AU2013289151A1 - High efficiency solar cell structures and manufacturing methods - Google Patents
High efficiency solar cell structures and manufacturing methods Download PDFInfo
- Publication number
- AU2013289151A1 AU2013289151A1 AU2013289151A AU2013289151A AU2013289151A1 AU 2013289151 A1 AU2013289151 A1 AU 2013289151A1 AU 2013289151 A AU2013289151 A AU 2013289151A AU 2013289151 A AU2013289151 A AU 2013289151A AU 2013289151 A1 AU2013289151 A1 AU 2013289151A1
- Authority
- AU
- Australia
- Prior art keywords
- layer
- metal
- emitter
- cell
- backplane
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000004519 manufacturing process Methods 0.000 title abstract description 109
- 238000000034 method Methods 0.000 claims abstract description 589
- 238000001465 metallisation Methods 0.000 claims abstract description 262
- 239000000758 substrate Substances 0.000 claims abstract description 169
- 229910052751 metal Inorganic materials 0.000 claims description 610
- 239000002184 metal Substances 0.000 claims description 610
- 230000008569 process Effects 0.000 claims description 402
- 229910052710 silicon Inorganic materials 0.000 claims description 143
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims description 141
- 239000010703 silicon Substances 0.000 claims description 140
- 238000002161 passivation Methods 0.000 claims description 92
- 238000007639 printing Methods 0.000 claims description 63
- 239000004065 semiconductor Substances 0.000 claims description 55
- 238000007747 plating Methods 0.000 claims description 46
- 229910021417 amorphous silicon Inorganic materials 0.000 claims description 41
- 238000002955 isolation Methods 0.000 claims description 25
- 238000005530 etching Methods 0.000 claims description 14
- 239000007921 spray Substances 0.000 claims description 12
- 229910021420 polycrystalline silicon Inorganic materials 0.000 claims description 6
- 238000000227 grinding Methods 0.000 claims description 3
- LEVVHYCKPQWKOP-UHFFFAOYSA-N [Si].[Ge] Chemical compound [Si].[Ge] LEVVHYCKPQWKOP-UHFFFAOYSA-N 0.000 claims description 2
- 150000004767 nitrides Chemical class 0.000 claims 1
- 239000010410 layer Substances 0.000 description 602
- 210000004027 cell Anatomy 0.000 description 575
- 239000000463 material Substances 0.000 description 230
- 238000012545 processing Methods 0.000 description 127
- 238000003475 lamination Methods 0.000 description 124
- 238000000151 deposition Methods 0.000 description 122
- 230000008021 deposition Effects 0.000 description 105
- 238000001505 atmospheric-pressure chemical vapour deposition Methods 0.000 description 92
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 90
- 229910052782 aluminium Inorganic materials 0.000 description 90
- 238000002679 ablation Methods 0.000 description 88
- 238000005240 physical vapour deposition Methods 0.000 description 83
- 235000012431 wafers Nutrition 0.000 description 83
- 238000009792 diffusion process Methods 0.000 description 77
- 239000000853 adhesive Substances 0.000 description 73
- 230000001070 adhesive effect Effects 0.000 description 73
- 230000015572 biosynthetic process Effects 0.000 description 73
- 238000000608 laser ablation Methods 0.000 description 71
- 238000013461 design Methods 0.000 description 68
- 239000011888 foil Substances 0.000 description 65
- 238000007650 screen-printing Methods 0.000 description 61
- 238000005553 drilling Methods 0.000 description 57
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 49
- 239000006096 absorbing agent Substances 0.000 description 49
- 239000011521 glass Substances 0.000 description 49
- 239000010949 copper Substances 0.000 description 47
- 238000010586 diagram Methods 0.000 description 46
- 239000011135 tin Substances 0.000 description 46
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 45
- 229910021426 porous silicon Inorganic materials 0.000 description 45
- XHXFXVLFKHQFAL-UHFFFAOYSA-N phosphoryl trichloride Chemical compound ClP(Cl)(Cl)=O XHXFXVLFKHQFAL-UHFFFAOYSA-N 0.000 description 44
- 239000000976 ink Substances 0.000 description 41
- 230000002787 reinforcement Effects 0.000 description 37
- 229910052802 copper Inorganic materials 0.000 description 36
- BHEPBYXIRTUNPN-UHFFFAOYSA-N hydridophosphorus(.) (triplet) Chemical compound [PH] BHEPBYXIRTUNPN-UHFFFAOYSA-N 0.000 description 36
- 238000000059 patterning Methods 0.000 description 36
- 241001323321 Pluto Species 0.000 description 33
- 230000008901 benefit Effects 0.000 description 32
