BE741192A - - Google Patents

Info

Publication number
BE741192A
BE741192A BE741192DA BE741192A BE 741192 A BE741192 A BE 741192A BE 741192D A BE741192D A BE 741192DA BE 741192 A BE741192 A BE 741192A
Authority
BE
Belgium
Application number
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of BE741192A publication Critical patent/BE741192A/xx

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H10W74/137—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed the encapsulations being directly on the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/303—Macromolecular compounds obtained by reactions forming a linkage containing nitrogen with or without oxygen or carbon in the main chain of the macromolecule, not provided for in groups H01B3/38 or H01B3/302
    • H01B3/306—Polyimides or polyesterimides
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01B—CABLES; CONDUCTORS; INSULATORS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING OR DIELECTRIC PROPERTIES
    • H01B3/00—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties
    • H01B3/18—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances
    • H01B3/30—Insulators or insulating bodies characterised by the insulating materials; Selection of materials for their insulating or dielectric properties mainly consisting of organic substances plastics; resins; waxes
    • H01B3/307—Other macromolecular compounds
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P14/00—Formation of materials, e.g. in the shape of layers or pillars
    • H10P14/60—Formation of materials, e.g. in the shape of layers or pillars of insulating materials
    • H10P14/68—Organic materials, e.g. photoresists
    • H10P14/683—Organic materials, e.g. photoresists carbon-based polymeric organic materials, e.g. polyimides, poly cyclobutene or PVC
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/10—Encapsulations, e.g. protective coatings characterised by their shape or disposition
    • H10W74/131—Encapsulations, e.g. protective coatings characterised by their shape or disposition the semiconductor body being only partially enclosed
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W74/00—Encapsulations, e.g. protective coatings
    • H10W74/40—Encapsulations, e.g. protective coatings characterised by their materials
    • H10W74/47—Encapsulations, e.g. protective coatings characterised by their materials comprising organic materials, e.g. plastics or resins

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Formation Of Insulating Films (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Laminated Bodies (AREA)
BE741192D 1968-11-08 1969-11-03 BE741192A (cg-RX-API-DMAC7.html)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US77430268A 1968-11-08 1968-11-08

Publications (1)

Publication Number Publication Date
BE741192A true BE741192A (cg-RX-API-DMAC7.html) 1970-04-16

Family

ID=25100841

Family Applications (1)

Application Number Title Priority Date Filing Date
BE741192D BE741192A (cg-RX-API-DMAC7.html) 1968-11-08 1969-11-03

Country Status (9)

Country Link
US (1) US3615913A (cg-RX-API-DMAC7.html)
JP (1) JPS497995B1 (cg-RX-API-DMAC7.html)
BE (1) BE741192A (cg-RX-API-DMAC7.html)
BR (1) BR6913970D0 (cg-RX-API-DMAC7.html)
DE (1) DE1955730A1 (cg-RX-API-DMAC7.html)
ES (1) ES372779A1 (cg-RX-API-DMAC7.html)
FR (1) FR2022876A1 (cg-RX-API-DMAC7.html)
GB (1) GB1286086A (cg-RX-API-DMAC7.html)
NL (1) NL6916814A (cg-RX-API-DMAC7.html)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2027105A1 (de) * 1970-06-03 1971-12-16 Bosch Gmbh Robert Halbleiterbauelement und Verfahren zu seiner Herstellung

