BR112014022052A8 - processo de fabricação de um sensor de pressão - Google Patents

processo de fabricação de um sensor de pressão

Info

Publication number
BR112014022052A8
BR112014022052A8 BR112014022052A BR112014022052A BR112014022052A8 BR 112014022052 A8 BR112014022052 A8 BR 112014022052A8 BR 112014022052 A BR112014022052 A BR 112014022052A BR 112014022052 A BR112014022052 A BR 112014022052A BR 112014022052 A8 BR112014022052 A8 BR 112014022052A8
Authority
BR
Brazil
Prior art keywords
pressure sensor
supporting substrate
deformable membrane
probes
conductive material
Prior art date
Application number
BR112014022052A
Other languages
English (en)
Other versions
BR112014022052A2 (pt
BR112014022052B1 (pt
Inventor
Le Neal Jean-François
Brida Sébastiano
Original Assignee
Auxitrol Sa
Centre Nat Rech Scient
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Auxitrol Sa, Centre Nat Rech Scient filed Critical Auxitrol Sa
Publication of BR112014022052A2 publication Critical patent/BR112014022052A2/pt
Publication of BR112014022052A8 publication Critical patent/BR112014022052A8/pt
Publication of BR112014022052B1 publication Critical patent/BR112014022052B1/pt

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B3/00—Devices comprising flexible or deformable elements, e.g. comprising elastic tongues or membranes
    • B81B3/0018—Structures acting upon the moving or flexible element for transforming energy into mechanical movement or vice versa, i.e. actuators, sensors, generators
    • B81B3/0021—Transducers for transforming electrical into mechanical energy or vice versa
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B32—LAYERED PRODUCTS
    • B32B—LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT OR NON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
    • B32B38/00—Ancillary operations in connection with laminating processes
    • B32B38/08—Impregnating
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/02—Microstructural systems; Auxiliary parts of microstructural devices or systems containing distinct electrical or optical devices of particular relevance for their function, e.g. microelectro-mechanical systems [MEMS]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00134—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems comprising flexible or deformable structures
    • B81C1/00182—Arrangements of deformable or non-deformable structures, e.g. membrane and cavity for use in a transducer
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81C—PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTURE OR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
    • B81C1/00—Manufacture or treatment of devices or systems in or on a substrate
    • B81C1/00015—Manufacture or treatment of devices or systems in or on a substrate for manufacturing microsystems
    • B81C1/00341—Processes for manufacturing microsystems not provided for in groups B81C1/00023 - B81C1/00261
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G01L19/0069—Electrical connection means from the sensor to its support
    • G01L19/0076—Electrical connection means from the sensor to its support using buried connections
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/147—Details about the mounting of the sensor to support or covering means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L7/00—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements
    • G01L7/02—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges
    • G01L7/08—Measuring the steady or quasi-steady pressure of a fluid or a fluent solid material by mechanical or fluid pressure-sensitive elements in the form of elastically-deformable gauges of the flexible-diaphragm type
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G01L9/0045—Diaphragm associated with a buried cavity
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0042—Constructional details associated with semiconductive diaphragm sensors, e.g. etching, or constructional details of non-semiconductive diaphragms
    • G01L9/0048—Details about the mounting of the diaphragm to its support or about the diaphragm edges, e.g. notches, round shapes for stress relief
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0054—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements integral with a semiconducting diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/006—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of metallic strain gauges fixed to an element other than the pressure transmitting diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
    • G01L9/04—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of resistance-strain gauges
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/02—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning
    • G01L9/06—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means by making use of variations in ohmic resistance, e.g. of potentiometers, electric circuits therefor, e.g. bridges, amplifiers or signal conditioning of piezo-resistive devices
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2201/00—Specific applications of microelectromechanical systems
    • B81B2201/02—Sensors
    • B81B2201/0264—Pressure sensors
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2203/00—Basic microelectromechanical structures
    • B81B2203/01—Suspended structures, i.e. structures allowing a movement
    • B81B2203/0127—Diaphragms, i.e. structures separating two media that can control the passage from one medium to another; Membranes, i.e. diaphragms with filtering function
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/07—Interconnects
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/094—Feed-through, via
    • B81B2207/095—Feed-through, via through the lid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B2207/00—Microstructural systems or auxiliary parts thereof
    • B81B2207/09—Packages
    • B81B2207/091—Arrangements for connecting external electrical signals to mechanical structures inside the package
    • B81B2207/094—Feed-through, via
    • B81B2207/096—Feed-through, via through the substrate
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B81—MICROSTRUCTURAL TECHNOLOGY
    • B81B—MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICAL DEVICES
    • B81B7/00—Microstructural systems; Auxiliary parts of microstructural devices or systems
    • B81B7/0006—Interconnects
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/0061—Electrical connection means
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L19/00—Details of, or accessories for, apparatus for measuring steady or quasi-steady pressure of a fluent medium insofar as such details or accessories are not special to particular types of pressure gauges
    • G01L19/14—Housings
    • G01L19/148—Details about the circuit board integration, e.g. integrated with the diaphragm surface or encapsulation
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/0051—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance
    • G01L9/0052—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements
    • G01L9/0055—Transmitting or indicating the displacement of flexible diaphragms using variations in ohmic resistance of piezoresistive elements bonded on a diaphragm
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L9/00—Measuring steady of quasi-steady pressure of fluid or fluent solid material by electric or magnetic pressure-sensitive elements; Transmitting or indicating the displacement of mechanical pressure-sensitive elements, used to measure the steady or quasi-steady pressure of a fluid or fluent solid material, by electric or magnetic means
    • G01L9/0041—Transmitting or indicating the displacement of flexible diaphragms
    • G01L9/008—Transmitting or indicating the displacement of flexible diaphragms using piezoelectric devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45163—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than 1550°C
    • H01L2224/45169—Platinum (Pt) as principal constituent
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/10—Methods of surface bonding and/or assembly therefor
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00—Metal working
    • Y10T29/49—Method of mechanical manufacture
    • Y10T29/49826—Assembling or joining
    • Y10T29/49888—Subsequently coating

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical & Material Sciences (AREA)
  • Analytical Chemistry (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Computer Hardware Design (AREA)
  • Measuring Fluid Pressure (AREA)
  • Pressure Sensors (AREA)

Abstract

processo de fabricação de um sensor de pressão e sensor de pressão. a presente invenção trata da fabricação de uma estrutura micromecânica para medir ou detectar uma grandeza mecânica ou uma grandeza física e, em particular, um sensor de pressão que compreende tal microestrutura. mais especificamente, a presente invenção concerne um processo de fabricação de um sensor de pressão que compreende as seguintes etapas: - montagem de um substrato de suporte com uma membrana deformável sobre a qual sondas de tensões foram depositada s, a qual membrana deformável compreende uma zona adelgaçada em seu centro , e o substrato de suporte está disposto acima da membrana deformável, sendo que o substrato de suporte compreende uma superfície superior , uma superfície inferior em contato com a membrana deformável , sendo que o substrato de suporte compreende ainda recessos laterais dispostos acima das sondas de tensões e um recesso central disposto acima a zona adelgaçada da membrana , para obter uma estrutura micromecânica ; e depois de efetuada a montagem , o processo compreende a seguinte etapa: - deposição em uma única etapa de pelo menos um material condutor sobre a superfície superior do suporte e nos recessos laterais do suporte , e o material condutor se estende nos recessos para estar em contato com as sondas de tensões a fim de formar contatos elétricos em ligação com as sondas de tensões.
BR112014022052-2A 2012-03-06 2013-03-06 Processo de fabricação de um sensor de pressão BR112014022052B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1252042 2012-03-06
FR1252042A FR2987892B1 (fr) 2012-03-06 2012-03-06 Procede de fabrication d'un capteur de pression et capteur correspondant
PCT/EP2013/054531 WO2013131973A1 (fr) 2012-03-06 2013-03-06 Procede de fabrication d'un capteur de pression et capteur correspondant

Publications (3)

Publication Number Publication Date
BR112014022052A2 BR112014022052A2 (pt) 2020-10-27
BR112014022052A8 true BR112014022052A8 (pt) 2021-05-11
BR112014022052B1 BR112014022052B1 (pt) 2021-06-22

