BR112012027923A2 - redução dos efeitos de projeções como tampa devido à ablação a laser de um nível de metal pelo uso de uma camada de polímero reticulável por luz ou por calor não reticulado - Google Patents
redução dos efeitos de projeções como tampa devido à ablação a laser de um nível de metal pelo uso de uma camada de polímero reticulável por luz ou por calor não reticuladoInfo
- Publication number
- BR112012027923A2 BR112012027923A2 BR112012027923A BR112012027923A BR112012027923A2 BR 112012027923 A2 BR112012027923 A2 BR 112012027923A2 BR 112012027923 A BR112012027923 A BR 112012027923A BR 112012027923 A BR112012027923 A BR 112012027923A BR 112012027923 A2 BR112012027923 A2 BR 112012027923A2
- Authority
- BR
- Brazil
- Prior art keywords
- effects
- polymer layer
- metal level
- laser ablation
- reduction
- Prior art date
Links
- 238000000608 laser ablation Methods 0.000 title abstract 2
- 239000002184 metal Substances 0.000 title abstract 2
- 229920000642 polymer Polymers 0.000 title abstract 2
- 238000010147 laser engraving Methods 0.000 abstract 1
- 239000000463 material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/468—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics
- H10K10/471—Insulated gate field-effect transistors [IGFETs] characterised by the gate dielectrics the gate dielectric comprising only organic materials
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K71/00—Manufacture or treatment specially adapted for the organic devices covered by this subclass
- H10K71/621—Providing a shape to conductive layers, e.g. patterning or selective deposition
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/464—Lateral top-gate IGFETs comprising only a single gate
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K10/00—Organic devices specially adapted for rectifying, amplifying, oscillating or switching; Organic capacitors or resistors having potential barriers
- H10K10/40—Organic transistors
- H10K10/46—Field-effect transistors, e.g. organic thin-film transistors [OTFT]
- H10K10/462—Insulated gate field-effect transistors [IGFETs]
- H10K10/466—Lateral bottom-gate IGFETs comprising only a single gate
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Thin Film Transistor (AREA)
- Treatments Of Macromolecular Shaped Articles (AREA)
- Formation Of Insulating Films (AREA)
Abstract
redução dos efeitos de projeções como tampa devido à ablação a laser de um nível de metal pelo uso de uma camada de polímero reticulável por luz ou por calor não reticulado. o uso de um material reticulável a laser que aparece em forma não reticulada ou parcialmente reticulada para proteger, durante uma gravação a laser, os eletrodos de um transistor orgânico.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
FR1053566A FR2959865B1 (fr) | 2010-05-07 | 2010-05-07 | Diminution des effets de casquettes dues a l'ablation laser d'un niveau metallique par utilisation d'une couche de polymere photo- ou thermo-reticulable non reticule |
PCT/FR2011/050923 WO2011138539A1 (fr) | 2010-05-07 | 2011-04-21 | Diminution des effets de casquettes dues à l'ablation laser d'un niveau métallique par utilisation d'une couche de polymère photo- ou thermo- réticulable non réticulé |
Publications (1)
Publication Number | Publication Date |
---|---|
BR112012027923A2 true BR112012027923A2 (pt) | 2016-08-16 |
Family
ID=43420120
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112012027923A BR112012027923A2 (pt) | 2010-05-07 | 2011-04-21 | redução dos efeitos de projeções como tampa devido à ablação a laser de um nível de metal pelo uso de uma camada de polímero reticulável por luz ou por calor não reticulado |
Country Status (8)
Country | Link |
---|---|
US (1) | US8580605B2 (pt) |
EP (1) | EP2567419A1 (pt) |
JP (1) | JP2013529382A (pt) |
KR (1) | KR20130067275A (pt) |
CN (1) | CN102918676A (pt) |
BR (1) | BR112012027923A2 (pt) |
FR (1) | FR2959865B1 (pt) |
