AU2002352956A1 - Semiconductor component handling device having an electrostatic dissipating film - Google Patents
Semiconductor component handling device having an electrostatic dissipating filmInfo
- Publication number
- AU2002352956A1 AU2002352956A1 AU2002352956A AU2002352956A AU2002352956A1 AU 2002352956 A1 AU2002352956 A1 AU 2002352956A1 AU 2002352956 A AU2002352956 A AU 2002352956A AU 2002352956 A AU2002352956 A AU 2002352956A AU 2002352956 A1 AU2002352956 A1 AU 2002352956A1
- Authority
- AU
- Australia
- Prior art keywords
- handling device
- semiconductor component
- component handling
- dissipating film
- electrostatic dissipating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000004065 semiconductor Substances 0.000 title 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
- B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
- H01L21/67323—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/68—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts by incorporating or moulding on preformed parts, e.g. inserts or layers, e.g. foam blocks
- B29C70/74—Moulding material on a relatively small portion of the preformed part, e.g. outsert moulding
- B29C70/76—Moulding on edges or extremities of the preformed part
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
- B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
- B29C70/00—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts
- B29C70/88—Shaping composites, i.e. plastics material comprising reinforcements, fillers or preformed parts, e.g. inserts characterised primarily by possessing specific properties, e.g. electrically conductive or locally reinforced
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
- H01L21/6733—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
- H01L21/6735—Closed carriers
- H01L21/67396—Closed carriers characterised by the presence of antistatic elements
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Composite Materials (AREA)
- Packaging Frangible Articles (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Stackable Containers (AREA)
- Containers Having Bodies Formed In One Piece (AREA)
- Packaging For Recording Disks (AREA)
- Details Of Rigid Or Semi-Rigid Containers (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US33368601P | 2001-11-27 | 2001-11-27 | |
US60/333,686 | 2001-11-27 | ||
PCT/US2002/038076 WO2003046952A2 (en) | 2001-11-27 | 2002-11-26 | Semiconductor component handling device having an electrostatic dissipating film |
Publications (2)
Publication Number | Publication Date |
---|---|
AU2002352956A8 AU2002352956A8 (en) | 2003-06-10 |
AU2002352956A1 true AU2002352956A1 (en) | 2003-06-10 |
Family
ID=23303841
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002352956A Abandoned AU2002352956A1 (en) | 2001-11-27 | 2002-11-26 | Semiconductor component handling device having an electrostatic dissipating film |
Country Status (8)
Country | Link |
---|---|
US (1) | US20050056601A1 (en) |
EP (1) | EP1470570A4 (en) |
JP (1) | JP2005510868A (en) |
KR (1) | KR20040062966A (en) |
CN (1) | CN1741885A (en) |
AU (1) | AU2002352956A1 (en) |
TW (1) | TW200301009A (en) |
WO (1) | WO2003046952A2 (en) |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2005521236A (en) * | 2001-11-27 | 2005-07-14 | エンテグリス・インコーポレーテッド | Semiconductor parts handling equipment with performance film |
JP4584023B2 (en) * | 2005-05-17 | 2010-11-17 | 信越ポリマー株式会社 | Substrate storage container and manufacturing method thereof |
US20070154717A1 (en) * | 2005-12-30 | 2007-07-05 | Saint-Gobain Performance Plastics Corporation | Thermally stable composite material |
US20070154716A1 (en) * | 2005-12-30 | 2007-07-05 | Saint-Gobain Performance Plastics Corporation | Composite material |
US20070152195A1 (en) * | 2005-12-30 | 2007-07-05 | Saint-Gobain Performance Plastics Corporation | Electrostatic dissipative composite material |
US7476339B2 (en) * | 2006-08-18 | 2009-01-13 | Saint-Gobain Ceramics & Plastics, Inc. | Highly filled thermoplastic composites |
KR20170100353A (en) * | 2016-02-25 | 2017-09-04 | (주)코스탯아이앤씨 | Tray accommodating semiconductor device and cover therefor |
KR101843982B1 (en) * | 2017-02-22 | 2018-03-30 | 윤세원 | Electronic components magazine and fabricating method thereof |
JP6578033B2 (en) * | 2018-01-29 | 2019-09-18 | ウォン ユン、セ | Manufacturing method of electronic component container |
US10950485B2 (en) | 2019-04-17 | 2021-03-16 | Taiwan Semiconductor Manufacturing Co., Ltd. | Semiconductor processing apparatus and method utilizing electrostatic discharge (ESD) prevention layer |
DE102019125819A1 (en) | 2019-04-17 | 2020-10-22 | Taiwan Semiconductor Manufacturing Co., Ltd. | SEMICONDUCTOR PROCESSING DEVICE AND METHOD USING AN ELECTROSTATIC DISCHARGE (ESD) PREVENTIVE LAYER |
Family Cites Families (9)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH088294B2 (en) * | 1988-05-17 | 1996-01-29 | 三井東圧化学株式会社 | IC wafer container |
US5186338A (en) * | 1991-07-11 | 1993-02-16 | Eastman Kodak Company | Pallet for holding a cassette |
US6010008A (en) * | 1997-07-11 | 2000-01-04 | Fluoroware, Inc. | Transport module |
US6428729B1 (en) * | 1998-05-28 | 2002-08-06 | Entegris, Inc. | Composite substrate carrier |
DE19924182B4 (en) * | 1998-05-28 | 2008-04-17 | Entegris, Inc., Chaska | Carrier for semiconductor wafers to be processed, stored and / or transported |
US6079565A (en) * | 1998-12-28 | 2000-06-27 | Flouroware, Inc. | Clipless tray |
US6248262B1 (en) * | 2000-02-03 | 2001-06-19 | General Electric Company | Carbon-reinforced thermoplastic resin composition and articles made from same |
JP4424524B2 (en) * | 2000-04-12 | 2010-03-03 | Okiセミコンダクタ株式会社 | Chip tray |
JP2005521236A (en) * | 2001-11-27 | 2005-07-14 | エンテグリス・インコーポレーテッド | Semiconductor parts handling equipment with performance film |
-
2002
- 2002-11-26 JP JP2003548279A patent/JP2005510868A/en not_active Withdrawn
- 2002-11-26 US US10/496,679 patent/US20050056601A1/en not_active Abandoned
- 2002-11-26 KR KR10-2004-7007903A patent/KR20040062966A/en not_active Application Discontinuation
- 2002-11-26 WO PCT/US2002/038076 patent/WO2003046952A2/en active Application Filing
- 2002-11-26 EP EP02789916A patent/EP1470570A4/en active Pending
- 2002-11-26 AU AU2002352956A patent/AU2002352956A1/en not_active Abandoned
- 2002-11-26 CN CNA02827606XA patent/CN1741885A/en active Pending
- 2002-11-27 TW TW091134460A patent/TW200301009A/en unknown
Also Published As
Publication number | Publication date |
---|---|
TW200301009A (en) | 2003-06-16 |
US20050056601A1 (en) | 2005-03-17 |
JP2005510868A (en) | 2005-04-21 |
AU2002352956A8 (en) | 2003-06-10 |
CN1741885A (en) | 2006-03-01 |
KR20040062966A (en) | 2004-07-09 |
WO2003046952B1 (en) | 2004-02-26 |
EP1470570A4 (en) | 2007-12-12 |
WO2003046952A2 (en) | 2003-06-05 |
EP1470570A2 (en) | 2004-10-27 |
WO2003046952A3 (en) | 2003-12-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK6 | Application lapsed section 142(2)(f)/reg. 8.3(3) - pct applic. not entering national phase |