BR0307889A - Processo de limpeza contìnua de um material revestido por uma substância orgânica, gerador e dispositivo para realização do processo - Google Patents

Processo de limpeza contìnua de um material revestido por uma substância orgânica, gerador e dispositivo para realização do processo

Info

Publication number
BR0307889A
BR0307889A BR0307889-2A BR0307889A BR0307889A BR 0307889 A BR0307889 A BR 0307889A BR 0307889 A BR0307889 A BR 0307889A BR 0307889 A BR0307889 A BR 0307889A
Authority
BR
Brazil
Prior art keywords
generator
organic substance
voltage
continuous cleaning
material coated
Prior art date
Application number
BR0307889-2A
Other languages
English (en)
Other versions
BRPI0307889B8 (pt
BR0307889B1 (pt
Inventor
Daniel Chaleix
Patrick Choquet
Gerard Baravian
Bernard Lacour
Vicent Puech
Original Assignee
Usinor
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Usinor filed Critical Usinor
Priority to BRBR122012007163-3A priority Critical patent/BR122012007163B1/pt
Publication of BR0307889A publication Critical patent/BR0307889A/pt
Publication of BR0307889B1 publication Critical patent/BR0307889B1/pt
Publication of BRPI0307889B8 publication Critical patent/BRPI0307889B8/pt

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23G—CLEANING OR DE-GREASING OF METALLIC MATERIAL BY CHEMICAL METHODS OTHER THAN ELECTROLYSIS
    • C23G5/00—Cleaning or de-greasing metallic material by other methods; Apparatus for cleaning or de-greasing metallic material with organic solvents
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B7/00—Cleaning by methods not provided for in a single other subclass or a single group in this subclass
    • B08B7/0035—Cleaning by methods not provided for in a single other subclass or a single group in this subclass by radiant energy, e.g. UV, laser, light beam or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
    • H01J37/32—Gas-filled discharge tubes
    • H01J37/32009—Arrangements for generation of plasma specially adapted for examination or treatment of objects, e.g. plasma sources
    • H01J37/32348—Dielectric barrier discharge
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
    • H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
    • H01L21/3065—Plasma etching; Reactive-ion etching
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05H—PLASMA TECHNIQUE; PRODUCTION OF ACCELERATED ELECTRICALLY-CHARGED PARTICLES OR OF NEUTRONS; PRODUCTION OR ACCELERATION OF NEUTRAL MOLECULAR OR ATOMIC BEAMS
    • H05H1/00—Generating plasma; Handling plasma
    • H05H1/24—Generating plasma
    • H05H1/2406—Generating plasma using dielectric barrier discharges, i.e. with a dielectric interposed between the electrodes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/32—Processing objects by plasma generation
    • H01J2237/33—Processing objects by plasma generation characterised by the type of processing
    • H01J2237/335—Cleaning

Abstract

"PROCESSO DE LIMPEZA CONTìNUA DE UM MATERIAL REVESTIDO POR UMA SUBSTâNCIA ORGâNICA, GERADOR E DISPOSITIVO PARA REALIZAçãO DO PROCESSO". A presente invenção trata de um processo de limpeza contínua de um material (2) revestido por uma substância orgânica, que compreende as etapas que consistem em introduzir o referido material (2) em uma zona de tratamento alimentada por um fluxo gasoso que compreende o oxigênio, em aterrar o referido material (2) e em gerar um plasma impondo um campo elétrico entre a superfície do referido material (2) e pelo menos um eletrodo (3) recoberto de dielétrico, sendo que o referido campo elétrico é pulsado e compreende uma sucessão de impulsos de tensão positivos e negativos em relação ao referido material (2), a tensão máxima dos impulsos positivos U+ é superior à tensão de inicialização do arco Ua e a tensão máxima dos impulsos negativos U em valor absoluto é inferior à tensão de inicialização Ua, bem como um gerador e um dispositivo de realização do processo.
BRPI0307889A 2002-02-19 2003-02-19 processo de limpeza contínua de um material revestido por uma substância orgânica e dispositivo para realização do processo BRPI0307889B8 (pt)

