AU2003236286A1 - Position detection mark, mark identification method, position detection method, exposure method, and position information detection method - Google Patents
Position detection mark, mark identification method, position detection method, exposure method, and position information detection methodInfo
- Publication number
- AU2003236286A1 AU2003236286A1 AU2003236286A AU2003236286A AU2003236286A1 AU 2003236286 A1 AU2003236286 A1 AU 2003236286A1 AU 2003236286 A AU2003236286 A AU 2003236286A AU 2003236286 A AU2003236286 A AU 2003236286A AU 2003236286 A1 AU2003236286 A1 AU 2003236286A1
- Authority
- AU
- Australia
- Prior art keywords
- mark
- position detection
- detection
- detection method
- exposure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/70—Microphotolithographic exposure; Apparatus therefor
- G03F7/70483—Information management; Active and passive control; Testing; Wafer monitoring, e.g. pattern monitoring
- G03F7/70491—Information management, e.g. software; Active and passive control, e.g. details of controlling exposure processes or exposure tool monitoring processes
- G03F7/70541—Tagging, i.e. hardware or software tagging of features or components, e.g. using tagging scripts or tagging identifier codes for identification of chips, shots or wafers
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7003—Alignment type or strategy, e.g. leveling, global alignment
- G03F9/7046—Strategy, e.g. mark, sensor or wavelength selection
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7076—Mark details, e.g. phase grating mark, temporary mark
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F9/00—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically
- G03F9/70—Registration or positioning of originals, masks, frames, photographic sheets or textured or patterned surfaces, e.g. automatically for microlithography
- G03F9/7073—Alignment marks and their environment
- G03F9/7084—Position of mark on substrate, i.e. position in (x, y, z) of mark, e.g. buried or resist covered mark, mark on rearside, at the substrate edge, in the circuit area, latent image mark, marks in plural levels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/544—Marks applied to semiconductor devices or parts, e.g. registration marks, alignment structures, wafer maps
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/5442—Marks applied to semiconductor devices or parts comprising non digital, non alphanumeric information, e.g. symbols
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2223/00—Details relating to semiconductor or other solid state devices covered by the group H01L23/00
- H01L2223/544—Marks applied to semiconductor devices or parts
- H01L2223/54453—Marks applied to semiconductor devices or parts for use prior to dicing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2002-95562 | 2002-03-29 | ||
JP2002095562 | 2002-03-29 | ||
JP2002242457 | 2002-08-22 | ||
JP2002-242457 | 2002-08-22 | ||
PCT/JP2003/004019 WO2003083914A1 (en) | 2002-03-29 | 2003-03-28 | Position detection mark, mark identification method, position detection method, exposure method, and position information detection method |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2003236286A1 true AU2003236286A1 (en) | 2003-10-13 |
Family
ID=28677581
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2003236286A Abandoned AU2003236286A1 (en) | 2002-03-29 | 2003-03-28 | Position detection mark, mark identification method, position detection method, exposure method, and position information detection method |
Country Status (4)
Country | Link |
---|---|
JP (1) | JP4400214B2 (en) |
KR (1) | KR20040104960A (en) |
AU (1) | AU2003236286A1 (en) |
WO (1) | WO2003083914A1 (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2008053618A (en) * | 2006-08-28 | 2008-03-06 | Canon Inc | Exposure apparatus and method therefor, as well as device manufacturing method using exposure apparatus |
KR100818408B1 (en) * | 2006-12-26 | 2008-04-01 | 동부일렉트로닉스 주식회사 | Alignment key for exposure process |
JP4871335B2 (en) * | 2008-09-18 | 2012-02-08 | Nskテクノロジー株式会社 | Exposure equipment |
JP5538048B2 (en) * | 2010-04-22 | 2014-07-02 | 日東電工株式会社 | Alignment mark detection method and printed circuit board manufacturing method |
NL2009079A (en) * | 2011-08-23 | 2013-02-27 | Asml Netherlands Bv | Metrology method and apparatus, and device manufacturing method. |
JP5793457B2 (en) * | 2012-03-26 | 2015-10-14 | 株式会社Screenホールディングス | Transfer method and transfer apparatus |
TW202413882A (en) * | 2022-06-09 | 2024-04-01 | 美商應用材料股份有限公司 | Automated metrology method for large devices |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH05217843A (en) * | 1992-01-27 | 1993-08-27 | Nec Corp | Stepper |
JPH0815854A (en) * | 1994-06-30 | 1996-01-19 | Fujitsu Ltd | Production of semiconductor device |
JP2001274058A (en) * | 2000-03-24 | 2001-10-05 | Nikon Corp | Mark detecting method, exposure method and aligner |
-
2003
- 2003-03-28 WO PCT/JP2003/004019 patent/WO2003083914A1/en active Application Filing
- 2003-03-28 KR KR10-2004-7015219A patent/KR20040104960A/en not_active Application Discontinuation
- 2003-03-28 AU AU2003236286A patent/AU2003236286A1/en not_active Abandoned
- 2003-03-28 JP JP2003581241A patent/JP4400214B2/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
JPWO2003083914A1 (en) | 2005-08-04 |
KR20040104960A (en) | 2004-12-13 |
JP4400214B2 (en) | 2010-01-20 |
WO2003083914A1 (en) | 2003-10-09 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |