EP1567034A4 - Semiconductor component handling device having a performance film - Google Patents

Semiconductor component handling device having a performance film

Info

Publication number
EP1567034A4
EP1567034A4 EP02784595A EP02784595A EP1567034A4 EP 1567034 A4 EP1567034 A4 EP 1567034A4 EP 02784595 A EP02784595 A EP 02784595A EP 02784595 A EP02784595 A EP 02784595A EP 1567034 A4 EP1567034 A4 EP 1567034A4
Authority
EP
European Patent Office
Prior art keywords
handling device
semiconductor component
component handling
performance film
film
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
EP02784595A
Other languages
German (de)
French (fr)
Other versions
EP1567034A2 (en
Inventor
Sanjiv M Bhatt
Shawn D Eggum
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Entegris Inc
Original Assignee
Entegris Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc filed Critical Entegris Inc
Publication of EP1567034A2 publication Critical patent/EP1567034A2/en
Publication of EP1567034A4 publication Critical patent/EP1567034A4/en
Withdrawn legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H01L21/67323—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H01L21/6733—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)
EP02784595A 2001-11-27 2002-11-26 Semiconductor component handling device having a performance film Withdrawn EP1567034A4 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US33368901P 2001-11-27 2001-11-27
US333689P 2001-11-27
PCT/US2002/037860 WO2003046950A2 (en) 2001-11-27 2002-11-26 Semiconductor component handling device having a performance film

Publications (2)

Publication Number Publication Date
EP1567034A2 EP1567034A2 (en) 2005-08-31
EP1567034A4 true EP1567034A4 (en) 2007-11-14

Family

ID=23303851

Family Applications (1)

Application Number Title Priority Date Filing Date
EP02784595A Withdrawn EP1567034A4 (en) 2001-11-27 2002-11-26 Semiconductor component handling device having a performance film

Country Status (8)

Country Link
US (1) US20050236110A1 (en)
EP (1) EP1567034A4 (en)
JP (1) JP2005521236A (en)
KR (1) KR20040062643A (en)
CN (1) CN1636275A (en)
AU (1) AU2002346528A1 (en)
TW (1) TW200300996A (en)
WO (1) WO2003046950A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2003046952A2 (en) * 2001-11-27 2003-06-05 Entegris, Inc Semiconductor component handling device having an electrostatic dissipating film
EP2386401A1 (en) 2010-05-11 2011-11-16 Samsung Electro-Mechanics Co., Ltd. Case of electronic device having antenna pattern embedde therein, and mold therefor and mthod of manufacturing thereof
EP2387106B1 (en) 2010-05-11 2013-01-23 Samsung Electro-Mechanics Co., Ltd. Case of electronic device having low frequency antenna pattern embedded therein, mold therefor and method of manufacturing thereof
JP5321988B2 (en) * 2010-05-11 2013-10-23 サムソン エレクトロ−メカニックス カンパニーリミテッド． Electronic device case in which antenna pattern frame is embedded, manufacturing mold and manufacturing method thereof
US9079714B2 (en) * 2012-07-31 2015-07-14 Shenzhen China Star Optoelectronics Technology Co., Ltd Glass substrate cassette and pick-and-place system for glass substrate
SG10201901758WA (en) * 2014-08-28 2019-03-28 Entegris Inc Substrate container
CN109195682A (en) 2016-06-01 2019-01-11 恩特格里斯公司 Conducting filtration device
KR102495884B1 (en) 2018-05-07 2023-02-06 엔테그리스, 아이엔씨. Fluid circuit with integrated electrostatic discharge mitigation
EP3929969B1 (en) * 2020-06-22 2023-12-06 Siltronic AG Method for manufacturing a process container for semiconductor workpieces and process container
EP4068343A1 (en) 2021-04-01 2022-10-05 Siltronic AG Device for transporting semiconductor wafers

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0342930A2 (en) * 1988-05-17 1989-11-23 MITSUI TOATSU CHEMICALS, Inc. A container for an integrated circuit wafer and method for preparing the same
DE19924182A1 (en) * 1998-05-28 1999-12-02 Fluoroware Inc Carrier for wafers or magnetic disks of high functional density, used during manufacture and transport
US6428729B1 (en) * 1998-05-28 2002-08-06 Entegris, Inc. Composite substrate carrier
WO2003046952A2 (en) * 2001-11-27 2003-06-05 Entegris, Inc Semiconductor component handling device having an electrostatic dissipating film

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5593916A (en) * 1988-08-12 1997-01-14 Mitsui Toatsu Chemicals, Incorporated Processing of glass substrates using holding container and holding container
JPH044142A (en) * 1990-04-20 1992-01-08 Teijin Ltd Antistatic polyester film
US6039186A (en) * 1997-04-16 2000-03-21 Fluoroware, Inc. Composite transport carrier
US6068137A (en) * 1997-09-16 2000-05-30 Sumitomo Metal Industries, Ltd. Semiconductor wafer carrier
US6079565A (en) * 1998-12-28 2000-06-27 Flouroware, Inc. Clipless tray
JP3916342B2 (en) * 1999-04-20 2007-05-16 信越ポリマー株式会社 Substrate storage container

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0342930A2 (en) * 1988-05-17 1989-11-23 MITSUI TOATSU CHEMICALS, Inc. A container for an integrated circuit wafer and method for preparing the same
DE19924182A1 (en) * 1998-05-28 1999-12-02 Fluoroware Inc Carrier for wafers or magnetic disks of high functional density, used during manufacture and transport
US6428729B1 (en) * 1998-05-28 2002-08-06 Entegris, Inc. Composite substrate carrier
WO2003046952A2 (en) * 2001-11-27 2003-06-05 Entegris, Inc Semiconductor component handling device having an electrostatic dissipating film

Also Published As

Publication number Publication date
WO2003046950A2 (en) 2003-06-05
EP1567034A2 (en) 2005-08-31
CN1636275A (en) 2005-07-06
WO2003046950A3 (en) 2005-06-02
US20050236110A1 (en) 2005-10-27
AU2002346528A1 (en) 2003-06-10
TW200300996A (en) 2003-06-16
AU2002346528A8 (en) 2003-06-10
KR20040062643A (en) 2004-07-07
JP2005521236A (en) 2005-07-14

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Legal Events

Date Code Title Description
PUAI Public reference made under article 153(3) epc to a published international application that has entered the european phase

Free format text: ORIGINAL CODE: 0009012

17P Request for examination filed

Effective date: 20040625

AK Designated contracting states

Kind code of ref document: A2

Designated state(s): DE FR GB IT

A4 Supplementary search report drawn up and despatched

Effective date: 20071015

RIC1 Information provided on ipc code assigned before grant

Ipc: A47G 19/08 20060101AFI20050714BHEP

Ipc: H01L 21/68 20060101ALI20071009BHEP

STAA Information on the status of an ep patent application or granted ep patent

Free format text: STATUS: THE APPLICATION IS DEEMED TO BE WITHDRAWN

18D Application deemed to be withdrawn

Effective date: 20080115