BR0012290B1 - processo para a produÇço de pasta fluida de àxido de cÉrio e a referida pasta. - Google Patents
processo para a produÇço de pasta fluida de àxido de cÉrio e a referida pasta.Info
- Publication number
- BR0012290B1 BR0012290B1 BRPI0012290-4A BR0012290A BR0012290B1 BR 0012290 B1 BR0012290 B1 BR 0012290B1 BR 0012290 A BR0012290 A BR 0012290A BR 0012290 B1 BR0012290 B1 BR 0012290B1
- Authority
- BR
- Brazil
- Prior art keywords
- slurry
- production
- cerium oxide
- oxide slurry
- cerium
- Prior art date
Links
- 239000002002 slurry Substances 0.000 title 2
- 229910000420 cerium oxide Inorganic materials 0.000 title 1
- BMMGVYCKOGBVEV-UHFFFAOYSA-N oxo(oxoceriooxy)cerium Chemical compound [Ce]=O.O=[Ce]=O BMMGVYCKOGBVEV-UHFFFAOYSA-N 0.000 title 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09K—MATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
- C09K3/00—Materials not provided for elsewhere
- C09K3/14—Anti-slip materials; Abrasives
- C09K3/1454—Abrasive powders, suspensions and pastes for polishing
- C09K3/1463—Aqueous liquid suspensions
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01F—COMPOUNDS OF THE METALS BERYLLIUM, MAGNESIUM, ALUMINIUM, CALCIUM, STRONTIUM, BARIUM, RADIUM, THORIUM, OR OF THE RARE-EARTH METALS
- C01F17/00—Compounds of rare earth metals
- C01F17/20—Compounds containing only rare earth metals as the metal element
- C01F17/206—Compounds containing only rare earth metals as the metal element oxide or hydroxide being the only anion
- C01F17/224—Oxides or hydroxides of lanthanides
- C01F17/235—Cerium oxides or hydroxides
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/01—Particle morphology depicted by an image
- C01P2004/03—Particle morphology depicted by an image obtained by SEM
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/62—Submicrometer sized, i.e. from 0.1-1 micrometer
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2006/00—Physical properties of inorganic compounds
- C01P2006/12—Surface area
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- Geology (AREA)
- Inorganic Chemistry (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Compounds Of Alkaline-Earth Elements, Aluminum Or Rare-Earth Metals (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US33422299A | 1999-06-16 | 1999-06-16 | |
| US09/553,968 US6238450B1 (en) | 1999-06-16 | 2000-04-21 | Ceria powder |
| PCT/US2000/015479 WO2000076920A1 (en) | 1999-06-16 | 2000-06-06 | Improved ceria powder |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| BR0012290A BR0012290A (pt) | 2002-04-16 |
| BR0012290B1 true BR0012290B1 (pt) | 2009-01-13 |
Family
ID=26989098
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| BRPI0012290-4A BR0012290B1 (pt) | 1999-06-16 | 2000-06-06 | processo para a produÇço de pasta fluida de àxido de cÉrio e a referida pasta. |
Country Status (14)
| Country | Link |
|---|---|
| US (1) | US6238450B1 (pt) |
| EP (1) | EP1200352B1 (pt) |
| JP (1) | JP3887230B2 (pt) |
| KR (1) | KR100429940B1 (pt) |
| CN (1) | CN1129554C (pt) |
| AU (1) | AU752038B2 (pt) |
| BR (1) | BR0012290B1 (pt) |
| CA (1) | CA2374373C (pt) |
