BR112012012778A8 - disposição para unir um micro componente a um substrato - Google Patents
disposição para unir um micro componente a um substratoInfo
- Publication number
- BR112012012778A8 BR112012012778A8 BR112012012778A BR112012012778A BR112012012778A8 BR 112012012778 A8 BR112012012778 A8 BR 112012012778A8 BR 112012012778 A BR112012012778 A BR 112012012778A BR 112012012778 A BR112012012778 A BR 112012012778A BR 112012012778 A8 BR112012012778 A8 BR 112012012778A8
- Authority
- BR
- Brazil
- Prior art keywords
- attaching
- substrate
- arrangement
- micro component
- micro
- Prior art date
Links
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4228—Passive alignment, i.e. without a detection of the degree of coupling or the position of the elements
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/02—Mountings, adjusting means, or light-tight connections, for optical elements for lenses
- G02B7/025—Mountings, adjusting means, or light-tight connections, for optical elements for lenses using glue
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4219—Mechanical fixtures for holding or positioning the elements relative to each other in the couplings; Alignment methods for the elements, e.g. measuring or observing methods especially used therefor
- G02B6/4236—Fixing or mounting methods of the aligned elements
- G02B6/4239—Adhesive bonding; Encapsulation with polymer material
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B7/00—Mountings, adjusting means, or light-tight connections, for optical elements
- G02B7/003—Alignment of optical elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L24/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54426—Marks applied to semiconductor devices or parts for alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/2612—Auxiliary members for layer connectors, e.g. spacers
- H01L2224/26152—Auxiliary members for layer connectors, e.g. spacers being formed on an item to be connected not being a semiconductor or solid-state body
- H01L2224/26175—Flow barriers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/2919—Material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
- H01L2224/321—Disposition
- H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8312—Aligning
- H01L2224/83121—Active alignment, i.e. by apparatus steering, e.g. optical alignment using marks or sensors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8312—Aligning
- H01L2224/83143—Passive alignment, i.e. self alignment, e.g. using surface energy, chemical reactions, thermal equilibrium
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8319—Arrangement of the layer connectors prior to mounting
- H01L2224/83192—Arrangement of the layer connectors prior to mounting wherein the layer connectors are disposed only on another item or body to be connected to the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/832—Applying energy for connecting
- H01L2224/83234—Applying energy for connecting using means for applying energy being within the device, e.g. integrated heater
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/8338—Bonding interfaces outside the semiconductor or solid-state body
- H01L2224/83385—Shape, e.g. interlocking features
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
- H01L2224/838—Bonding techniques
- H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
- H01L2224/83855—Hardening the adhesive by curing, i.e. thermosetting
- H01L2224/83862—Heat curing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/345—Arrangements for heating
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
- H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/24—Structurally defined web or sheet [e.g., overall dimension, etc.]
- Y10T428/24479—Structurally defined web or sheet [e.g., overall dimension, etc.] including variation in thickness
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Micromachines (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Semiconductor Lasers (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US26545909P | 2009-12-01 | 2009-12-01 | |
US12/955,011 US8836100B2 (en) | 2009-12-01 | 2010-11-29 | Slotted configuration for optimized placement of micro-components using adhesive bonding |
