WO2009151492A3 - Metal and electronic device coating process for marine use and other environments - Google Patents

Metal and electronic device coating process for marine use and other environments Download PDF

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Publication number
WO2009151492A3
WO2009151492A3 PCT/US2009/001410 US2009001410W WO2009151492A3 WO 2009151492 A3 WO2009151492 A3 WO 2009151492A3 US 2009001410 W US2009001410 W US 2009001410W WO 2009151492 A3 WO2009151492 A3 WO 2009151492A3
Authority
WO
WIPO (PCT)
Prior art keywords
environments
metal
electronic device
compositions
coating process
Prior art date
Application number
PCT/US2009/001410
Other languages
French (fr)
Other versions
WO2009151492A2 (en
Inventor
Sidney Edward Martin
Eric Roger Dawicki
Angela Michele Dawicki
Original Assignee
Northeast Maritime Institute, Inc.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US12/104,080 external-priority patent/US20090263581A1/en
Priority claimed from US12/104,152 external-priority patent/US20090263641A1/en
Application filed by Northeast Maritime Institute, Inc. filed Critical Northeast Maritime Institute, Inc.
Priority to US12/988,103 priority Critical patent/US20110262740A1/en
Priority to CN200980122498.6A priority patent/CN102083550B/en
Priority to AU2009258264A priority patent/AU2009258264B2/en
Priority to CA2724602A priority patent/CA2724602A1/en
Priority to RU2010146453/04A priority patent/RU2539694C2/en
Priority to EP09762789A priority patent/EP2328692A2/en
Publication of WO2009151492A2 publication Critical patent/WO2009151492A2/en
Publication of WO2009151492A3 publication Critical patent/WO2009151492A3/en

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D1/00—Processes for applying liquids or other fluent materials
    • B05D1/60—Deposition of organic layers from vapour phase
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D165/00—Coating compositions based on macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Coating compositions based on derivatives of such polymers
    • C09D165/04—Polyxylylenes
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
    • C09D5/16—Antifouling paints; Underwater paints
    • C09D5/1656—Antifouling paints; Underwater paints characterised by the film-forming substance
    • C09D5/1662—Synthetic film-forming substance
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/60—Additives non-macromolecular
    • C09D7/61—Additives non-macromolecular inorganic
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
    • C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
    • C09D7/40—Additives
    • C09D7/66—Additives characterised by particle size
    • C09D7/69—Particle size larger than 1000 nm
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/285—Permanent coating compositions
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D2601/00—Inorganic fillers
    • B05D2601/20—Inorganic fillers used for non-pigmentation effect
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D—PROCESSES FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
    • B05D3/00—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials
    • B05D3/14—Pretreatment of surfaces to which liquids or other fluent materials are to be applied; After-treatment of applied coatings, e.g. intermediate treating of an applied coating preparatory to subsequent applications of liquids or other fluent materials by electrical means
    • B05D3/141—Plasma treatment
    • B05D3/142—Pretreatment
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/18—Oxygen-containing compounds, e.g. metal carbonyls
    • C08K3/20—Oxides; Hydroxides
    • C08K3/22—Oxides; Hydroxides of metals
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/28—Nitrogen-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
    • C08K3/00—Use of inorganic substances as compounding ingredients
    • C08K3/38—Boron-containing compounds
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L65/00—Compositions of macromolecular compounds obtained by reactions forming a carbon-to-carbon link in the main chain; Compositions of derivatives of such polymers
    • C08L65/04—Polyxylenes
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/021—Components thermally connected to metal substrates or heat-sinks by insert mounting
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0137—Materials
    • H05K2201/0179—Thin film deposited insulating layer, e.g. inorganic layer for printed capacitor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0203—Fillers and particles
    • H05K2201/0206—Materials
    • H05K2201/0209—Inorganic, non-metallic particles
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09872—Insulating conformal coating

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Wood Science & Technology (AREA)
  • Organic Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Inorganic Chemistry (AREA)
  • Nanotechnology (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Paints Or Removers (AREA)
  • Compositions Of Macromolecular Compounds (AREA)

Abstract

The present disclosure relates, in part, to Parylene based conformal coating compositions having improved properties, e.g., improved heat transfer and durability characteristics, as well as a methods and apparatus to coat objects with these compositions, and objects coated with these compositions. In some aspects, coating compositions comprising Parylene and boron nitride are disclosed. The disclosure also includes objects (e.g., electronic equipment, textiles, etc.) having a conformal coating comprising a Parylene compound and boron nitride.
PCT/US2009/001410 2007-09-05 2009-03-05 Metal and electronic device coating process for marine use and other environments WO2009151492A2 (en)

Priority Applications (6)

