BR112013004222A2 - circuito impresso que comporta pelo menos um componente cerâmico. - Google Patents

circuito impresso que comporta pelo menos um componente cerâmico.

Info

Publication number
BR112013004222A2
BR112013004222A2 BR112013004222A BR112013004222A BR112013004222A2 BR 112013004222 A2 BR112013004222 A2 BR 112013004222A2 BR 112013004222 A BR112013004222 A BR 112013004222A BR 112013004222 A BR112013004222 A BR 112013004222A BR 112013004222 A2 BR112013004222 A2 BR 112013004222A2
Authority
BR
Brazil
Prior art keywords
ceramic component
printed circuit
circuit board
support
connectors
Prior art date
Application number
BR112013004222A
Other languages
English (en)
Other versions
BR112013004222B1 (pt
Inventor
Tony Lhommeau
Original Assignee
Hispano Suiza Sa
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hispano Suiza Sa filed Critical Hispano Suiza Sa
Publication of BR112013004222A2 publication Critical patent/BR112013004222A2/pt
Publication of BR112013004222B1 publication Critical patent/BR112013004222B1/pt

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H01G2/065—Mountings specially adapted for mounting on a printed-circuit support for surface mounting, e.g. chip capacitors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/018—Dielectrics
    • H01G4/06—Solid dielectrics
    • H01G4/08—Inorganic dielectrics
    • H01G4/12—Ceramic dielectrics
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/02—Mountings
    • H01G2/06—Mountings specially adapted for mounting on a printed-circuit support
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10742—Details of leads
    • H05K2201/10886—Other details
    • H05K2201/10909—Materials of terminal, e.g. of leads or electrodes of components
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50—Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Structure Of Printed Boards (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Combinations Of Printed Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)

Abstract

circuito impresso que comporta pelo menos um componente cerâmico. a invenção refere-se a um circuito impresso que compreende um suporte (1) sobre o qual pelo menos um componente cerâmico (2, 3, 4) é fixado, de modo a permitir que o calor produzido pelo componente cerâmico (2, 3, 4) seja descarregado e a evitar fissuras no componente cerâmico (2, 3, 4) e no suporte (1). para esse fim, o componente cerâmico (2, 3, 4) é fixado sobre o suporte (1) por meio de dois conectores (5, 6) produzidos a partir de material composto por matriz metálica. os ditos dois conectores também têm, de preferência, fendas de modo a permitir que as pressões mecânicas exercidas no suporte sejam transportadas pelos conectores.
BR112013004222-2A 2010-08-25 2011-08-23 Circuito impresso ou uso de um material composto por matriz metálica BR112013004222B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR1056769 2010-08-25
FR1056769A FR2964291B1 (fr) 2010-08-25 2010-08-25 Circuit imprime comportant au moins un composant ceramique
PCT/FR2011/051950 WO2012025693A1 (fr) 2010-08-25 2011-08-23 Circuit imprime comportant au moins un composant ceramique

Publications (2)

Publication Number Publication Date
BR112013004222A2 true BR112013004222A2 (pt) 2016-07-05
BR112013004222B1 BR112013004222B1 (pt) 2020-02-18

Family

ID=43431226

Family Applications (1)

Application Number Title Priority Date Filing Date
BR112013004222-2A BR112013004222B1 (pt) 2010-08-25 2011-08-23 Circuito impresso ou uso de um material composto por matriz metálica

Country Status (9)

Country Link
US (1) US9198295B2 (pt)
EP (1) EP2609604B1 (pt)
JP (1) JP2013536587A (pt)
CN (1) CN103069518B (pt)
BR (1) BR112013004222B1 (pt)
CA (1) CA2809401C (pt)
FR (1) FR2964291B1 (pt)
RU (1) RU2608587C2 (pt)
WO (1) WO2012025693A1 (pt)

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE102015102866B4 (de) 2015-02-27 2023-02-02 Tdk Electronics Ag Keramisches Bauelement, Bauelementanordnung und Verfahren zur Herstellung eines keramischen Bauelements
GB201609688D0 (en) * 2016-05-03 2016-07-20 Moog Unna Gmbh Capacitor tray
JP7028031B2 (ja) * 2018-03-30 2022-03-02 Tdk株式会社 電子部品
US11219121B2 (en) 2020-01-08 2022-01-04 Honeywell International Inc. Circuit board assembly with electronic surface mount device and mount arrangement for thermal protection