PCT/US2010/058278 WO2011068777A2 (en) | 2009-12-01 | 2010-11-30 | Slotted configuration for optimized placement of micro-components using adhesive bonding |
Publications (2)
Publication Number | Publication Date |
---|---|
BR112012012778A2 BR112012012778A2 (pt) | 2017-12-12 |
BR112012012778A8 true BR112012012778A8 (pt) | 2018-05-08 |
Family
ID=44068222
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR112012012778A BR112012012778A8 (pt) | 2009-12-01 | 2010-11-30 | disposição para unir um micro componente a um substrato |
Country Status (5)
Country | Link |
---|---|
US (2) | US8836100B2 (pt) |
EP (1) | EP2507830B1 (pt) |
CN (2) | CN102714199B (pt) |
BR (1) | BR112012012778A8 (pt) |
WO (1) | WO2011068777A2 (pt) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US8836100B2 (en) | 2009-12-01 | 2014-09-16 | Cisco Technology, Inc. | Slotted configuration for optimized placement of micro-components using adhesive bonding |
US9261652B2 (en) | 2012-01-17 | 2016-02-16 | Cisco Technology, Inc. | Optical components including bonding slots for adhesion stability |
US9656439B2 (en) | 2013-07-10 | 2017-05-23 | Lumentum Operations Llc | Assembly of components having different coefficients of thermal expansion |
US9565773B2 (en) | 2014-03-31 | 2017-02-07 | Apple Inc. | Methods for assembling electronic devices with adhesive |
CN104979186B (zh) * | 2014-04-10 | 2018-02-06 | 中芯国际集成电路制造(上海)有限公司 | 一种半导体器件的制造方法 |
GB2526150B (en) * | 2014-05-16 | 2016-07-13 | Xyratex Tech Ltd | An optical printed circuit board and a method of mounting a component onto an optical printed circuit board |
US10025033B2 (en) | 2016-03-01 | 2018-07-17 | Advanced Semiconductor Engineering, Inc. | Optical fiber structure, optical communication apparatus and manufacturing process for manufacturing the same |
US9933577B2 (en) | 2016-03-11 | 2018-04-03 | Globalfoundries Inc. | Photonics chip |
US10241264B2 (en) | 2016-07-01 | 2019-03-26 | Advanced Semiconductor Engineering, Inc. | Semiconductor device packages |
US11215762B2 (en) | 2018-08-15 | 2022-01-04 | Advanced Semiconductor Engineering, Inc. | Optical device package and method for manufacturing the same |
JP7357595B2 (ja) * | 2020-09-17 | 2023-10-06 | 三菱電機株式会社 | 半導体装置および半導体装置の製造方法 |
US20220199881A1 (en) * | 2020-12-17 | 2022-06-23 | Intel Corporation | Micro patterns created on the surface to control placement and uniformity of material with viscosity |
WO2023217637A1 (en) * | 2022-05-09 | 2023-11-16 | X-Celeprint Limited | High-precision printed structures and methods of making |
Family Cites Families (34)
Publication number | Priority date | Publication date | Assignee | Title |
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JPH0618654A (ja) | 1992-06-30 | 1994-01-28 | Matsushita Electric Works Ltd | 受光装置 |
GB2310052B (en) * | 1996-02-08 | 2000-01-19 | Northern Telecom Ltd | Securing an optical fibre in a v-groove |
US5789278A (en) * | 1996-07-30 | 1998-08-04 | Micron Technology, Inc. | Method for fabricating chip modules |
US6535318B1 (en) * | 1999-11-12 | 2003-03-18 | Jds Uniphase Corporation | Integrated optoelectronic devices having pop-up mirrors therein and methods of forming and operating same |
US6215946B1 (en) * | 2000-03-16 | 2001-04-10 | Act Microdevices, Inc. | V-groove chip with wick-stop trench for improved fiber positioning |
US6363201B2 (en) * | 2000-03-16 | 2002-03-26 | Haleos, Inc. | Fiber array with wick-stop trench for improved fiber positioning |
US6404566B1 (en) * | 2000-04-04 | 2002-06-11 | Lucent Technologies Inc. | Apparatus and method for assembling optical devices |
US6848839B2 (en) * | 2000-04-07 | 2005-02-01 | Shipley Company, L.L.C. | Methods and devices for coupling optoelectronic packages |
US6547452B1 (en) * | 2000-05-11 | 2003-04-15 | International Business Machines Corporation | Alignment systems for subassemblies of overmolded optoelectronic modules |
US6526204B1 (en) * | 2000-07-11 | 2003-02-25 | Shipley Company Llc | Optical fiber array for preventing flow of glue between fibers and waveguide |
US6839474B2 (en) * | 2000-11-16 | 2005-01-04 | Shipley Company, L.L.C. | Optical assembly for coupling with integrated optical devices and method for making |
