BR0315010A - Dispositivo para tratar material em folha contìnua em um processo acentuado com plasma - Google Patents

Dispositivo para tratar material em folha contìnua em um processo acentuado com plasma

Info

Publication number
BR0315010A
BR0315010A BR0315010-0A BR0315010A BR0315010A BR 0315010 A BR0315010 A BR 0315010A BR 0315010 A BR0315010 A BR 0315010A BR 0315010 A BR0315010 A BR 0315010A
Authority
BR
Brazil
Prior art keywords
magnetron
plasma
web
drum
sheet material
Prior art date
Application number
BR0315010-0A
Other languages
English (en)
Inventor
Pierre Fayet
Bertrand Jaccoud
Original Assignee
Tetra Laval Holdings & Finance
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Tetra Laval Holdings & Finance filed Critical Tetra Laval Holdings & Finance
Publication of BR0315010A publication Critical patent/BR0315010A/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32082—Radio frequency generated discharge
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering
    • C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
    • C23C14/352—Sputtering by application of a magnetic field, e.g. magnetron sputtering using more than one target
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/56—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks
    • C23C14/562—Apparatus specially adapted for continuous coating; Arrangements for maintaining the vacuum, e.g. vacuum locks for coating elongated substrates
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C16/00—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes
    • C23C16/44—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating
    • C23C16/50—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges
    • C23C16/505—Chemical coating by decomposition of gaseous compounds, without leaving reaction products of surface material in the coating, i.e. chemical vapour deposition [CVD] processes characterised by the method of coating using electric discharges using radio frequency discharges
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/3266—Magnetic control means
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32431—Constructional details of the reactor
    • H01J37/32733—Means for moving the material to be treated
    • H01J37/32752—Means for moving the material to be treated for moving the material across the discharge
    • H01J37/32761—Continuous moving
    • H01J37/3277—Continuous moving of continuous material
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
    • H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
    • H01J37/3405—Magnetron sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Plasma & Fusion (AREA)
  • Analytical Chemistry (AREA)
  • Materials Engineering (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Chemical Vapour Deposition (AREA)
  • Physical Vapour Deposition (AREA)
  • Treatments Of Macromolecular Shaped Articles (AREA)
  • Plasma Technology (AREA)

Abstract

"DISPOSITIVO PARA TRATAR MATERIAL EM FOLHA CONTìNUA EM UM PROCESSO ACENTUADO COM PLASMA". A presente invenção refere-se a um dispositivo para tratar um material em folha contínua em um processo acentuado com plasma contínuo que compreende uma câmara de vácuo (1) com o dispositivo (2) para manter uma pressão reduzida constante dentro da câmara (1) e disposto dentro da câmara (1), um tambor giratório (3) para suportar e transportar a folha contínua (4), um dispositivo magnetron defrontando-se com a folha contínua (4) suportada e transportada pelo tambor (3) e um dispositivo de suprimento de gás para suprir um gás do processo ou mistura do gás do processo para um espaço (10) entre o tambor e o dispositivo magnetron, espaço este (10) no qual o plasma é sustentado. O dispositivo magnetron compreende uma pluralidade de eletrodos magnetron independentes (6) com faces de magnetron retangulares dispostas ao lado uma da outra em paralelo. Cada eletrodo magnetron (6) é individualmente energizado com uma voltagem alternada por seu próprio dispositivo de suprimento de força (7). O tambor (3) é eletricamente aterrado, flutuante ou negativamente polarizado. O dispositivo é em particular aplicável para revestir uma folha contínua flexível (4) em um processo químico de deposição por vapor acentuado com plasma, por exemplo, para revestir uma folha contínua de uma película de polímero com óxido de silício para aperfeiçoar suas propriedades de barreira. O dispositivo produz com alta confiabilidade, revestimentos com uma qualidade muito constante e só precisa de pouca manutenção que pode ser realizada de uma maneira simples.
BR0315010-0A 2002-10-03 2003-09-09 Dispositivo para tratar material em folha contìnua em um processo acentuado com plasma BR0315010A (pt)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
CH01652/02A CH696013A5 (de) 2002-10-03 2002-10-03 Vorrichtung zur Behandlung eines bandförmigen Materials in einem Plasma-unterstützten Prozess.
PCT/CH2003/000609 WO2004032175A1 (de) 2002-10-03 2003-09-09 Vorrichtung zur behandlung eines bandförmigen materials in einem plasma-unterstützten prozess

Publications (1)

Publication Number Publication Date
BR0315010A true BR0315010A (pt) 2005-08-09

Family

ID=32046627

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0315010-0A BR0315010A (pt) 2002-10-03 2003-09-09 Dispositivo para tratar material em folha contìnua em um processo acentuado com plasma

