CN111800939A - PCB assembly, LED module and LED display screen - Google Patents
PCB assembly, LED module and LED display screen Download PDFInfo
- Publication number
- CN111800939A CN111800939A CN202010806344.7A CN202010806344A CN111800939A CN 111800939 A CN111800939 A CN 111800939A CN 202010806344 A CN202010806344 A CN 202010806344A CN 111800939 A CN111800939 A CN 111800939A
- Authority
- CN
- China
- Prior art keywords
- pcb
- pcb board
- copper
- assembly
- display screen
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000009434 installation Methods 0.000 claims abstract description 7
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 claims description 42
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 38
- 229910052802 copper Inorganic materials 0.000 claims description 35
- 239000010949 copper Substances 0.000 claims description 35
- 229910052742 iron Inorganic materials 0.000 claims description 21
- 239000000463 material Substances 0.000 claims description 13
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 229910000831 Steel Inorganic materials 0.000 claims description 5
- 239000010959 steel Substances 0.000 claims description 5
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 4
- 229910052782 aluminium Inorganic materials 0.000 claims description 4
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- 238000003466 welding Methods 0.000 description 15
- 230000007547 defect Effects 0.000 description 8
- 238000000034 method Methods 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 238000001179 sorption measurement Methods 0.000 description 3
- LAXBNTIAOJWAOP-UHFFFAOYSA-N 2-chlorobiphenyl Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1 LAXBNTIAOJWAOP-UHFFFAOYSA-N 0.000 description 2
- 101710149812 Pyruvate carboxylase 1 Proteins 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- 230000005389 magnetism Effects 0.000 description 2
- 206010062544 Tooth fracture Diseases 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000008021 deposition Effects 0.000 description 1
- 238000009713 electroplating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- G—PHYSICS
- G09—EDUCATION; CRYPTOGRAPHY; DISPLAY; ADVERTISING; SEALS
- G09F—DISPLAYING; ADVERTISING; SIGNS; LABELS OR NAME-PLATES; SEALS
- G09F9/00—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements
- G09F9/30—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements
- G09F9/33—Indicating arrangements for variable information in which the information is built-up on a support by selection or combination of individual elements in which the desired character or characters are formed by combining individual elements being semiconductor devices, e.g. diodes
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/14—Mounting supporting structure in casing or on frame or rack
- H05K7/1417—Mounting supporting structure in casing or on frame or rack having securing means for mounting boards, plates or wiring boards
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Theoretical Computer Science (AREA)
- Illuminated Signs And Luminous Advertising (AREA)
- Devices For Indicating Variable Information By Combining Individual Elements (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a PCB assembly, comprising: a PCB board; the connecting pieces are arranged on the PCB at intervals and are flat, and one side, far away from the PCB, of each connecting piece is provided with an installation part used for being connected with the outside. The invention does not need to open holes on the PCB, saves the cost and leaves more space for the PCB circuit. The total thickness of the LED module is reduced, so that the LED display screen advances one step towards ultra-thin and is more suitable for automatic production.
Description
Technical Field
The invention relates to the technical field of LEDs, in particular to a PCB assembly, an LED module and an LED display screen.
Background
At the present stage, along with the continuous progress of science and technology, the LED display screen module is developed to PCB board + drain pan module and the two kinds of compound mode of the PCB board module that do not take the drain pan by traditional PCB board + drain pan combination. The LED display screen is continuously developed towards the direction of small spacing, high quality, ultra-thinness, quick splicing, quick mounting and dismounting and low cost; the initial LED display screen PCB board is from the lamp face direction locking screw, but with the reduction of the point spacing and the higher and higher requirement on the lamp face, the lamp face direction locking screw has defects, and can not meet the corresponding requirement. Therefore, the structure of punching through holes and blind holes on the PCB and locking screws on the back surface is realized. The LED display screen with the structure at the existing small spacing is used, but due to the PCB material, the strength of the drilled hole for locking the screw is not enough, the screw thread can not reach the standard of the common screw, and the screw specification is smaller, the strength is poorer and other factors influence, so that the back locking screw mode has many defects, and the reliability of the product is not enough; meanwhile, in the production and maintenance processes, the situation that the screw is broken and left on the PCB often occurs, once the situation occurs, the broken screw head is difficult to take out, so that the product has defects, and the PCB is seriously wasted. In view of the situation, in order to improve the reliability, a structure for welding the copper columns on the PCB is provided, the structure can solve the problem of tooth breakage caused by screw sliding, but the cost is also increased correspondingly, along with the development of mechanical equipment, the automation of the LED display screen is improved, the structure has the defect of an automation process, auxiliary materials must be added to realize the welding of the copper columns on the PCB, and meanwhile, the copper columns must be provided with positioning holes to be used for positioning on the PCB, so that the production efficiency is reduced, the undesirable risk of improvement is reduced, and the production cost is increased.
