AU554236B2 - Electrolyte composition and process for electrodepositing copper - Google Patents

Electrolyte composition and process for electrodepositing copper

Info

Publication number
AU554236B2
AU554236B2 AU29033/84A AU2903384A AU554236B2 AU 554236 B2 AU554236 B2 AU 554236B2 AU 29033/84 A AU29033/84 A AU 29033/84A AU 2903384 A AU2903384 A AU 2903384A AU 554236 B2 AU554236 B2 AU 554236B2
Authority
AU
Australia
Prior art keywords
electrolyte composition
electrodepositing copper
electrodepositing
copper
electrolyte
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU29033/84A
Other languages
English (en)
Other versions
AU2903384A (en
Inventor
Daniel J. Combs
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
OMI International Corp
Original Assignee
OMI International Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by OMI International Corp filed Critical OMI International Corp
Publication of AU2903384A publication Critical patent/AU2903384A/en
Application granted granted Critical
Publication of AU554236B2 publication Critical patent/AU554236B2/en
Anticipated expiration legal-status Critical
Ceased legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D3/00—Electroplating: Baths therefor
    • C25D3/02—Electroplating: Baths therefor from solutions
    • C25D3/38—Electroplating: Baths therefor from solutions of copper
AU29033/84A 1983-06-10 1984-06-04 Electrolyte composition and process for electrodepositing copper Ceased AU554236B2 (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US50121183A 1983-06-10 1983-06-10
US501211 1995-07-11

Publications (2)

Publication Number Publication Date
AU2903384A AU2903384A (en) 1984-12-13
AU554236B2 true AU554236B2 (en) 1986-08-14

Family

ID=23992559

Family Applications (1)

Application Number Title Priority Date Filing Date
AU29033/84A Ceased AU554236B2 (en) 1983-06-10 1984-06-04 Electrolyte composition and process for electrodepositing copper

Country Status (10)

Country Link
JP (1) JPS6013090A (pt)
AU (1) AU554236B2 (pt)
BR (1) BR8402811A (pt)
CA (1) CA1255621A (pt)
DE (1) DE3420999A1 (pt)
ES (1) ES533252A0 (pt)
FR (1) FR2547318B1 (pt)
GB (1) GB2141140B (pt)
IT (1) IT1177785B (pt)
NL (1) NL8401841A (pt)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4126502C1 (pt) * 1991-08-07 1993-02-11 Schering Ag Berlin Und Bergkamen, 1000 Berlin, De
JPH10330983A (ja) 1997-05-30 1998-12-15 Fukuda Metal Foil & Powder Co Ltd 電解銅箔及びその製造方法
DE19758121C2 (de) * 1997-12-17 2000-04-06 Atotech Deutschland Gmbh Wäßriges Bad und Verfahren zum elektrolytischen Abscheiden von Kupferschichten
DE10261852B3 (de) 2002-12-20 2004-06-03 Atotech Deutschland Gmbh Gemisch oligomerer Phenaziniumverbindungen und dessen Herstellungsverfahren, saures Bad zur elektrolytischen Abscheidung eines Kupferniederschlages, enthaltend die oligomeren Phenaziniumverbindungen, sowie Verfahren zum elektrolytischen Abscheiden eines Kupferniederschlages mit einem das Gemisch enthaltenden Bad
DE10337669B4 (de) * 2003-08-08 2006-04-27 Atotech Deutschland Gmbh Wässrige, saure Lösung und Verfahren zum galvanischen Abscheiden von Kupferüberzügen sowie Verwendung der Lösung
JP4644447B2 (ja) * 2004-06-25 2011-03-02 株式会社日立製作所 プリント配線板の製造方法
GB0520793D0 (en) * 2005-10-13 2005-11-23 Avecia Inkjet Ltd Phthalocyanine inks and their use in ink-jet printing

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
NL75967C (pt) * 1952-05-26
BE520209A (pt) * 1952-05-26
US2738318A (en) * 1954-12-28 1956-03-13 Udylite Res Corp Electrodeposition of copper from an acid bath
US2882209A (en) * 1957-05-20 1959-04-14 Udylite Res Corp Electrodeposition of copper from an acid bath
NL291575A (pt) * 1962-04-16
US3328273A (en) * 1966-08-15 1967-06-27 Udylite Corp Electro-deposition of copper from acidic baths
US3770598A (en) * 1972-01-21 1973-11-06 Oxy Metal Finishing Corp Electrodeposition of copper from acid baths
AU496780B2 (en) * 1975-03-11 1978-10-26 Oxy Metal Industries Corporation Additives in baths forthe electrodeposition of copper
DE2746938A1 (de) * 1977-10-17 1979-04-19 Schering Ag Saures galvanisches kupferbad
US4272335A (en) * 1980-02-19 1981-06-09 Oxy Metal Industries Corporation Composition and method for electrodeposition of copper
US4336114A (en) * 1981-03-26 1982-06-22 Hooker Chemicals & Plastics Corp. Electrodeposition of bright copper

Also Published As

Publication number Publication date
GB2141140B (en) 1986-12-10
NL8401841A (nl) 1985-01-02
IT1177785B (it) 1987-08-26
ES8601336A1 (es) 1985-10-16
FR2547318B1 (fr) 1990-05-04
GB2141140A (en) 1984-12-12
ES533252A0 (es) 1985-10-16
JPS6013090A (ja) 1985-01-23
DE3420999C2 (pt) 1987-10-15
IT8448351A0 (it) 1984-06-08
FR2547318A1 (fr) 1984-12-14
AU2903384A (en) 1984-12-13
BR8402811A (pt) 1985-05-21
JPS6112036B2 (pt) 1986-04-05
CA1255621A (en) 1989-06-13
DE3420999A1 (de) 1984-12-13
GB8414862D0 (en) 1984-07-18

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