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 30
- 239000004593 Epoxy Substances 0.000 description 29
- 239000010409 thin film Substances 0.000 description 29
- 239000002019 doping agent Substances 0.000 description 28
- 239000007943 implant Substances 0.000 description 28
- 239000000969 carrier Substances 0.000 description 26
- 239000005038 ethylene vinyl acetate Substances 0.000 description 26
- 239000000443 aerosol Substances 0.000 description 25
- DQXBYHZEEUGOBF-UHFFFAOYSA-N but-3-enoic acid;ethene Chemical compound C=C.OC(=O)CC=C DQXBYHZEEUGOBF-UHFFFAOYSA-N 0.000 description 25
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 25
- 229910000679 solder Inorganic materials 0.000 description 25
- 229910021419 crystalline silicon Inorganic materials 0.000 description 24
- 210000002381 plasma Anatomy 0.000 description 24
- 229920005989 resin Polymers 0.000 description 24
- 239000011347 resin Substances 0.000 description 24
- 238000011065 in-situ storage Methods 0.000 description 23
- 229910052709 silver Inorganic materials 0.000 description 23
- 229910019213 POCl3 Inorganic materials 0.000 description 22
- 238000007641 inkjet printing Methods 0.000 description 22
- 229910052759 nickel Inorganic materials 0.000 description 22
- 150000002739 metals Chemical class 0.000 description 21
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 20
- 229910052698 phosphorus Inorganic materials 0.000 description 20
- 239000011574 phosphorus Substances 0.000 description 20
- ZOXJGFHDIHLPTG-UHFFFAOYSA-N Boron Chemical compound [B] ZOXJGFHDIHLPTG-UHFFFAOYSA-N 0.000 description 19
- 229910052581 Si3N4 Inorganic materials 0.000 description 19
- 229910052796 boron Inorganic materials 0.000 description 19
- 238000004140 cleaning Methods 0.000 description 19
- 239000003989 dielectric material Substances 0.000 description 19
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 description 19
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 17
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 17
- 230000009977 dual effect Effects 0.000 description 17
- 230000006870 function Effects 0.000 description 17
- KRHYYFGTRYWZRS-UHFFFAOYSA-N hydrofluoric acid Substances F KRHYYFGTRYWZRS-UHFFFAOYSA-N 0.000 description 17
- QPJSUIGXIBEQAC-UHFFFAOYSA-N n-(2,4-dichloro-5-propan-2-yloxyphenyl)acetamide Chemical compound CC(C)OC1=CC(NC(C)=O)=C(Cl)C=C1Cl QPJSUIGXIBEQAC-UHFFFAOYSA-N 0.000 description 17
- HBVFXTAPOLSOPB-UHFFFAOYSA-N nickel vanadium Chemical compound [V].[Ni] HBVFXTAPOLSOPB-UHFFFAOYSA-N 0.000 description 17
- 239000004332 silver Substances 0.000 description 17
- 239000000126 substance Substances 0.000 description 17
- 238000011066 ex-situ storage Methods 0.000 description 15
- 229910021421 monocrystalline silicon Inorganic materials 0.000 description 15
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 15
- 230000001681 protective effect Effects 0.000 description 15
- 238000000926 separation method Methods 0.000 description 15
- 229910052718 tin Inorganic materials 0.000 description 15
- 238000009966 trimming Methods 0.000 description 15
- 239000010408 film Substances 0.000 description 14
- 239000007789 gas Substances 0.000 description 14
- 239000005543 nano-size silicon particle Substances 0.000 description 14
- 229920003023 plastic Polymers 0.000 description 14
- 238000007654 immersion Methods 0.000 description 13
- 238000002294 plasma sputter deposition Methods 0.000 description 13
- 239000004033 plastic Substances 0.000 description 13
- 230000002829 reductive effect Effects 0.000 description 13
- 238000005507 spraying Methods 0.000 description 13
- 229910045601 alloy Inorganic materials 0.000 description 12
- 239000000956 alloy Substances 0.000 description 12
- 239000011449 brick Substances 0.000 description 12
- 238000005229 chemical vapour deposition Methods 0.000 description 12
- 230000036961 partial effect Effects 0.000 description 12
- 238000000623 plasma-assisted chemical vapour deposition Methods 0.000 description 12
- 230000006798 recombination Effects 0.000 description 12
- 238000005215 recombination Methods 0.000 description 12
- 238000012360 testing method Methods 0.000 description 12
- 238000000137 annealing Methods 0.000 description 11
- 238000001704 evaporation Methods 0.000 description 11
- 230000008020 evaporation Effects 0.000 description 11
- 239000001257 hydrogen Substances 0.000 description 11
- 229910052739 hydrogen Inorganic materials 0.000 description 11
