features
- C08L2205/02—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group
- C08L2205/025—Polymer mixtures characterised by other features containing two or more polymers of the same C08L -group containing two or more polymers of the same hierarchy C08L, and differing only in parameters such as density, comonomer content, molecular weight, structure
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- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
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- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
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- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
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- H01L2224/481—Disposition
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- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
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- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10254—Diamond [C]
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- H01L2924/1033—Gallium nitride [GaN]
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15311—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a ball array, e.g. BGA
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- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
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Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Abstract
a composição de resina de vedação é usada para vedar um elemento semicondutor de potência formado de sic, gan, ga2o3, ou diamante, e contém a resina termocurável (a) e sílica (b) em que a sílica (b) contém fe, a quantidade contida de fe é não mais do que 220 ppm com respeito à quantidade total da sílica (b), e a sílica (b) é granular, semelhante a comprimido, ou semelhante à folha.
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2015254082 | 2015-12-25 | ||
JP2015-254082 | 2015-12-25 | ||
PCT/JP2016/085165 WO2017110373A1 (ja) | 2015-12-25 | 2016-11-28 | 封止用樹脂組成物、および半導体装置 |
Publications (2)
Publication Number | Publication Date |
---|---|
BR112018009890A2 true BR112018009890A2 (pt) | 2018-11-13 |
BR112018009890B1 BR112018009890B1 (pt) | 2022-01-18 |
Family
ID=59089296
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112018009890-6A BR112018009890B1 (pt) | 2015-12-25 | 2016-11-28 | Composição de resina para encapsulação, e dispositivo semicondutor |
Country Status (9)
Country | Link |
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US (1) | US10262914B2 (pt) |
EP (1) | EP3395907B1 (pt) |
JP (1) | JP6168259B1 (pt) |
KR (1) | KR101947334B1 (pt) |
CN (1) | CN108473777B (pt) |
BR (1) | BR112018009890B1 (pt) |
HU (1) | HUE052360T2 (pt) |
TW (1) | TW201731935A (pt) |
WO (1) | WO2017110373A1 (pt) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2018168715A1 (ja) * | 2017-03-13 | 2018-09-20 | リンテック株式会社 | 樹脂組成物及び樹脂シート |
TWI758489B (zh) * | 2017-06-30 | 2022-03-21 | 日商琳得科股份有限公司 | 樹脂組成物及樹脂薄片 |
TWI765028B (zh) * | 2017-06-30 | 2022-05-21 | 日商琳得科股份有限公司 | 樹脂薄片、層合體及樹脂薄片的製造方法 |
JP2019116532A (ja) * | 2017-12-26 | 2019-07-18 | 京セラ株式会社 | 封止成形材料用組成物及び電子部品装置 |
FR3136889A1 (fr) * | 2022-06-15 | 2023-12-22 | Safran | Matériau diélectrique composite et module de puissance comprenant une couche d’encapsulation formée d’un tel matériau |
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JPH04175358A (ja) | 1990-11-08 | 1992-06-23 | Mitsubishi Kasei Corp | 半導体封止用樹脂組成物 |
JP2542797B2 (ja) | 1994-09-29 | 1996-10-09 | 日本化学工業株式会社 | 高純度シリカの製造方法 |
JPH11322816A (ja) | 1998-03-11 | 1999-11-26 | Hitachi Chem Co Ltd | 樹脂ペースト組成物及びこれを用いた半導体装置 |
US6555602B1 (en) * | 1999-10-06 | 2003-04-29 | Nitto Denko Corporation | Composition of epoxy resin, anhydride and microcapsule accelerator |
JP4614214B2 (ja) * | 1999-12-02 | 2011-01-19 | 信越化学工業株式会社 | 半導体装置素子用中空パッケージ |
JP4022640B2 (ja) | 2001-11-20 | 2007-12-19 | 東ソー株式会社 | 塊状高純度シリカ及びその製造方法 |
JP5330644B2 (ja) * | 2006-12-01 | 2013-10-30 | 株式会社日本触媒 | 表面処理されたシリカ粒子 |
US8235870B2 (en) * | 2008-08-15 | 2012-08-07 | Phresh, Llc | Method and apparatus for integrating physical exercise and interactive multimedia |
KR101453729B1 (ko) * | 2009-10-20 | 2014-10-22 | 가부시기가이샤 닛뽕쇼꾸바이 | 비정질 실리카 및 그 제조방법 |
JP2012089750A (ja) * | 2010-10-21 | 2012-05-10 | Hitachi Chem Co Ltd | 半導体封止充てん用熱硬化性樹脂組成物及び半導体装置 |
JP5733743B2 (ja) * | 2010-12-15 | 2015-06-10 | 日東電工株式会社 | 光半導体装置 |
JP6251575B2 (ja) | 2013-01-23 | 2017-12-20 | 日東電工株式会社 | シート状の電子部品封止用熱硬化性樹脂組成物、樹脂封止型半導体装置、及び樹脂封止型半導体装置の製造方法 |
JP6315368B2 (ja) | 2013-09-11 | 2018-04-25 | パナソニックIpマネジメント株式会社 | 半導体封止用エポキシ樹脂組成物および半導体装置 |
WO2015037349A1 (ja) | 2013-09-13 | 2015-03-19 | 富士電機株式会社 | 半導体装置 |
JP2015101668A (ja) | 2013-11-26 | 2015-06-04 | 住友ベークライト株式会社 | 半導体封止用樹脂組成物および半導体装置 |
JP6311399B2 (ja) | 2014-03-28 | 2018-04-18 | 三菱ケミカル株式会社 | 熱硬化性樹脂組成物、およびその成形体 |
WO2016120953A1 (ja) | 2015-01-26 | 2016-08-04 | セントラル硝子株式会社 | 半導体封止用硬化性樹脂組成物およびその硬化物、並びにこれらを用いた半導体装置 |
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2016
- 2016-11-28 US US15/775,275 patent/US10262914B2/en active Active
- 2016-11-28 BR BR112018009890-6A patent/BR112018009890B1/pt active IP Right Grant
- 2016-11-28 CN CN201680076081.0A patent/CN108473777B/zh active Active
- 2016-11-28 HU HUE16878267A patent/HUE052360T2/hu unknown
- 2016-11-28 KR KR1020187017378A patent/KR101947334B1/ko active IP Right Grant
- 2016-11-28 JP JP2017512398A patent/JP6168259B1/ja active Active
- 2016-11-28 EP EP16878267.0A patent/EP3395907B1/en active Active
- 2016-11-28 WO PCT/JP2016/085165 patent/WO2017110373A1/ja active Application Filing
- 2016-12-01 TW TW105139607A patent/TW201731935A/zh unknown
Also Published As
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JPWO2017110373A1 (ja) | 2017-12-28 |
EP3395907B1 (en) | 2020-08-05 |
CN108473777A (zh) | 2018-08-31 |
US20180337105A1 (en) | 2018-11-22 |
HUE052360T2 (hu) | 2021-04-28 |
JP6168259B1 (ja) | 2017-07-26 |
EP3395907A4 (en) | 2019-08-14 |
US10262914B2 (en) | 2019-04-16 |
BR112018009890B1 (pt) | 2022-01-18 |
KR101947334B1 (ko) | 2019-02-12 |
CN108473777B (zh) | 2020-11-17 |
KR20180075690A (ko) | 2018-07-04 |
WO2017110373A1 (ja) | 2017-06-29 |
TW201731935A (zh) | 2017-09-16 |
EP3395907A1 (en) | 2018-10-31 |
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