AU2003210922A1 - Abrasive articles and methods for the manufacture and use of same - Google Patents

Abrasive articles and methods for the manufacture and use of same

Info

Publication number
AU2003210922A1
AU2003210922A1 AU2003210922A AU2003210922A AU2003210922A1 AU 2003210922 A1 AU2003210922 A1 AU 2003210922A1 AU 2003210922 A AU2003210922 A AU 2003210922A AU 2003210922 A AU2003210922 A AU 2003210922A AU 2003210922 A1 AU2003210922 A1 AU 2003210922A1
Authority
AU
Australia
Prior art keywords
abrasive
abrasive article
article
performance
performance index
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2003210922A
Other languages
English (en)
Inventor
Gary M. Palmgren
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
3M Innovative Properties Co
Original Assignee
3M Innovative Properties Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 3M Innovative Properties Co filed Critical 3M Innovative Properties Co
Publication of AU2003210922A1 publication Critical patent/AU2003210922A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D11/00—Constructional features of flexible abrasive materials; Special features in the manufacture of such materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B7/00—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor
    • B24B7/20—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground
    • B24B7/22—Machines or devices designed for grinding plane surfaces on work, including polishing plane glass surfaces; Accessories therefor characterised by a special design with respect to properties of the material of non-metallic articles to be ground for grinding inorganic material, e.g. stone, ceramics, porcelain
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B21/00—Machines or devices using grinding or polishing belts; Accessories therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Ceramic Engineering (AREA)
  • Inorganic Chemistry (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
  • Grinding And Polishing Of Tertiary Curved Surfaces And Surfaces With Complex Shapes (AREA)
AU2003210922A 2002-04-03 2003-02-07 Abrasive articles and methods for the manufacture and use of same Abandoned AU2003210922A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US10/115,538 US7160173B2 (en) 2002-04-03 2002-04-03 Abrasive articles and methods for the manufacture and use of same
US10/115,538 2002-04-03
PCT/US2003/003775 WO2003085595A1 (en) 2002-04-03 2003-02-07 Abrasive articles and methods for the manufacture and use of same

Publications (1)

Publication Number Publication Date
AU2003210922A1 true AU2003210922A1 (en) 2003-10-20

Family

ID=28673794

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2003210922A Abandoned AU2003210922A1 (en) 2002-04-03 2003-02-07 Abrasive articles and methods for the manufacture and use of same

Country Status (11)

Country Link
US (2) US7160173B2 (enExample)
EP (1) EP1490830B1 (enExample)
JP (1) JP2005521565A (enExample)
KR (1) KR100971567B1 (enExample)
CN (1) CN100577357C (enExample)
AT (1) ATE324639T1 (enExample)
AU (1) AU2003210922A1 (enExample)
DE (1) DE60304849T2 (enExample)
MY (1) MY141485A (enExample)
TW (1) TWI277485B (enExample)
WO (1) WO2003085595A1 (enExample)

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US7758403B2 (en) * 2007-11-16 2010-07-20 Hitachi Global Storage Technologies Netherlands B.V. System, method and apparatus for lapping workpieces with soluble abrasives
JP5415735B2 (ja) * 2008-09-26 2014-02-12 株式会社荏原製作所 ドレッシング方法、ドレッシング条件の決定方法、ドレッシング条件決定プログラム、および研磨装置
KR20120030048A (ko) * 2009-04-17 2012-03-27 쓰리엠 이노베이티브 프로퍼티즈 컴파니 금속 입자 전달 용품, 금속 개질된 기판 및 이의 제조 및 이용 방법
US8236163B2 (en) * 2009-09-18 2012-08-07 United Technologies Corporation Anode media for use in electroplating processes, and methods of cleaning thereof
JP5671554B2 (ja) * 2009-12-30 2015-02-18 スリーエム イノベイティブ プロパティズ カンパニー 有機微粒子装填研磨パッド、並びにその製造及び使用方法
US9205530B2 (en) 2010-07-07 2015-12-08 Seagate Technology Llc Lapping a workpiece
EP2651651B1 (en) * 2010-12-17 2019-01-23 3M Innovative Properties Company Transfer article having multi-sized particles and methods
PL2665583T3 (pl) * 2011-01-22 2017-01-31 Rud. Starcke Gmbh & Co. Kg Korpus ścierny
DE102011103815A1 (de) * 2011-06-01 2012-12-06 Rud. Starcke Gmbh & Co. Kg Schleifkörper
US9440205B1 (en) * 2012-08-24 2016-09-13 E. & J. Gallo Winery System and method for micro dosing
CN103341889A (zh) * 2013-06-26 2013-10-09 上海点派企业形象策划有限公司 切削抛光有机玻璃的金刚石刀具的模型及其应用
TWI546158B (zh) * 2013-12-20 2016-08-21 中國砂輪企業股份有限公司 低磁性化學機械研磨修整器
SG10201600301SA (en) * 2016-01-14 2017-08-30 3M Innovative Properties Co CMP Pad Conditioner, Pad Conditioning System And Method
CN105669032A (zh) * 2016-01-20 2016-06-15 广西丛欣实业有限公司 耐热玻璃
CN106336814A (zh) * 2016-08-27 2017-01-18 宁波市鄞州伴佰精密机械有限公司 不锈钢零件防嵌粒抛光液的制备方法
CN106349949A (zh) * 2016-08-27 2017-01-25 宁波市鄞州伴佰精密机械有限公司 一种用于不锈钢零件的抛光液的制备方法
JP6732381B2 (ja) * 2016-10-03 2020-07-29 株式会社ディスコ 切削装置
JP6517873B2 (ja) * 2017-05-17 2019-05-22 ファナック株式会社 鏡面加工方法および鏡面加工用工具の製造方法
FI131501B1 (en) * 2023-11-23 2025-05-26 Mirka Ltd Grinding process control