- 230000001590 oxidative effect Effects 0.000 description 11
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 10
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 10
- 239000010953 base metal Substances 0.000 description 10
- 239000004020 conductor Substances 0.000 description 10
- 238000005520 cutting process Methods 0.000 description 10
- 239000008393 encapsulating agent Substances 0.000 description 10
- 239000000835 fiber Substances 0.000 description 10
- 238000002513 implantation Methods 0.000 description 10
- 239000005368 silicate glass Substances 0.000 description 10
- 238000011282 treatment Methods 0.000 description 10
- 229920002799 BoPET Polymers 0.000 description 9
- 239000005041 Mylar™ Substances 0.000 description 9
- 238000013459 approach Methods 0.000 description 9
- 238000000576 coating method Methods 0.000 description 9
- 238000005516 engineering process Methods 0.000 description 9
- 238000010023 transfer printing Methods 0.000 description 9
- 238000007704 wet chemistry method Methods 0.000 description 9
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 8
- 238000000407 epitaxy Methods 0.000 description 8
- 229910052814 silicon oxide Inorganic materials 0.000 description 8
- 230000008093 supporting effect Effects 0.000 description 8
- 238000012546 transfer Methods 0.000 description 8
- ZDHXKXAHOVTTAH-UHFFFAOYSA-N trichlorosilane Chemical compound Cl[SiH](Cl)Cl ZDHXKXAHOVTTAH-UHFFFAOYSA-N 0.000 description 8
- 239000005052 trichlorosilane Substances 0.000 description 8
- 238000007738 vacuum evaporation Methods 0.000 description 8
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 7
- 239000006117 anti-reflective coating Substances 0.000 description 7
- 238000000605 extraction Methods 0.000 description 7
- 239000002243 precursor Substances 0.000 description 7
- 238000002360 preparation method Methods 0.000 description 7
- 229920001169 thermoplastic Polymers 0.000 description 7
- 239000004416 thermosoftening plastic Substances 0.000 description 7
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 6
- XYFCBTPGUUZFHI-UHFFFAOYSA-N Phosphine Chemical compound P XYFCBTPGUUZFHI-UHFFFAOYSA-N 0.000 description 6
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 6
- 230000015556 catabolic process Effects 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 6
- 238000006731 degradation reaction Methods 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 6
- 230000001976 improved effect Effects 0.000 description 6
- 238000010030 laminating Methods 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 239000011241 protective layer Substances 0.000 description 6
- 230000009467 reduction Effects 0.000 description 6
- 239000005361 soda-lime glass Substances 0.000 description 6
- 238000004544 sputter deposition Methods 0.000 description 6
- WGTYBPLFGIVFAS-UHFFFAOYSA-M tetramethylammonium hydroxide Chemical compound [OH-].C[N+](C)(C)C WGTYBPLFGIVFAS-UHFFFAOYSA-M 0.000 description 6
- 230000009466 transformation Effects 0.000 description 6
- 230000009286 beneficial effect Effects 0.000 description 5
- 238000005137 deposition process Methods 0.000 description 5
- 229910052732 germanium Inorganic materials 0.000 description 5
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 5
- 230000010354 integration Effects 0.000 description 5
- 238000001459 lithography Methods 0.000 description 5
- 239000000203 mixture Substances 0.000 description 5
- 230000004048 modification Effects 0.000 description 5
- 238000012986 modification Methods 0.000 description 5
- 229920002620 polyvinyl fluoride Polymers 0.000 description 5
- 238000004080 punching Methods 0.000 description 5
- 229910021332 silicide Inorganic materials 0.000 description 5
- 238000012421 spiking Methods 0.000 description 5
- 238000007751 thermal spraying Methods 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- 229910000838 Al alloy Inorganic materials 0.000 description 4
- 101100459910 Arabidopsis thaliana NCS1 gene Proteins 0.000 description 4
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 4
- 229910000577 Silicon-germanium Inorganic materials 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 4
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000005388 borosilicate glass Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 4
- 238000003776 cleavage reaction Methods 0.000 description 4
- 238000012864 cross contamination Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 238000011049 filling Methods 0.000 description 4
