WO2010087668A3 - 프로브 구조물 및 이를 갖는 프로브 카드 - Google Patents

프로브 구조물 및 이를 갖는 프로브 카드 Download PDF

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Publication number
WO2010087668A3
WO2010087668A3 PCT/KR2010/000602 KR2010000602W WO2010087668A3 WO 2010087668 A3 WO2010087668 A3 WO 2010087668A3 KR 2010000602 W KR2010000602 W KR 2010000602W WO 2010087668 A3 WO2010087668 A3 WO 2010087668A3
Authority
WO
WIPO (PCT)
Prior art keywords
joined
securing
pillar
probe
contact
Prior art date
Application number
PCT/KR2010/000602
Other languages
English (en)
French (fr)
Other versions
WO2010087668A2 (ko
Inventor
이호준
이소형
Original Assignee
주식회사 미코티엔
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 주식회사 미코티엔 filed Critical 주식회사 미코티엔
Publication of WO2010087668A2 publication Critical patent/WO2010087668A2/ko
Publication of WO2010087668A3 publication Critical patent/WO2010087668A3/ko

Links

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/06711—Probe needles; Cantilever beams; "Bump" contacts; Replaceable probe pins
    • G01R1/06716—Elastic
    • G01R1/06727—Cantilever beams
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R1/00—Details of instruments or arrangements of the types included in groups G01R5/00 - G01R13/00 and G01R31/00
    • G01R1/02—General constructional details
    • G01R1/06—Measuring leads; Measuring probes
    • G01R1/067—Measuring probes
    • G01R1/073—Multiple probes
    • G01R1/07307—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card
    • G01R1/07342—Multiple probes with individual probe elements, e.g. needles, cantilever beams or bump contacts, fixed in relation to each other, e.g. bed of nails fixture or probe card the body of the probe being at an angle other than perpendicular to test object, e.g. probe card
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/26—Testing of individual semiconductor devices
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Measuring Leads Or Probes (AREA)

Abstract

프로브 기판의 패드 상에 부착되는 고정부와, 고정부에 기립 구조로 연결되는 제1 기둥부와, 기둥부에 캔틸레버(cantilever) 구조로 연결되는 제1 빔부와, 제1 빔부의 선단에 기립 구조로 연결되는 제2 기둥부와, 제2 기둥부에 고정부 방향으로 캔틸레버 구조로 연결되는 제2 빔부, 그리고 제2 빔부의 선단에 기립 구조로 연결되고 전기 검사를 수행할 때 피검사체와 접촉하는 접촉부를 포함한다. 따라서, 고정 위치와 접촉 위치 사이의 수평 거리를 상대적으로 짧게 하면서도 균일한 접촉 압력을 형성하면서, 충분한 탄성 확보하여 수명이 길어질 수 있다.
PCT/KR2010/000602 2009-02-02 2010-02-01 프로브 구조물 및 이를 갖는 프로브 카드 WO2010087668A2 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR10-2009-0007842 2009-02-02
KR20090007842A KR101506624B1 (ko) 2009-02-02 2009-02-02 프로브 구조물 및 이를 갖는 프로브 카드

Publications (2)

Publication Number Publication Date
WO2010087668A2 WO2010087668A2 (ko) 2010-08-05
WO2010087668A3 true WO2010087668A3 (ko) 2010-10-21

Family

ID=42396222

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/KR2010/000602 WO2010087668A2 (ko) 2009-02-02 2010-02-01 프로브 구조물 및 이를 갖는 프로브 카드

Country Status (2)

Country Link
KR (1) KR101506624B1 (ko)
WO (1) WO2010087668A2 (ko)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101672826B1 (ko) * 2016-02-03 2016-11-07 주식회사 프로이천 니들 타입 핀 보드
KR102098654B1 (ko) * 2019-10-02 2020-04-09 주식회사 프로이천 프로브 카드
CN111579835B (zh) * 2020-05-18 2023-05-16 武汉精毅通电子技术有限公司 一种适用于大电流高速信号测试的探针及连接器
KR102377600B1 (ko) * 2020-08-06 2022-03-24 (주)티에스이 프로브 카드
CN114678716B (zh) * 2020-12-24 2024-04-16 深圳凯智通微电子技术有限公司 弹片探针和弹片探针模组

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002365308A (ja) * 2001-06-08 2002-12-18 Japan Electronic Materials Corp 垂直ブレード型プローブ、垂直ブレード型プローブユニット及びそれを用いた垂直ブレード型プローブカード
JP2004117081A (ja) * 2002-09-25 2004-04-15 Japan Electronic Materials Corp 垂直型プローブユニット及びこれを用いた垂直型プローブカード
JP2007093282A (ja) * 2005-09-27 2007-04-12 Japan Electronic Materials Corp プローブカードの製造方法
JP2007183250A (ja) * 2005-12-06 2007-07-19 Enplas Corp プローブチップ及びプローブカード
US20070202658A1 (en) * 2006-02-08 2007-08-30 Bahadir Tunaboylu Approach for fabricating cantilever probes for probe card assemblies
US20080265927A1 (en) * 2007-04-26 2008-10-30 Silicon Test Systems, Inc. Tester on a probe card

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7265565B2 (en) 2003-02-04 2007-09-04 Microfabrica Inc. Cantilever microprobes for contacting electronic components and methods for making such probes
KR100573089B1 (ko) * 2003-03-17 2006-04-24 주식회사 파이컴 프로브 및 그 제조방법
TW200815763A (en) * 2006-09-26 2008-04-01 Nihon Micronics Kabushiki Kaisha Electrical test probe and electrical test probe assembly
KR101273970B1 (ko) * 2006-12-11 2013-06-12 (주) 미코에스앤피 프로브의 탐침 및 프로브의 제조방법

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002365308A (ja) * 2001-06-08 2002-12-18 Japan Electronic Materials Corp 垂直ブレード型プローブ、垂直ブレード型プローブユニット及びそれを用いた垂直ブレード型プローブカード
JP2004117081A (ja) * 2002-09-25 2004-04-15 Japan Electronic Materials Corp 垂直型プローブユニット及びこれを用いた垂直型プローブカード
JP2007093282A (ja) * 2005-09-27 2007-04-12 Japan Electronic Materials Corp プローブカードの製造方法
JP2007183250A (ja) * 2005-12-06 2007-07-19 Enplas Corp プローブチップ及びプローブカード
US20070202658A1 (en) * 2006-02-08 2007-08-30 Bahadir Tunaboylu Approach for fabricating cantilever probes for probe card assemblies
US20080265927A1 (en) * 2007-04-26 2008-10-30 Silicon Test Systems, Inc. Tester on a probe card

Also Published As

Publication number Publication date
KR101506624B1 (ko) 2015-04-06
KR20100088753A (ko) 2010-08-11
WO2010087668A2 (ko) 2010-08-05

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