AU2020102480A4 - High-strength double-layer PCB - Google Patents
High-strength double-layer PCB Download PDFInfo
- Publication number
- AU2020102480A4 AU2020102480A4 AU2020102480A AU2020102480A AU2020102480A4 AU 2020102480 A4 AU2020102480 A4 AU 2020102480A4 AU 2020102480 A AU2020102480 A AU 2020102480A AU 2020102480 A AU2020102480 A AU 2020102480A AU 2020102480 A4 AU2020102480 A4 AU 2020102480A4
- Authority
- AU
- Australia
- Prior art keywords
- holes
- test
- steel sheets
- layer
- main board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Ceased
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
- G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
- G01B7/02—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring length, width or thickness
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Investigating Strength Of Materials By Application Of Mechanical Stress (AREA)
Abstract
A high-strength double-layer PCB comprises a main board, a test edge, and a
reinforcing frame. The test edge is connected to the main board. The reinforcing
frame is mounted on the main board and comprises two opposite long steel sheets
and a plurality of short steel sheets, wherein the two ends of each of the plurality of
5 short steel sheets are respectively connected to the long steel sheets, the long steel
sheets are provided with connecting pieces, the connecting pieces have insertion
holes, positioning parts are inserted into the insertion holes to fix the connecting
pieces, the main board has connecting holes and receding grooves, the connecting
holes are matched with the connecting pieces and communicated with the receding
o grooves, and the positioning parts are inserted into the receding grooves. The
strength of the PCB is improved, such that the PCB is prevented against
deformation, which may otherwise cause falling of devices from the PCB, and the
service life of the PCB is guaranteed.
Dr a w in g s A t t a ch e d t o t h e S p e cifica tio n
211
21
221
22 222
FIG.3
2/2
Description
Dr a w in g s A t t a ch e d t o t h e S p e cifica tio n
211 21
221
22 222
FIG.3
2/2
S p e cifica tio n
High-strength Double-layer PCB
Technical Field The utility model belongs to the technical field of circuit boards and particularly relates to a high-strength double-layer PCB.
Description of Related Art Along with the design trend of becoming lighter, thinner, and smaller PCBs, the high-density interconnection (circuit board) design has become the most typical approach to follow this trend. Due to the limitation of the structural space, the PCBs cannot be made very thick. Failure to meet the thickness requirements may o lead to deformation of the PCBs if the PCBs fall in use, thus resulting in desoldering and malfunction of devices on the PCBs, such that the usability of the PCBs will be affected. All PCBs, as multi-layer boards, have some offset. The actual offset of the PCBs is generally determined by slicing; however, this method is low in efficiency, and once sliced, the boards cannot be delivered and have to be scrapped.
Brief Summary of the Invention The technical issue mainly to be settled by the utility model is to provide a high-strength double-layer PCB. The strength of the PCB is improved, such that the PCB is prevented against deformation, which may otherwise cause falling of devices from the PCB, and the service life of the PCB is guaranteed. One technical solution adopted by the utility model to settle the aforesaid technical issue is as follows: a high-strength double-layer PCB comprises a main board, a test edge, and a reinforcing frame, wherein the test edge is connected to the main board, and the reinforcing frame is mounted on the main board; The reinforcing frame comprises two opposite long steel sheets and a plurality of short steel sheets, wherein the two ends of each of the plurality of short steel
S p e cifica tio n
sheets are respectively connected to the two long steel sheets, the long steel sheets are provided with connecting pieces, the connecting pieces have insertion holes, and positioning parts are inserted into the insertion holes to fix the connecting pieces; The main board has connecting holes and receding grooves, the connecting holes are matched with the connecting pieces and communicated with the receding grooves, and the positioning parts are inserted into the receding grooves; and The test edge comprises a first layer of test board and a second layer of test board, wherein the first layer of test board has two test through holes, the second o layer of test board has a copper layer, the copper layer has two round holes, and the round holes penetrate through the copper layer and correspond to the test through holes, respectively. Furthermore, each positioning part comprises an insertion piece and a fixing piece, wherein the insertion piece is integrated with the fixing piece and is inserted into one insertion hole, and the fixing piece is fixed on the main board. Furthermore, a diameter of the round holes is greater than that of the test through holes, the diameter of the round holes is 20mil, and the diameter of the test through holes is 10mil. Furthermore, the cross-section of the insertion piece is L-shaped. Furthermore, the fixing piece is fixed on the main board with a screw. Furthermore, the short steel sheets are zigzag S-shaped steel sheets. Furthermore, the reinforcing frame has a thickness of 0.5-1mm. The utility model has at least the following beneficial effects: The reinforcing frame of the utility model comprises the two opposite long steel sheets and the plurality of short steel sheets, the long steel sheets are provided with the connecting pieces, the connecting pieces have the insertion holes, and the insertion pieces of the positioning parts are inserted into the insertion holes to fix the reinforcing frame, such that the strength of the PCB is improved, the PCB is
S p e cifica tio n
prevented against deformation, which may otherwise cause falling of devices from the PCB, the service life of the PCB is guaranteed. It is worth mentioning that the short steel sheets are zigzag S-shaped steel sheets, such that the contact area between the short steel sheets and the main board is enlarged, and deformation of the PCB is further avoided; The test edge of the utility model comprises the first layer of test board and the second layer of test board, the first layer of test board has two test through holes, the second layer of test board has a copper layer, the copper layer has two round holes penetrating through the copper layer and corresponding to the two test o through holes respectively, the diameter of the round holes is greater than that of the test through holes, and two electrical test pins are respectively inserted into the two through holes; if a short circuit occurs, it indicates that the offset between the two layers of boards is too large, and the PCB is determined as unqualified; if an open circuit occurs, it indicates that there no offset or a small offset between the two boards, and the PCB is determined as qualified. Compared with traditional detection methods, labor is greatly saved, and the detection efficiency is improved.