- 238000010285 flame spraying Methods 0.000 description 4
- 238000005247 gettering Methods 0.000 description 4
- 238000007737 ion beam deposition Methods 0.000 description 4
- 238000005224 laser annealing Methods 0.000 description 4
- 230000000670 limiting effect Effects 0.000 description 4
- 239000007788 liquid Substances 0.000 description 4
- 230000007935 neutral effect Effects 0.000 description 4
- 238000004806 packaging method and process Methods 0.000 description 4
- RLOWWWKZYUNIDI-UHFFFAOYSA-N phosphinic chloride Chemical compound ClP=O RLOWWWKZYUNIDI-UHFFFAOYSA-N 0.000 description 4
- 238000001020 plasma etching Methods 0.000 description 4
- 229920000647 polyepoxide Polymers 0.000 description 4
- 239000005020 polyethylene terephthalate Substances 0.000 description 4
- 229920000139 polyethylene terephthalate Polymers 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 238000002310 reflectometry Methods 0.000 description 4
- 238000007788 roughening Methods 0.000 description 4
- 230000007017 scission Effects 0.000 description 4
- 230000011218 segmentation Effects 0.000 description 4
- 238000005476 soldering Methods 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000011701 zinc Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- 229910018125 Al-Si Inorganic materials 0.000 description 3
- 229910018520 Al—Si Inorganic materials 0.000 description 3
- 101100126074 Caenorhabditis elegans imp-2 gene Proteins 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 230000009471 action Effects 0.000 description 3
- 230000004913 activation Effects 0.000 description 3
- 238000000231 atomic layer deposition Methods 0.000 description 3
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 3
- 238000005422 blasting Methods 0.000 description 3
- -1 but not limited to Substances 0.000 description 3
- 238000004364 calculation method Methods 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000000356 contaminant Substances 0.000 description 3
- 238000011109 contamination Methods 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 3
- 230000008025 crystallization Effects 0.000 description 3
- 230000001627 detrimental effect Effects 0.000 description 3
- 230000005611 electricity Effects 0.000 description 3
- 238000004299 exfoliation Methods 0.000 description 3
- 238000003306 harvesting Methods 0.000 description 3
- 239000001307 helium Substances 0.000 description 3
- 229910052734 helium Inorganic materials 0.000 description 3
- SWQJXJOGLNCZEY-UHFFFAOYSA-N helium atom Chemical compound [He] SWQJXJOGLNCZEY-UHFFFAOYSA-N 0.000 description 3
- 239000012535 impurity Substances 0.000 description 3
- 230000007774 longterm Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 239000002105 nanoparticle Substances 0.000 description 3
- 230000003647 oxidation Effects 0.000 description 3
- 238000007254 oxidation reaction Methods 0.000 description 3
- 229910052760 oxygen Inorganic materials 0.000 description 3
- 239000001301 oxygen Substances 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000007789 sealing Methods 0.000 description 3
- 230000035945 sensitivity Effects 0.000 description 3
- FVBUAEGBCNSCDD-UHFFFAOYSA-N silicide(4-) Chemical compound [Si-4] FVBUAEGBCNSCDD-UHFFFAOYSA-N 0.000 description 3
- 229920001187 thermosetting polymer Polymers 0.000 description 3
- VXEGSRKPIUDPQT-UHFFFAOYSA-N 4-[4-(4-methoxyphenyl)piperazin-1-yl]aniline Chemical compound C1=CC(OC)=CC=C1N1CCN(C=2C=CC(N)=CC=2)CC1 VXEGSRKPIUDPQT-UHFFFAOYSA-N 0.000 description 2
- MHAJPDPJQMAIIY-UHFFFAOYSA-N Hydrogen peroxide Chemical compound OO MHAJPDPJQMAIIY-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 229920000271 Kevlar® Polymers 0.000 description 2
- 125000000174 L-prolyl group Chemical group [H]N1C([H])([H])C([H])([H])C([H])([H])[C@@]1([H])C(*)=O 0.000 description 2
- GQPLMRYTRLFLPF-UHFFFAOYSA-N Nitrous Oxide Chemical compound [O-][N+]#N GQPLMRYTRLFLPF-UHFFFAOYSA-N 0.000 description 2
- 229910020286 SiOxNy Inorganic materials 0.000 description 2
- 229910020776 SixNy Inorganic materials 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 2
- CSDREXVUYHZDNP-UHFFFAOYSA-N alumanylidynesilicon Chemical compound [Al].[Si] CSDREXVUYHZDNP-UHFFFAOYSA-N 0.000 description 2
- 239000004760 aramid Substances 0.000 description 2
- 238000004380 ashing Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 210000000988 bone and bone Anatomy 0.000 description 2
- 230000005587 bubbling Effects 0.000 description 2
