BR112016023676A2 - pó de sinterização com baixa pressão - Google Patents
pó de sinterização com baixa pressãoInfo
- Publication number
- BR112016023676A2 BR112016023676A2 BR112016023676A BR112016023676A BR112016023676A2 BR 112016023676 A2 BR112016023676 A2 BR 112016023676A2 BR 112016023676 A BR112016023676 A BR 112016023676A BR 112016023676 A BR112016023676 A BR 112016023676A BR 112016023676 A2 BR112016023676 A2 BR 112016023676A2
- Authority
- BR
- Brazil
- Prior art keywords
- low pressure
- sintering powder
- pressure sintering
- powder
- type
- Prior art date
Links
- 239000000843 powder Substances 0.000 title abstract 3
- 238000005245 sintering Methods 0.000 title abstract 3
- 239000002923 metal particle Substances 0.000 abstract 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/05—Metallic powder characterised by the size or surface area of the particles
- B22F1/052—Metallic powder characterised by the size or surface area of the particles characterised by a mixture of particles of different sizes or by the particle size distribution
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/102—Metallic powder coated with organic material
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/10—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material
- B22F1/107—Metallic powder containing lubricating or binding agents; Metallic powder containing organic material containing organic material comprising solvents, e.g. for slip casting
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- B22F1/00—Metallic powder; Treatment of metallic powder, e.g. to facilitate working or to improve properties
- B22F1/17—Metallic particles coated with metal
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- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/02—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers
- B22F7/04—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite layers with one or more layers not made from powder, e.g. made from solid metal
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- B22F7/00—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression
- B22F7/06—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools
- B22F7/062—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts
- B22F7/064—Manufacture of composite layers, workpieces, or articles, comprising metallic powder, by sintering the powder, with or without compacting wherein at least one part is obtained by sintering or compression of composite workpieces or articles from parts, e.g. to form tipped tools involving the connection or repairing of preformed parts using an intermediate powder layer
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Abstract
resumo "pó de sinterização com baixa pressão" a presente invenção se refere a um pó de sinterização que compreende um primeiro tipo de partículas de metal que possuem uma dimensão mais longa média de 100 nm a 50 µm.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
IN1023DE2014 | 2014-04-11 | ||
PCT/GB2015/051096 WO2015155542A1 (en) | 2014-04-11 | 2015-04-10 | Low pressure sintering powder |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112016023676A2 true BR112016023676A2 (pt) | 2017-08-15 |
Family
ID=54287354
Family Applications (1)
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BR112016023676A BR112016023676A2 (pt) | 2014-04-11 | 2015-04-10 | pó de sinterização com baixa pressão |
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Country | Link |
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US (2) | US10998284B2 (pt) |
EP (1) | EP3129174B1 (pt) |
JP (1) | JP2017514995A (pt) |
CN (1) | CN106457383B (pt) |
BR (1) | BR112016023676A2 (pt) |
CA (1) | CA2944958A1 (pt) |
MX (1) | MX2016013376A (pt) |
TW (1) | TW201611198A (pt) |
WO (1) | WO2015155542A1 (pt) |
Families Citing this family (20)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW201611198A (zh) * | 2014-04-11 | 2016-03-16 | 阿爾發金屬公司 | 低壓燒結粉末 |
US10644210B2 (en) | 2016-04-01 | 2020-05-05 | Nichia Corporation | Method of manufacturing light emitting element mounting base member, method of manufacturing light emitting device using the light emitting element mounting base member, light emitting element mounting base member, and light emitting device using the light emitting element mounting base member |
EP3226291B1 (en) | 2016-04-01 | 2024-04-03 | Nichia Corporation | Method of manufacturing a light emitting element mounting base member, and light emitting element mounting base member |
JP6920029B2 (ja) | 2016-04-04 | 2021-08-18 | 日亜化学工業株式会社 | 金属粉焼結ペースト及びその製造方法、導電性材料の製造方法 |
JP7007140B2 (ja) * | 2016-09-30 | 2022-01-24 | Dowaエレクトロニクス株式会社 | 接合材およびそれを用いた接合方法 |
