AU554236B2 - Electrolyte composition and process for electrodepositing copper - Google Patents

Electrolyte composition and process for electrodepositing copper

Info

Publication number
AU554236B2
AU554236B2 AU29033/84A AU2903384A AU554236B2 AU 554236 B2 AU554236 B2 AU 554236B2 AU 29033/84 A AU29033/84 A AU 29033/84A AU 2903384 A AU2903384 A AU 2903384A AU 554236 B2 AU554236 B2 AU 554236B2
Authority
AU
Australia
Prior art keywords
electrolyte composition
electrodepositing copper
electrodepositing
copper
electrolyte
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU29033/84A
Other languages
English (en)
Other versions
AU2903384A (en
Inventor
Daniel J. Combs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMI International Corp filed Critical OMI International Corp
Publication of AU2903384A publication Critical patent/AU2903384A/en
Application granted granted Critical
Publication of AU554236B2 publication Critical patent/AU554236B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Electroplating And Plating Baths Therefor (AREA)
  • Chemically Coating (AREA)
  • Electrolytic Production Of Metals (AREA)
AU29033/84A 1983-06-10 1984-06-04 Electrolyte composition and process for electrodepositing copper Ceased AU554236B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US50121183A 1983-06-10 1983-06-10
US501211 1983-06-10

Publications (2)

Publication Number Publication Date
AU2903384A AU2903384A (en) 1984-12-13
AU554236B2 true AU554236B2 (en) 1986-08-14

Family

ID=23992559

Family Applications (1)

Application Number Title Priority Date Filing Date
AU29033/84A Ceased AU554236B2 (en) 1983-06-10 1984-06-04 Electrolyte composition and process for electrodepositing copper

Country Status (10)

Country Link
JP (1) JPS6013090A (pt)
AU (1) AU554236B2 (pt)
BR (1) BR8402811A (pt)
CA (1) CA1255621A (pt)
DE (1) DE3420999A1 (pt)
ES (1) ES8601336A1 (pt)
FR (1) FR2547318B1 (pt)
GB (1) GB2141140B (pt)
IT (1) IT1177785B (pt)
NL (1) NL8401841A (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4126502C1 (pt) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
JPH10330983A (ja) 1997-05-30 1998-12-15 Fukuda Metal Foil & Powder Co Ltd 電解銅箔及びその製造方法
DE19758121C2 (de) * 1997-12-17 2000-04-06 Atotech Deutschland Gmbh Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten
DE10261852B3 (de) 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad
DE10337669B4 (de) * 2003-08-08 2006-04-27 Atotech Deutschland Gmbh Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung
JP4644447B2 (ja) * 2004-06-25 2011-03-02 株式会社日立製作所 プリント配線板の製造方法
GB0520793D0 (en) * 2005-10-13 2005-11-23 Avecia Inkjet Ltd Phthalocyanine inks and their use in ink-jet printing

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE520210A (pt) * 1952-05-26
NL178453B (nl) * 1952-05-26 Mita Industrial Co Ltd Werkwijze voor het elektrostatisch copieren.
US2738318A (en) * 1954-12-28 1956-03-13 Udylite Res Corp Electrodeposition of copper from an acid bath
US2882209A (en) * 1957-05-20 1959-04-14 Udylite Res Corp Electrodeposition of copper from an acid bath
NL291575A (pt) * 1962-04-16
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
BE833384A (fr) * 1975-03-11 1976-03-12 Electrodeposition du cuivre
DE2746938C2 (de) * 1977-10-17 1987-04-09 Schering AG, 1000 Berlin und 4709 Bergkamen Wäßriges saures Bad zur galvanischen Abscheidung von glänzenden und rißfreien Kupferüberzügen und Verwendung dieses Bades
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
US4336114A (en) * 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper

Also Published As

Publication number Publication date
JPS6112036B2 (pt) 1986-04-05
IT1177785B (it) 1987-08-26
AU2903384A (en) 1984-12-13
ES533252A0 (es) 1985-10-16
GB2141140B (en) 1986-12-10
FR2547318B1 (fr) 1990-05-04
CA1255621A (en) 1989-06-13
FR2547318A1 (fr) 1984-12-14
NL8401841A (nl) 1985-01-02
GB2141140A (en) 1984-12-12
GB8414862D0 (en) 1984-07-18
JPS6013090A (ja) 1985-01-23
DE3420999A1 (de) 1984-12-13
BR8402811A (pt) 1985-05-21
ES8601336A1 (es) 1985-10-16
IT8448351A0 (it) 1984-06-08
DE3420999C2 (pt) 1987-10-15

Similar Documents

Publication Publication Date Title
JPS56130488A (en) Copper electrodepositing composition and method
AU530827B2 (en) Electrodeposition of bright copper
AU564519B2 (en) High speed copper electroplating
EP0167905A3 (en) Conductive theromosetting compositions and process for using same
AU554426B2 (en) High current density electroplating cell
GB8331366D0 (en) Electrolytic process and cell
AU2713684A (en) Electrolytic cell
AU587689B2 (en) Zinc-nickel alloy electrolyte and process
AU3086484A (en) Cermet electrode composition
ZW11784A1 (en) Coating compositions used in electrodeposition process
AU562995B2 (en) Electrolytic reduction cell
DE3473198D1 (en) Multilevel metal structure and process for making same
AU3739885A (en) Frozen electrolyte bath removal apparatus
AU554236B2 (en) Electrolyte composition and process for electrodepositing copper
JPS57207189A (en) Method and composition for electrodepositing tin
AU5297886A (en) Electroplating composition and process and surfactant compound for use therein
AU538732B2 (en) Bath composition and method for electrodepositing cobalt-zinc alloys
AU552731B2 (en) Metal electro-deposition
AU575037B2 (en) Cyanide-free copper plating electrolyte and process
ZA835969B (en) Coating compositions used in electrodeposition process
AU559896B2 (en) Electrolytic copper depositing processes
AU1398683A (en) Filtration method using surfactant and electrolyte
AU575838B2 (en) Composition for electroplating of metals
AU1591883A (en) Electrolytic reduction cell
AU579685B2 (en) Electrochemical process