Families Citing this family (54)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4001870A (en) * 1972-08-18 1977-01-04 Hitachi, Ltd. Isolating protective film for semiconductor devices and method for making the same
US4017886A (en) * 1972-10-18 1977-04-12 Hitachi, Ltd. Discrete semiconductor device having polymer resin as insulator and method for making the same
DE2322347A1 (de) * 1973-05-03 1974-11-14 Siemens Ag Verfahren zum herstellen eines halbleiterelementes mit isolierender schutzschicht
JPS5067575A (cg-RX-API-DMAC7.html) * 1973-10-15 1975-06-06
US3916073A (en) * 1974-03-11 1975-10-28 Gen Instrument Corp Process for passivating semiconductor surfaces and products thereof
DE2442276A1 (de) * 1974-09-04 1976-03-25 Siemens Ag Elektrooptischer wandler
JPS6022497B2 (ja) * 1974-10-26 1985-06-03 ソニー株式会社 半導体装置
US3978426A (en) * 1975-03-11 1976-08-31 Bell Telephone Laboratories, Incorporated Heterostructure devices including tapered optical couplers
US4030948A (en) * 1975-07-21 1977-06-21 Abe Berger Polyimide containing silicones as protective coating on semiconductor device
US4017340A (en) * 1975-08-04 1977-04-12 General Electric Company Semiconductor element having a polymeric protective coating and glass coating overlay
US4198444A (en) * 1975-08-04 1980-04-15 General Electric Company Method for providing substantially hermetic sealing means for electronic components
GB1553243A (en) * 1975-08-04 1979-09-26 Gen Electric Semiconductor
US4040874A (en) * 1975-08-04 1977-08-09 General Electric Company Semiconductor element having a polymeric protective coating and glass coating overlay
SE418433B (sv) * 1975-12-11 1981-05-25 Gen Electric Halvledarelement med ett skikt av ett polymert siloxan-innehallande membranmaterial med variabel permeabilitet anbringat pa utvalda ytomraden av elementet
SE418432B (sv) * 1975-12-11 1981-05-25 Gen Electric Sett for behandling av ett utvalt omrade hos ett halvledarelement
GB1563421A (en) * 1975-12-18 1980-03-26 Gen Electric Polyimide-siloxane copolymer protective coating for semiconductor devices
GB1585477A (en) * 1976-01-26 1981-03-04 Gen Electric Semiconductors
US4140572A (en) * 1976-09-07 1979-02-20 General Electric Company Process for selective etching of polymeric materials embodying silicones therein
US4238528A (en) * 1978-06-26 1980-12-09 International Business Machines Corporation Polyimide coating process and material
CH661932A5 (en) * 1978-09-18 1987-08-31 Gen Electric Process for the preparation of a coating composition for semiconductor components, this composition, and the use thereof
JPS55166943A (en) * 1979-06-15 1980-12-26 Fujitsu Ltd Semiconductor device
US4225686A (en) * 1979-07-19 1980-09-30 The Upjohn Company Blends of copolyimides with copolyamideimides
JPS6015152B2 (ja) * 1980-01-09 1985-04-17 株式会社日立製作所 樹脂封止半導体メモリ装置
JPS56114335A (en) * 1980-02-13 1981-09-08 Fujitsu Ltd Semiconductor device and its manufacture
US4426769A (en) 1981-08-14 1984-01-24 Amp Incorporated Moisture getter for integrated circuit packages
US4535350A (en) * 1981-10-29 1985-08-13 National Semiconductor Corporation Low-cost semiconductor device package and process
US4468411A (en) * 1982-04-05 1984-08-28 Motorola, Inc. Method for providing alpha particle protection for an integrated circuit die
US4670325A (en) * 1983-04-29 1987-06-02 Ibm Corporation Structure containing a layer consisting of a polyimide and an organic filled and method for producing such a structure
JPS59204295A (ja) * 1983-04-29 1984-11-19 インタ−ナシヨナル　ビジネス　マシ−ンズ　コ−ポレ−シヨン 金属回路構造体
US4603372A (en) * 1984-11-05 1986-07-29 Direction De La Meteorologie Du Ministere Des Transports Method of fabricating a temperature or humidity sensor of the thin film type, and sensors obtained thereby
US5026667A (en) * 1987-12-29 1991-06-25 Analog Devices, Incorporated Producing integrated circuit chips with reduced stress effects
US5144407A (en) * 1989-07-03 1992-09-01 General Electric Company Semiconductor chip protection layer and protected chip
KR0159287B1 (ko) * 1991-01-24 1999-01-15 윤종용 실록산 변성 폴리이미드 수지의 제조방법
US5808351A (en) * 1994-02-08 1998-09-15 Prolinx Labs Corporation Programmable/reprogramable structure using fuses and antifuses
US5834824A (en) * 1994-02-08 1998-11-10 Prolinx Labs Corporation Use of conductive particles in a nonconductive body as an integrated circuit antifuse
US5813881A (en) * 1994-02-08 1998-09-29 Prolinx Labs Corporation Programmable cable and cable adapter using fuses and antifuses
US5917229A (en) * 1994-02-08 1999-06-29 Prolinx Labs Corporation Programmable/reprogrammable printed circuit board using fuse and/or antifuse as interconnect
US5962815A (en) * 1995-01-18 1999-10-05 Prolinx Labs Corporation Antifuse interconnect between two conducting layers of a printed circuit board
US5906042A (en) * 1995-10-04 1999-05-25 Prolinx Labs Corporation Method and structure to interconnect traces of two conductive layers in a printed circuit board
US5767575A (en) * 1995-10-17 1998-06-16 Prolinx Labs Corporation Ball grid array structure and method for packaging an integrated circuit chip
US5783452A (en) * 1996-02-02 1998-07-21 University Of Washington Covered microchannels and the microfabrication thereof
US5872338A (en) * 1996-04-10 1999-02-16 Prolinx Labs Corporation Multilayer board having insulating isolation rings
US6034427A (en) * 1998-01-28 2000-03-07 Prolinx Labs Corporation Ball grid array structure and method for packaging an integrated circuit chip
US6319604B1 (en) 1999-07-08 2001-11-20 Phelps Dodge Industries, Inc. Abrasion resistant coated wire
US6914093B2 (en) 2001-10-16 2005-07-05 Phelps Dodge Industries, Inc. Polyamideimide composition
DE10253163B4 (de) * 2002-11-14 2015-07-23 Epcos Ag Bauelement mit hermetischer Verkapselung und Waferscale Verfahren zur Herstellung
US7658709B2 (en) * 2003-04-09 2010-02-09 Medtronic, Inc. Shape memory alloy actuators
US7973122B2 (en) * 2004-06-17 2011-07-05 General Cable Technologies Corporation Polyamideimide compositions having multifunctional core structures
US20080193637A1 (en) * 2006-01-03 2008-08-14 Murray Thomas J Abrasion resistant coated wire
US20070151743A1 (en) * 2006-01-03 2007-07-05 Murray Thomas J Abrasion resistant coated wire
US7790501B2 (en) * 2008-07-02 2010-09-07 Ati Technologies Ulc Semiconductor chip passivation structures and methods of making the same
US7994044B2 (en) * 2009-09-03 2011-08-09 Ati Technologies Ulc Semiconductor chip with contoured solder structure opening
US8647974B2 (en) 2011-03-25 2014-02-11 Ati Technologies Ulc Method of fabricating a semiconductor chip with supportive terminal pad
JP2014192500A (ja) * 2013-03-28 2014-10-06 Shindengen Electric Mfg Co Ltd メサ型半導体装置の製造方法

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE2027105A1 (de) * 1970-06-03 1971-12-16 Bosch Gmbh Robert Halbleiterbauelement und Verfahren zu seiner Herstellung

Also Published As

Publication number Publication date
NL6916814A (cg-RX-API-DMAC7.html) 1970-05-12
DE1955730A1 (de) 1970-06-04
FR2022876A1 (cg-RX-API-DMAC7.html) 1970-08-07
ES372779A1 (es) 1971-11-01
GB1286086A (en) 1972-08-16
BR6913970D0 (pt) 1973-01-11
US3615913A (en) 1971-10-26
JPS497995B1 (cg-RX-API-DMAC7.html) 1974-02-23

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