According to the scheme of the copper cylinder lock PCB in the existing LED display screen module, because the copper cylinders are all cylindrical and are welded on the PCB, holes must be drilled on the PCB for positioning the copper cylinders; after the copper column is welded, the torque of the locking screw is smaller, and the copper column and the bonding pad fall off after the locking screw; the copper column with the screw hole can be taken up only by auxiliary materials when the manipulator takes the copper column due to the limitation of equipment in the process of welding the copper column, so that the production cost is increased.
In chinese patent application No.: 201110002980.5 discloses a copper-column welded PCB and an LED display device, the PCB comprises a PCB main board, at least one PCB control board and at least one control module; the PCB control panel is provided with a plurality of complete copper column welding holes, and pins of the control module are welded on the PCB control panel through the complete copper column welding holes; each side of the PCB control panel is also provided with a plurality of partial copper column welding holes, and the partial copper column welding holes are connected with the preset circuit of the PCB mainboard and used for welding, fixing and conducting the PCB control panel. Including the LED lamp plate and above the PCB board.
In chinese patent application No.: 201910854223.7 discloses a production process of a PCB hole embedded copper column, which comprises the following steps: cutting the copper-clad plate according to the size requirement; etching the copper foil layer of the copper-clad plate; carrying out lamination treatment on the copper-clad plate, the prepreg and the copper foil to form a PCB; drilling the PCB to form a through hole penetrating through the PCB; embedding a copper column into the through hole; carrying out chemical copper deposition treatment on the surface of the PCB, so that a layer of heat-conducting first copper layer is respectively deposited between copper foils and copper columns on the upper surface and the lower surface of the PCB; and carrying out pattern electroplating and circuit etching to finish the manufacture of the circuit pattern. The two technical schemes both utilize the copper column, and the defects exist. In view of this, the present application is proposed.
Disclosure of Invention
In order to solve at least one technical problem in the background art, the invention provides a PCB assembly, an LED module and an LED display screen, which are good in reliability.
The invention provides a PCB assembly, comprising:
a PCB board;
the connecting pieces are arranged on the PCB at intervals and are flat, and one side, far away from the PCB, of each connecting piece is provided with an installation part used for being connected with the outside.
Preferably, one side of the connecting piece close to the PCB is a plane.
Preferably, the connector is soldered to the PCB board.
Preferably, the connector is made of weldable material.
Preferably, the weldable material comprises iron, copper, steel, aluminum or nickel. For example, it may be an iron sheet, a copper sheet, a steel sheet, etc.
Preferably, the mounting portion is a threaded hole provided on the connecting member.
The invention also discloses an LED module, which comprises the PCB board assembly, a bottom shell and a plurality of screws, wherein the plurality of screws penetrate through the bottom shell and are respectively in threaded connection with the plurality of mounting parts.
The invention also discloses an LED display screen which comprises the LED module.
The beneficial effects brought by one aspect of the invention are as follows:
the existing LED module structure has the following assembly modes: 1. directly lock the screw assembly on the PCB board, 2 lock the screw after the PCB board welding locks the copper post, 3 install magnet direct absorption PCB board assembly on the drain pan.
1. Directly locking screw assembly on the PCB: due to the influence of the point spacing, through holes are difficult to drill on the PCB more and more, blind holes are expensive to drill, PCB circuits are affected, reliability is reduced along with the reduction of the point spacing, and defects such as tooth slippage, tooth breakage and short screw tooth length and no strength often occur. The module of the iron sheet structure with the threaded hole directly welds the iron sheet on the PCB, and the locking screw can select standard screws of various types according to requirements, so that the cost is low, and the situations of tooth sliding and tooth breaking do not occur; meanwhile, the screw is locked on the iron sheet, so that the strength is high and the reliability is good.
2. The module of the PCB welded copper column is influenced by materials and has higher price; positioning is needed during welding, so that holes need to be drilled on the PCB, and meanwhile, the supporting surface is assembled on the end face of the copper column, which is greatly influenced by the structure, the processing precision and the welding condition of the copper column; the copper column welding process needs auxiliary materials to realize automation. The iron sheet with the threaded hole is not a circular welding disc, so that the positioning can be realized without drilling holes on the PCB; the holding surface is around the iron sheet, and the module effect is influenced by iron sheet overall dimension very little, and the production process does not need auxiliary material can realize automaticly.
3. The magnet directly adsorbs the PCB board for assembly, and the magnetism of the magnet is influenced when the temperature of the display screen is high in the mode, so that the adsorption capacity of the magnet is weakened, the module is loosened, and the product performance is influenced; simultaneously, the flatness of the assembled product and the flatness after splicing are difficult to control under the influence of the sizes of the PCB and the magnet. The module of the iron sheet with the threaded hole solves the problems, the PCB can be adsorbed on the magnet of the bottom shell after the iron sheet is welded on the PCB, and the magnet can be locked by screws to be used as an alternative installation mode after the magnetism of the magnet is reduced. The matching surface of the module is arranged around the iron sheet and is not influenced by the size of the iron sheet, so that the flatness and the smoothness of the product are very good.
The invention does not need to open holes on the PCB, saves the cost and leaves more space for the PCB circuit. The total thickness of the LED module is reduced, so that the LED display screen advances one step towards ultra-thin and is more suitable for automatic production.
Drawings
FIG. 1 is a schematic structural diagram of a conventional PCB assembly disclosed in the present invention;
FIG. 2 is a schematic structural diagram of a PCB assembly disclosed in the present invention;
FIG. 3 is a schematic structural view of a connector according to the present disclosure;
fig. 4 is a schematic structural diagram of an LED module disclosed in the present invention.
Detailed Description
It should be noted that, in the case of no conflict, the embodiments and features in the embodiments in the present application may be combined with each other; the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left" and "right", etc., indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplification of description, but do not indicate or imply that the positions or elements referred to must have specific orientations, be constructed in specific orientations, and be operated, and thus are not to be construed as limitations of the present invention. Furthermore, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
Referring to fig. 1, 2 and 3, the present invention provides a PCB assembly including:
a PCB board 1; and the connecting pieces 2 are arranged on the PCB board 1 at intervals, the connecting pieces 2 are flat, and one side of each connecting piece 2, which is far away from the PCB board 1, is provided with an installation part used for being connected with the outside. One side of the connecting piece 2 close to the PCB board 1 is a plane, so that the connecting piece is conveniently welded with the PCB board, the distance can be reduced, and the contact area is increased. The connecting piece 2 is welded on the PCB board 1. The connector is made of weldable material. The weldable material comprises iron, copper, steel, aluminum or nickel, and may be, for example, an iron sheet, a copper sheet, a steel sheet, an aluminum sheet, or the like. The welding and the connection are convenient. The installation department is for setting up screw hole 3 on the connecting piece 2. The number and the position of the connecting pieces 2 can be set according to requirements. The connecting member is made of existing material capable of being welded, and is not limited to the above example.