JP2019065229A (ja) * | 2017-10-04 | 2019-04-25 | コニカミノルタ株式会社 | 混合液の製造方法、混合液を製造するシステム、インク組成物、画像形成方法および画像形成物 |
WO2019163568A1 (ja) | 2018-02-22 | 2019-08-29 | リンテック株式会社 | フィルム状焼成材料、及び支持シート付フィルム状焼成材料 |
US11929341B2 (en) | 2018-06-26 | 2024-03-12 | Alpha Assembly Solutions Inc. | Nano copper paste and film for sintered die attach and similar applications |
JP2020116611A (ja) * | 2019-01-24 | 2020-08-06 | 株式会社弘輝 | フラックス及びソルダペースト |
JP7228422B2 (ja) * | 2019-03-15 | 2023-02-24 | 日東電工株式会社 | 焼結接合用シート、基材付き焼結接合用シート、および焼結接合用材料層付き半導体チップ |
JP6831417B2 (ja) * | 2019-03-29 | 2021-02-17 | Dowaエレクトロニクス株式会社 | 接合用金属ペースト及びそれを用いた接合方法 |
US11628494B2 (en) | 2019-03-29 | 2023-04-18 | Xerox Corporation | Surface additive for three-dimensional metal printing compositions |
TWI815706B (zh) | 2019-09-24 | 2023-09-11 | 美商阿爾發金屬化工公司 | 燒結組成物 |
JP7474122B2 (ja) | 2020-06-12 | 2024-04-24 | 株式会社ダイセル | 銀ナノ粒子及びその製造方法 |
EP4128326A2 (de) * | 2020-06-23 | 2023-02-08 | Siemens Aktiengesellschaft | Verfahren zur kontaktierung eines leistungshalbleiters auf einem substrat sowie leistungshalbleitermodul mit einem leistungshalbleiter und einem substrat |
CN111872370B (zh) * | 2020-07-15 | 2022-04-26 | 深圳市惠拓电子材料有限公司 | 一种ntc热敏电阻材料超微粒径的制备方法 |
US20220230984A1 (en) * | 2021-01-20 | 2022-07-21 | GM Global Technology Operations LLC | Joining material for bonding overlapping components of power electronic devices |
WO2023174581A1 (en) * | 2022-03-15 | 2023-09-21 | Alpha Assembly Solutions Inc. | Sinter ready multilayer wire/ribbon bond pads and method for die top attachment |
WO2023190593A1 (ja) * | 2022-03-31 | 2023-10-05 | パナソニックIpマネジメント株式会社 | ペースト組成物及び複合体 |
EP4324578A1 (de) * | 2022-08-17 | 2024-02-21 | Heraeus Electronics GmbH & Co. KG | Silbersinterpaste und deren verwendung zum verbinden von bauelementen |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7081214B2 (en) * | 2000-10-25 | 2006-07-25 | Harima Chemicals, Inc. | Electroconductive metal paste and method for production thereof |
US7968008B2 (en) * | 2006-08-03 | 2011-06-28 | Fry's Metals, Inc. | Particles and inks and films using them |
JP4872663B2 (ja) | 2006-12-28 | 2012-02-08 | 株式会社日立製作所 | 接合用材料及び接合方法 |
US8555491B2 (en) | 2007-07-19 | 2013-10-15 | Alpha Metals, Inc. | Methods of attaching a die to a substrate |
JP5574761B2 (ja) * | 2009-04-17 | 2014-08-20 | 国立大学法人山形大学 | 被覆銀超微粒子とその製造方法 |
KR101257242B1 (ko) | 2009-07-03 | 2013-04-23 | 주식회사 에프피 | 저온 소성 태양전지 전극용 페이스트 조성물 및 이를 이용한 집광형 구상 실리콘 태양전지 |
DE102009040076A1 (de) * | 2009-09-04 | 2011-03-10 | W.C. Heraeus Gmbh | Metallpaste mit Oxidationsmittel |
JP5824201B2 (ja) | 2009-09-11 | 2015-11-25 | Dowaエレクトロニクス株式会社 | 接合材およびそれを用いた接合方法 |
JP5544945B2 (ja) * | 2010-03-11 | 2014-07-09 | セイコーエプソン株式会社 | 造粒粉末および造粒粉末の製造方法 |
EP2442367B1 (en) * | 2010-10-14 | 2014-07-16 | Rohm and Haas Electronic Materials LLC | Improved method for forming metal contacts |
EP3796336A1 (en) * | 2010-11-03 | 2021-03-24 | Alpha Assembly Solutions Inc. | Sintering materials and attachment methods using same |
JP2012182111A (ja) * | 2011-02-28 | 2012-09-20 | Samsung Electro-Mechanics Co Ltd | 導電性金属ペースト組成物及びその製造方法 |
EP3659971B1 (en) * | 2012-10-29 | 2024-07-03 | Alpha Assembly Solutions Inc. | Sintering powder |
TW201611198A (zh) | 2014-04-11 | 2016-03-16 | 阿爾發金屬公司 | 低壓燒結粉末 |
-
2015
- 2015-04-08 TW TW104111292A patent/TW201611198A/zh unknown
- 2015-04-10 CA CA2944958A patent/CA2944958A1/en not_active Abandoned
- 2015-04-10 EP EP15717217.2A patent/EP3129174B1/en active Active
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- 2015-04-10 MX MX2016013376A patent/MX2016013376A/es unknown
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- 2015-04-10 US US15/302,827 patent/US10998284B2/en active Active
- 2015-04-10 JP JP2016561751A patent/JP2017514995A/ja active Pending
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- 2021-04-30 US US17/245,397 patent/US20210249376A1/en active Pending
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US20170033073A1 (en) | 2017-02-02 |
TW201611198A (zh) | 2016-03-16 |
CA2944958A1 (en) | 2015-10-15 |
CN106457383A (zh) | 2017-02-22 |
EP3129174B1 (en) | 2022-11-09 |
WO2015155542A1 (en) | 2015-10-15 |
US10998284B2 (en) | 2021-05-04 |
CN106457383B (zh) | 2019-06-28 |
MX2016013376A (es) | 2017-05-02 |
JP2017514995A (ja) | 2017-06-08 |
US20210249376A1 (en) | 2021-08-12 |
EP3129174A1 (en) | 2017-02-15 |
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B06U | Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette] | ||
B11B | Dismissal acc. art. 36, par 1 of ipl - no reply within 90 days to fullfil the necessary requirements | ||
B350 | Update of information on the portal [chapter 15.35 patent gazette] |