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US3953647A (en) * 1973-10-05 1976-04-27 United Technologies Corporation Graphite fiber reinforced metal matrix composite
JPS6041136B2 (ja) * 1976-09-01 1985-09-14 財団法人特殊無機材料研究所 シリコンカ−バイド繊維強化軽金属複合材料の製造方法
JPS5787139A (en) * 1980-11-19 1982-05-31 Hitachi Ltd Semiconductor device
JPS57164946A (en) * 1981-03-31 1982-10-09 Sumitomo Chem Co Ltd Fiber reinforced metallic composite material
JPS61149449A (ja) * 1984-12-24 1986-07-08 Sumitomo Electric Ind Ltd 半導体装置用リ−ドフレ−ム複合材料およびその製造方法
JPS63245811A (ja) * 1987-03-31 1988-10-12 住友軽金属工業株式会社 複合リ−ド線及びその製造方法
JPH033752U (pt) * 1989-06-01 1991-01-16
CA2094369C (en) * 1992-04-21 2001-04-10 Pradeep Kumar Rohatgi Aluminum-base metal matrix composite
JPH0621276U (ja) * 1992-08-19 1994-03-18 株式会社富士通ゼネラル セラミックコンデンサの実装
US5367124A (en) * 1993-06-28 1994-11-22 International Business Machines Corporation Compliant lead for surface mounting a chip package to a substrate
US5588477A (en) * 1994-09-29 1996-12-31 General Motors Corporation Method of making metal matrix composite
US5937514A (en) * 1997-02-25 1999-08-17 Li; Chou H. Method of making a heat-resistant system
JPH10275740A (ja) * 1997-03-28 1998-10-13 Marcon Electron Co Ltd 電子部品
JP3206735B2 (ja) * 1998-01-29 2001-09-10 ティーディーケイ株式会社 セラミックコンデンサ
JPH1145821A (ja) * 1997-07-25 1999-02-16 Tdk Corp 金属端子付き複合積層セラミックコンデンサ
JPH1161292A (ja) * 1997-08-28 1999-03-05 Hitachi Ltd 銅−炭素繊維複合体及びその製造方法
DE69936008T2 (de) * 1998-01-07 2008-01-10 Tdk Corp. Keramischer Kondensator
US6081416A (en) * 1998-05-28 2000-06-27 Trinh; Hung Lead frames for mounting ceramic electronic parts, particularly ceramic capacitors, where the coefficient of thermal expansion of the lead frame is less than that of the ceramic
JP2000058372A (ja) * 1998-08-04 2000-02-25 Toshiba Corp セラミックコンデンサ実装構造
US6153929A (en) * 1998-08-21 2000-11-28 Micron Technology, Inc. Low profile multi-IC package connector
AT408345B (de) * 1999-11-17 2001-10-25 Electrovac Verfahren zur festlegung eines aus metall-matrix- composite-(mmc-) materiales gebildeten körpers auf einem keramischen körper
US6365973B1 (en) * 1999-12-07 2002-04-02 Intel Corporation Filled solder
JP2002198254A (ja) * 2000-12-26 2002-07-12 Tdk Corp セラミックコンデンサ
JP2002270464A (ja) * 2001-03-14 2002-09-20 Tdk Corp セラミックコンデンサ
JP2002313667A (ja) * 2001-04-12 2002-10-25 Murata Mfg Co Ltd セラミック電子部品
JP2003257779A (ja) * 2002-02-28 2003-09-12 Tdk Corp 電子部品
ATE394357T1 (de) * 2003-07-21 2008-05-15 Abb Research Ltd Laserbestrahlte metallisierte elektrokeramik
JP3883528B2 (ja) * 2003-08-19 2007-02-21 Ｔｄｋ株式会社 電子部品
US7279023B2 (en) * 2003-10-02 2007-10-09 Materials And Electrochemical Research (Mer) Corporation High thermal conductivity metal matrix composites
US20090147440A1 (en) * 2007-12-11 2009-06-11 Avx Corporation Low inductance, high rating capacitor devices
JP5350962B2 (ja) * 2009-09-30 2013-11-27 富士通株式会社 電子部品、基板ユニット及び情報処理装置

Also Published As

Publication number Publication date
WO2012025693A1 (fr) 2012-03-01
JP2013536587A (ja) 2013-09-19
BR112013004222B1 (pt) 2020-02-18
US9198295B2 (en) 2015-11-24
CN103069518A (zh) 2013-04-24
US20130146348A1 (en) 2013-06-13
FR2964291A1 (fr) 2012-03-02
RU2013112934A (ru) 2014-09-27
FR2964291B1 (fr) 2012-08-24
CA2809401C (fr) 2018-06-26
RU2608587C2 (ru) 2017-01-23
CN103069518B (zh) 2016-10-19
CA2809401A1 (fr) 2012-03-01
EP2609604B1 (fr) 2018-04-25
EP2609604A1 (fr) 2013-07-03

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Legal Events

Date Code Title Description
B06F Objections, documents and/or translations needed after an examination request according [chapter 6.6 patent gazette]
B06T Formal requirements before examination [chapter 6.20 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 23/08/2011, OBSERVADAS AS CONDICOES LEGAIS.

B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

Free format text: REFERENTE A 12A ANUIDADE.

B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2737 DE 20-06-2023 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.