BR112016029470A2 - cabeçote de acabamento - Google Patents
cabeçote de acabamentoInfo
- Publication number
- BR112016029470A2 BR112016029470A2 BR112016029470A BR112016029470A BR112016029470A2 BR 112016029470 A2 BR112016029470 A2 BR 112016029470A2 BR 112016029470 A BR112016029470 A BR 112016029470A BR 112016029470 A BR112016029470 A BR 112016029470A BR 112016029470 A2 BR112016029470 A2 BR 112016029470A2
- Authority
- BR
- Brazil
- Prior art keywords
- liquid
- optical unit
- unit
- coupling
- optical
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/1462—Nozzles; Features related to nozzles
- B23K26/1464—Supply to, or discharge from, nozzles of media, e.g. gas, powder, wire
- B23K26/1476—Features inside the nozzle for feeding the fluid stream through the nozzle
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/04—Automatically aligning, aiming or focusing the laser beam, e.g. using the back-scattered light
- B23K26/042—Automatically aligning the laser beam
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
- B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
a presente invenção refere-se a um cabeçote de acabamento (1) para o acoplamento de um feixe de laser (100) em um jato líquido (200). esse cabeçote de acabamento (1) compreende uma unidade óptica (2) com pelo menos um elemento óptico (20, 20.1, ... 21.4) para a focagem do feixe de laser (100) e uma unidade de acoplamento (3) com uma câmara de líquido (32) limitada por uma parede, sendo que, na parede está disposto um bocal (33) com uma abertura de bocal (37) para a produção de um jato líquido (200). em um estado da unidade de acoplamento (3), ligada com a unidade óptica (2), o feixe de laser (100), que pode ser focado através da unidade óptica (2), pode ser direcionado em uma direção do feixe através da câmara de líquido (32) da unidade de acoplamento (3) para a abertura de bocal (37) e pode ser acoplado no jato líquido (200), produzível pelo bocal (33), passando na direção do feixe. para a alimentação da câmara de líquido (32) com líquido da unidade óptica (2) é formada uma interface de líquido (50) entre a unidade óptica (2) e a unidade de acoplamento (3), sendo que, no estado da unidade de acoplamento (3), ligada com a unidade óptica (2), visto na direção do feixe, a interface de líquido (50) está disposta antes, visto na direção do feixe, do elemento óptico (20, 21.4) da unidade óptica (2).
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP14405051.5A EP2957378A1 (de) | 2014-06-16 | 2014-06-16 | Bearbeitungskopf zum Einkopplen eines Laserstrahles in einem Flüssigkeitsstrahl mit einer Flüssigkeitschnittstelle |
PCT/CH2015/000088 WO2015192255A2 (de) | 2014-06-16 | 2015-06-12 | Bearbeitungskopf |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112016029470A2 true BR112016029470A2 (pt) | 2017-08-22 |
Family
ID=51167838
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112016029470A BR112016029470A2 (pt) | 2014-06-16 | 2015-06-12 | cabeçote de acabamento |
Country Status (9)
Country | Link |
---|---|
US (1) | US10780527B2 (pt) |
EP (2) | EP2957378A1 (pt) |
JP (2) | JP2017523048A (pt) |
KR (2) | KR102260607B1 (pt) |
CN (1) | CN107073647B (pt) |
BR (1) | BR112016029470A2 (pt) |
CA (1) | CA2984574C (pt) |
RU (1) | RU2701697C2 (pt) |
WO (1) | WO2015192255A2 (pt) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103203543B (zh) * | 2013-02-04 | 2015-03-11 | 中国航空工业集团公司北京航空制造工程研究所 | 一种用于激光冲击强化叶片的水约束层的喷射方法和装置 |
DE102016116512A1 (de) | 2016-09-03 | 2018-03-08 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Verfahren und Vorrichtung zur Bearbeitung eines Werkstückes |
EP3466597A1 (en) * | 2017-10-05 | 2019-04-10 | Synova S.A. | Apparatus for machining a workpiece with a laser beam |
EP3513898A1 (en) * | 2018-01-19 | 2019-07-24 | Synova S.A. | Apparatus for automatic jet angle adjustment |
EP3533557B1 (en) | 2018-03-01 | 2021-05-26 | Synova S.A. | Apparatus for machining a workpiece with a laser beam coupled into a fluid jet, with automatic laser-nozzle alignment ; method of aligning such a beam |
US11433476B2 (en) | 2018-04-23 | 2022-09-06 | Lsp Technologies, Inc. | Apparatus for laser peening hidden surfaces |
JP6852031B2 (ja) * | 2018-09-26 | 2021-03-31 | 株式会社東芝 | 溶接装置及びノズル装置 |
US11478878B2 (en) * | 2018-09-28 | 2022-10-25 | Synfuel Americas Corporation | Laser cutting system for cutting articles and forming filtration tubes |
DE102019103659B4 (de) * | 2019-02-13 | 2023-11-30 | Bystronic Laser Ag | Gasführung, Laserschneidkopf und Laserschneidmaschine |