- 239000003251 chemically resistant material Substances 0.000 description 2
- 238000001816 cooling Methods 0.000 description 2
- 230000008878 coupling Effects 0.000 description 2
- 238000010168 coupling process Methods 0.000 description 2
- 238000005859 coupling reaction Methods 0.000 description 2
- 238000005336 cracking Methods 0.000 description 2
- 238000004132 cross linking Methods 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- 230000000593 degrading effect Effects 0.000 description 2
- MROCJMGDEKINLD-UHFFFAOYSA-N dichlorosilane Chemical compound Cl[SiH2]Cl MROCJMGDEKINLD-UHFFFAOYSA-N 0.000 description 2
- 238000001035 drying Methods 0.000 description 2
- 239000002355 dual-layer Substances 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000009713 electroplating Methods 0.000 description 2
- 238000005538 encapsulation Methods 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 239000002421 finishing Substances 0.000 description 2
- 238000010304 firing Methods 0.000 description 2
- 238000009472 formulation Methods 0.000 description 2
- GPRLSGONYQIRFK-UHFFFAOYSA-N hydron Chemical compound [H+] GPRLSGONYQIRFK-UHFFFAOYSA-N 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 238000005468 ion implantation Methods 0.000 description 2
- 239000004761 kevlar Substances 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 238000010330 laser marking Methods 0.000 description 2
- 230000000873 masking effect Effects 0.000 description 2
- 239000011159 matrix material Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 229910052757 nitrogen Inorganic materials 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- 230000000737 periodic effect Effects 0.000 description 2
- 229910000073 phosphorus hydride Inorganic materials 0.000 description 2
- 239000005360 phosphosilicate glass Substances 0.000 description 2
- 238000002203 pretreatment Methods 0.000 description 2
- 238000003672 processing method Methods 0.000 description 2
- 230000010349 pulsation Effects 0.000 description 2
- 239000003870 refractory metal Substances 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000000565 sealant Substances 0.000 description 2
- 238000010008 shearing Methods 0.000 description 2
- 239000000377 silicon dioxide Substances 0.000 description 2
- 235000012239 silicon dioxide Nutrition 0.000 description 2
- 239000005049 silicon tetrachloride Substances 0.000 description 2
- 239000002210 silicon-based material Substances 0.000 description 2
- 239000010944 silver (metal) Substances 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 238000000992 sputter etching Methods 0.000 description 2
- 239000007858 starting material Substances 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- 239000002344 surface layer Substances 0.000 description 2
- 238000004381 surface treatment Methods 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- 238000009823 thermal lamination Methods 0.000 description 2
- 238000007669 thermal treatment Methods 0.000 description 2
- 230000008719 thickening Effects 0.000 description 2
- 230000035899 viability Effects 0.000 description 2
- 238000001039 wet etching Methods 0.000 description 2
- 229910052725 zinc Inorganic materials 0.000 description 2
- 229910002601 GaN Inorganic materials 0.000 description 1
- GYHNNYVSQQEPJS-UHFFFAOYSA-N Gallium Chemical compound [Ga] GYHNNYVSQQEPJS-UHFFFAOYSA-N 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- 229910000927 Ge alloy Inorganic materials 0.000 description 1
- 101100268078 Mus musculus Zbtb24 gene Proteins 0.000 description 1
- 101100335694 Oryza sativa subsp. japonica G1L6 gene Proteins 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 229910000676 Si alloy Inorganic materials 0.000 description 1
- 229910003811 SiGeC Inorganic materials 0.000 description 1
- 229910004205 SiNX Inorganic materials 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 229910007637 SnAg Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910001297 Zn alloy Inorganic materials 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 238000000637 aluminium metallisation Methods 0.000 description 1
- FJMNNXLGOUYVHO-UHFFFAOYSA-N aluminum zinc Chemical compound [Al].[Zn] FJMNNXLGOUYVHO-UHFFFAOYSA-N 0.000 description 1
- 230000003466 anti-cipated effect Effects 0.000 description 1
- 229910052787 antimony Inorganic materials 0.000 description 1
- WATWJIUSRGPENY-UHFFFAOYSA-N antimony atom Chemical compound [Sb] WATWJIUSRGPENY-UHFFFAOYSA-N 0.000 description 1