Priority Applications (1)

Application Number Priority Date Filing Date Title
BRBR122012007163-3A BR122012007163B1 (pt) 2002-02-19 2003-02-19 Gerador para um processo de limpeza contínua de um material revestido por uma substância orgânica

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
FR02/02047 2002-02-19
FR0202047A FR2836157B1 (fr) 2002-02-19 2002-02-19 Procede de nettoyage de la surface d'un materiau enduit d'une susbstance organique, generateur et dispositif de mise en oeuvre
PCT/FR2003/000541 WO2003078692A1 (fr) 2002-02-19 2003-02-19 Procédé de nettoyage de la surface d'un matériau enduit d'une substance organique, générateur et dispositif de mise en oeuvre

Publications (3)

Publication Number Publication Date
BR0307889A true BR0307889A (pt) 2004-12-28
BR0307889B1 BR0307889B1 (pt) 2012-11-27
BRPI0307889B8 BRPI0307889B8 (pt) 2017-03-28

Family

ID=27636284

Family Applications (2)

Application Number Title Priority Date Filing Date
BRPI0307889A BRPI0307889B8 (pt) 2002-02-19 2003-02-19 processo de limpeza contínua de um material revestido por uma substância orgânica e dispositivo para realização do processo
BRBR122012007163-3A BR122012007163B1 (pt) 2002-02-19 2003-02-19 Gerador para um processo de limpeza contínua de um material revestido por uma substância orgânica

Family Applications After (1)

Application Number Title Priority Date Filing Date
BRBR122012007163-3A BR122012007163B1 (pt) 2002-02-19 2003-02-19 Gerador para um processo de limpeza contínua de um material revestido por uma substância orgânica

Country Status (18)

Country Link
US (2) US7662237B2 (pt)
EP (1) EP1476588B1 (pt)
JP (2) JP4704686B2 (pt)
KR (1) KR100929538B1 (pt)
CN (2) CN101014222B (pt)
AT (1) ATE340278T1 (pt)
AU (1) AU2003238140B2 (pt)
BR (2) BRPI0307889B8 (pt)
CA (1) CA2476184C (pt)
DE (1) DE60308484T2 (pt)
ES (1) ES2273007T3 (pt)
FR (1) FR2836157B1 (pt)
MX (1) MXPA04007930A (pt)
PL (1) PL202796B1 (pt)
PT (1) PT1476588E (pt)
RU (1) RU2308546C2 (pt)
WO (1) WO2003078692A1 (pt)
ZA (1) ZA200406609B (pt)

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FR2865420B1 (fr) 2004-01-28 2007-09-14 Saint Gobain Procede de nettoyage d'un substrat
EP1570921A1 (de) * 2004-03-02 2005-09-07 Siemens Aktiengesellschaft Verfahren zur Plasmareinigung eines Bauteils
US20060246218A1 (en) * 2005-04-29 2006-11-02 Guardian Industries Corp. Hydrophilic DLC on substrate with barrier discharge pyrolysis treatment
AT502351A1 (de) * 2005-09-12 2007-03-15 Ziger Peter Anlage zur plasmaprozessierung von endlosmaterial
SK287455B6 (sk) * 2006-06-08 2010-10-07 Fakulta Matematiky, Fyziky A Informatiky Univerzity Komensk�Ho Zariadenie a spôsob čistenia, leptania, aktivácie a následné úpravy povrchu skla, povrchu skla pokrytého kysličníkmi kovov a povrchu iných materiálov pokrytých SiO2
JP2009032651A (ja) * 2007-06-26 2009-02-12 Panasonic Electric Works Co Ltd プラズマ処理装置
DE102007052573B4 (de) * 2007-11-03 2015-04-09 Manroland Web Systems Gmbh Feuchtwerk
US9168988B2 (en) * 2010-12-27 2015-10-27 Loch Stock and Barrel LLC Method of cleaning a rotating object
TWI463922B (zh) * 2011-03-09 2014-12-01 Creating Nano Technologies Inc 電漿產生裝置
EP2707704B1 (en) * 2011-05-13 2019-04-24 DBD Innovations Pty Ltd Method of analyzing a material
WO2015187161A1 (en) * 2014-06-05 2015-12-10 Illinois Tool Works Inc. System and method for cleaning an object
CN104342714B (zh) * 2014-10-22 2016-08-24 河北大学 一种去除不锈钢表面氧化皮的方法
US10722925B2 (en) * 2017-12-04 2020-07-28 Suss Micro Tec Photomask Equipment Gmbh & Co Kg Treatment head, treatment system and method for treating a local surface area of a substrate
RU2739195C1 (ru) * 2020-04-07 2020-12-21 Общество С Ограниченной Ответственностью "Нтц Тонкопленочных Технологий В Энергетике" Вакуумная напылительная установка с системой лазерной очистки паллет (варианты)