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US3656265A (en) * 1969-10-14 1972-04-18 Schaffner Mfg Co Inc Method of making an abrasive belt
CS206626B1 (en) 1978-02-23 1981-06-30 Miroslav Mirsch Method of adaptive control of necking-down cycle on grinding machine and device for execution of the said cycle
US4351029A (en) 1979-12-05 1982-09-21 Westinghouse Electric Corp. Tool life monitoring and tracking apparatus
US4535571A (en) * 1981-03-30 1985-08-20 Energy-Adaptive Grinding, Inc. Grinding control methods and apparatus
JPS57194876A (en) * 1981-05-21 1982-11-30 Seiko Seiki Co Ltd Controlling method of grinding machine
US4590573A (en) 1982-09-17 1986-05-20 Robert Hahn Computer-controlled grinding machine
DE3518902C2 (de) 1985-05-25 1994-06-09 Schaudt Maschinenbau Gmbh Vorrichtung zur Identifikation von Schleifscheiben
ATE70708T1 (de) * 1987-07-24 1992-01-15 Siemens Ag Einrichtung fuer in zahnaerztliche behandlungsinstrumente einsetzbare werkzeuge.
US5177901A (en) 1988-11-15 1993-01-12 Smith Roderick L Predictive high wheel speed grinding system
US5012989A (en) 1989-11-24 1991-05-07 Eastman Kodak Company Apparatus and method for tape velocity and tension control in a capstanless magnetic tape transport
GB2241911B (en) 1990-03-14 1993-11-17 Norville Optical Co Ltd Ophthalmic lens manufacture
US5152917B1 (en) 1991-02-06 1998-01-13 Minnesota Mining & Mfg Structured abrasive article
DE4111016C1 (en) 1991-04-05 1992-07-16 Herminghausen-Werke Gmbh, 6052 Muehlheim, De Grinding machine setter matching monitored tool condition - uses data store for condition parameter in form of magnetisable or optically writable code carrier directly mountable on regulating or grinding wheel
US5344688A (en) * 1992-08-19 1994-09-06 Minnesota Mining And Manufacturing Company Coated abrasive article and a method of making same
DE69401915T2 (de) 1993-01-12 1997-10-09 Minnesota Mining & Mfg Spurservoregelungsverfahren fur datenkassettenbandantrieb
US5441549A (en) * 1993-04-19 1995-08-15 Minnesota Mining And Manufacturing Company Abrasive articles comprising a grinding aid dispersed in a polymeric blend binder
DE4318102A1 (de) * 1993-06-01 1994-12-08 Zahnradfabrik Friedrichshafen Verfahren zur Vermeidung von Überbeanspruchungen eines Werkstückes beim Schleifen
CZ144294A3 (en) 1993-06-14 1994-12-15 Stiefenhofer Gmbh C Method of controlling movement of material during its treatment by sterilization and apparatus for making the same
US5508596A (en) 1993-10-07 1996-04-16 Omax Corporation Motion control with precomputation
US5514028A (en) 1994-01-07 1996-05-07 Ali; Christopher A. Single sheet sandpaper delivery system and sandpaper sheet therefor
US5452150A (en) 1994-06-27 1995-09-19 Minnesota Mining And Manufacturing Company Data cartridge with magnetic tape markers
US5643044A (en) 1994-11-01 1997-07-01 Lund; Douglas E. Automatic chemical and mechanical polishing system for semiconductor wafers
US5897424A (en) 1995-07-10 1999-04-27 The United States Of America As Represented By The Secretary Of Commerce Renewable polishing lap
US5609718A (en) * 1995-09-29 1997-03-11 Micron Technology, Inc. Method and apparatus for measuring a change in the thickness of polishing pads used in chemical-mechanical planarization of semiconductor wafers
US5738574A (en) * 1995-10-27 1998-04-14 Applied Materials, Inc. Continuous processing system for chemical mechanical polishing
US5725421A (en) * 1996-02-27 1998-03-10 Minnesota Mining And Manufacturing Company Apparatus for rotative abrading applications