WO (1) | WO2011138539A1 (pt) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN105185835A (zh) * | 2015-07-30 | 2015-12-23 | 京东方科技集团股份有限公司 | 一种薄膜晶体管及其制作方法、阵列基板、显示装置 |
CN105702700B (zh) * | 2016-02-02 | 2018-10-26 | 福州大学 | 一种基于激光刻蚀技术的薄膜晶体管阵列及其制作方法 |
JP7234358B2 (ja) * | 2018-11-14 | 2023-03-07 | サン-ゴバン グラス フランス | ガラス基材の層又は層の積層物の選択的エッチングのための方法 |
Family Cites Families (15)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6186067B1 (en) * | 1999-09-30 | 2001-02-13 | Presstek, Inc. | Infrared laser-imageable lithographic printing members and methods of preparing and imaging such printing members |
KR101007813B1 (ko) * | 2003-11-24 | 2011-01-14 | 삼성전자주식회사 | 완충층을 포함하는 유기박막 트랜지스터 |
JP2005297498A (ja) * | 2004-04-16 | 2005-10-27 | Dainippon Printing Co Ltd | 可撓性基板およびそれを用いた有機デバイス |
GB0506896D0 (en) * | 2005-04-05 | 2005-05-11 | Plastic Logic Ltd | Stack ablation |
GB0511132D0 (en) * | 2005-06-01 | 2005-07-06 | Plastic Logic Ltd | Layer-selective laser ablation patterning |
WO2006129126A2 (en) * | 2005-06-01 | 2006-12-07 | Plastic Logic Limited | Layer-selective laser ablation patterning |
DE102005035696A1 (de) * | 2005-07-27 | 2007-02-15 | Thüringisches Institut für Textil- und Kunststoff-Forschung e.V. | Verfahren zur Herstellung organischer Feldeffekttransistoren und darauf basierender Schaltungen auf Lösungsmittel- und temperaturempfindlichen Kunststoffoberflächen und organische Feldeffekttransistoren und organische optoelektronische Bauelemente nach diesem Verfahren |
US7176053B1 (en) * | 2005-08-16 | 2007-02-13 | Organicid, Inc. | Laser ablation method for fabricating high performance organic devices |
GB2430201A (en) * | 2005-09-20 | 2007-03-21 | Seiko Epson Corp | Substrate surface with different hydrophilic or oleophilic areas |
JP5025124B2 (ja) * | 2005-11-24 | 2012-09-12 | 株式会社リコー | 有機半導体装置及びその製造方法並びに表示装置 |
US7545042B2 (en) * | 2005-12-22 | 2009-06-09 | Princo Corp. | Structure combining an IC integrated substrate and a carrier, and method of manufacturing such structure |
US7867688B2 (en) * | 2006-05-30 | 2011-01-11 | Eastman Kodak Company | Laser ablation resist |
JP4818839B2 (ja) * | 2006-07-19 | 2011-11-16 | 株式会社 日立ディスプレイズ | 液晶表示装置及びその製造方法 |
WO2009035036A1 (ja) * | 2007-09-14 | 2009-03-19 | Konica Minolta Holdings, Inc. | 電極の形成方法及び有機薄膜トランジスタ |
US8153347B2 (en) * | 2008-12-04 | 2012-04-10 | Eastman Kodak Company | Flexographic element and method of imaging |
-
2010
- 2010-05-07 FR FR1053566A patent/FR2959865B1/fr not_active Expired - Fee Related
-
2011
- 2011-04-21 CN CN2011800226229A patent/CN102918676A/zh active Pending
- 2011-04-21 WO PCT/FR2011/050923 patent/WO2011138539A1/fr active Application Filing
- 2011-04-21 EP EP11731442A patent/EP2567419A1/fr not_active Withdrawn
- 2011-04-21 KR KR1020127030491A patent/KR20130067275A/ko not_active Application Discontinuation
- 2011-04-21 BR BR112012027923A patent/BR112012027923A2/pt not_active IP Right Cessation
- 2011-04-21 JP JP2013508541A patent/JP2013529382A/ja active Pending
-
2012
- 2012-11-05 US US13/669,061 patent/US8580605B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
FR2959865A1 (fr) | 2011-11-11 |
FR2959865B1 (fr) | 2013-04-05 |
KR20130067275A (ko) | 2013-06-21 |
EP2567419A1 (fr) | 2013-03-13 |
US20130122648A1 (en) | 2013-05-16 |
US8580605B2 (en) | 2013-11-12 |
WO2011138539A1 (fr) | 2011-11-10 |
JP2013529382A (ja) | 2013-07-18 |
CN102918676A (zh) | 2013-02-06 |
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Legal Events
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B08F | Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette] |
Free format text: REFERENTE AS 4A E 5A ANUIDADES. |
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B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2384 DE 13-09-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |
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B350 | Update of information on the portal [chapter 15.35 patent gazette] |