BE904074A - DECOUPLING CAPACITOR FOR ASSEMBLY WITH A PIN GRID ARRANGEMENT. - Google Patents

DECOUPLING CAPACITOR FOR ASSEMBLY WITH A PIN GRID ARRANGEMENT.

Info

Publication number
BE904074A
BE904074A BE6/48183A BE6048183A BE904074A BE 904074 A BE904074 A BE 904074A BE 6/48183 A BE6/48183 A BE 6/48183A BE 6048183 A BE6048183 A BE 6048183A BE 904074 A BE904074 A BE 904074A
Authority
BE
Belgium
Prior art keywords
assembly
decoupling capacitor
pin grid
grid arrangement
conductors
Prior art date
Application number
BE6/48183A
Other languages
French (fr)
Inventor
S C Lockard
M S Hyslop
J M Hernandez
Original Assignee
Rogers Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Rogers Corp filed Critical Rogers Corp
Publication of BE904074A publication Critical patent/BE904074A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G4/00—Fixed capacitors; Processes of their manufacture
    • H01G4/002—Details
    • H01G4/228—Terminals
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01G—CAPACITORS; CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES, LIGHT-SENSITIVE OR TEMPERATURE-SENSITIVE DEVICES OF THE ELECTROLYTIC TYPE
    • H01G2/00—Details of capacitors not covered by a single one of groups H01G4/00-H01G11/00
    • H01G2/12—Protection against corrosion
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0216—Reduction of cross-talk, noise or electromagnetic interference
    • H05K1/023—Reduction of cross-talk, noise or electromagnetic interference using auxiliary mounted passive components or auxiliary substances
    • H05K1/0231—Capacitors or dielectric substances
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10431—Details of mounted components
    • H05K2201/10507—Involving several components
    • H05K2201/10515—Stacked components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10613—Details of electrical connections of non-printed components, e.g. special leads
    • H05K2201/10621—Components characterised by their electrical contacts
    • H05K2201/10704—Pin grid array [PGA]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3447—Lead-in-hole components

Landscapes

  • Engineering & Computer Science (AREA)
  • Power Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Manufacturing & Machinery (AREA)
  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Fixed Capacitors And Capacitor Manufacturing Machines (AREA)

Abstract

Le condensateur de découpage comprend un matériau diélectrique (38) interposé entre une paire de conducteurs (40,42) et ayant plusieurs conducteurs (44,46) partant de chaque conducteur. Conformément à la présente invention, le condensateur de découplage est dimensionné et disposé dans chaque cas de manière à pouvoir etre adapté sous un montage PGA et à correspondre à la disposition des broches de terre et de puissance de montage PGA. Application au découplage des bruits à haute fréquence.The chopping capacitor includes a dielectric material (38) interposed between a pair of conductors (40,42) and having a plurality of conductors (44,46) extending from each conductor. In accordance with the present invention, the decoupling capacitor is dimensioned and arranged in each case so as to be able to be adapted under a PGA mounting and to correspond to the arrangement of the ground and power PGA mounting pins. Application to decoupling high frequency noise.

BE6/48183A 1985-01-22 1986-01-21 DECOUPLING CAPACITOR FOR ASSEMBLY WITH A PIN GRID ARRANGEMENT. BE904074A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69318985A 1985-01-22 1985-01-22

Publications (1)

Publication Number Publication Date
BE904074A true BE904074A (en) 1986-05-15

Family

ID=24783676

Family Applications (1)

Application Number Title Priority Date Filing Date
BE6/48183A BE904074A (en) 1985-01-22 1986-01-21 DECOUPLING CAPACITOR FOR ASSEMBLY WITH A PIN GRID ARRANGEMENT.