Application Number Priority Date Filing Date Title
US12/988,103 US20110262740A1 (en) 2007-09-05 2009-03-05 Metal and electronic device coating process for marine use and other environments
CN200980122498.6A CN102083550B (en) 2008-04-16 2009-03-05 The metal of peculiar to vessel and other environment and electronic device coating process
AU2009258264A AU2009258264B2 (en) 2008-04-16 2009-03-05 Metal and electronic device coating process for marine use and other environments
CA2724602A CA2724602A1 (en) 2008-04-16 2009-03-05 Metal and electronic device coating process for marine use and other environments
RU2010146453/04A RU2539694C2 (en) 2008-04-16 2009-03-05 Application of coating on metal and electronic device to be applied in sea conditions and other media
EP09762789A EP2328692A2 (en) 2008-04-16 2009-03-05 Metal and electronic device coating process for marine use and other environments

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US12/104,152 2008-04-16
US12/104,080 US20090263581A1 (en) 2008-04-16 2008-04-16 Method and apparatus to coat objects with parylene and boron nitride
US12/104,080 2008-04-16
US12/104,152 US20090263641A1 (en) 2008-04-16 2008-04-16 Method and apparatus to coat objects with parylene

Publications (2)

Publication Number Publication Date
WO2009151492A2 WO2009151492A2 (en) 2009-12-17
WO2009151492A3 true WO2009151492A3 (en) 2010-03-25

Family

ID=41278148

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2009/001410 WO2009151492A2 (en) 2007-09-05 2009-03-05 Metal and electronic device coating process for marine use and other environments

Country Status (7)

Country Link
EP (1) EP2328692A2 (en)
KR (1) KR20110059563A (en)
CN (2) CN102083550B (en)
AU (1) AU2009258264B2 (en)
CA (1) CA2724602A1 (en)
RU (1) RU2539694C2 (en)
WO (1) WO2009151492A2 (en)

Families Citing this family (17)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101138207B1 (en) * 2010-02-10 2012-05-10 주식회사 코아비스 Armature for fuel pump and manufacturing method thereof
DK2659686T3 (en) * 2010-12-28 2017-11-13 Sonova Ag HEARING HOUSE MANUFACTURED WITH POWDER INJECTION FORM / HEARING AID HOUSING MADE BY POWDER INJECTION MOLDING
US8852693B2 (en) 2011-05-19 2014-10-07 Liquipel Ip Llc Coated electronic devices and associated methods
DE102011103737A1 (en) * 2011-05-31 2012-12-06 Heinz Busch Method of coating inner surfaces of elongate objects
US9210933B2 (en) * 2011-07-08 2015-12-15 Specialty Coating Systems, Inc. Antimicrobial parylene coatings and methods of depositing same
JP2013143563A (en) 2012-01-10 2013-07-22 Hzo Inc Systems for assembling electronic devices with internal moisture-resistant coatings
EP2822705B1 (en) * 2012-03-06 2016-09-07 Semblant Limited Coated electrical assembly
EP2828004B1 (en) * 2012-03-23 2019-11-20 hZo, Inc. Apparatuses, systems and methods for applying protective coatings to electronic device assemblies
CN105050734A (en) * 2013-03-15 2015-11-11 Hzo股份有限公司 Combining different types of moisture -resistant materials
US9161434B2 (en) 2013-09-04 2015-10-13 Apple Inc. Methods for shielding electronic components from moisture
CN104947074B (en) * 2014-11-19 2019-07-05 宁波聚膜新材料科技有限公司 A kind of textile surfaces high molecular film method based on chemical vapor deposition
CN106811735B (en) * 2015-12-29 2019-02-05 广东易能纳米科技有限公司 A kind of preparation method of mobile phone nano water-proof film
CN105937024A (en) * 2016-04-20 2016-09-14 叶羽敏 Preparation method and application of electronic product protective coating
US10835978B2 (en) * 2016-07-06 2020-11-17 Hewlett-Packard Development Company, L.P. Logo on a device
US10897824B2 (en) * 2017-10-30 2021-01-19 Baker Hughes, A Ge Company, Llc Encapsulation of downhole microelectronics and method the same
CN113025960B (en) * 2021-03-05 2022-07-19 贵州航天林泉电机有限公司 Parylene F-type vapor deposition method
CN115449772A (en) * 2022-08-22 2022-12-09 秦皇岛精和智能装备有限公司 Coating protection process and equipment suitable for black box

Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3301707A (en) * 1962-12-27 1967-01-31 Union Carbide Corp Thin film resistors and methods of making thereof
US3405117A (en) * 1964-12-24 1968-10-08 Union Carbide Corp alpha-chloro-di-p-xylylenes
US4176209A (en) * 1978-01-09 1979-11-27 Raytheon Corporation Process for forming polymeric paraxylylene coatings and films possessing improved oxidation resistance
WO2000047666A1 (en) * 1999-02-15 2000-08-17 Dsm N.V. Resin composition and cured product
US20030052949A1 (en) * 2001-04-27 2003-03-20 Konica Corporation Ink-jet head and the preparation method thereof, and a coating layer and the preparation method thereof
US20050158454A1 (en) * 2002-04-04 2005-07-21 Dielectric Systems, Inc. Method and system for forming an organic light-emitting device display having a plurality of passive polymer layers
WO2007008607A2 (en) * 2005-07-07 2007-01-18 Specialty Coating Systems, Inc. Nanoscale structures and methods of preparation
JP2007053147A (en) * 2005-08-16 2007-03-01 Sony Corp Organic semiconductor device and its manufacturing method
WO2007025868A1 (en) * 2005-08-27 2007-03-08 Oerlikon Leybold Vacuum Gmbh Coated articles
US20080057260A1 (en) * 2004-04-22 2008-03-06 Dirk Buchhauser Encapsulation For An Organic Electronic Component, Its Production Process And Its Use

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5510138A (en) * 1994-05-24 1996-04-23 Delco Electronics Corporation Hot melt conformal coating materials
US6143647A (en) * 1997-07-24 2000-11-07 Intel Corporation Silicon-rich block copolymers to achieve unbalanced vias
AU5087198A (en) * 1996-10-25 1998-05-22 Specialty Coating Systems, Inc. Process for making a parylene coating
EP1042793A1 (en) * 1997-12-16 2000-10-11 Infineon Technologies AG Barrier layer for copper metallizing
US6888305B2 (en) * 2001-11-06 2005-05-03 Universal Display Corporation Encapsulation structure that acts as a multilayer mirror
RU2317313C2 (en) * 2004-10-28 2008-02-20 Самсунг Электроникс Ко., Лтд Liquid-crystal polymer film preparation process
GB0610432D0 (en) * 2006-05-26 2006-07-05 B G Res Ltd Performance issues in use of vessels for biological applications
KR100914976B1 (en) * 2007-03-30 2009-09-02 주식회사 하이닉스반도체 Method of manufacturing semiconductor device

Patent Citations (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3301707A (en) * 1962-12-27 1967-01-31 Union Carbide Corp Thin film resistors and methods of making thereof
US3405117A (en) * 1964-12-24 1968-10-08 Union Carbide Corp alpha-chloro-di-p-xylylenes
US4176209A (en) * 1978-01-09 1979-11-27 Raytheon Corporation Process for forming polymeric paraxylylene coatings and films possessing improved oxidation resistance
WO2000047666A1 (en) * 1999-02-15 2000-08-17 Dsm N.V. Resin composition and cured product
US20030052949A1 (en) * 2001-04-27 2003-03-20 Konica Corporation Ink-jet head and the preparation method thereof, and a coating layer and the preparation method thereof
US20050158454A1 (en) * 2002-04-04 2005-07-21 Dielectric Systems, Inc. Method and system for forming an organic light-emitting device display having a plurality of passive polymer layers
US20080057260A1 (en) * 2004-04-22 2008-03-06 Dirk Buchhauser Encapsulation For An Organic Electronic Component, Its Production Process And Its Use
WO2007008607A2 (en) * 2005-07-07 2007-01-18 Specialty Coating Systems, Inc. Nanoscale structures and methods of preparation
JP2007053147A (en) * 2005-08-16 2007-03-01 Sony Corp Organic semiconductor device and its manufacturing method
WO2007025868A1 (en) * 2005-08-27 2007-03-08 Oerlikon Leybold Vacuum Gmbh Coated articles

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
DATABASE WPI Week 200735, Derwent World Patents Index; AN 2007-366700, XP002556373 *
SENKEVICH J J: "CVD OF NANOPOROUS SILICA", CHEMICAL VAPOR DEPOSITION, WILEY-VCH VERLAG, WEINHEIM, DE, vol. 5, no. 6, 1 December 1999 (1999-12-01), pages 257 - 260, XP000870653, ISSN: 0948-1907 *

Also Published As

Publication number Publication date
RU2010146453A (en) 2012-05-27
KR20110059563A (en) 2011-06-02
AU2009258264B2 (en) 2014-06-05
WO2009151492A2 (en) 2009-12-17
CN102083550A (en) 2011-06-01
CN102083550B (en) 2015-11-25
RU2539694C2 (en) 2015-01-27
AU2009258264A1 (en) 2009-12-17
CA2724602A1 (en) 2009-12-17
CN105400269A (en) 2016-03-16
EP2328692A2 (en) 2011-06-08

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