- 229920006231 aramid fiber Polymers 0.000 description 1
- 229920003235 aromatic polyamide Polymers 0.000 description 1
- 229910052785 arsenic Inorganic materials 0.000 description 1
- RQNWIZPPADIBDY-UHFFFAOYSA-N arsenic atom Chemical compound [As] RQNWIZPPADIBDY-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- JUPQTSLXMOCDHR-UHFFFAOYSA-N benzene-1,4-diol;bis(4-fluorophenyl)methanone Chemical compound OC1=CC=C(O)C=C1.C1=CC(F)=CC=C1C(=O)C1=CC=C(F)C=C1 JUPQTSLXMOCDHR-UHFFFAOYSA-N 0.000 description 1
- 229910052797 bismuth Inorganic materials 0.000 description 1
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 description 1
- 230000000903 blocking effect Effects 0.000 description 1
- 239000012876 carrier material Substances 0.000 description 1
- 239000003054 catalyst Substances 0.000 description 1
- 239000001913 cellulose Substances 0.000 description 1
- 229920002678 cellulose Polymers 0.000 description 1
- 229910010293 ceramic material Inorganic materials 0.000 description 1
- 239000003638 chemical reducing agent Substances 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 238000010344 co-firing Methods 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 230000001010 compromised effect Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000002826 coolant Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000000254 damaging effect Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000002939 deleterious effect Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000012938 design process Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 230000004069 differentiation Effects 0.000 description 1
- 238000010017 direct printing Methods 0.000 description 1
- FGXWKSZFVQUSTL-UHFFFAOYSA-N domperidone Chemical compound C12=CC=CC=C2NC(=O)N1CCCN(CC1)CCC1N1C2=CC=C(Cl)C=C2NC1=O FGXWKSZFVQUSTL-UHFFFAOYSA-N 0.000 description 1
- 238000011143 downstream manufacturing Methods 0.000 description 1
- 238000001312 dry etching Methods 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 229920000840 ethylene tetrafluoroethylene copolymer Polymers 0.000 description 1
- 230000007717 exclusion Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229920002313 fluoropolymer Polymers 0.000 description 1
- 229910052733 gallium Inorganic materials 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 230000005661 hydrophobic surface Effects 0.000 description 1
- 238000005286 illumination Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000010348 incorporation Methods 0.000 description 1
- 229910052738 indium Inorganic materials 0.000 description 1
- APFVFJFRJDLVQX-UHFFFAOYSA-N indium atom Chemical compound [In] APFVFJFRJDLVQX-UHFFFAOYSA-N 0.000 description 1
- 239000011261 inert gas Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 230000005527 interface trap Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 238000010297 mechanical methods and process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229910001092 metal group alloy Inorganic materials 0.000 description 1
- 238000004377 microelectronic Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 239000001272 nitrous oxide Substances 0.000 description 1
- 239000000615 nonconductor Substances 0.000 description 1
- 231100000252 nontoxic Toxicity 0.000 description 1
- 230000003000 nontoxic effect Effects 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000003071 parasitic effect Effects 0.000 description 1
- 230000035515 penetration Effects 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 239000012071 phase Substances 0.000 description 1
- OYLRFHLPEAGKJU-UHFFFAOYSA-N phosphane silicic acid Chemical compound P.[Si](O)(O)(O)O OYLRFHLPEAGKJU-UHFFFAOYSA-N 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 238000009832 plasma treatment Methods 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 150000003071 polychlorinated biphenyls Chemical class 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 230000003389 potentiating effect Effects 0.000 description 1
- 230000002028 premature Effects 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000004886 process control Methods 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 230000007261 regionalization Effects 0.000 description 1
- 239000012779 reinforcing material Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000004044 response Effects 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000007761 roller coating Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000012812 sealant material Substances 0.000 description 1