Brief Description of the Several Views of the Drawings FIG. 1 is an exploded view of the utility model (without test edge); FIG. 2 is a structural view of the utility model; FIG. 3 is an exploded view of the test edge of the utility model; Reference signs in the figures: 1, main board; 11, connecting hole; 12, receding groove; 2, test edge; 21, first layer of test board; 211, test through hole; 22, second layer of test board; 221, copper layer; 222, round hole; 3, reinforcing frame; 31, long steel sheet; 311, connecting piece; 312, insertion hole; 32, short steel sheet; 4, insertion piece; 5, fixing piece.
Detailed Description of the Invention
S p e cifica tio n
The preferred embodiments of the utility model are expounded below in conjunction with the accompanying drawings to ensure that those skilled in the art can understand the advantages and features of the utility model more easily and that the protection scope of the utility model can be defined more clearly. Embodiment: A high-strength double-layer PCB, as shown in FIG. 1-FIG3, comprises a main board 1, a test edge 2 and a reinforcing frame 3, wherein the test edge 2 is connected to the main board 1, and the reinforcing frame 3 is mounted on the main board 1; The reinforcing frame 3 comprises two opposite long steel sheets 31 and a o plurality of short steel sheets 32, wherein the two ends of each of the plurality of short steel sheets 32 are respectively connected to the two long steel sheets 31, the long steel sheets 31 have connecting pieces 311, the connecting pieces 311 have insertion holes 312, and positioning parts are inserted into the insertion holes 312 to fix the connecting pieces 311; The main board 1 has connecting holes 11 and receding grooves 12, the connecting holes 11 are matched with the connecting pieces 311 and are communicated with the receding grooves 12, and the positioning parts are inserted into the receding grooves 12; and The test edge 2 comprises a first layer of test board 21 and a second layer of test board 22, where the first layer of test board 21 has two test through holes 211, the second layer of test board 22 has a copper layer 211, the copper layer 221 has two round holes 222, and the round holes 222 penetrate through the copper layer 221 and correspond to the two test through holes 211, respectively. Each positioning part comprises an insertion piece 4 and a fixing piece 5, wherein the insertion piece 4 is integrated with the fixing piece 5 and is inserted into one insertion hole 312, and the fixing piece 5 is fixed on the main board 1. The diameter of the round holes 222 is greater than that of the test through holes 211, the diameter of the round holes 222 is 20mil, and the diameter of the test
S p e cifica tio n
through holes 211 is 10mil. The cross-section of the insertion piece 4 is L-shaped. The fixing piece 5 is fixed on the main board 1 with a screw. The short steel sheets 32 are zigzag S-shaped steel sheets The thickness of the reinforcing frame 3 is 0.5-1mm. The operating principle of the utility model is as follows: the connecting pieces of the reinforcing frame are clamped in the connecting holes of the main board, the insertion pieces of the positioning parts are inserted into the insertion holes of the connecting pieces, and the positioning pieces are fixed on the main o board with screws to fasten the reinforcing frame on the main board, such that the strength of the PCB is improved, and the service life of the PCB is guaranteed. The above embodiments are merely preferred ones of the utility model, and are not intended to limit the patent scope of the utility model. Any equivalent structural transformations obtained on the basis of the contents of the specification and accompanying drawings of the utility model, or direct or indirect application to other relating technical fields should also fall within the patent protection scope of the utility model.