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Also Published As

Publication number Publication date
CN101014222B (zh) 2010-11-03
FR2836157A1 (fr) 2003-08-22
FR2836157B1 (fr) 2004-04-09
CA2476184C (fr) 2010-02-09
CA2476184A1 (fr) 2003-09-25
BRPI0307889B8 (pt) 2017-03-28
AU2003238140B2 (en) 2008-05-01
PL202796B1 (pl) 2009-07-31
KR20040084923A (ko) 2004-10-06
DE60308484T2 (de) 2007-05-24
WO2003078692A1 (fr) 2003-09-25
US9502214B2 (en) 2016-11-22
JP4704686B2 (ja) 2011-06-15
KR100929538B1 (ko) 2009-12-03
EP1476588A1 (fr) 2004-11-17
BR122012007163B1 (pt) 2015-08-11
AU2003238140A1 (en) 2003-09-29
CN101014222A (zh) 2007-08-08
CN1311100C (zh) 2007-04-18
RU2004127920A (ru) 2005-06-10
PL370588A1 (en) 2005-05-30
MXPA04007930A (es) 2004-11-26
BR0307889B1 (pt) 2012-11-27
ATE340278T1 (de) 2006-10-15
ZA200406609B (en) 2005-08-31
JP2010031377A (ja) 2010-02-12
PT1476588E (pt) 2006-12-29
JP2005526181A (ja) 2005-09-02
DE60308484D1 (de) 2006-11-02
CN1633524A (zh) 2005-06-29
ES2273007T3 (es) 2007-05-01
EP1476588B1 (fr) 2006-09-20
US20090255809A1 (en) 2009-10-15
US20050145174A1 (en) 2005-07-07
RU2308546C2 (ru) 2007-10-20
US7662237B2 (en) 2010-02-16

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Legal Events

Date Code Title Description
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B06A Patent application procedure suspended [chapter 6.1 patent gazette]
B09A Decision: intention to grant [chapter 9.1 patent gazette]
B16A Patent or certificate of addition of invention granted [chapter 16.1 patent gazette]

Free format text: PRAZO DE VALIDADE: 20 (VINTE) ANOS CONTADOS A PARTIR DE 19/02/2003, MEDIANTE O RECOLHIMENTO DA TAXA QUINQUENAL DE MANUTENCAO (ARTIGOS 119 E 120 DA LPI) E OBSERVADAS AS DEMAIS CONDICOES LEGAIS.

B16C Correction of notification of the grant [chapter 16.3 patent gazette]
B21F Lapse acc. art. 78, item iv - on non-payment of the annual fees in time

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B24J Lapse because of non-payment of annual fees (definitively: art 78 iv lpi, resolution 113/2013 art. 12)

Free format text: EM VIRTUDE DA EXTINCAO PUBLICADA NA RPI 2658 DE 14-12-2021 E CONSIDERANDO AUSENCIA DE MANIFESTACAO DENTRO DOS PRAZOS LEGAIS, INFORMO QUE CABE SER MANTIDA A EXTINCAO DA PATENTE E SEUS CERTIFICADOS, CONFORME O DISPOSTO NO ARTIGO 12, DA RESOLUCAO 113/2013.