- 238000012163 sequencing technique Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- 238000000527 sonication Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 1
- 238000002207 thermal evaporation Methods 0.000 description 1
- 239000012815 thermoplastic material Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- 239000004634 thermosetting polymer Substances 0.000 description 1
- 238000012876 topography Methods 0.000 description 1
- 238000000844 transformation Methods 0.000 description 1
- 238000003949 trap density measurement Methods 0.000 description 1
- 238000004148 unit process Methods 0.000 description 1
- 230000000007 visual effect Effects 0.000 description 1
- 230000004382 visual function Effects 0.000 description 1
- 238000009756 wet lay-up Methods 0.000 description 1
- NWONKYPBYAMBJT-UHFFFAOYSA-L zinc sulfate Chemical compound [Zn+2].[O-]S([O-])(=O)=O NWONKYPBYAMBJT-UHFFFAOYSA-L 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/18—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof
- H01L31/1804—Processes or apparatus specially adapted for the manufacture or treatment of these devices or of parts thereof comprising only elements of Group IV of the Periodic Table
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/02—Details
- H01L31/0224—Electrodes
- H01L31/022408—Electrodes for devices characterised by at least one potential jump barrier or surface barrier
- H01L31/022425—Electrodes for devices characterised by at least one potential jump barrier or surface barrier for solar cells
- H01L31/022441—Electrode arrangements specially adapted for back-contact solar cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/068—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells
- H01L31/0682—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN homojunction type, e.g. bulk silicon PN homojunction solar cells or thin film polycrystalline silicon PN homojunction solar cells back-junction, i.e. rearside emitter, solar cells, e.g. interdigitated base-emitter regions back-junction cells
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L31/00—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L31/04—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices
- H01L31/06—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers
- H01L31/072—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type
- H01L31/0745—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type comprising a AIVBIV heterojunction, e.g. Si/Ge, SiGe/Si or Si/SiC solar cells
- H01L31/0747—Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof adapted as photovoltaic [PV] conversion devices characterised by potential barriers the potential barriers being only of the PN heterojunction type comprising a AIVBIV heterojunction, e.g. Si/Ge, SiGe/Si or Si/SiC solar cells comprising a heterojunction of crystalline and amorphous materials, e.g. heterojunction with intrinsic thin layer
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E10/00—Energy generation through renewable energy sources
- Y02E10/50—Photovoltaic [PV] energy
- Y02E10/547—Monocrystalline silicon PV cells
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Sustainable Energy (AREA)
- Sustainable Development (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Crystallography & Structural Chemistry (AREA)
- Photovoltaic Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US201261619300P | 2012-04-02 | 2012-04-02 | |
US61/619,300 | 2012-04-02 | ||
PCT/US2013/035029 WO2014011260A2 (fr) | 2012-04-02 | 2013-04-02 | Structures de cellule solaire haute performance et procédés de fabrication |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2013289151A1 true AU2013289151A1 (en) | 2014-11-13 |
Family
ID=49916638
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2013289151A Abandoned AU2013289151A1 (en) | 2012-04-02 | 2013-04-02 | High efficiency solar cell structures and manufacturing methods |
Country Status (3)
Country | Link |
---|---|
JP (1) | JP2015516145A (fr) |
AU (1) | AU2013289151A1 (fr) |
WO (1) | WO2014011260A2 (fr) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10164131B2 (en) * | 2014-12-19 | 2018-12-25 | Sunpower Corporation | Multi-layer sputtered metal seed for solar cell conductive contact |
FR3050870B1 (fr) * | 2016-04-28 | 2018-05-25 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Procede de realisation d’un dispositif de detection de rayonnement electromagnetique comportant une couche en un materiau getter |