Claims (7)
- C 1 a i m s1, A high-strength double-layer PCB, comprising a main board (1), a test edge (2) and a reinforcing frame (3), wherein the test edge is connected to the main board, and the reinforcing frame is mounted on the main board; the reinforcing frame comprises two opposite long steel sheets (31) and a plurality of short steel sheets (32), wherein two ends of each of the plurality of short steel sheets are respectively connected to the two long steel sheets, the long steel sheets are provided with connecting pieces (311), the connecting pieces have insertion holes (312), and positioning parts are inserted into the insertion holes to fix the connecting pieces; the main board has connecting holes (11) and receding grooves (12), the connecting holes are matched with the connecting pieces and communicated with the receding grooves, and the positioning parts are inserted into the receding grooves; and the test edge comprises a first layer of test board (21) and a second layer of test board (22), wherein the first layer of test board has two test through holes (211), the second layer of test board has a copper layer (221), the copper layer has two round holes (222), and the round holes penetrate through the copper layer and correspond to the test through holes, respectively.
- 2, The high-strength double-layer PCB according to Claim 1, wherein each said positioning part comprises an insertion piece (4) and a fixing piece (5), the insertion piece is integrated with the fixing piece and is inserted into one said insertion hole, and the fixing piece is fixed on the main board.
- 3, The high-strength double-layer PCB according to Claim 1, wherein a diameter of the round holes is greater than that of the test through holes, the diameter of the round holes is 20mil, and the diameter of the test through holes is 1Omil.
- 4, The high-strength double-layer PCB according to Claim 2, wherein a cross-section of the insertion piece is L-shaped.C 1 a i m s
- 5, The high-strength double-layer PCB according to Claim 2, wherein the fixing piece is fixed on the main board with a screw.
- 6, The high-strength double-layer PCB according to Claim 1, wherein the short steel sheets are zigzag S-shaped steel sheets.
- 7. The high-strength double-layer PCB according to Claim 1, wherein the reinforcing frame has a thickness of 0.5-1mm.D r a w i n g s A t t a c h e d t o t h e S p e c i f i c a t i o n 24 Jun 2020 2020102480FIG. 1FIG. 21/2D r a w i n g s A t t a c h e d t o t h e S p e c i f i c a t i o n 24 Jun 2020 2020102480FIG. 32/2
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202021148606.7 | 2020-06-19 | ||
CN202021148606.7U CN212034444U (en) | 2020-06-19 | 2020-06-19 | High-strength double-layer PCB |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2020102480A4 true AU2020102480A4 (en) | 2020-11-19 |
Family
ID=73249721
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2020102480A Ceased AU2020102480A4 (en) | 2020-06-19 | 2020-06-24 | High-strength double-layer PCB |
Country Status (3)
Country | Link |
---|---|
CN (1) | CN212034444U (en) |
AU (1) | AU2020102480A4 (en) |
WO (1) | WO2021253473A1 (en) |
Family Cites Families (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7013563B2 (en) * | 2003-07-11 | 2006-03-21 | Endicott Interconnect Technologies, Inc. | Method of testing spacings in pattern of openings in PCB conductive layer |
KR100781585B1 (en) * | 2006-07-24 | 2007-12-05 | 삼성전기주식회사 | Printed circuit board |
CN102098884B (en) * | 2010-12-29 | 2014-07-23 | 北大方正集团有限公司 | Standard laminated plate and manufacturing method thereof |
CN102711382B (en) * | 2012-06-14 | 2015-02-25 | 广州美维电子有限公司 | Printed circuit board (PCB) layer-by-layer para-position laser drilling method |
CN103533748B (en) * | 2013-10-17 | 2017-05-24 | 东莞市五株电子科技有限公司 | Laser alignment testing structure and method for high-density interconnected printed circuit board |
CN104918423B (en) * | 2015-06-19 | 2018-06-15 | 深圳崇达多层线路板有限公司 | A kind of method for manufacturing circuit board of detectable internal layer orifice ring |
CN205883707U (en) * | 2016-07-28 | 2017-01-11 | 广东欧珀移动通信有限公司 | Pcb |
-
2020
- 2020-06-19 CN CN202021148606.7U patent/CN212034444U/en active Active
- 2020-06-24 AU AU2020102480A patent/AU2020102480A4/en not_active Ceased
- 2020-06-24 WO PCT/CN2020/098040 patent/WO2021253473A1/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
CN212034444U (en) | 2020-11-27 |
WO2021253473A1 (en) | 2021-12-23 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
FGI | Letters patent sealed or granted (innovation patent) | ||
MK22 | Patent ceased section 143a(d), or expired - non payment of renewal fee or expiry |