Family

ID=47790258

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112014022052-2A BR112014022052B1 (pt) 2012-03-06 2013-03-06 Processo de fabricação de um sensor de pressão

Country Status (9)

Country Link
US (1) US9643836B2 (pt)
EP (1) EP2823273B1 (pt)
JP (1) JP6122880B2 (pt)
CN (1) CN104508447B (pt)
BR (1) BR112014022052B1 (pt)
CA (1) CA2866388C (pt)
ES (1) ES2743457T3 (pt)
FR (1) FR2987892B1 (pt)
WO (1) WO2013131973A1 (pt)

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR2982023B1 (fr) * 2011-10-26 2015-03-06 Auxitrol Sa Structure micromecanique a membrane deformable et a protection contre de fortes deformations
US9891124B2 (en) * 2013-05-24 2018-02-13 Hitachi Metals, Ltd. Pressure sensor, and mass flow meter, and mass flow controller using same
EP3001166A1 (de) * 2014-09-09 2016-03-30 Robert Bosch Gmbh Mikromechanische drucksensorvorrichtung und entsprechendes herstellungsverfahren
DE102015217030A1 (de) * 2014-09-09 2016-03-10 Robert Bosch Gmbh Mikromechanische Drucksensorvorrichtung und entsprechendes Herstellungsverfahren
US10163660B2 (en) * 2017-05-08 2018-12-25 Tt Electronics Plc Sensor device with media channel between substrates
JP6950268B2 (ja) * 2017-05-12 2021-10-13 コニカミノルタ株式会社 クリーニング装置、画像形成装置及びプログラム
US11174157B2 (en) * 2018-06-27 2021-11-16 Advanced Semiconductor Engineering Inc. Semiconductor device packages and methods of manufacturing the same
CN112723301A (zh) * 2020-12-21 2021-04-30 苏州长风航空电子有限公司 一种航空用高频响压力传感器芯片及制备方法
US20220236128A1 (en) * 2021-01-27 2022-07-28 Honeywell International Inc. Pressure sensor components having microfluidic channels

Family Cites Families (19)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54131892A (en) * 1978-04-05 1979-10-13 Hitachi Ltd Semiconductor pressure converter
US4625561A (en) * 1984-12-06 1986-12-02 Ford Motor Company Silicon capacitive pressure sensor and method of making
US4777826A (en) * 1985-06-20 1988-10-18 Rosemount Inc. Twin film strain gauge system
US6338284B1 (en) * 1999-02-12 2002-01-15 Integrated Sensing Systems (Issys) Inc. Electrical feedthrough structures for micromachined devices and methods of fabricating the same
US6330829B1 (en) * 2000-03-16 2001-12-18 Kulite Semiconductor Products Inc. Oil-filled pressure transducer
US7152478B2 (en) * 2000-07-20 2006-12-26 Entegris, Inc. Sensor usable in ultra pure and highly corrosive environments
US6612175B1 (en) * 2000-07-20 2003-09-02 Nt International, Inc. Sensor usable in ultra pure and highly corrosive environments
EP2287916A3 (de) * 2001-08-24 2012-01-25 Schott AG Verfahren zum Kontaktieren und Gehäusen von integrierten Schaltungen
JP2004177343A (ja) * 2002-11-28 2004-06-24 Fujikura Ltd 圧力センサ
US7540198B2 (en) * 2004-06-15 2009-06-02 Canon Kabushiki Kaisha Semiconductor device
JP4893123B2 (ja) * 2006-06-23 2012-03-07 株式会社デンソー 半導体式圧力センサおよびその製造方法
CN101542257B (zh) * 2006-11-29 2012-04-04 株式会社藤仓 压力传感器模块
JP4967907B2 (ja) * 2007-08-01 2012-07-04 ミツミ電機株式会社 半導体圧力センサ及びその製造方法
US7775119B1 (en) * 2009-03-03 2010-08-17 S3C, Inc. Media-compatible electrically isolated pressure sensor for high temperature applications
DE102009045164A1 (de) * 2009-09-30 2011-03-31 Robert Bosch Gmbh Sensoranordnung und Verfahren zu deren Herstellung
JP5218455B2 (ja) * 2010-03-17 2013-06-26 株式会社デンソー 半導体力学量センサおよびその製造方法
US20130214370A1 (en) * 2010-05-03 2013-08-22 S3C, Inc. System and method for minimizing deflection of a membrance of an absolute pressure sensor
US8490495B2 (en) * 2010-05-05 2013-07-23 Consensic, Inc. Capacitive pressure sensor with vertical electrical feedthroughs and method to make the same
JP5779931B2 (ja) * 2011-03-24 2015-09-16 富士通株式会社 半導体装置の製造方法