Country Status (11)

Country Link
US (1) US7806981B2 (pt)
EP (1) EP1547124B1 (pt)
JP (1) JP4585860B2 (pt)
KR (1) KR100977892B1 (pt)
CN (1) CN100466154C (pt)
AU (1) AU2003257359A1 (pt)
BR (1) BR0315010A (pt)
CH (1) CH696013A5 (pt)
DE (1) DE50303504D1 (pt)
MX (1) MXPA05003539A (pt)
WO (1) WO2004032175A1 (pt)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5095087B2 (ja) * 2005-04-21 2012-12-12 大日本印刷株式会社 成膜装置及び成膜方法
JP4558810B2 (ja) * 2008-02-29 2010-10-06 富士フイルム株式会社 成膜装置
DE202008006477U1 (de) * 2008-05-06 2008-07-24 Forschungs- Und Applikationslabor Plasmatechnik Gmbh Dresden Vorrichtung zur Modifizierung von Substratoberflächen
EP2473650A4 (en) * 2009-09-05 2015-09-02 Gen Plasma Inc PLASMA ASSISTED STEAM PHASE CHEMICAL DEPOSITION APPARATUS
JP5270505B2 (ja) * 2009-10-05 2013-08-21 株式会社神戸製鋼所 プラズマｃｖｄ装置
JP6474546B2 (ja) * 2011-12-28 2019-02-27 大日本印刷株式会社 プラズマを使った前処理装置を有した蒸着装置
JP5958092B2 (ja) * 2012-05-31 2016-07-27 ソニー株式会社 成膜装置及び成膜方法
JP6045265B2 (ja) * 2012-09-18 2016-12-14 リンテック株式会社 イオン注入装置
EP2762607B1 (en) * 2013-01-31 2018-07-25 Applied Materials, Inc. Deposition source with adjustable electrode
EP3054032B1 (en) * 2015-02-09 2017-08-23 Coating Plasma Industrie Installation for film deposition onto and/or modification of the surface of a moving substrate
RU2719370C2 (ru) * 2015-07-03 2020-04-17 Тетра Лаваль Холдингз Энд Файнэнс С.А. Устройство для обработки полотняной основы в плазмостимулируемом процессе
WO2017072121A1 (en) 2015-10-29 2017-05-04 Tetra Laval Holdings & Finance S.A. Laminated barrier film and edge-covering strip for packaging
US20200190663A1 (en) 2017-04-28 2020-06-18 Tetra Laval Holdings & Finance S.A. Barrier film
CN110832108B (zh) * 2017-06-30 2023-03-31 凸版印刷株式会社 膜处理方法及膜制造方法

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JPH07100857B2 (ja) * 1985-10-09 1995-11-01 株式会社日立製作所 炭素皮膜形成方法及び装置
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JPS63103066A (ja) * 1986-10-17 1988-05-07 Hitachi Ltd プレ−ナマグネトロン方式のスパツタリング装置
DE3735162A1 (de) * 1986-10-17 1988-04-28 Hitachi Ltd Aufdampfvorrichtung
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JPH0565642A (ja) * 1991-09-10 1993-03-19 Matsushita Electric Ind Co Ltd 反応性スパツタリング装置
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Also Published As

Publication number Publication date
DE50303504D1 (de) 2006-06-29
US7806981B2 (en) 2010-10-05
WO2004032175A1 (de) 2004-04-15
CH696013A5 (de) 2006-11-15
CN100466154C (zh) 2009-03-04
EP1547124B1 (de) 2006-05-24
KR20050065572A (ko) 2005-06-29
EP1547124A1 (de) 2005-06-29
CN1689133A (zh) 2005-10-26
US20060150908A1 (en) 2006-07-13
JP4585860B2 (ja) 2010-11-24
AU2003257359A1 (en) 2004-04-23
JP2006501366A (ja) 2006-01-12
KR100977892B1 (ko) 2010-08-24
MXPA05003539A (es) 2005-06-03

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Legal Events

Date Code Title Description
B08F Application dismissed because of non-payment of annual fees [chapter 8.6 patent gazette]

Free format text: REFERENTE A 13A ANUIDADE.

B08K Patent lapsed as no evidence of payment of the annual fee has been furnished to inpi [chapter 8.11 patent gazette]

Free format text: EM VIRTUDE DO ARQUIVAMENTO PUBLICADO NA RPI 2385 DE 20-09-2016 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDO O ARQUIVAMENTO DO PEDIDO DE PATENTE, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.