| DE (1) | DE60001958T2 (pt) |
| IL (1) | IL147040A (pt) |
| MX (1) | MXPA01013093A (pt) |
| MY (1) | MY125250A (pt) |
| TW (1) | TW503216B (pt) |
| WO (1) | WO2000076920A1 (pt) |
Families Citing this family (66)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6602111B1 (en) * | 1999-07-16 | 2003-08-05 | Seimi Chemical Co., Ltd. | Abrasive |
| US6402851B1 (en) * | 2000-05-19 | 2002-06-11 | International Business Machines Corporation | Lanthanide oxide dissolution from glass surface |
| US7887714B2 (en) | 2000-12-25 | 2011-02-15 | Nissan Chemical Industries, Ltd. | Cerium oxide sol and abrasive |
| TWI272249B (en) * | 2001-02-27 | 2007-02-01 | Nissan Chemical Ind Ltd | Crystalline ceric oxide sol and process for producing the same |
| US6839362B2 (en) * | 2001-05-22 | 2005-01-04 | Saint-Gobain Ceramics & Plastics, Inc. | Cobalt-doped saturable absorber Q-switches and laser systems |
| TWI256971B (en) * | 2002-08-09 | 2006-06-21 | Hitachi Chemical Co Ltd | CMP abrasive and method for polishing substrate |
| JP3860528B2 (ja) * | 2002-11-12 | 2006-12-20 | 株式会社東芝 | 半導体装置の製造方法 |
| JP2004193495A (ja) * | 2002-12-13 | 2004-07-08 | Toshiba Corp | 化学的機械的研磨用スラリーおよびこれを用いた半導体装置の製造方法 |
| US7326477B2 (en) * | 2003-09-23 | 2008-02-05 | Saint-Gobain Ceramics & Plastics, Inc. | Spinel boules, wafers, and methods for fabricating same |
| US7045223B2 (en) * | 2003-09-23 | 2006-05-16 | Saint-Gobain Ceramics & Plastics, Inc. | Spinel articles and methods for forming same |
| US20050061230A1 (en) * | 2003-09-23 | 2005-03-24 | Saint-Gobain Ceramics & Plastics, Inc. | Spinel articles and methods for forming same |
| TWI273632B (en) | 2004-07-28 | 2007-02-11 | K C Tech Co Ltd | Polishing slurry, method of producing same, and method of polishing substrate |
| KR100682233B1 (ko) * | 2004-07-29 | 2007-02-12 | 주식회사 엘지화학 | 산화세륨 분말 및 그 제조방법 |
| KR100672940B1 (ko) | 2004-08-03 | 2007-01-24 | 삼성전자주식회사 | 금속막을 위한 화학적기계적 연마 슬러리 및 이를 이용한금속막의 화학적기계적 연마 방법 |
| US7919815B1 (en) | 2005-02-24 | 2011-04-05 | Saint-Gobain Ceramics & Plastics, Inc. | Spinel wafers and methods of preparation |
| KR100641348B1 (ko) | 2005-06-03 | 2006-11-03 | 주식회사 케이씨텍 | Ｃｍｐ용 슬러리와 이의 제조 방법 및 기판의 연마 방법 |
| US20080132150A1 (en) * | 2006-11-30 | 2008-06-05 | Gregory John Arserio | Polishing method for extreme ultraviolet optical elements and elements produced using the method |
| JP5474566B2 (ja) * | 2007-01-23 | 2014-04-16 | サンーゴバン アブレイシブズ，インコーポレイティド | 凝集塊を含む研磨布紙製品 |
| JP4301305B2 (ja) * | 2007-02-16 | 2009-07-22 | ソニー株式会社 | 基体研磨方法、半導体装置の製造方法 |
| US8000487B2 (en) | 2008-03-06 | 2011-08-16 | Starkey Laboratories, Inc. | Frequency translation by high-frequency spectral envelope warping in hearing assistance devices |
| KR100873945B1 (ko) * | 2008-07-16 | 2008-12-12 | (주) 뉴웰 | 미세 산화세륨 분말 그 제조 방법 및 이를 포함하는 씨엠피슬러리 |
| BRPI0916391A2 (pt) * | 2008-07-22 | 2019-03-06 | Saint Gobain Abrasifs Sa | produtos abrasivos revestidos contendo agregados |
| US8526650B2 (en) | 2009-05-06 | 2013-09-03 | Starkey Laboratories, Inc. | Frequency translation by high-frequency spectral envelope warping in hearing assistance devices |
