AU2002346528A1 - Semiconductor component handling device having a performance film - Google Patents

Semiconductor component handling device having a performance film

Info

Publication number
AU2002346528A1
AU2002346528A1 AU2002346528A AU2002346528A AU2002346528A1 AU 2002346528 A1 AU2002346528 A1 AU 2002346528A1 AU 2002346528 A AU2002346528 A AU 2002346528A AU 2002346528 A AU2002346528 A AU 2002346528A AU 2002346528 A1 AU2002346528 A1 AU 2002346528A1
Authority
AU
Australia
Prior art keywords
handling device
semiconductor component
component handling
performance film
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002346528A
Other versions
AU2002346528A8 (en
Inventor
Sanjiv M. Bhatt
Shawn D. Eggum
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of AU2002346528A8 publication Critical patent/AU2002346528A8/en
Publication of AU2002346528A1 publication Critical patent/AU2002346528A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H01L21/67323—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H01L21/6733—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
AU2002346528A 2001-11-27 2002-11-26 Semiconductor component handling device having a performance film Abandoned AU2002346528A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US33368901P 2001-11-27 2001-11-27
US60/333,689 2001-11-27
PCT/US2002/037860 WO2003046950A2 (en) 2001-11-27 2002-11-26 Semiconductor component handling device having a performance film

Publications (2)

Publication Number Publication Date
AU2002346528A8 AU2002346528A8 (en) 2003-06-10
AU2002346528A1 true AU2002346528A1 (en) 2003-06-10

Family

ID=23303851

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002346528A Abandoned AU2002346528A1 (en) 2001-11-27 2002-11-26 Semiconductor component handling device having a performance film

Country Status (8)

Country Link
US (1) US20050236110A1 (en)
EP (1) EP1567034A4 (en)
JP (1) JP2005521236A (en)
KR (1) KR20040062643A (en)
CN (1) CN1636275A (en)
AU (1) AU2002346528A1 (en)
TW (1) TW200300996A (en)
WO (1) WO2003046950A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU2002352956A1 (en) * 2001-11-27 2003-06-10 Entegris, Inc Semiconductor component handling device having an electrostatic dissipating film
JP5305113B2 (en) 2010-05-11 2013-10-02 サムソン エレクトロ−メカニックス カンパニーリミテッド． Electronic device case in which antenna pattern for low frequency is embedded, manufacturing mold and manufacturing method thereof
EP2386401A1 (en) 2010-05-11 2011-11-16 Samsung Electro-Mechanics Co., Ltd. Case of electronic device having antenna pattern embedde therein, and mold therefor and mthod of manufacturing thereof
EP2386400A1 (en) * 2010-05-11 2011-11-16 Samsung Electro-Mechanics Co., Ltd. Case of electronic device having antenna pattern frame embedded therein, mold therefor and method of manufacturing thereof
US9079714B2 (en) * 2012-07-31 2015-07-14 Shenzhen China Star Optoelectronics Technology Co., Ltd Glass substrate cassette and pick-and-place system for glass substrate
TW201611169A (en) * 2014-08-28 2016-03-16 安堤格里斯公司 Substrate container
TWI645889B (en) 2016-06-01 2019-01-01 恩特葛瑞斯股份有限公司 Conductive filter
WO2019216973A1 (en) 2018-05-07 2019-11-14 Entegris, Inc. Fluid circuit with integrated electrostatic discharge mitigation
EP3929969B1 (en) * 2020-06-22 2023-12-06 Siltronic AG Method for manufacturing a process container for semiconductor workpieces and process container
EP4068343A1 (en) 2021-04-01 2022-10-05 Siltronic AG Device for transporting semiconductor wafers

Family Cites Families (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088294B2 (en) * 1988-05-17 1996-01-29 三井東圧化学株式会社 IC wafer container
US5593916A (en) * 1988-08-12 1997-01-14 Mitsui Toatsu Chemicals, Incorporated Processing of glass substrates using holding container and holding container
JPH044142A (en) * 1990-04-20 1992-01-08 Teijin Ltd Antistatic polyester film
US6039186A (en) * 1997-04-16 2000-03-21 Fluoroware, Inc. Composite transport carrier
US6068137A (en) * 1997-09-16 2000-05-30 Sumitomo Metal Industries, Ltd. Semiconductor wafer carrier
US6428729B1 (en) * 1998-05-28 2002-08-06 Entegris, Inc. Composite substrate carrier
DE29924287U1 (en) * 1998-05-28 2002-08-29 Fluoroware Inc Carrier for disks to be machined, stored and / or transported
US6079565A (en) * 1998-12-28 2000-06-27 Flouroware, Inc. Clipless tray
JP3916342B2 (en) * 1999-04-20 2007-05-16 信越ポリマー株式会社 Substrate storage container
AU2002352956A1 (en) * 2001-11-27 2003-06-10 Entegris, Inc Semiconductor component handling device having an electrostatic dissipating film

Also Published As

Publication number Publication date
JP2005521236A (en) 2005-07-14
KR20040062643A (en) 2004-07-07
US20050236110A1 (en) 2005-10-27
AU2002346528A8 (en) 2003-06-10
CN1636275A (en) 2005-07-06
EP1567034A2 (en) 2005-08-31
TW200300996A (en) 2003-06-16
EP1567034A4 (en) 2007-11-14
WO2003046950A2 (en) 2003-06-05
WO2003046950A3 (en) 2005-06-02

Similar Documents

Publication Publication Date Title
AU2002316979A1 (en) Semiconductor device
AU2002243722A1 (en) Electronic device package
AU2002337834A1 (en) Stacked packages
AU2003277266A1 (en) Semiconductor device package
AU2003247448A1 (en) Stacked microelectronic packages
AU2003291199A1 (en) Package having exposed integrated circuit device
AU2001284456A1 (en) Substrate transporting device
AU2002338003A1 (en) Semiconductor Devices
AU2002330511A1 (en) Semiconductor calculation device
AU2002346528A1 (en) Semiconductor component handling device having a performance film
AUPR690901A0 (en) A jointing device
AU2002352956A1 (en) Semiconductor component handling device having an electrostatic dissipating film
AU2001278818A1 (en) Substrate for manufacturing a semiconductor device with three element alloy
AU2002236421A1 (en) A substrate for a semiconductor device
AU2002301136A1 (en) A Clamp Device
AU2002361152A1 (en) Field device with a gps-module
AU2003237768A1 (en) An integrated circuit package employing a flexible substrate
AU2002366912A1 (en) Vacuum electronic device
AU2001260938A1 (en) A semiconductor device
AU2001228975A1 (en) A semiconductor device
AU2002217744A1 (en) A semiconductor device
AU2002254926A1 (en) Device for holding a substrate
AU2002251912A1 (en) Semiconductor structure and device including a carbon film
AU2002313213A1 (en) Semiconductor device
AU2002318814A1 (en) Semiconductor device

Legal Events

Date Code Title Description
MK6 Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase