AU2009258264B2 - Metal and electronic device coating process for marine use and other environments - Google Patents

Metal and electronic device coating process for marine use and other environments Download PDF

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Publication number
AU2009258264B2
AU2009258264B2 AU2009258264A AU2009258264A AU2009258264B2 AU 2009258264 B2 AU2009258264 B2 AU 2009258264B2 AU 2009258264 A AU2009258264 A AU 2009258264A AU 2009258264 A AU2009258264 A AU 2009258264A AU 2009258264 B2 AU2009258264 B2 AU 2009258264B2
Authority
AU
Australia
Prior art keywords
parylene
boron nitride
xylylene
poly
coating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Ceased
Application number
AU2009258264A
Other languages
English (en)
Other versions
AU2009258264A1 (en
Inventor
Angela Michele Dawicki
Eric Roger Dawicki
Sidney Edward Martin
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
HZO Inc
Original Assignee
HZO Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/104,080 external-priority patent/US20090263581A1/en
Priority claimed from US12/104,152 external-priority patent/US20090263641A1/en
Application filed by HZO Inc filed Critical HZO Inc
Publication of AU2009258264A1 publication Critical patent/AU2009258264A1/en
Assigned to HZO, INC. reassignment HZO, INC. Request for Assignment Assignors: NORTHEAST MARITIME INSTITUTE, INC.
Priority to AU2014201938A priority Critical patent/AU2014201938A1/en
Priority to AU2014201939A priority patent/AU2014201939A1/en
Application granted granted Critical
Publication of AU2009258264B2 publication Critical patent/AU2009258264B2/en
Ceased legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/60—Deposition of organic layers from vapour phase
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D165/04—Polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/16—Antifouling paints; Underwater paints
    • C09D5/1656—Antifouling paints; Underwater paints characterised by the film-forming substance
    • C09D5/1662—Synthetic film-forming substance
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/66—Additives characterised by particle size
    • C09D7/69—Particle size larger than 1000 nm
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2601/00—Inorganic fillers
    • B05D2601/20—Inorganic fillers used for non-pigmentation effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
    • B05D3/141—Plasma treatment
    • B05D3/142—Pretreatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C08L65/04—Polyxylenes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
AU2009258264A 2008-04-16 2009-03-05 Metal and electronic device coating process for marine use and other environments Ceased AU2009258264B2 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
AU2014201938A AU2014201938A1 (en) 2008-04-16 2014-04-04 Metal and electronic device coating process for marine use and other environments
AU2014201939A AU2014201939A1 (en) 2008-04-16 2014-04-04 Metal and electronic device coating process for marine use and other environments

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US12/104,152 2008-04-16
US12/104,080 US20090263581A1 (en) 2008-04-16 2008-04-16 Method and apparatus to coat objects with parylene and boron nitride
US12/104,080 2008-04-16
US12/104,152 US20090263641A1 (en) 2008-04-16 2008-04-16 Method and apparatus to coat objects with parylene
PCT/US2009/001410 WO2009151492A2 (en) 2008-04-16 2009-03-05 Metal and electronic device coating process for marine use and other environments

Related Child Applications (2)

Application Number Title Priority Date Filing Date
AU2014201939A Division AU2014201939A1 (en) 2008-04-16 2014-04-04 Metal and electronic device coating process for marine use and other environments
AU2014201938A Division AU2014201938A1 (en) 2008-04-16 2014-04-04 Metal and electronic device coating process for marine use and other environments

Publications (2)

Publication Number Publication Date
AU2009258264A1 AU2009258264A1 (en) 2009-12-17
AU2009258264B2 true AU2009258264B2 (en) 2014-06-05

Family

ID=41278148

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2009258264A Ceased AU2009258264B2 (en) 2008-04-16 2009-03-05 Metal and electronic device coating process for marine use and other environments

Country Status (7)

