AU2003263597A1 - Soldering filler metal, assembly method for semiconductor device using same, and semiconductor device - Google Patents
Soldering filler metal, assembly method for semiconductor device using same, and semiconductor deviceInfo
- Publication number
- AU2003263597A1 AU2003263597A1 AU2003263597A AU2003263597A AU2003263597A1 AU 2003263597 A1 AU2003263597 A1 AU 2003263597A1 AU 2003263597 A AU2003263597 A AU 2003263597A AU 2003263597 A AU2003263597 A AU 2003263597A AU 2003263597 A1 AU2003263597 A1 AU 2003263597A1
- Authority
- AU
- Australia
- Prior art keywords
- semiconductor device
- same
- assembly method
- filler metal
- soldering filler
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C22—METALLURGY; FERROUS OR NON-FERROUS ALLOYS; TREATMENT OF ALLOYS OR NON-FERROUS METALS
- C22C—ALLOYS
- C22C13/00—Alloys based on tin
- C22C13/02—Alloys based on tin with antimony or bismuth as the next major constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/02—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape
- B23K35/0222—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by mechanical features, e.g. shape for use in soldering, brazing
- B23K35/0227—Rods, wires
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
- B23K2101/40—Semiconductor devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
- H01L2224/29001—Core members of the layer connector
- H01L2224/29099—Material
- H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
- H01L2224/29298—Fillers
- H01L2224/29299—Base material
- H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
- H01L2224/29301—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof the principal constituent melting at a temperature of less than 400°C
- H01L2224/29311—Tin [Sn] as principal constituent
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/00013—Fully indexed content
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01015—Phosphorus [P]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01051—Antimony [Sb]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01052—Tellurium [Te]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01327—Intermediate phases, i.e. intermetallics compounds
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-273598 | 2002-09-19 | ||
JP2002273598A JP4147875B2 (ja) | 2002-09-19 | 2002-09-19 | ろう材、これを用いた半導体装置の組み立て方法並びに半導体装置 |
PCT/JP2003/011730 WO2004026527A1 (en) | 2002-09-19 | 2003-09-12 | Soldering filler metal, assembly method for semiconductor device using same, and semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003263597A1 true AU2003263597A1 (en) | 2004-04-08 |
Family
ID=32024961
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003263597A Abandoned AU2003263597A1 (en) | 2002-09-19 | 2003-09-12 | Soldering filler metal, assembly method for semiconductor device using same, and semiconductor device |
Country Status (7)
Country | Link |
---|---|
EP (1) | EP2099580A1 (ja) |
JP (1) | JP4147875B2 (ja) |
KR (1) | KR100595037B1 (ja) |
CN (1) | CN100404193C (ja) |
AU (1) | AU2003263597A1 (ja) |
TW (1) | TWI231238B (ja) |
WO (1) | WO2004026527A1 (ja) |
Families Citing this family (10)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101239425A (zh) * | 2008-03-13 | 2008-08-13 | 浙江省冶金研究院有限公司 | 一种无铅高温电子钎料及制备方法 |
WO2012077228A1 (ja) * | 2010-12-10 | 2012-06-14 | 三菱電機株式会社 | 無鉛はんだ合金、半導体装置、および半導体装置の製造方法 |
JP5878290B2 (ja) * | 2010-12-14 | 2016-03-08 | 株式会社日本スペリア社 | 鉛フリーはんだ合金 |
JP5635561B2 (ja) * | 2012-06-21 | 2014-12-03 | 株式会社タムラ製作所 | はんだ組成物 |
JP5938390B2 (ja) * | 2012-12-25 | 2016-06-22 | 三菱マテリアル株式会社 | パワーモジュール |
CN106271181A (zh) * | 2015-05-13 | 2017-01-04 | 广西民族大学 | 一种Sn-Sb-X系高温抗氧化无铅钎料 |
CN105750757A (zh) * | 2016-03-22 | 2016-07-13 | 苏州虎伏新材料科技有限公司 | 一种用于堆焊以获得锡基巴氏合金耐磨层的焊接材料 |
JP6355091B1 (ja) * | 2017-03-07 | 2018-07-11 | パナソニックIpマネジメント株式会社 | はんだ合金およびそれを用いた接合構造体 |
JP6355092B1 (ja) | 2017-05-11 | 2018-07-11 | パナソニックIpマネジメント株式会社 | はんだ合金およびそれを用いた接合構造体 |
JP6998557B2 (ja) * | 2017-09-29 | 2022-01-18 | パナソニックIpマネジメント株式会社 | はんだ合金およびそれを用いた接合構造体 |
Family Cites Families (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US2059019A (en) * | 1936-02-20 | 1936-10-27 | Cleveland Graphite Bronze Co | Bearing alloy |
GB2181009B (en) * | 1985-09-23 | 1989-11-29 | Fluke Mfg Co John | Apparatus and method for providing improved resistive ratio stability of a resistive divider network |
JPH0825051B2 (ja) * | 1992-06-22 | 1996-03-13 | 株式会社日本スペリア社 | はんだ合金 |
US5851482A (en) * | 1996-03-22 | 1998-12-22 | Korea Institute Of Machinery & Metals | Tin-bismuth based lead-free solder for copper and copper alloys |
US5837191A (en) * | 1996-10-22 | 1998-11-17 | Johnson Manufacturing Company | Lead-free solder |
US5833921A (en) * | 1997-09-26 | 1998-11-10 | Ford Motor Company | Lead-free, low-temperature solder compositions |
JP2001191196A (ja) * | 1999-10-29 | 2001-07-17 | Topy Ind Ltd | ぬれ性、熱サイクル特性及び耐酸化性に優れたSn基Pbフリー半田 |
DE10145389C2 (de) * | 2001-09-14 | 2003-07-24 | Forschungsvereinigung Antriebs | Gleitlagerlegierung auf Sn-Basis |
-
2002
- 2002-09-19 JP JP2002273598A patent/JP4147875B2/ja not_active Expired - Fee Related
-
2003
- 2003-09-12 AU AU2003263597A patent/AU2003263597A1/en not_active Abandoned
- 2003-09-12 CN CNB038219441A patent/CN100404193C/zh not_active Expired - Fee Related
- 2003-09-12 KR KR1020057004774A patent/KR100595037B1/ko not_active IP Right Cessation
- 2003-09-12 EP EP03797594A patent/EP2099580A1/en not_active Withdrawn
- 2003-09-12 WO PCT/JP2003/011730 patent/WO2004026527A1/en active IP Right Grant
- 2003-09-15 TW TW092125309A patent/TWI231238B/zh not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR20050057490A (ko) | 2005-06-16 |
CN1681620A (zh) | 2005-10-12 |
TWI231238B (en) | 2005-04-21 |
EP2099580A1 (en) | 2009-09-16 |
WO2004026527A1 (en) | 2004-04-01 |
TW200406278A (en) | 2004-05-01 |
JP4147875B2 (ja) | 2008-09-10 |
CN100404193C (zh) | 2008-07-23 |
JP2004106027A (ja) | 2004-04-08 |
KR100595037B1 (ko) | 2006-06-30 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |