BR0009620A - Composição de borracha de silicone curável a temperatura ambiente - Google Patents

Composição de borracha de silicone curável a temperatura ambiente

Info

Publication number
BR0009620A
BR0009620A BR0009620-2A BR0009620A BR0009620A BR 0009620 A BR0009620 A BR 0009620A BR 0009620 A BR0009620 A BR 0009620A BR 0009620 A BR0009620 A BR 0009620A
Authority
BR
Brazil
Prior art keywords
room temperature
rubber composition
silicone rubber
curable silicone
temperature curable
Prior art date
Application number
BR0009620-2A
Other languages
English (en)
Portuguese (pt)
Inventor
Hiroshi Adachi
Norio Sato
Original Assignee
Dow Corning Toray Silicone
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Dow Corning Toray Silicone filed Critical Dow Corning Toray Silicone
Publication of BR0009620A publication Critical patent/BR0009620A/pt

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/04—Polysiloxanes
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L83/00—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers
    • C08L83/14—Compositions of macromolecular compounds obtained by reactions forming in the main chain of the macromolecule a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon only; Compositions of derivatives of such polymers in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/04—Polysiloxanes
    • C08G77/14—Polysiloxanes containing silicon bound to oxygen-containing groups
    • C08G77/18—Polysiloxanes containing silicon bound to oxygen-containing groups to alkoxy or aryloxy groups
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G77/00—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule
    • C08G77/48—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms
    • C08G77/50—Macromolecular compounds obtained by reactions forming a linkage containing silicon with or without sulfur, nitrogen, oxygen or carbon in the main chain of the macromolecule in which at least two but not all the silicon atoms are connected by linkages other than oxygen atoms by carbon linkages
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/24—Acids; Salts thereof
    • C08K3/26—Carbonates; Bicarbonates
    • C08K2003/265—Calcium, strontium or barium carbonate
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K2201/00—Specific properties of additives
    • C08K2201/014—Additives containing two or more different additives of the same subgroup in C08K

Landscapes

  • Chemical & Material Sciences (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • Organic Chemistry (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Sealing Material Composition (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Paints Or Removers (AREA)
BR0009620-2A 1999-11-29 2000-11-27 Composição de borracha de silicone curável a temperatura ambiente BR0009620A (pt)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP33809099A JP5101762B2 (ja) 1999-11-29 1999-11-29 室温硬化性シリコーンゴム組成物

Publications (1)

Publication Number Publication Date
BR0009620A true BR0009620A (pt) 2002-04-23

Family

ID=18314820

Family Applications (1)

Application Number Title Priority Date Filing Date
BR0009620-2A BR0009620A (pt) 1999-11-29 2000-11-27 Composição de borracha de silicone curável a temperatura ambiente

Country Status (9)

Country Link
EP (1) EP1104787B1 (OSRAM)
JP (1) JP5101762B2 (OSRAM)
KR (1) KR100675021B1 (OSRAM)
CN (1) CN1255478C (OSRAM)
AT (1) ATE266701T1 (OSRAM)
BR (1) BR0009620A (OSRAM)
DE (1) DE60010627T2 (OSRAM)
ES (1) ES2220349T3 (OSRAM)
TW (1) TWI249559B (OSRAM)

Families Citing this family (26)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4809518B2 (ja) * 2000-07-31 2011-11-09 東レ・ダウコーニング株式会社 防振性シリコーン組成物
JP2002069300A (ja) * 2000-08-31 2002-03-08 Dow Corning Toray Silicone Co Ltd 防振性シリコーンコンパウンド
DE10139132A1 (de) * 2001-08-09 2003-02-27 Consortium Elektrochem Ind Alkoxyvernetzende einkomponentige feuchtigkeitshärtende Massen
KR101042468B1 (ko) 2003-03-31 2011-06-16 신에쓰 가가꾸 고교 가부시끼가이샤 포토마스크 블랭크, 포토마스크, 및 이들의 제조 방법
JP3962926B2 (ja) * 2003-04-01 2007-08-22 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
FR2855179B1 (fr) * 2003-04-04 2007-04-06 Rhodia Chimie Sa Agglomere de particules, notamment de liege, comprenant un liant silicone vulcanise, utilisation de cet agglomere pour la fabrication de bouchons
JP4438937B2 (ja) * 2004-02-05 2010-03-24 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
JP4530136B2 (ja) * 2004-04-06 2010-08-25 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物及びその製造方法
JP4781779B2 (ja) * 2005-10-27 2011-09-28 信越化学工業株式会社 高分子量オルガノポリシロキサンの製造方法、該高分子量オルガノポリシロキサンを含む組成物およびその硬化物で封止された光半導体装置
US7625976B2 (en) * 2006-01-09 2009-12-01 Momemtive Performance Materials Inc. Room temperature curable organopolysiloxane composition
US20070179236A1 (en) * 2006-02-01 2007-08-02 Landon Shayne J Sealant composition having reduced permeability to gas
JP5015476B2 (ja) * 2006-03-01 2012-08-29 東レ・ダウコーニング株式会社 電極・電気回路の保護剤組成物
JP4912754B2 (ja) 2006-06-05 2012-04-11 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
JP4530177B2 (ja) 2006-12-11 2010-08-25 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
JP5284631B2 (ja) * 2007-12-11 2013-09-11 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化性ポリオルガノシロキサン組成物
JP4984086B2 (ja) * 2008-05-14 2012-07-25 信越化学工業株式会社 室温硬化性オルガノポリシロキサン組成物
GB0808682D0 (en) * 2008-05-14 2008-06-18 Dow Corning Silicone rubber compositions
CN102162720B (zh) * 2010-12-27 2012-06-20 天津钢管集团股份有限公司 应用缩聚二次印模硅橡胶测量标准样管人工u型伤的方法
JP2012219113A (ja) * 2011-04-04 2012-11-12 Dow Corning Toray Co Ltd 室温硬化性シリコーンゴム組成物
JP6440615B2 (ja) 2012-07-30 2018-12-19 ダウ シリコーンズ コーポレーション 熱伝導性縮合反応硬化型ポリオルガノシロキサン組成物、並びに該組成物の調製及び使用のための方法
EP2882802B1 (de) 2012-08-10 2017-06-28 Sika Technology AG Witterungsstabile siliconmischung mit verbesserter grünstandfestigkeit
KR101884177B1 (ko) 2013-12-27 2018-08-02 다우 코닝 도레이 캄파니 리미티드 실온-경화성 실리콘 고무 조성물, 및 그의 용도
CN109690367A (zh) * 2016-09-07 2019-04-26 住友化学株式会社 波长转换片材、层叠体及发光装置、以及波长转换片材的制造方法
KR101864504B1 (ko) * 2016-11-11 2018-06-29 주식회사 케이씨씨 유기폴리실록산 조성물
CN110982482B (zh) * 2019-12-25 2021-08-17 广西华纳新材料科技有限公司 一种低模量高伸长率粘接性好的硅酮密封胶及其制备方法
WO2024162022A1 (ja) 2023-01-31 2024-08-08 モメンティブ・パフォーマンス・マテリアルズ・ジャパン合同会社 室温硬化型シリコーン組成物

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5051455A (en) * 1990-01-16 1991-09-24 Dow Corning Corporation Adhesion of silicone sealants
GB9124833D0 (en) * 1991-11-22 1992-01-15 Dow Corning Sa Curable filled polysiloxane compositions
TW252146B (OSRAM) * 1992-08-25 1995-07-21 Dow Corning

Also Published As

Publication number Publication date
DE60010627T2 (de) 2005-09-01
JP2001152020A (ja) 2001-06-05
TWI249559B (en) 2006-02-21
ES2220349T3 (es) 2004-12-16
JP5101762B2 (ja) 2012-12-19
KR20010051993A (ko) 2001-06-25
DE60010627D1 (de) 2004-06-17
KR100675021B1 (ko) 2007-01-29
EP1104787B1 (en) 2004-05-12
CN1304952A (zh) 2001-07-25
EP1104787A3 (en) 2001-12-19
EP1104787A2 (en) 2001-06-06
ATE266701T1 (de) 2004-05-15
CN1255478C (zh) 2006-05-10

Similar Documents

Publication Publication Date Title
BR0009620A (pt) Composição de borracha de silicone curável a temperatura ambiente
ATE262564T1 (de) Bei raumtempertur aushärtende silikonkautschukzusammensetzung
NO20011836L (no) Fotoherdbare siloxanpolymerer
DK1406505T3 (da) Bionedbrydelig gummibase, som udviser forbedrede egenskaber
BR9900845A (pt) Polímeros de hidrogel de silicone.
PL317847A1 (en) Silica based rubber compositions for tyres, containing strengthening additive based on polyorganosiloxane with functional groups and organosiloxane
TR199700163A3 (tr) Reolojisi tadil edilmis polimerler.
DE69527924D1 (de) Hitzebeständige xylanasen
DE59913159D1 (de) Acryloxypropyl- oder Methacryloxypropyl-Gruppen enthaltende Siloxan-Oligomere
ATE325844T1 (de) Thermoplastische zusammensetzungen auf basis von polyamid
DE69306698D1 (de) Polydiorganosiloxan mit Alkoxyendgruppen und von diesem abgeleitete, bei Umgebungstemperatur vulkanisierbare Siliconelastomere
EP0939107A3 (de) Bei Raumtemperatur aushärtende Silicon-Masse und ihre Verwendung
DE50207876D1 (de) Polymerzusammensetzung, enthaltend wenigstens ein mittelmolekulares reaktives polyisobuten
DE60014427D1 (de) Bei umgebungstemperatur härtbare siloxanzusammensetzungen mit verbesserter adhäsion
ATE236222T1 (de) Bei raumtemperatur aushärtende silicon-masse ii und ihre verwendung
DE69800172D1 (de) Mit Organohydrogensiloxan-Vernetzen härtbare Organosiloxan-Zusammensetzunt mit verbesserten Hysterese-Eigenschaften
DE69513490D1 (de) Härtbare Siliconkautschukzusammensetzung
EP0787774A3 (en) Room-temperature-curable silicone composition
DE50213575D1 (de) Carbamat- und/oder allophanatgruppen enthaltende, thermisch und mit aktinischer strahlung härtbare gemische
CO5160379A1 (es) Interpolimeros mejorados de olefina funcionalizados con silano y derivados de los mismos tencion
DE69421743D1 (de) Silikongummi-Zusammensetzungen, Herstellung und Verwendung
DE69915740D1 (de) Härtbare Harzzusammensetzungen, ihre Herstellung und Verwendung
DE69905542D1 (de) Additionshärtbare Silikonelastomermischung
BR9915093B1 (pt) composição polimérica modificada com borracha melhorada.
DK0861875T3 (da) Smidige polyamidbaserede sammensætninger, der er egnede til blæseekstrudering

Legal Events

Date Code Title Description
B11A Dismissal acc. art.33 of ipl - examination not requested within 36 months of filing
B11Y Definitive dismissal - extension of time limit for request of examination expired [chapter 11.1.1 patent gazette]