| WO2012092619A2 (en) | 2010-12-30 | 2012-07-05 | Saint-Gobain Abrasives, Inc. | Coated abrasive aggregates and products containg same |
| CN103370174B (zh) | 2010-12-31 | 2017-03-29 | 圣戈本陶瓷及塑料股份有限公司 | 具有特定形状的研磨颗粒和此类颗粒的形成方法 |
| CN102751187B (zh) * | 2011-04-20 | 2015-11-25 | 中芯国际集成电路制造(上海)有限公司 | 抛光方法以及栅极的形成方法 |
| WO2013003830A2 (en) | 2011-06-30 | 2013-01-03 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive articles including abrasive particles of silicon nitride |
| CN103764349B (zh) | 2011-06-30 | 2017-06-09 | 圣戈本陶瓷及塑料股份有限公司 | 液相烧结碳化硅研磨颗粒 |
| BR112014007089A2 (pt) | 2011-09-26 | 2017-03-28 | Saint-Gobain Ceram & Plastics Inc | artigos abrasivos incluindo materiais de partículas abrasivas, abrasivos revestidos usando os materiais de partículas abrasivas e os métodos de formação |
| US9168638B2 (en) | 2011-09-29 | 2015-10-27 | Saint-Gobain Abrasives, Inc. | Abrasive products and methods for finishing hard surfaces |
| KR102187425B1 (ko) | 2011-12-30 | 2020-12-09 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | 형상화 연마입자 및 이의 형성방법 |
| CN104114664B (zh) | 2011-12-30 | 2016-06-15 | 圣戈本陶瓷及塑料股份有限公司 | 形成成型研磨颗粒 |
| PL2797716T3 (pl) | 2011-12-30 | 2021-07-05 | Saint-Gobain Ceramics & Plastics, Inc. | Kompozytowe ukształtowane cząstki ścierne i sposób ich formowania |
| WO2013106575A1 (en) | 2012-01-10 | 2013-07-18 | Saint-Gobain Abrasives, Inc. | Abrasive products and methods for finishing coated surfaces |
| EP3705177A1 (en) | 2012-01-10 | 2020-09-09 | Saint-Gobain Ceramics & Plastics Inc. | Abrasive particles having complex shapes and methods of forming same |
| US8840696B2 (en) | 2012-01-10 | 2014-09-23 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive particles having particular shapes and methods of forming such particles |
| CA2867350C (en) | 2012-03-16 | 2017-05-23 | Saint-Gobain Abrasives, Inc. | Abrasive products and methods for finishing surfaces |
| US8968435B2 (en) | 2012-03-30 | 2015-03-03 | Saint-Gobain Abrasives, Inc. | Abrasive products and methods for fine polishing of ophthalmic lenses |
| US9242346B2 (en) | 2012-03-30 | 2016-01-26 | Saint-Gobain Abrasives, Inc. | Abrasive products having fibrillated fibers |
| KR102534897B1 (ko) | 2012-05-23 | 2023-05-30 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | 형상화 연마입자들 및 이의 형성방법 |
| US10106714B2 (en) | 2012-06-29 | 2018-10-23 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive particles having particular shapes and methods of forming such particles |
| KR20150030237A (ko) * | 2012-07-25 | 2015-03-19 | 코니카 미놀타 가부시키가이샤 | 연마재 재생 방법 |
| US9440332B2 (en) | 2012-10-15 | 2016-09-13 | Saint-Gobain Abrasives, Inc. | Abrasive particles having particular shapes and methods of forming such particles |
| KR101818946B1 (ko) | 2012-12-31 | 2018-01-17 | 생-고뱅 세라믹스 앤드 플라스틱스, 인코포레이티드 | 미립자 소재 및 이의 형성방법 |
| CN107685296B (zh) | 2013-03-29 | 2020-03-06 | 圣戈班磨料磨具有限公司 | 具有特定形状的磨粒、形成这种粒子的方法及其用途 |
| TW201502263A (zh) | 2013-06-28 | 2015-01-16 | Saint Gobain Ceramics | 包含成形研磨粒子之研磨物品 |
| CA3114978A1 (en) | 2013-09-30 | 2015-04-02 | Saint-Gobain Ceramics & Plastics, Inc. | Shaped abrasive particles and methods of forming same |
