BR112014009821A2 - composição de elastômero de silicone multicomponente curável à temperatura ambiente - Google Patents
composição de elastômero de silicone multicomponente curável à temperatura ambienteInfo
- Publication number
- BR112014009821A2 BR112014009821A2 BR112014009821A BR112014009821A BR112014009821A2 BR 112014009821 A2 BR112014009821 A2 BR 112014009821A2 BR 112014009821 A BR112014009821 A BR 112014009821A BR 112014009821 A BR112014009821 A BR 112014009821A BR 112014009821 A2 BR112014009821 A2 BR 112014009821A2
- Authority
- BR
- Brazil
- Prior art keywords
- room temperature
- elastomer composition
- silicone elastomer
- temperature curable
- curable multicomponent
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
- C08G77/382—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon
- C08G77/388—Polysiloxanes modified by chemical after-treatment containing atoms other than carbon, hydrogen, oxygen or silicon containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
- C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
- C08G77/04—Polysiloxanes
- C08G77/38—Polysiloxanes modified by chemical after-treatment
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/541—Silicon-containing compounds containing oxygen
- C08K5/5415—Silicon-containing compounds containing oxygen containing at least one Si—O bond
- C08K5/5419—Silicon-containing compounds containing oxygen containing at least one Si—O bond containing at least one Si—C bond
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/544—Silicon-containing compounds containing nitrogen
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K5/00—Use of organic ingredients
- C08K5/54—Silicon-containing compounds
- C08K5/549—Silicon-containing compounds containing silicon in a ring
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
- C08L83/04—Polysiloxanes
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
- C08K3/24—Acids; Salts thereof
- C08K3/26—Carbonates; Bicarbonates
- C08K2003/265—Calcium, strontium or barium carbonate
Landscapes
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- General Chemical & Material Sciences (AREA)
- Compositions Of Macromolecular Compounds (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2011230691A JP6039894B2 (ja) | 2011-10-20 | 2011-10-20 | 多成分型室温硬化性シリコーンエラストマー組成物 |
| PCT/JP2012/076877 WO2013058293A1 (en) | 2011-10-20 | 2012-10-11 | Multi-component room-temperature-curable silicone elastomer composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| BR112014009821A2 true BR112014009821A2 (pt) | 2017-06-13 |
Family
ID=47178261
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BR112014009821A BR112014009821A2 (pt) | 2011-10-20 | 2012-10-11 | composição de elastômero de silicone multicomponente curável à temperatura ambiente |
Country Status (7)
| Country | Link |
|---|---|
| US (1) | US20140288246A1 (pt) |
| EP (1) | EP2768885B1 (pt) |
| JP (1) | JP6039894B2 (pt) |
| KR (1) | KR101954055B1 (pt) |
| CN (1) | CN103890046A (pt) |
| BR (1) | BR112014009821A2 (pt) |
| WO (1) | WO2013058293A1 (pt) |
Families Citing this family (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102014210309A1 (de) * | 2014-05-30 | 2015-12-03 | Wacker Chemie Ag | Vernetzbare Massen auf Basis von organyloxysilanterminierten Polymeren |
| CN110475836B (zh) * | 2017-03-31 | 2022-07-22 | 住友化学株式会社 | 组合物 |
| EP3986967A4 (en) | 2019-06-21 | 2023-01-25 | Dow Silicones Corporation | METHOD FOR PRODUCING A THIXOTROPIC CURING SILICONE COMPOSITION |
| KR20220024580A (ko) * | 2019-06-21 | 2022-03-03 | 다우 실리콘즈 코포레이션 | 열 전도성 실리콘 조성물 |
| EP3992252A4 (en) * | 2019-06-26 | 2023-07-19 | Sekisui Polymatech Co., Ltd. | HEAT CONDUCTIVE COMPOSITION PACKAGING, AND TWO COMPONENT CURING TYPE HEAT CONDUCTIVE COMPOSITION |
| CN110760067B (zh) * | 2019-10-22 | 2021-09-24 | 广东万木新材料科技有限公司 | 一种有机硅低聚物及其合成方法与应用 |
| US20230068114A1 (en) * | 2019-12-19 | 2023-03-02 | Momentive Performance Materials Japan Llc | Curable composition |
