BR0318090A - Gaiola de blindagem - Google Patents
Gaiola de blindagemInfo
- Publication number
- BR0318090A BR0318090A BR0318090-5A BR0318090A BR0318090A BR 0318090 A BR0318090 A BR 0318090A BR 0318090 A BR0318090 A BR 0318090A BR 0318090 A BR0318090 A BR 0318090A
- Authority
- BR
- Brazil
- Prior art keywords
- shield cage
- sections
- cage
- shield
- flexible
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
- H05K9/0007—Casings
- H05K9/002—Casings with localised screening
- H05K9/0022—Casings with localised screening of components mounted on printed circuit boards [PCB]
- H05K9/0024—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields
- H05K9/003—Shield cases mounted on a PCB, e.g. cans or caps or conformal shields made from non-conductive materials comprising an electro-conductive coating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K9/00—Screening of apparatus or components against electric or magnetic fields
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0284—Details of three-dimensional rigid printed circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09009—Substrate related
- H05K2201/09018—Rigid curved substrate
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10227—Other objects, e.g. metallic pieces
- H05K2201/10371—Shields or metal cases
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Applications Claiming Priority (4)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
EP03388007 | 2003-02-07 | ||
EP03388024A EP1445998B1 (en) | 2003-02-07 | 2003-04-25 | A shield can for shielding electronic components on a PWB |
US46775403P | 2003-05-02 | 2003-05-02 | |
PCT/EP2003/014798 WO2004071144A1 (en) | 2003-02-07 | 2003-12-19 | A shield can for shielding electronic components on a pwb |
Publications (1)
Publication Number | Publication Date |
---|---|
BR0318090A true BR0318090A (pt) | 2005-12-20 |
Family
ID=32853969
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BR0318090-5A BR0318090A (pt) | 2003-02-07 | 2003-12-19 | Gaiola de blindagem |
Country Status (5)
Country | Link |
---|---|
JP (1) | JP4657927B2 (ja) |
KR (1) | KR20060037236A (ja) |
AU (1) | AU2003298234A1 (ja) |
BR (1) | BR0318090A (ja) |
WO (1) | WO2004071144A1 (ja) |
Families Citing this family (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2014220397A (ja) * | 2013-05-09 | 2014-11-20 | 富士通株式会社 | シールド部品および電子装置 |
KR102286337B1 (ko) | 2014-10-17 | 2021-08-04 | 쓰리엠 이노베이티브 프로퍼티즈 컴파니 | 전자파 차폐 구조물과 방열패드 및 이들을 포함하는 전자회로기판 조립체 |
WO2018022725A1 (en) | 2016-07-26 | 2018-02-01 | General Cable Technologies Corporation | Cable having shielding tape wth conductive shielding segments |
ES2970292T3 (es) | 2018-06-14 | 2024-05-27 | Gen Cable Technologies Corp | Cable con cinta de blindaje con segmentos de blindaje conductor |
CN113766822A (zh) * | 2021-10-28 | 2021-12-07 | 维沃移动通信有限公司 | 一种电路板组件和电子设备 |
Family Cites Families (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5811050A (en) * | 1994-06-06 | 1998-09-22 | Gabower; John F. | Electromagnetic interference shield for electronic devices |
US5608188A (en) * | 1994-09-02 | 1997-03-04 | Motorola, Inc. | Multi compartment electromagnetic energy shield |
US5566055A (en) * | 1995-03-03 | 1996-10-15 | Parker-Hannifin Corporation | Shieled enclosure for electronics |
DE29612557U1 (de) * | 1996-07-19 | 1996-09-12 | Nokia Mobile Phones Ltd., Salo | Abschirmeinrichtung gegen elektromagnetische Strahlung |
WO2002052916A1 (en) * | 2000-12-21 | 2002-07-04 | Shielding For Electronics, Inc. | Emi and rfi containment enclosure for electronic devices |
-
2003
- 2003-12-19 KR KR1020057014374A patent/KR20060037236A/ko active IP Right Grant
- 2003-12-19 WO PCT/EP2003/014798 patent/WO2004071144A1/en active Application Filing
- 2003-12-19 BR BR0318090-5A patent/BR0318090A/pt not_active IP Right Cessation
- 2003-12-19 AU AU2003298234A patent/AU2003298234A1/en not_active Abandoned
- 2003-12-19 JP JP2005515704A patent/JP4657927B2/ja not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JP2006514442A (ja) | 2006-04-27 |
JP4657927B2 (ja) | 2011-03-23 |
AU2003298234A1 (en) | 2004-08-30 |
WO2004071144A1 (en) | 2004-08-19 |
KR20060037236A (ko) | 2006-05-03 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
B08L | Patent application lapsed because of non payment of annual fee [chapter 8.12 patent gazette] |
Free format text: REFERENTE AO NAO RECOLHIMENTO DAS 9A E 10A ANUIDADES. |
|
B08I | Application fees: publication cancelled [chapter 8.9 patent gazette] |
Free format text: ANULADA A PUBLICACAO CODIGO 8.12 NA RPI NO 2257 DE 08/04/2014 POR TER SIDO INDEVIDA. |
|
B08F | Application fees: application dismissed [chapter 8.6 patent gazette] |
Free format text: REFERENTE AS 9A, 10A, 11A, 12A, 13A, 14A, 15A E 16A ANUIDADES. |
|
B08K | Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette] |
Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2602 DE 17-11-2020 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013. |