Also Published As

Publication number Publication date
EP2823273A1 (fr) 2015-01-14
FR2987892B1 (fr) 2014-04-18
CN104508447A (zh) 2015-04-08
JP6122880B2 (ja) 2017-04-26
EP2823273B1 (fr) 2019-05-29
BR112014022052A2 (pt) 2020-10-27
JP2015511006A (ja) 2015-04-13
CA2866388A1 (fr) 2013-09-12
CA2866388C (fr) 2021-08-31
US9643836B2 (en) 2017-05-09
US20150033878A1 (en) 2015-02-05
BR112014022052B1 (pt) 2021-06-22
WO2013131973A1 (fr) 2013-09-12
FR2987892A1 (fr) 2013-09-13
CN104508447B (zh) 2017-06-09
ES2743457T3 (es) 2020-02-19

Similar Documents

Publication Publication Date Title
BR112014022052A8 (pt) processo de fabricação de um sensor de pressão
ES2614714T3 (es) Soporte eléctricamente calefactable y cuerpo calefactor de superficie, así como procedimiento para su fabricación
BR112012029003A2 (pt) lente de menisco líquido arqueada
BR112016024105A2 (pt) vidraça com uma superfície de comutação iluminada e uma função de aquecimento
BR112017005014A2 (pt) sensor para detectar o nível de um meio
BR112013026382A2 (pt) método para determinar um item de informação topológica sobre um sistema de distribuição elétrica de baixa tensão e sistema de distribuição de baixa tensão
MX349764B (es) Celda de carga con un medio para compensar errores debidos a una desalineacion.
BR112013028115A2 (pt) painel com um elemento de conexão elétrica
BR112013003880A2 (pt) recipiente rotulado em molde
BR112015005717A2 (pt) método para a determinação das correntes de fase de uma máquina elétrica com um conversor de corrente
BR112014006009A8 (pt) Variantes de enzimas com propriedades aperfeiçoadas
ES2627117T3 (es) Método basado en MGMT para obtener un rendimiento elevado de expresión de proteínas recombinantes
BR112013008060A2 (pt) pneumático com armadura de carcaça radial
BR112014011926A2 (pt) chave de alta-tensão
BR112016025898A2 (pt) ?drimenol sintases e método para produzir drimenol?
BR112015006717A2 (pt) sensor de pressão à base de nanocalibradores acoplados a um ressonador
BR112013029686A2 (pt) estrutura de flip chip de diodo emissor de luz e método de formação de uma estrutura de flip chip de diodo emissor de luz
WO2013071176A3 (en) Three port mtj structure and integration
BR112012029580A2 (pt) realização de um composto ótico transparente com estrutura celular
BR112014016373A8 (pt) método para produzir duas ou mais células fotovoltaicas interconectadas à base de película fina e artigo fotovoltaico
BR112012007576A2 (pt) sistema eletrocromo transparante com vários pares de eletrodos
CN204085661U (zh) 车辆动态称重压电传感器
BR112016001951A2 (pt) cuba de eletrólise destinada à produção de alumínio e usina de eletrólise, compreendendo essa cuba
WO2010087668A3 (ko) 프로브 구조물 및 이를 갖는 프로브 카드
ES2602316T3 (es) Dispositivo de mando, en particular para un componente de vehículo y procedimiento para su fabricación

Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06U Preliminary requirement: requests with searches performed by other patent offices: procedure suspended [chapter 6.21 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B09W Correction of the decision to grant [chapter 9.1.4 patent gazette]

Free format text: RETIFIQUE-SE, POR INCORRECAO NO TITULO E NO NOME DA DEPOSITANTE

B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 06/03/2013, OBSERVADAS AS CONDICOES LEGAIS.