| CN113337245B (zh) * | 2021-07-26 | 2022-03-25 | 深圳市希顺有机硅科技有限公司 | 一种脱醇型光伏组件密封胶及其制备方法 |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1394206A (en) | 1971-09-13 | 1975-05-14 | Gen Electric | Self-bonding two-package room temperature vulcanizable silicone rubber compositions |
| US4461867A (en) * | 1982-09-27 | 1984-07-24 | General Electric Company | Composition for promoting adhesion of curable silicones to substrates |
| JPS6076536A (ja) | 1983-08-08 | 1985-05-01 | ゼネラル・エレクトリツク・カンパニイ | アルコキシ終端ポリジオルガノシロキサンの製造方法 |
| DE3566674D1 (en) * | 1984-07-26 | 1989-01-12 | Dow Corning | Silicone elastomers with good adhesion |
| JP2565333B2 (ja) | 1987-04-28 | 1996-12-18 | 東レ・ダウコーニング・シリコーン株式会社 | 電気・電子機器用室温硬化性オルガノポリシロキサン組成物 |
| JPH07113083B2 (ja) * | 1987-08-28 | 1995-12-06 | 東レ・ダウコーニング・シリコーン株式会社 | 室温硬化性オルガノポリシロキサン組成物 |
| JPH0786172B2 (ja) * | 1988-12-05 | 1995-09-20 | 東芝シリコーン株式会社 | 室温硬化性シリコーンゴム組成物 |
| JP2550749B2 (ja) | 1990-05-07 | 1996-11-06 | 信越化学工業株式会社 | 硬化性シリコーン組成物及び硬化物 |
| US5183873A (en) * | 1991-10-21 | 1993-02-02 | Wacker Silicones Corporation | Room temperature stable organopolysiloxane compositions |
| JPH05263062A (ja) * | 1992-03-23 | 1993-10-12 | Toshiba Silicone Co Ltd | 接着性シリコーンゴム組成物 |
| US5346940A (en) * | 1993-03-24 | 1994-09-13 | Loctite Corporation | Two-part fast curing RTV silicone for formed-on-part automotive gasket |
| JP3024432B2 (ja) * | 1993-04-23 | 2000-03-21 | 信越化学工業株式会社 | シリコーンゴム組成物及びその硬化方法 |
| JP3349702B2 (ja) * | 1994-01-21 | 2002-11-25 | ジーイー東芝シリコーン株式会社 | 接着シール材及びその硬化方法 |
| JP3614958B2 (ja) * | 1995-11-29 | 2005-01-26 | 東レ・ダウコーニング・シリコーン株式会社 | 室温硬化性シリコーンエラストマー組成物 |
| US5674936A (en) | 1996-05-10 | 1997-10-07 | General Electric Company | Non-corrosive translucent RTV compositions having good rheology |
| JP2002053753A (ja) | 2000-08-07 | 2002-02-19 | Shin Etsu Chem Co Ltd | 室温硬化性オルガノポリシロキサン組成物 |
| JP3714402B2 (ja) | 2000-10-12 | 2005-11-09 | 信越化学工業株式会社 | 室温硬化性オルガノポリシロキサン組成物 |
| JP2003221506A (ja) * | 2002-01-31 | 2003-08-08 | Dow Corning Toray Silicone Co Ltd | 室温硬化性オルガノポリシロキサン組成物 |
| US20050014894A1 (en) * | 2002-08-29 | 2005-01-20 | Flannigan William Tait | Room temperature curable organopolysiloxane compositions |
| JP4357991B2 (ja) | 2004-03-02 | 2009-11-04 | モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 | 硬化性ポリマー組成物および硬化性ポリマー組成物の調製方法 |
| TW200716710A (en) * | 2005-09-30 | 2007-05-01 | Dow Corning Toray Co Ltd | Multi-component room-temperature curable silicone rubber composition |
| DE102007037197A1 (de) * | 2007-08-07 | 2009-02-12 | Wacker Chemie Ag | Vernetzbare Massen auf der Basis von Organosiliciumverbindungen |
| JP5053814B2 (ja) * | 2007-11-30 | 2012-10-24 | 東レ・ダウコーニング株式会社 | 多成分型室温硬化性シリコーンゴム組成物 |
-
2011
- 2011-10-20 JP JP2011230691A patent/JP6039894B2/ja active Active
-
2012
- 2012-10-11 EP EP12784751.5A patent/EP2768885B1/en active Active
- 2012-10-11 CN CN201280050649.3A patent/CN103890046A/zh active Pending
- 2012-10-11 KR KR1020147012794A patent/KR101954055B1/ko active IP Right Grant
- 2012-10-11 US US14/352,809 patent/US20140288246A1/en not_active Abandoned
- 2012-10-11 BR BR112014009821A patent/BR112014009821A2/pt not_active Application Discontinuation
- 2012-10-11 WO PCT/JP2012/076877 patent/WO2013058293A1/en active Application Filing
Also Published As
| Publication number | Publication date |
|---|---|
| US20140288246A1 (en) | 2014-09-25 |
| KR101954055B1 (ko) | 2019-05-31 |
| WO2013058293A1 (en) | 2013-04-25 |
| EP2768885B1 (en) | 2018-05-23 |
| CN103890046A (zh) | 2014-06-25 |
| EP2768885A1 (en) | 2014-08-27 |
| JP2013087244A (ja) | 2013-05-13 |
| KR20140081869A (ko) | 2014-07-01 |
| JP6039894B2 (ja) | 2016-12-07 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| B11A | Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing | ||
| B11N | Dismissal: publication cancelled [chapter 11.14 patent gazette] | ||
| B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] | ||
| B08H | Application fees: decision cancelled [chapter 8.8 patent gazette] | ||
| B350 | Update of information on the portal [chapter 15.35 patent gazette] |