AU2003236212A1 - System for aligning wafers and for reading micro bar-codes and marks on chips using laser - Google Patents

System for aligning wafers and for reading micro bar-codes and marks on chips using laser

Info

Publication number
AU2003236212A1
AU2003236212A1 AU2003236212A AU2003236212A AU2003236212A1 AU 2003236212 A1 AU2003236212 A1 AU 2003236212A1 AU 2003236212 A AU2003236212 A AU 2003236212A AU 2003236212 A AU2003236212 A AU 2003236212A AU 2003236212 A1 AU2003236212 A1 AU 2003236212A1
Authority
AU
Australia
Prior art keywords
marks
codes
chips
laser
micro bar
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003236212A
Other languages
English (en)
Inventor
Xavier Enrich Sard
Manuel Lozano Fantoba
Carles Perello Garcia
Joaquin Santander Vallejo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Consejo Superior de Investigaciones Cientificas CSIC
Original Assignee
Consejo Superior de Investigaciones Cientificas CSIC
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Consejo Superior de Investigaciones Cientificas CSIC filed Critical Consejo Superior de Investigaciones Cientificas CSIC
Publication of AU2003236212A1 publication Critical patent/AU2003236212A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
    • H01L2223/544—Marks applied to semiconductor devices or parts
    • H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
AU2003236212A 2002-05-16 2003-05-09 System for aligning wafers and for reading micro bar-codes and marks on chips using laser Abandoned AU2003236212A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
ES200201114A ES2195786B1 (es) 2002-05-16 2002-05-16 Sistema de alineamiento de obleas y de lectura de microcodigos de barras y de marcas en chips con laser.
ESP200201114 2002-05-16
PCT/ES2003/000207 WO2003098683A1 (fr) 2002-05-16 2003-05-09 Systeme d'alignement de tranches et de lecture de micro-codes barres et de marques dans des puces laser

Publications (1)

Publication Number Publication Date
AU2003236212A1 true AU2003236212A1 (en) 2003-12-02

Family

ID=29433277

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003236212A Abandoned AU2003236212A1 (en) 2002-05-16 2003-05-09 System for aligning wafers and for reading micro bar-codes and marks on chips using laser

Country Status (3)

Country Link
AU (1) AU2003236212A1 (fr)
ES (1) ES2195786B1 (fr)
WO (1) WO2003098683A1 (fr)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101812209B1 (ko) * 2016-02-16 2017-12-26 주식회사 이오테크닉스 레이저 마킹 장치 및 레이저 마킹 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0243520B1 (fr) * 1986-04-29 1991-11-27 Ibm Deutschland Gmbh Alignement masque-substrat interférométrique
JPH0715927B2 (ja) * 1987-10-30 1995-02-22 東京エレクトロン株式会社 プローブ装置
US5733711A (en) * 1996-01-02 1998-03-31 Micron Technology, Inc. Process for forming both fixed and variable patterns on a single photoresist resin mask
US5705320A (en) * 1996-11-12 1998-01-06 Taiwan Semiconductor Manufacturing Company, Ltd. Recovery of alignment marks and laser marks after chemical-mechanical-polishing
JPH11135390A (ja) * 1997-10-27 1999-05-21 Sony Corp Ｉｄが印字されているウェーハ、半導体デバイスの製造方法および半導体デバイスの製造装置
JP2002246446A (ja) * 2001-02-20 2002-08-30 Assist Japan Kk ウェハアライメント装置

Also Published As

Publication number Publication date
ES2195786A1 (es) 2003-12-01
ES2195786B1 (es) 2005-03-16
WO2003098683A1 (fr) 2003-11-27

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase