BE788159A - Procede de decapage du nitrure de silicium - Google Patents

Procede de decapage du nitrure de silicium

Info

Publication number
BE788159A
BE788159A BE788159A BE788159A BE788159A BE 788159 A BE788159 A BE 788159A BE 788159 A BE788159 A BE 788159A BE 788159 A BE788159 A BE 788159A BE 788159 A BE788159 A BE 788159A
Authority
BE
Belgium
Prior art keywords
silicon nitride
pickling process
pickling
nitride
silicon
Prior art date
Application number
BE788159A
Other languages
English (en)
French (fr)
Inventor
P T Panousis
H A Waggener
Original Assignee
Western Electric Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Western Electric Co filed Critical Western Electric Co
Publication of BE788159A publication Critical patent/BE788159A/xx

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C09DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09KMATERIALS FOR MISCELLANEOUS APPLICATIONS, NOT PROVIDED FOR ELSEWHERE
    • C09K13/00Etching, surface-brightening or pickling compositions
    • C09K13/04Etching, surface-brightening or pickling compositions containing an inorganic acid
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P50/00Etching of wafers, substrates or parts of devices
    • H10P50/20Dry etching; Plasma etching; Reactive-ion etching
    • H10P50/28Dry etching; Plasma etching; Reactive-ion etching of insulating materials
    • H10P50/282Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials
    • H10P50/283Dry etching; Plasma etching; Reactive-ion etching of insulating materials of inorganic materials by chemical means
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/043Dual dielectric
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/051Etching
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S148/00Metal treatment
    • Y10S148/114Nitrides of silicon

Landscapes

  • Chemical & Material Sciences (AREA)
  • Inorganic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Weting (AREA)
  • Bipolar Transistors (AREA)
BE788159A 1971-09-03 1972-08-30 Procede de decapage du nitrure de silicium BE788159A (fr)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US17784071A 1971-09-03 1971-09-03

Publications (1)

Publication Number Publication Date
BE788159A true BE788159A (fr) 1972-12-18

Family

ID=22650170

Family Applications (1)

Application Number Title Priority Date Filing Date
BE788159A BE788159A (fr) 1971-09-03 1972-08-30 Procede de decapage du nitrure de silicium

Country Status (12)

Country Link
US (1) US3715249A (enExample)
JP (1) JPS5141550B2 (enExample)
KR (1) KR780000506B1 (enExample)
BE (1) BE788159A (enExample)
CA (1) CA958313A (enExample)
DE (1) DE2241870C3 (enExample)
FR (1) FR2151104B1 (enExample)
GB (1) GB1392758A (enExample)
HK (1) HK35876A (enExample)
IT (1) IT962297B (enExample)
NL (1) NL154059B (enExample)
SE (1) SE375118B (enExample)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2425684A1 (de) * 1974-05-28 1975-12-11 Ibm Deutschland Verfahren zum aetzen von silicium enthaltenden materialien
US4116714A (en) * 1977-08-15 1978-09-26 International Business Machines Corporation Post-polishing semiconductor surface cleaning process
US5215930A (en) * 1991-10-23 1993-06-01 At&T Bell Laboratories Integrated circuit etching of silicon nitride and polysilicon using phosphoric acid
KR970008354B1 (ko) * 1994-01-12 1997-05-23 엘지반도체 주식회사 선택적 식각방법
US5607543A (en) * 1995-04-28 1997-03-04 Lucent Technologies Inc. Integrated circuit etching
US5885903A (en) * 1997-01-22 1999-03-23 Micron Technology, Inc. Process for selectively etching silicon nitride in the presence of silicon oxide
EP1704586A1 (en) * 2003-12-30 2006-09-27 Akrion Llc System and method for selective etching of silicon nitride during substrate processing
JP3882932B2 (ja) 2004-04-08 2007-02-21 信越化学工業株式会社 ジルコニウム含有酸化物
JP4799332B2 (ja) * 2006-09-12 2011-10-26 株式会社東芝 エッチング液、エッチング方法および電子部品の製造方法
TWI629720B (zh) 2015-09-30 2018-07-11 Tokyo Electron Limited 用於濕蝕刻製程之溫度的動態控制之方法及設備

Also Published As

Publication number Publication date
NL7211625A (enExample) 1973-03-06
DE2241870C3 (de) 1978-04-20
FR2151104A1 (enExample) 1973-04-13
DE2241870A1 (de) 1973-03-22
JPS4834675A (enExample) 1973-05-21
CA958313A (en) 1974-11-26
IT962297B (it) 1973-12-20
DE2241870B2 (de) 1976-03-11
JPS5141550B2 (enExample) 1976-11-10
KR780000506B1 (en) 1978-10-25
HK35876A (en) 1976-06-18
US3715249A (en) 1973-02-06
GB1392758A (en) 1975-04-30
SE375118B (enExample) 1975-04-07
FR2151104B1 (enExample) 1974-08-19
NL154059B (nl) 1977-07-15

Similar Documents

Publication Publication Date Title
IT962283B (it) Dispositivo per lucidare sottili dischetti di silicio
BE829378A (fr) Procede pour le tirage de couches epitaxiales en silicium
IT973049B (it) Dispositivo di formatura
BE793245A (fr) Procede d'elimination de l'inversion a la surface d'un semi-conducteur
AR192371A1 (es) Aparato de traccion por fricion
BE823974A (fr) Procede d'hydrochloration du silicium
BE785287A (fr) Procede de fabrication des conducteurs-poutres pour dispositifssemiconducteurs
BE788159A (fr) Procede de decapage du nitrure de silicium
BE763313A (fr) Procede de preparation du diamant
BR7208032D0 (pt) Processo de purificacao de acrilonitrila
CH531994A (de) Gerät für die Behandlung von Wasser
BE769289A (fr) Procede de fabrication de tetrafluorure de silicium
BE786986A (fr) Procede de preparation du 2-chloro-butadiene-1,3
IT970130B (it) Apparato di sedimentazione
BE789006A (fr) Procede de nettoyage
BE784616A (fr) Procede de nitration
BE786364A (fr) Procede de purification du propylene
BE789702A (fr) Procede de preparation de dinitroanthraquinones
BE785438A (fr) Procede de purification de cyclopentene
BE781213A (fr) Procede de determination de peroxydes
BR7208557D0 (pt) Processo de purificacao de tiolcarbamatos
BE793370A (fr) Procede de nettoyage
BE787990A (fr) Procede de preparation de peroxydiesters
BE785174A (fr) Procede de preparation de n-(2,4-dihalogeno-s-triazin-6-yl)- urees
BE781377A (fr) Procede de fabrication de phenoxyphenols ou de chlorophenoxyphenols