| US9281210B2 (en) * | 2013-10-10 | 2016-03-08 | Cabot Microelectronics Corporation | Wet-process ceria compositions for polishing substrates, and methods related thereto |
| KR101870617B1 (ko) | 2013-12-31 | 2018-06-26 | 생-고뱅 어브레이시브즈, 인코포레이티드 | 형상화 연마 입자들을 포함하는 연마 물품 |
| US9771507B2 (en) | 2014-01-31 | 2017-09-26 | Saint-Gobain Ceramics & Plastics, Inc. | Shaped abrasive particle including dopant material and method of forming same |
| MX2016013464A (es) | 2014-04-14 | 2017-04-13 | Saint-Gobain Ceram & Plastics Inc | Articulo abrasivo que incluye particulas abrasivas conformadas. |
| ES2972193T3 (es) | 2014-04-14 | 2024-06-11 | Saint Gobain Ceramics | Artículo abrasivo que incluye partículas abrasivas conformadas |
| WO2015184355A1 (en) | 2014-05-30 | 2015-12-03 | Saint-Gobain Abrasives, Inc. | Method of using an abrasive article including shaped abrasive particles |
| US9914864B2 (en) | 2014-12-23 | 2018-03-13 | Saint-Gobain Ceramics & Plastics, Inc. | Shaped abrasive particles and method of forming same |
| US9707529B2 (en) | 2014-12-23 | 2017-07-18 | Saint-Gobain Ceramics & Plastics, Inc. | Composite shaped abrasive particles and method of forming same |
| US9676981B2 (en) | 2014-12-24 | 2017-06-13 | Saint-Gobain Ceramics & Plastics, Inc. | Shaped abrasive particle fractions and method of forming same |
| WO2016161157A1 (en) | 2015-03-31 | 2016-10-06 | Saint-Gobain Abrasives, Inc. | Fixed abrasive articles and methods of forming same |
| TWI634200B (zh) | 2015-03-31 | 2018-09-01 | 聖高拜磨料有限公司 | 固定磨料物品及其形成方法 |
| EP3307483B1 (en) | 2015-06-11 | 2020-06-17 | Saint-Gobain Ceramics&Plastics, Inc. | Abrasive article including shaped abrasive particles |
| PL3455321T3 (pl) | 2016-05-10 | 2022-12-12 | Saint-Gobain Ceramics&Plastics, Inc. | Sposób formowania cząstek ściernych |
| CN109462993A (zh) | 2016-05-10 | 2019-03-12 | 圣戈本陶瓷及塑料股份有限公司 | 磨料颗粒及其形成方法 |
| EP4349896A3 (en) | 2016-09-29 | 2024-06-12 | Saint-Gobain Abrasives, Inc. | Fixed abrasive articles and methods of forming same |
| US10563105B2 (en) | 2017-01-31 | 2020-02-18 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive article including shaped abrasive particles |
| US10759024B2 (en) | 2017-01-31 | 2020-09-01 | Saint-Gobain Ceramics & Plastics, Inc. | Abrasive article including shaped abrasive particles |
| WO2018236989A1 (en) | 2017-06-21 | 2018-12-27 | Saint-Gobain Ceramics & Plastics, Inc. | PARTICULATE MATERIALS AND METHODS OF FORMATION THEREOF |
| KR20220116556A (ko) | 2019-12-27 | 2022-08-23 | 세인트-고바인 세라믹스 앤드 플라스틱스, 인크. | 연마 물품 및 이의 형성 방법 |
Family Cites Families (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| GB1501570A (en) | 1975-11-11 | 1978-02-15 | Showa Denko Kk | Abrader for mirror polishing of glass and method for mirror polishing |
| EP0078098B1 (en) * | 1981-08-07 | 1986-05-14 | United Kingdom Atomic Energy Authority | Cerium compounds |
| FR2549846B1 (fr) | 1983-07-29 | 1986-12-26 | Rhone Poulenc Spec Chim | Nouvelle composition de polissage a base de cerium et son procede de fabrication |
| FI95387C (fi) | 1992-12-29 | 1996-01-25 | Borealis As | Menetelmä -olefiinien polymeroimiseksi sekä esipolymeroitu katalyyttikompositio ja menetelmä tämän valmistamiseksi |
