AU560540B2 - Flood soldering device - Google Patents

Flood soldering device

Info

Publication number
AU560540B2
AU560540B2 AU19681/83A AU1968183A AU560540B2 AU 560540 B2 AU560540 B2 AU 560540B2 AU 19681/83 A AU19681/83 A AU 19681/83A AU 1968183 A AU1968183 A AU 1968183A AU 560540 B2 AU560540 B2 AU 560540B2
Authority
AU
Australia
Prior art keywords
pressure chamber
soldering
chamber
wave
return
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU19681/83A
Other languages
English (en)
Other versions
AU1968183A (en
Inventor
Haim Shtalryd
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
ERSA ERNST SACHS KG AND CO GmbH
Original Assignee
SACHS ERSA KG
ERSA Ernst Sachs KG GmbH and Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SACHS ERSA KG, ERSA Ernst Sachs KG GmbH and Co filed Critical SACHS ERSA KG
Publication of AU1968183A publication Critical patent/AU1968183A/en
Application granted granted Critical
Publication of AU560540B2 publication Critical patent/AU560540B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/018—Unsoldering; Removal of melted solder or other residues
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2101/00—Articles made by soldering, welding or cutting
    • B23K2101/36—Electric or electronic devices
    • B23K2101/42—Printed circuits

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Molten Solder (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Coating With Molten Metal (AREA)
  • Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
AU19681/83A 1982-09-30 1983-09-28 Flood soldering device Ceased AU560540B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
DE3236493A DE3236493C1 (de) 1982-09-30 1982-09-30 Schwalloetgeraet
DE32364938 1982-09-30

Publications (2)

Publication Number Publication Date
AU1968183A AU1968183A (en) 1984-04-05
AU560540B2 true AU560540B2 (en) 1987-04-09

Family

ID=6174739

Family Applications (1)

Application Number Title Priority Date Filing Date
AU19681/83A Ceased AU560540B2 (en) 1982-09-30 1983-09-28 Flood soldering device

Country Status (8)

Country Link
EP (1) EP0105832B1 (enrdf_load_stackoverflow)
JP (1) JPS59147772A (enrdf_load_stackoverflow)
KR (1) KR840006434A (enrdf_load_stackoverflow)
AT (1) ATE16687T1 (enrdf_load_stackoverflow)
AU (1) AU560540B2 (enrdf_load_stackoverflow)
CA (1) CA1217684A (enrdf_load_stackoverflow)
DE (2) DE3236493C1 (enrdf_load_stackoverflow)
IL (1) IL69899A (enrdf_load_stackoverflow)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63224865A (ja) * 1986-12-11 1988-09-19 ペイス　インコーポレイテッド 半田付けおよび／または半田外し装置
JP2023073102A (ja) * 2021-11-15 2023-05-25 富士フイルムビジネスイノベーション株式会社 ノズル、はんだ付け装置及び基板装置の製造方法

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3198414A (en) * 1963-07-30 1965-08-03 Electrovert Mfg Co Ltd Molten solder bath with uniformly dispersed additive

Also Published As

Publication number Publication date
DE3236493C1 (de) 1983-11-03
CA1217684A (en) 1987-02-10
JPS59147772A (ja) 1984-08-24
IL69899A (en) 1985-12-31
KR840006434A (ko) 1984-11-29
JPS6343196B2 (enrdf_load_stackoverflow) 1988-08-29
AU1968183A (en) 1984-04-05
DE3361354D1 (en) 1986-01-09
ATE16687T1 (de) 1985-12-15
EP0105832A1 (de) 1984-04-18
EP0105832B1 (de) 1985-11-27

Similar Documents

Publication Publication Date Title
MY108121A (en) Gas shrouded wave soldering
DE69223101D1 (de) Vakuumlaminierungsvorrichtung mit Fördereinrichtung und Verfahren zum Betreiben des Gerätes
JPS5550437U (enrdf_load_stackoverflow)
ATE27931T1 (de) Wellenloeten von intergrierten schaltungen.
BG103583A (en) Device for agitation and aeration of a liquid and foam elimination in a tank for the treatment of the above liquid
MY104651A (en) An automatic jet soldering apparatus
ATE209T1 (de) Vorrichtung zum aufbringen einer loetmittelschicht auf eine leiterplatte
AU560540B2 (en) Flood soldering device
DE59809852D1 (de) Filterkaffeemaschine
USD276947S (en) Cart for curing circuit boards
EP0329372A3 (en) Foam fluxer
KR930003794A (ko) 전자 부품의 프린트 기판에의 탑재 방법
EP0294235A3 (en) Apparatus for continuously producing a base for a printed circuit board
ATE52114T1 (de) Behaelter mit einer integrierten druckkammer.
JPS5720139A (en) Motor pump
JPS6418568A (en) Device and method for automatic soldering
CA2058716A1 (en) Printed circuit board assembly handle/stiffener
JPS57145716A (en) Lineup feeder of chiplike component
KR910000993Y1 (ko) 전기 기판 납땜용 후락스 도포장치
EP0282638A3 (en) Printing ink for solder resist in printed circuit board
USD276429S (en) Combined printed circuit board carrier and component tray
JPS6489356A (en) Hybrid integrated circuit
DE3464015D1 (en) Spraying device
JPS6411393A (en) Printed board
DE3476354D1 (en) Varnish coater for printed product