US5653044A (en) * 1996-03-22 1997-08-05 California Pellet Mill Company Horizontal cooler and dryer with solid pans
US5833519A (en) * 1996-08-06 1998-11-10 Micron Technology, Inc. Method and apparatus for mechanical polishing
US6475253B2 (en) * 1996-09-11 2002-11-05 3M Innovative Properties Company Abrasive article and method of making
US5908283A (en) * 1996-11-26 1999-06-01 United Parcel Service Of Americia, Inc. Method and apparatus for palletizing packages of random size and weight
DE19722121A1 (de) * 1997-05-27 1998-12-03 Wendt Gmbh Vorrichtung zur Kennzeichnung und automatischen Identifikation und Klassifikation von Werkzeugen
US6146248A (en) 1997-05-28 2000-11-14 Lam Research Corporation Method and apparatus for in-situ end-point detection and optimization of a chemical-mechanical polishing process using a linear polisher
TW374050B (en) 1997-10-31 1999-11-11 Applied Materials Inc Method and apparatus for modeling substrate reflectivity during chemical mechanical polishing
US6123612A (en) 1998-04-15 2000-09-26 3M Innovative Properties Company Corrosion resistant abrasive article and method of making
US6000997A (en) * 1998-07-10 1999-12-14 Aplex, Inc. Temperature regulation in a CMP process
US6428407B1 (en) * 1998-09-03 2002-08-06 James Tait Elder Coated abrasive tool and construction method
US6206759B1 (en) * 1998-11-30 2001-03-27 Micron Technology, Inc. Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines
DE19915909C2 (de) 1998-12-11 2003-05-28 Steinemann Technology Ag St Ga Verfahren zur Steuerung des Schleifprozesses sowie Rechnersteuerung für Breitschleifmaschine
US6322427B1 (en) * 1999-04-30 2001-11-27 Applied Materials, Inc. Conditioning fixed abrasive articles
US6264533B1 (en) * 1999-05-28 2001-07-24 3M Innovative Properties Company Abrasive processing apparatus and method employing encoded abrasive product
TW466153B (en) 1999-06-22 2001-12-01 Applied Materials Inc Method and apparatus for measuring a pad profile and closed loop control of a pad conditioning process
US6293139B1 (en) * 1999-11-03 2001-09-25 Memc Electronic Materials, Inc. Method of determining performance characteristics of polishing pads
JP4387010B2 (ja) 1999-11-10 2009-12-16 株式会社ディスコ 切削装置
US6280288B1 (en) * 2000-02-04 2001-08-28 Norton Company Process for determining optimum grinding conditions
US6896583B2 (en) 2001-02-06 2005-05-24 Agere Systems, Inc. Method and apparatus for conditioning a polishing pad
US6612917B2 (en) * 2001-02-07 2003-09-02 3M Innovative Properties Company Abrasive article suitable for modifying a semiconductor wafer
DE60121292T2 (de) * 2001-04-02 2007-07-05 Infineon Technologies Ag Verfahren zur Konditionierung der Oberfläche eines Polierkissens
US6564116B2 (en) * 2001-04-06 2003-05-13 Gou-Jen Wang Method for determining efficiently parameters in chemical-mechanical polishing (CMP)

Also Published As

Publication number Publication date
HK1073516A1 (en) 2005-10-07
KR20040097263A (ko) 2004-11-17
CN1647103A (zh) 2005-07-27
JP2005521565A (ja) 2005-07-21
TWI277485B (en) 2007-04-01
MY141485A (en) 2010-04-30
EP1490830A1 (en) 2004-12-29
WO2003085595A1 (en) 2003-10-16
US20070084131A1 (en) 2007-04-19
KR100971567B1 (ko) 2010-07-20
EP1490830B1 (en) 2006-04-26
DE60304849D1 (de) 2006-06-01
TW200405842A (en) 2004-04-16
ATE324639T1 (de) 2006-05-15
US20030190868A1 (en) 2003-10-09
DE60304849T2 (de) 2006-11-23
US7160173B2 (en) 2007-01-09
CN100577357C (zh) 2010-01-06

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Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase