BE904074A - Condensateur de decouplage pour assemblage avec disposition a grille de broches. - Google Patents
Condensateur de decouplage pour assemblage avec disposition a grille de broches.Info
- Publication number
- BE904074A BE904074A BE6/48183A BE6048183A BE904074A BE 904074 A BE904074 A BE 904074A BE 6/48183 A BE6/48183 A BE 6/48183A BE 6048183 A BE6048183 A BE 6048183A BE 904074 A BE904074 A BE 904074A
- Authority
- BE
- Belgium
- Prior art keywords
- assembly
- decoupling capacitor
- pin grid
- grid arrangement
- conductors
- Prior art date
Links
- 239000003990 capacitor Substances 0.000 title abstract 3
- 239000004020 conductor Substances 0.000 abstract 3
- 239000003989 dielectric material Substances 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G4/00—Fixed capacitors; Processes of their manufacture
- H01G4/002—Details
- H01G4/228—Terminals
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
- H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
- H01G2/12—Protection against corrosion
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
- H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
- H05K1/0231—Capacitors or dielectric substances
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10431—Details of mounted components
- H05K2201/10507—Involving several components
- H05K2201/10515—Stacked components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
- H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
- H05K2201/10621—Components characterised by their electrical contacts
- H05K2201/10704—Pin grid array [PGA]
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Manufacturing & Machinery (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Le condensateur de découpage comprend un matériau diélectrique (38) interposé entre une paire de conducteurs (40,42) et ayant plusieurs conducteurs (44,46) partant de chaque conducteur. Conformément à la présente invention, le condensateur de découplage est dimensionné et disposé dans chaque cas de manière à pouvoir etre adapté sous un montage PGA et à correspondre à la disposition des broches de terre et de puissance de montage PGA. Application au découplage des bruits à haute fréquence.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US69318985A | 1985-01-22 | 1985-01-22 |
Publications (1)
Publication Number | Publication Date |
---|---|
BE904074A true BE904074A (fr) | 1986-05-15 |
Family
ID=24783676
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
BE6/48183A BE904074A (fr) | 1985-01-22 | 1986-01-21 | Condensateur de decouplage pour assemblage avec disposition a grille de broches. |
Country Status (7)
Country | Link |
---|---|
BE (1) | BE904074A (fr) |
BR (1) | BR8600229A (fr) |
DE (1) | DE3601681A1 (fr) |
FR (1) | FR2576448B1 (fr) |
GB (1) | GB2170047B (fr) |
IT (1) | IT1188279B (fr) |
MX (1) | MX160273A (fr) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US4667267A (en) * | 1985-01-22 | 1987-05-19 | Rogers Corporation | Decoupling capacitor for pin grid array package |
GB2176654B (en) * | 1985-06-11 | 1988-08-10 | Avx Corp | Method for optimising the decoupling of integrated circuit devices |
DE3636714C2 (de) * | 1986-10-28 | 1993-11-25 | Roederstein Kondensatoren | Verwendung eines Schichtkondensators als kapazitive Stromschiene |
DE3910518A1 (de) * | 1989-04-01 | 1990-10-04 | Manfred Haller | Schaltungsplatine fuer die optimale entkopplung von schaltungen mit digitalen ic's |
JPH0724332B2 (ja) * | 1989-07-04 | 1995-03-15 | 富士通株式会社 | プリント回路板 |
US5049979A (en) * | 1990-06-18 | 1991-09-17 | Microelectronics And Computer Technology Corporation | Combined flat capacitor and tab integrated circuit chip and method |
US5557505A (en) * | 1994-07-22 | 1996-09-17 | Ast Research, Inc. | Dual pattern microprocessor package footprint |
US5777853A (en) * | 1996-05-03 | 1998-07-07 | Ast Research, Inc. | Printed circuit board having a dual square pattern footprints for receiving one of two electronic components having equal printouts per size |
US5764488A (en) * | 1996-06-11 | 1998-06-09 | Ast Research, Inc. | Printed circuit board having a dual pattern footprint for receiving one of two component packages |
US5751557A (en) * | 1996-06-21 | 1998-05-12 | Ast Research, Inc. | Printed circuit board having a triple pattern footprint for receiving one of three component packages |
US6067594A (en) | 1997-09-26 | 2000-05-23 | Rambus, Inc. | High frequency bus system |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5332233B1 (fr) * | 1968-12-25 | 1978-09-07 | ||
US3611051A (en) * | 1970-03-13 | 1971-10-05 | Sprague Electric Co | Feed-through, electrolytic, book capacitor |
NL7207899A (fr) * | 1972-06-09 | 1973-12-11 | ||
US4338621A (en) * | 1980-02-04 | 1982-07-06 | Burroughs Corporation | Hermetic integrated circuit package for high density high power applications |
US4441119A (en) * | 1981-01-15 | 1984-04-03 | Mostek Corporation | Integrated circuit package |
US4439754A (en) * | 1981-04-03 | 1984-03-27 | Electro-Films, Inc. | Apertured electronic circuit package |
JPS5816552A (ja) * | 1981-07-22 | 1983-01-31 | Fujitsu Ltd | 半導体素子用パッケ−ジ |
DE3214991A1 (de) * | 1982-04-22 | 1983-11-03 | Siemens AG, 1000 Berlin und 8000 München | Halbleiterbaustein mit diskretem kondensator |
JPS594060A (ja) * | 1982-06-30 | 1984-01-10 | Fujitsu Ltd | 半導体装置 |
US4502101A (en) * | 1982-07-30 | 1985-02-26 | Rogers Corporation | Decoupled integrated circuit package |
GB2132019A (en) * | 1982-12-07 | 1984-06-27 | Stc Plc | Electrolytic capacitor manufacture |
US4475143A (en) * | 1983-01-10 | 1984-10-02 | Rogers Corporation | Decoupling capacitor and method of manufacture thereof |
US4494169A (en) * | 1983-11-14 | 1985-01-15 | Rogers Corporation | Decoupling capacitor and method of manufacture thereof |
-
1986
- 1986-01-10 FR FR868600287A patent/FR2576448B1/fr not_active Expired
- 1986-01-20 IT IT19116/86A patent/IT1188279B/it active
- 1986-01-21 BE BE6/48183A patent/BE904074A/fr not_active IP Right Cessation
- 1986-01-21 DE DE19863601681 patent/DE3601681A1/de not_active Withdrawn
- 1986-01-21 GB GB08601412A patent/GB2170047B/en not_active Expired
- 1986-01-21 BR BR8600229A patent/BR8600229A/pt unknown
- 1986-01-21 MX MX1286A patent/MX160273A/es unknown
Also Published As
Publication number | Publication date |
---|---|
GB8601412D0 (en) | 1986-02-26 |
GB2170047B (en) | 1988-12-21 |
FR2576448A1 (fr) | 1986-07-25 |
GB2170047A (en) | 1986-07-23 |
IT8619116A0 (it) | 1986-01-20 |
IT1188279B (it) | 1988-01-07 |
BR8600229A (pt) | 1986-09-30 |
DE3601681A1 (de) | 1986-08-07 |
FR2576448B1 (fr) | 1989-04-14 |
MX160273A (es) | 1990-01-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
CH | Change of patent owner |
Owner name: *MEKTRON N.V. Effective date: 19860121 |
|
RE | Patent lapsed |
Owner name: MEKTRON N.V. Effective date: 19920131 |