US6432695B1 (en) * | 2001-02-16 | 2002-08-13 | Institute Of Microelectronics | Miniaturized thermal cycler |
US7183195B2 (en) * | 2002-02-22 | 2007-02-27 | Samsung Electronics, Co., Ltd. | Method of fabricating dual damascene interconnections of microelectronic device using hybrid low k-dielectric and carbon-free inorganic filler |
US6808322B2 (en) * | 2002-09-24 | 2004-10-26 | Triquint Technology Holding Co. | Devices and method of mounting |
US6932521B2 (en) * | 2002-12-31 | 2005-08-23 | Oplink Communications, Inc. | Optical assembly and method for fabrication thereof |
US6774415B2 (en) * | 2003-01-02 | 2004-08-10 | International Business Machines Corporation | Method and structure for ultra-thin film SOI isolation |
GB0305890D0 (en) * | 2003-03-14 | 2003-04-16 | Bookham Technology Plc | Active alignment technique |
EP1697987A4 (en) * | 2003-11-10 | 2007-08-08 | Henkel Corp | ELECTRONIC CONDITIONING MATERIALS FOR SEMICONDUCTOR DEVICES WITH LOW DIELECTRIC CONSTANCE |
US7575955B2 (en) | 2004-01-06 | 2009-08-18 | Ismat Corporation | Method for making electronic packages |
US7104129B2 (en) * | 2004-02-02 | 2006-09-12 | Invensense Inc. | Vertically integrated MEMS structure with electronics in a hermetically sealed cavity |
JP4422624B2 (ja) * | 2004-03-03 | 2010-02-24 | 日本航空電子工業株式会社 | 微小可動デバイス及びその作製方法 |
US7545075B2 (en) * | 2004-06-04 | 2009-06-09 | The Board Of Trustees Of The Leland Stanford Junior University | Capacitive micromachined ultrasonic transducer array with through-substrate electrical connection and method of fabricating same |
WO2006081606A1 (en) | 2005-02-04 | 2006-08-10 | Redfern Integrated Optics Pty Ltd | Optical component and method of attachment |
KR100620810B1 (ko) * | 2005-03-07 | 2006-09-07 | 삼성전자주식회사 | Mems 소자 패키지 및 그 제조방법 |
KR100593937B1 (ko) * | 2005-03-30 | 2006-06-30 | 삼성전기주식회사 | Si기판을 이용한 LED 패키지 및 그 제조방법 |
TWM273082U (en) * | 2005-04-01 | 2005-08-11 | Lingsen Precision Ind Ltd | Structure for preventing glue from spilling used in carrier board for packaging integrated circuit |
KR100755658B1 (ko) * | 2006-03-09 | 2007-09-04 | 삼성전기주식회사 | 발광다이오드 패키지 |
US7447395B2 (en) * | 2006-06-15 | 2008-11-04 | Sioptical, Inc. | Silicon modulator offset tuning arrangement |
US7825501B2 (en) * | 2007-11-06 | 2010-11-02 | Fairchild Semiconductor Corporation | High bond line thickness for semiconductor devices |
US7829966B2 (en) * | 2007-11-23 | 2010-11-09 | Visera Technologies Company Limited | Electronic assembly for image sensor device |
US7821113B2 (en) * | 2008-06-03 | 2010-10-26 | Texas Instruments Incorporated | Leadframe having delamination resistant die pad |
US7943411B2 (en) * | 2008-09-10 | 2011-05-17 | Analog Devices, Inc. | Apparatus and method of wafer bonding using compatible alloy |
US8119498B2 (en) * | 2008-09-24 | 2012-02-21 | Evigia Systems, Inc. | Wafer bonding method and wafer stack formed thereby |
US8836100B2 (en) | 2009-12-01 | 2014-09-16 | Cisco Technology, Inc. | Slotted configuration for optimized placement of micro-components using adhesive bonding |
-
2010
- 2010-11-29 US US12/955,011 patent/US8836100B2/en active Active
- 2010-11-30 CN CN201080053263.9A patent/CN102714199B/zh active Active
- 2010-11-30 BR BR112012012778A patent/BR112012012778A8/pt not_active IP Right Cessation
- 2010-11-30 WO PCT/US2010/058278 patent/WO2011068777A2/en active Application Filing
- 2010-11-30 CN CN201510046559.2A patent/CN104614819B/zh active Active
- 2010-11-30 EP EP10834989.5A patent/EP2507830B1/en active Active
-
2014
- 2014-07-15 US US14/331,315 patent/US10175448B2/en active Active
Also Published As
Publication number | Publication date |
---|---|
CN104614819B (zh) | 2017-10-31 |
EP2507830B1 (en) | 2021-04-21 |
WO2011068777A3 (en) | 2011-09-22 |
EP2507830A4 (en) | 2018-01-10 |
CN102714199A (zh) | 2012-10-03 |
US8836100B2 (en) | 2014-09-16 |
US10175448B2 (en) | 2019-01-08 |
US20110127633A1 (en) | 2011-06-02 |
CN104614819A (zh) | 2015-05-13 |
EP2507830A2 (en) | 2012-10-10 |
WO2011068777A2 (en) | 2011-06-09 |
US20140362457A1 (en) | 2014-12-11 |
BR112012012778A2 (pt) | 2017-12-12 |
CN102714199B (zh) | 2015-03-18 |
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