Country Status (7)

Country Link
BE (1) BE904074A (en)
BR (1) BR8600229A (en)
DE (1) DE3601681A1 (en)
FR (1) FR2576448B1 (en)
GB (1) GB2170047B (en)
IT (1) IT1188279B (en)
MX (1) MX160273A (en)

Families Citing this family (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4667267A (en) * 1985-01-22 1987-05-19 Rogers Corporation Decoupling capacitor for pin grid array package
GB2176654B (en) * 1985-06-11 1988-08-10 Avx Corp Method for optimising the decoupling of integrated circuit devices
DE3636714C2 (en) * 1986-10-28 1993-11-25 Roederstein Kondensatoren Use of a film capacitor as a capacitive busbar
DE3910518A1 (en) * 1989-04-01 1990-10-04 Manfred Haller Printed circuit board for optimum decoupling of circuits having digital ICs
JPH0724332B2 (en) * 1989-07-04 1995-03-15 富士通株式会社 Printed circuit board
US5049979A (en) * 1990-06-18 1991-09-17 Microelectronics And Computer Technology Corporation Combined flat capacitor and tab integrated circuit chip and method
US5557505A (en) * 1994-07-22 1996-09-17 Ast Research, Inc. Dual pattern microprocessor package footprint
US5777853A (en) * 1996-05-03 1998-07-07 Ast Research, Inc. Printed circuit board having a dual square pattern footprints for receiving one of two electronic components having equal printouts per size
US5764488A (en) * 1996-06-11 1998-06-09 Ast Research, Inc. Printed circuit board having a dual pattern footprint for receiving one of two component packages
US5751557A (en) * 1996-06-21 1998-05-12 Ast Research, Inc. Printed circuit board having a triple pattern footprint for receiving one of three component packages
US6067594A (en) 1997-09-26 2000-05-23 Rambus, Inc. High frequency bus system

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5332233B1 (en) * 1968-12-25 1978-09-07
US3611051A (en) * 1970-03-13 1971-10-05 Sprague Electric Co Feed-through, electrolytic, book capacitor
NL7207899A (en) * 1972-06-09 1973-12-11
US4338621A (en) * 1980-02-04 1982-07-06 Burroughs Corporation Hermetic integrated circuit package for high density high power applications
US4441119A (en) * 1981-01-15 1984-04-03 Mostek Corporation Integrated circuit package
US4439754A (en) * 1981-04-03 1984-03-27 Electro-Films, Inc. Apertured electronic circuit package
JPS5816552A (en) * 1981-07-22 1983-01-31 Fujitsu Ltd Package for semiconductor element
DE3214991A1 (en) * 1982-04-22 1983-11-03 Siemens AG, 1000 Berlin und 8000 München Semiconductor chip with discrete capacitor
JPS594060A (en) * 1982-06-30 1984-01-10 Fujitsu Ltd Semiconductor device
US4502101A (en) * 1982-07-30 1985-02-26 Rogers Corporation Decoupled integrated circuit package
GB2132019A (en) * 1982-12-07 1984-06-27 Stc Plc Electrolytic capacitor manufacture
US4475143A (en) * 1983-01-10 1984-10-02 Rogers Corporation Decoupling capacitor and method of manufacture thereof
US4494169A (en) * 1983-11-14 1985-01-15 Rogers Corporation Decoupling capacitor and method of manufacture thereof

Also Published As

Publication number Publication date
FR2576448B1 (en) 1989-04-14
DE3601681A1 (en) 1986-08-07
MX160273A (en) 1990-01-25
BR8600229A (en) 1986-09-30
FR2576448A1 (en) 1986-07-25
IT1188279B (en) 1988-01-07
IT8619116A0 (en) 1986-01-20
GB8601412D0 (en) 1986-02-26
GB2170047A (en) 1986-07-23
GB2170047B (en) 1988-12-21

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Legal Events

Date Code Title Description
CH Change of patent owner

Owner name: *MEKTRON N.V.

Effective date: 19860121

RE Patent lapsed

Owner name: MEKTRON N.V.

Effective date: 19920131