| US5527423A (en) | 1994-10-06 | 1996-06-18 | Cabot Corporation | Chemical mechanical polishing slurry for metal layers |
| US5693239A (en) | 1995-10-10 | 1997-12-02 | Rodel, Inc. | Polishing slurries comprising two abrasive components and methods for their use |
| WO1997029510A1 (fr) * | 1996-02-07 | 1997-08-14 | Hitachi Chemical Company, Ltd. | Abrasif d'oxyde de cerium, microplaquette semi-conductrice, dispositif semi-conducteur, procede pour les produire et procede pour polir les substrats |
| US5858813A (en) | 1996-05-10 | 1999-01-12 | Cabot Corporation | Chemical mechanical polishing slurry for metal layers and films |
| KR19980019046A (ko) | 1996-08-29 | 1998-06-05 | 고사이 아키오 | 연마용 조성물 및 이의 용도(Abrasive composition and use of the same) |
| JPH10102040A (ja) * | 1996-09-30 | 1998-04-21 | Hitachi Chem Co Ltd | 酸化セリウム研磨剤及び基板の研磨法 |
| JPH10106986A (ja) * | 1996-09-30 | 1998-04-24 | Hitachi Chem Co Ltd | 酸化セリウム研磨剤及び基板の研磨法 |
| US5759917A (en) | 1996-12-30 | 1998-06-02 | Cabot Corporation | Composition for oxide CMP |
| JP3359535B2 (ja) * | 1997-04-25 | 2002-12-24 | 三井金属鉱業株式会社 | 半導体装置の製造方法 |
-
2000
- 2000-04-21 US US09/553,968 patent/US6238450B1/en not_active Expired - Fee Related
- 2000-05-16 TW TW089109353A patent/TW503216B/zh not_active IP Right Cessation
- 2000-06-06 IL IL14704000A patent/IL147040A/xx not_active IP Right Cessation
- 2000-06-06 MX MXPA01013093A patent/MXPA01013093A/es active IP Right Grant
- 2000-06-06 JP JP2001503391A patent/JP3887230B2/ja not_active Expired - Fee Related
- 2000-06-06 KR KR10-2001-7016080A patent/KR100429940B1/ko not_active IP Right Cessation
- 2000-06-06 CN CN00808911A patent/CN1129554C/zh not_active Expired - Fee Related
- 2000-06-06 EP EP00939578A patent/EP1200352B1/en not_active Expired - Lifetime
- 2000-06-06 CA CA002374373A patent/CA2374373C/en not_active Expired - Fee Related
- 2000-06-06 DE DE60001958T patent/DE60001958T2/de not_active Expired - Lifetime
- 2000-06-06 AU AU54647/00A patent/AU752038B2/en not_active Ceased
- 2000-06-06 WO PCT/US2000/015479 patent/WO2000076920A1/en active IP Right Grant
- 2000-06-06 BR BRPI0012290-4A patent/BR0012290B1/pt not_active IP Right Cessation
- 2000-06-14 MY MYPI20002675 patent/MY125250A/en unknown
Also Published As
| Publication number | Publication date |
|---|---|
| DE60001958D1 (de) | 2003-05-08 |
| BR0012290A (pt) | 2002-04-16 |
| CA2374373C (en) | 2005-04-05 |
| KR100429940B1 (ko) | 2004-05-03 |
| MY125250A (en) | 2006-07-31 |
| CN1355769A (zh) | 2002-06-26 |
| JP3887230B2 (ja) | 2007-02-28 |
| IL147040A (en) | 2005-07-25 |
| AU5464700A (en) | 2001-01-02 |
| IL147040A0 (en) | 2002-08-14 |
| DE60001958T2 (de) | 2004-03-04 |
| KR20020015698A (ko) | 2002-02-28 |
| EP1200352A1 (en) | 2002-05-02 |
| AU752038B2 (en) | 2002-09-05 |
| CN1129554C (zh) | 2003-12-03 |
| US6238450B1 (en) | 2001-05-29 |
| TW503216B (en) | 2002-09-21 |
| CA2374373A1 (en) | 2000-12-21 |
| WO2000076920A1 (en) | 2000-12-21 |
| EP1200352B1 (en) | 2003-04-02 |
| JP2003502255A (ja) | 2003-01-21 |
| MXPA01013093A (es) | 2002-06-04 |
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