CN112466967B (zh) * | 2020-11-23 | 2023-08-22 | 浙江晶科能源有限公司 | 一种选择性发射极太阳能电池及其制备方法 |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6313396B1 (en) * | 2000-05-22 | 2001-11-06 | The Boeing Company | Lightweight solar module and method of fabrication |
JP2005317779A (ja) * | 2004-04-28 | 2005-11-10 | Toyota Motor Corp | 光電変換素子 |
JP2008052767A (ja) * | 2006-08-22 | 2008-03-06 | Sony Corp | 記録装置および記録方法、並びにプログラム |
WO2008125543A2 (fr) * | 2007-04-17 | 2008-10-23 | Interuniversitair Microelektronica Centrum (Imec) | Procédé de réduction de l'épaisseur de substrats |
WO2008157577A2 (fr) * | 2007-06-18 | 2008-12-24 | E-Cube Technologies, Inc. | Procédés et appareils pour améliorer l'extraction d'énergie de piles solaires |
JP5252472B2 (ja) * | 2007-09-28 | 2013-07-31 | シャープ株式会社 | 太陽電池、太陽電池の製造方法、太陽電池モジュールの製造方法および太陽電池モジュール |
DE102009014348A1 (de) * | 2008-06-12 | 2009-12-17 | Bayer Materialscience Ag | Leichtes, biegesteifes und selbsttragendes Solarmodul sowie ein Verfahren zu dessen Herstellung |
EP2404317A4 (fr) * | 2009-03-06 | 2014-06-11 | Solexel Inc | Procédé de fabrication d'un substrat à couche mince |
JP2011054831A (ja) * | 2009-09-03 | 2011-03-17 | Sharp Corp | バックコンタクト型太陽電池セル、太陽電池ストリングおよび太陽電池モジュール |
CN102714235B (zh) * | 2010-01-22 | 2015-01-14 | 夏普株式会社 | 带布线板的太阳能电池单元及其制造方法 |
EP2577750A4 (fr) * | 2010-05-27 | 2014-04-09 | Solexel Inc | Traitement laser pour fabrication de cellules solaires en silicium cristallin mince à efficacité élevée |
WO2012021880A2 (fr) * | 2010-08-13 | 2012-02-16 | Solexel, Inc. | Appareil et procédé de fabrication répétée de substrats semi-conducteurs à couches minces au moyen d'un gabarit |
US8772076B2 (en) * | 2010-09-03 | 2014-07-08 | Solopower Systems, Inc. | Back contact diffusion barrier layers for group ibiiiavia photovoltaic cells |
US20120073650A1 (en) * | 2010-09-24 | 2012-03-29 | David Smith | Method of fabricating an emitter region of a solar cell |
-
2013
- 2013-04-02 JP JP2015504686A patent/JP2015516145A/ja not_active Ceased
- 2013-04-02 WO PCT/US2013/035029 patent/WO2014011260A2/fr active Application Filing
- 2013-04-02 AU AU2013289151A patent/AU2013289151A1/en not_active Abandoned
Also Published As
Publication number | Publication date |
---|---|
WO2014011260A3 (fr) | 2014-04-10 |
JP2015516145A (ja) | 2015-06-08 |
WO2014011260A2 (fr) | 2014-01-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US20170278991A1 (en) | Multi-level solar cell metallization | |
AU2012294932B2 (en) | High-efficiency solar photovoltaic cells and modules using thin crystalline semiconductor absorbers | |
US20130228221A1 (en) | Manufacturing methods and structures for large-area thin-film solar cells and other semiconductor devices | |
US20130213469A1 (en) | High efficiency solar cell structures and manufacturing methods | |
US20150171230A1 (en) | Fabrication methods for back contact solar cells | |
US20170236954A1 (en) | High efficiency solar cell structures and manufacturing methods | |
AU2016265969A1 (en) | Multi-level solar cell metallization | |
US9379258B2 (en) | Fabrication methods for monolithically isled back contact back junction solar cells | |
US9515217B2 (en) | Monolithically isled back contact back junction solar cells | |
US9911875B2 (en) | Solar cell metallization | |
AU2013272248A1 (en) | Manufacturing methods and structures for large-area thin-film solar cells and other semiconductor devices | |
JP5528809B2 (ja) | 三次元薄膜太陽電池製造のためのテンプレート及び使用方法 | |
KR102015591B1 (ko) | 박형 실리콘 태양 전지용 활성 후면판 | |
US20150194547A1 (en) | Systems and methods for monolithically isled solar photovoltaic cells | |
WO2014127067A1 (fr) | Photopiles à contact arrière et à jonction arrière à îlot monolithique utilisant des tranches massives | |
JP2014150280A (ja) | 三次元薄膜太陽電池製造のためのテンプレート及び使用方法 | |
AU2016200610B2 (en) | Structures and methods of formation of contiguous and non-contiguous base regions for high efficiency back-contact solar cells | |
US20160190366A1 (en) | Trench isolation for monolithically isled solar photovoltaic cells and modules | |
AU2013289151A1 (en) | High efficiency solar cell structures and manufacturing methods | |
WO2015100392A2 (fr) | Contacts auto-alignés pour des cellules solaires à jonction arrière et contact arrière à îlot monolithique |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK5 | Application lapsed section 142(2)(e) - patent request and compl. specification not accepted |