JPS6260099U - - Google Patents

Info

Publication number
JPS6260099U
JPS6260099U JP15168985U JP15168985U JPS6260099U JP S6260099 U JPS6260099 U JP S6260099U JP 15168985 U JP15168985 U JP 15168985U JP 15168985 U JP15168985 U JP 15168985U JP S6260099 U JPS6260099 U JP S6260099U
Authority
JP
Japan
Prior art keywords
frequency component
input
board
mounting
ground pattern
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15168985U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP15168985U priority Critical patent/JPS6260099U/ja
Publication of JPS6260099U publication Critical patent/JPS6260099U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図A〜Cはこの考案の第一実施例の構造を
説明するための線図、第2図は高周波部品を搭載
した状態を示す第一実施例の要部断面図、第3図
はこの考案の第一実施例の要部底面図、第4図は
この考案の第二実施例の説明に供する線図、第5
図及び第6図は従来の高周波部品搭載用基板の説
明に供する線図である。 25……出力信号配線パターン、27……入力
信号配線パターン、29……アースパターン、3
1,32……リード端子挿入孔、41……高周波
部品搭載用基板、43……切り溝、45,47…
…シールド金属部材、49……シールド金属部材
挿入孔。
Figures 1A to C are diagrams for explaining the structure of the first embodiment of this invention, Figure 2 is a cross-sectional view of the main parts of the first embodiment showing the state in which high-frequency components are mounted, and Figure 3 is a diagram for explaining the structure of the first embodiment of this invention. FIG. 4 is a bottom view of the essential parts of the first embodiment of this invention; FIG. 4 is a diagram for explaining the second embodiment of this invention;
6 and 6 are diagrams for explaining a conventional high-frequency component mounting board. 25... Output signal wiring pattern, 27... Input signal wiring pattern, 29... Earth pattern, 3
1, 32... Lead terminal insertion hole, 41... High frequency component mounting board, 43... Cut groove, 45, 47...
...Shield metal member, 49...Shield metal member insertion hole.

Claims (1)

【実用新案登録請求の範囲】 高周波部品の入力及び出力端子にそれぞれ導通
される入力及び出力信号配線パターン、及び、ア
ースパターンを具えた高周波部品搭載用基板にお
いて、 該高周波部品の入力部及び出力部間に設けられ
かつアースパターンに接続されたシールド金属部
材を具えて成ることを特徴とする高周波部品搭載
用基板。
[Scope of Claim for Utility Model Registration] A board for mounting a high-frequency component that is provided with input and output signal wiring patterns and a ground pattern that are electrically connected to the input and output terminals of the high-frequency component, respectively, at the input and output portions of the high-frequency component. A board for mounting high-frequency components, comprising a shield metal member provided between the parts and connected to a ground pattern.
JP15168985U 1985-10-03 1985-10-03 Pending JPS6260099U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15168985U JPS6260099U (en) 1985-10-03 1985-10-03

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15168985U JPS6260099U (en) 1985-10-03 1985-10-03

Publications (1)

Publication Number Publication Date
JPS6260099U true JPS6260099U (en) 1987-04-14

Family

ID=31068986

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15168985U Pending JPS6260099U (en) 1985-10-03 1985-10-03

Country Status (1)

Country Link
JP (1) JPS6260099U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07170090A (en) * 1993-12-15 1995-07-04 Nec Corp Hybrid integrated circuit device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07170090A (en) * 1993-12-15 1995-07-04 Nec Corp Hybrid integrated circuit device

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