Country Link
EP (1) EP2328692A2 (zh)
KR (1) KR20110059563A (zh)
CN (2) CN105400269A (zh)
AU (1) AU2009258264B2 (zh)
CA (1) CA2724602A1 (zh)
RU (1) RU2539694C2 (zh)
WO (1) WO2009151492A2 (zh)

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KR101138207B1 (ko) * 2010-02-10 2012-05-10 주식회사 코아비스 연료펌프용 아마추어 및 그 제조 방법
CN103283263A (zh) * 2010-12-28 2013-09-04 峰力公司 通过粉末注射成型制成的助听器壳体
US8852693B2 (en) 2011-05-19 2014-10-07 Liquipel Ip Llc Coated electronic devices and associated methods
DE102011103737A1 (de) * 2011-05-31 2012-12-06 Heinz Busch Verfahren zum Beschichten von inneren Oberflächen langgestreckter Gegenstände
US9210933B2 (en) * 2011-07-08 2015-12-15 Specialty Coating Systems, Inc. Antimicrobial parylene coatings and methods of depositing same
JP2013143563A (ja) 2012-01-10 2013-07-22 Hzo Inc 内部耐水性被覆を備える電子デバイスを組み立てるためのシステム
WO2013132250A1 (en) * 2012-03-06 2013-09-12 Semblant Limited Coated electrical assembly
WO2013142858A1 (en) * 2012-03-23 2013-09-26 Hzo, Inc. Apparatuses, systems and methods for applying protective coatings to electronic device assemblies
KR102167482B1 (ko) * 2013-03-15 2020-10-19 에이치제트오 인코포레이티드 상이한 유형의 내습성 재료들의 조합
US9161434B2 (en) 2013-09-04 2015-10-13 Apple Inc. Methods for shielding electronic components from moisture
CN104947074B (zh) * 2014-11-19 2019-07-05 宁波聚膜新材料科技有限公司 一种基于化学气相沉积的纺织物表面高分子镀膜方法
CN106811735B (zh) * 2015-12-29 2019-02-05 广东易能纳米科技有限公司 一种手机纳米防水膜的制备方法
CN105937024A (zh) * 2016-04-20 2016-09-14 叶羽敏 一种电子产品防护涂层的制备方法及应用
US10835978B2 (en) * 2016-07-06 2020-11-17 Hewlett-Packard Development Company, L.P. Logo on a device
US10897824B2 (en) * 2017-10-30 2021-01-19 Baker Hughes, A Ge Company, Llc Encapsulation of downhole microelectronics and method the same
CN113025960B (zh) * 2021-03-05 2022-07-19 贵州航天林泉电机有限公司 一种Parylene F型气相沉积方法
CN115449772A (zh) * 2022-08-22 2022-12-09 秦皇岛精和智能装备有限公司 一种适用于黑匣子的镀膜防护工艺及其设备

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Also Published As

Publication number Publication date
WO2009151492A3 (en) 2010-03-25
KR20110059563A (ko) 2011-06-02
RU2539694C2 (ru) 2015-01-27
WO2009151492A2 (en) 2009-12-17
RU2010146453A (ru) 2012-05-27
CN102083550A (zh) 2011-06-01
AU2009258264A1 (en) 2009-12-17
CN102083550B (zh) 2015-11-25
EP2328692A2 (en) 2011-06-08
CA2724602A1 (en) 2009-12-17
CN105400269A (zh) 2016-03-16

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Legal Events

Date Code Title Description
NB Applications allowed - extensions of time section 223(2)

Free format text: THE TIME IN WHICH TO ENTER NATIONAL PHASE HAS BEEN EXTENDED TO 16 FEB 2011.

PC1 Assignment before grant (sect. 113)

Owner name: HZO, INC.

Free format text: FORMER APPLICANT(S): NORTHEAST MARITIME INSTITUTE, INC.

FGA Letters patent sealed or granted (standard patent)
MK14 Patent ceased section 143(a) (annual fees not paid) or expired