JP7303053B2 (ja) * | 2019-07-17 | 2023-07-04 | ファナック株式会社 | 調整補助具及びレーザ溶接装置 |
Family Cites Families (37)
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US4078165A (en) * | 1976-05-03 | 1978-03-07 | Grumman Aerospace Corporation | Semi-automatic feed laser apparatus |
JPS6033893A (ja) * | 1983-08-02 | 1985-02-21 | Matsushita Electric Ind Co Ltd | レ−ザ加工装置 |
DE3339318C2 (de) * | 1983-10-29 | 1995-05-24 | Trumpf Gmbh & Co | Laser-Bearbeitungsmaschine |
FR2676913B1 (fr) * | 1991-05-28 | 1993-08-13 | Lasag Ag | Dispositif d'ablation de matiere, notamment pour la dentisterie. |
DE4418845C5 (de) * | 1994-05-30 | 2012-01-05 | Synova S.A. | Verfahren und Vorrichtung zur Materialbearbeitung mit Hilfe eines Laserstrahls |
RU2089365C1 (ru) * | 1995-07-06 | 1997-09-10 | Кумертауское авиационное производственное предприятие | Способ газолазерной резки металлических материалов и устройство для осуществления способа |
JPH10328867A (ja) * | 1997-06-05 | 1998-12-15 | Mitsubishi Electric Corp | レーザビーム加工装置およびレーザビーム加工装置用の焦点位置決め治具およびレーザビーム集光直径測定治具 |
CN1134322C (zh) * | 1998-04-30 | 2004-01-14 | 辛诺瓦有限公司 | 采用并入液体射流中的激光束的材料加工装置及方法 |
JP2000334590A (ja) * | 1999-05-24 | 2000-12-05 | Amada Eng Center Co Ltd | レーザ加工装置の加工ヘッド |
US6653593B2 (en) * | 1999-10-08 | 2003-11-25 | Nanovia, Lp | Control system for ablating high-density array of vias or indentation in surface of object |
JP2001276988A (ja) * | 2000-03-30 | 2001-10-09 | Mitsubishi Heavy Ind Ltd | レーザ加工装置 |
JP3484396B2 (ja) * | 2000-05-09 | 2004-01-06 | 新光電気工業株式会社 | ウェハーの切断方法 |
US6777641B2 (en) * | 2002-04-16 | 2004-08-17 | W.A. Whitney Co. | Method and apparatus for laser piercing and cutting metal sheet and plate |
US6987240B2 (en) * | 2002-04-18 | 2006-01-17 | Applied Materials, Inc. | Thermal flux processing by scanning |
DE102004038310A1 (de) * | 2004-08-05 | 2006-02-23 | Kuka Schweissanlagen Gmbh | Lasereinrichtung und Betriebsverfahren |
JP4741822B2 (ja) * | 2004-09-02 | 2011-08-10 | ルネサスエレクトロニクス株式会社 | 半導体装置の製造方法 |
EP1657020A1 (de) * | 2004-11-10 | 2006-05-17 | Synova S.A. | Verfahren und Vorrichtung zur Optimierung der Kohärenz eines Flüssigkeitsstrahls für eine Materialbearbeitung und Flüssigkeitsdüse für eine solche Vorrichtung |
ATE446159T1 (de) * | 2005-05-31 | 2009-11-15 | Trumpf Werkzeugmaschinen Gmbh | Laserbearbeitungsmaschine mit laserbearbeitungsdüsenjustierung zum ausrichten des laserstrahles mit der laserbearbeitungsdüsenbohrung |
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JP5326183B2 (ja) | 2005-10-14 | 2013-10-30 | 澁谷工業株式会社 | レーザアニール方法 |
KR101414867B1 (ko) | 2006-06-26 | 2014-07-03 | 오르보테크 엘티디. | 인쇄 회로 기판 타깃의 정렬 |
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-
2014
- 2014-06-16 EP EP14405051.5A patent/EP2957378A1/de not_active Withdrawn
-
2015
- 2015-06-12 BR BR112016029470A patent/BR112016029470A2/pt not_active Application Discontinuation
- 2015-06-12 KR KR1020207036341A patent/KR102260607B1/ko active IP Right Grant
- 2015-06-12 KR KR1020177001235A patent/KR20170015514A/ko active Application Filing
- 2015-06-12 JP JP2016573852A patent/JP2017523048A/ja active Pending
- 2015-06-12 CN CN201580044055.5A patent/CN107073647B/zh active Active
- 2015-06-12 CA CA2984574A patent/CA2984574C/en active Active
- 2015-06-12 EP EP15731240.6A patent/EP3154741B1/de active Active
- 2015-06-12 WO PCT/CH2015/000088 patent/WO2015192255A2/de active Application Filing
- 2015-06-12 US US15/319,213 patent/US10780527B2/en active Active
- 2015-06-12 RU RU2017101078A patent/RU2701697C2/ru active
-
2019
- 2019-06-26 JP JP2019118626A patent/JP6825047B2/ja active Active
Also Published As
Publication number | Publication date |
---|---|
CN107073647B (zh) | 2020-01-21 |
EP2957378A1 (de) | 2015-12-23 |
EP3154741A2 (de) | 2017-04-19 |
JP6825047B2 (ja) | 2021-02-03 |
CA2984574C (en) | 2022-08-23 |
CA2984574A1 (en) | 2015-12-23 |
RU2701697C2 (ru) | 2019-09-30 |
RU2017101078A3 (pt) | 2019-01-25 |
CN107073647A (zh) | 2017-08-18 |
JP2019155480A (ja) | 2019-09-19 |
US20170182593A1 (en) | 2017-06-29 |
JP2017523048A (ja) | 2017-08-17 |
KR20170015514A (ko) | 2017-02-08 |
WO2015192255A3 (de) | 2016-02-11 |
EP3154741B1 (de) | 2020-04-15 |
US10780527B2 (en) | 2020-09-22 |
WO2015192255A2 (de) | 2015-12-23 |
RU2017101078A (ru) | 2018-07-16 |
KR102260607B1 (ko) | 2021-06-04 |
KR20200143749A (ko) | 2020-12-24 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B11A | Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing | ||
B11Y | Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette] |