The existing module is connected with the magnet through screw connection, and the screw connection comprises direct screw connection and is connected with the magnet through a copper column and screws. The direct screw has the defects that the direct screw is mainly influenced by the point spacing, the product with small spacing is easy to have poor sliding tooth fracture, and the cost is high; the main defects of the copper columns and the screws are that positioning holes need to be drilled in the PCB 1, the torsion tension is not strong, and the connection effect is greatly influenced by welding and the size of the copper columns; the disadvantage of the magnet adsorption connection is that the flatness is difficult to control, and the magnetic force influences the product. In order to solve the problems, the iron sheet structure with the threaded hole 3 is designed. The conventional copper cylinder structure is changed, and the iron sheet is made into a flat shape, so that the structure can lock screws 5 with various sizes and is not influenced by the point distance. The iron sheet is welded on the PCB 1 without a positioning hole; the area of the bonding pad is large, and the torsion tension is greatly improved.
Referring to fig. 4, an LED module includes the PCB board assembly, a bottom case 4, and a plurality of screws 5, where the screws 5 penetrate the bottom case 4 and are respectively connected to the mounting portions by threads. A plurality of through holes corresponding to the connecting pieces one by one can be formed in the bottom shell 4, a screw penetrates through the through holes and is in threaded connection with the corresponding threaded holes, and the bottom shell, the connecting pieces and the PCB are fixedly connected through screwing. Low cost and good connection stability. The thickness is thinner.
The utility model provides a LED display screen, includes LED module, current box, with the LED module install on the box can.
The PCB board assembly is directly matched with the supporting surface of the external bottom shell 4 or the external box body, and a gap is reserved between the iron sheet and the bottom shell 4 or the external box body, so that the matching is not influenced by the flatness of the iron sheet, and the problem that the existing magnet adsorption connection occurs is solved. When solving above problem, the iron sheet structure of threaded hole 3 has also inherited the advantage of structure in the past for LED module can be quick, reliable installation, and the product is more frivolous, and the effect is better.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and the technical solutions and the inventive concepts thereof according to the present invention should be equivalent or changed within the scope of the present invention.
Claims (8)
1. A PCB board assembly, comprising:
a PCB board;
the connecting pieces are arranged on the PCB at intervals and are flat, and one side, far away from the PCB, of each connecting piece is provided with an installation part used for being connected with the outside.
2. The PCB board assembly of claim 1, wherein a side of the connector adjacent to the PCB board is planar.
3. The PCB board assembly of claim 1, wherein the connector is soldered to the PCB board.
4. The PCB assembly of claim 1, wherein the connector is made of a solderable material.
5. The PCB board assembly of claim 4, wherein the solderable material comprises iron, copper, steel, aluminum, or nickel.
6. The PCB board assembly of claim 1, wherein the mounting portion is a threaded hole disposed on the connector.
7. An LED module, comprising the PCB assembly of any one of claims 1-5, a bottom housing, and a plurality of screws passing through the bottom housing and threaded with the mounting portions, respectively.
8. An LED display screen, characterized by comprising the LED module set of claim 6.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010806344.7A CN111800939A (en) | 2020-08-12 | 2020-08-12 | PCB assembly, LED module and LED display screen |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010806344.7A CN111800939A (en) | 2020-08-12 | 2020-08-12 | PCB assembly, LED module and LED display screen |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111800939A true CN111800939A (en) | 2020-10-20 |
Family
ID=72834040
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010806344.7A Pending CN111800939A (en) | 2020-08-12 | 2020-08-12 | PCB assembly, LED module and LED display screen |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111800939A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112954916A (en) * | 2021-01-29 | 2021-06-11 | 长春希达电子技术有限公司 | COB efficient splicing display system and splicing method thereof |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202758566U (en) * | 2012-08-21 | 2013-02-27 | 杭州希和光电子有限公司 | Bottom shell separating type front maintaining light-emitting diode (LED) display screen |
-
2020
- 2020-08-12 CN CN202010806344.7A patent/CN111800939A/en active Pending
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN202758566U (en) * | 2012-08-21 | 2013-02-27 | 杭州希和光电子有限公司 | Bottom shell separating type front maintaining light-emitting diode (LED) display screen |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112954916A (en) * | 2021-01-29 | 2021-06-11 | 长春希达电子技术有限公司 | COB efficient splicing display system and splicing method thereof |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20201020 |
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| RJ01 | Rejection of invention patent application after publication |