BR0214040A - Juntas ligadas curáveis e redissociáveis - Google Patents

Juntas ligadas curáveis e redissociáveis

Info

Publication number
BR0214040A
BR0214040A BR0214040-3A BR0214040A BR0214040A BR 0214040 A BR0214040 A BR 0214040A BR 0214040 A BR0214040 A BR 0214040A BR 0214040 A BR0214040 A BR 0214040A
Authority
BR
Brazil
Prior art keywords
action
heat
redissociable
curable
joints
Prior art date
Application number
BR0214040-3A
Other languages
English (en)
Other versions
BR0214040B1 (pt
Inventor
Jana Kolbe
Thomas Kowalik
Matthias Popp
Monika Sebald
Oliver Schorsch
Stefan Heberer
Markus Pridoehl
Guido Zimmermann
Andreas Hartwig
Erwin Born
Original Assignee
Degussa
Fraunhofer Ges Forschung
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from DE10210661A external-priority patent/DE10210661A1/de
Application filed by Degussa, Fraunhofer Ges Forschung filed Critical Degussa
Publication of BR0214040A publication Critical patent/BR0214040A/pt
Publication of BR0214040B1 publication Critical patent/BR0214040B1/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K9/00—Use of pretreated ingredients
    • C08K9/04—Ingredients treated with organic substances
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
    • C09J11/02—Non-macromolecular additives
    • C09J11/04—Non-macromolecular additives inorganic
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J9/00—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof
    • C08J9/04—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent
    • C08J9/06—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent
    • C08J9/10—Working-up of macromolecular substances to porous or cellular articles or materials; After-treatment thereof using blowing gases generated by a previously added blowing agent by a chemical blowing agent developing nitrogen, the blowing agent being a compound containing a nitrogen-to-nitrogen bond
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J5/00—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers
    • C09J5/06—Adhesive processes in general; Adhesive processes not provided for elsewhere, e.g. relating to primers involving heating of the applied adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J9/00—Adhesives characterised by their physical nature or the effects produced, e.g. glue sticks
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08J—WORKING-UP; GENERAL PROCESSES OF COMPOUNDING; AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F, C08G or C08H
    • C08J2207/00—Foams characterised by their intended use
    • C08J2207/02—Adhesive
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/50—Additional features of adhesives in the form of films or foils characterized by process specific features
    • C09J2301/502—Additional features of adhesives in the form of films or foils characterized by process specific features process for debonding adherents
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
    • Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
    • Y10T156/1153—Temperature change for delamination [e.g., heating during delaminating, etc.]
    • Y10T156/1158—Electromagnetic radiation applied to work for delamination [e.g., microwave, uv, ir, etc.]

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Inorganic Chemistry (AREA)
  • General Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Vehicle Interior And Exterior Ornaments, Soundproofing, And Insulation (AREA)

Abstract

"JUNTAS LIGADAS CURáVEIS E REDISSOCIáVEIS". A invenção refere-se a uma composição adesiva para a obtenção de produtos termorrígidos, capazes de ser aquecidos através de um campo elétrico, de um campo magnético, de um campo eletromagnético, de um campo elétrico alternante, de um campo magnético alternante ou de um campo eletromagnético alternante e que contêm partículas de recheio que são metálicas, ferromagnéticas, ferrimagnéticas, superparamagnéticas ou paramagnéticas. A dita composição adesiva pode ser endurecida sob a ação de aquecimento para formar uma estrutura adesiva estável de alta resistência, as ditas estruturas adesivas resultantes sendo capazes de ser similarmente dissociadas sob a ação de calor.
BRPI0214040-3A 2001-11-13 2002-11-12 composiÇço adesiva para a produÇço de termorrÍgidos, seu uso, seu processo de cura, compàsito adesivo, seus processos de dissociaÇço tÉrmica e uso dos referidos processos. BR0214040B1 (pt)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
DE10155614 2001-11-13
DE10210661A DE10210661A1 (de) 2001-11-13 2002-03-12 Induktiv härtbare und wieder lösbare Verbindungen
PCT/EP2002/012610 WO2003042315A1 (de) 2001-11-13 2002-11-12 Härtbare und wieder lösbare klebeverbindungen

Publications (2)

Publication Number Publication Date
BR0214040A true BR0214040A (pt) 2004-10-13
BR0214040B1 BR0214040B1 (pt) 2012-07-24

Family

ID=26010566

Family Applications (1)

Application Number Title Priority Date Filing Date
BRPI0214040-3A BR0214040B1 (pt) 2001-11-13 2002-11-12 composiÇço adesiva para a produÇço de termorrÍgidos, seu uso, seu processo de cura, compàsito adesivo, seus processos de dissociaÇço tÉrmica e uso dos referidos processos.

Country Status (9)

Country Link
US (1) US7569624B2 (pt)
EP (1) EP1444306B1 (pt)
JP (1) JP4320258B2 (pt)
KR (1) KR100628841B1 (pt)
AT (1) ATE358706T1 (pt)
BR (1) BR0214040B1 (pt)
CA (1) CA2467091C (pt)
DE (1) DE50209878D1 (pt)
WO (1) WO2003042315A1 (pt)

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US7704586B2 (en) * 2005-03-09 2010-04-27 Degussa Ag Plastic molded bodies having two-dimensional and three-dimensional image structures produced through laser subsurface engraving
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DE102005040157A1 (de) * 2005-08-25 2007-03-01 Degussa Ag Paste aus nanoskaligem Pulver und Dispergiermittel
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KR100628841B1 (ko) 2006-09-29
CA2467091C (en) 2009-10-20
JP4320258B2 (ja) 2009-08-26
US7569624B2 (en) 2009-08-04
US20040249037A1 (en) 2004-12-09
WO2003042315A1 (de) 2003-05-22
EP1444306A1 (de) 2004-08-11
DE50209878D1 (de) 2007-05-16
BR0214040B1 (pt) 2012-07-24
CA2467091A1 (en) 2003-05-22
ATE358706T1 (de) 2007-04-15
JP2005525433A (ja) 2005-08-25
EP1444306B1 (de) 2007-04-04

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