WO2003046950A3 - Semiconductor component handling device having a performance film - Google Patents

Semiconductor component handling device having a performance film Download PDF

Info

Publication number
WO2003046950A3
WO2003046950A3 PCT/US2002/037860 US0237860W WO03046950A3 WO 2003046950 A3 WO2003046950 A3 WO 2003046950A3 US 0237860 W US0237860 W US 0237860W WO 03046950 A3 WO03046950 A3 WO 03046950A3
Authority
WO
WIPO (PCT)
Prior art keywords
film
containment
moldable material
handling device
semiconductor component
Prior art date
Application number
PCT/US2002/037860
Other languages
French (fr)
Other versions
WO2003046950A2 (en
Inventor
Sanjiv M Bhatt
Shawn D Eggum
Original Assignee
Entegris Inc
Sanjiv M Bhatt
Shawn D Eggum
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc, Sanjiv M Bhatt, Shawn D Eggum filed Critical Entegris Inc
Priority to US10/496,754 priority Critical patent/US20050236110A1/en
Priority to KR10-2004-7007895A priority patent/KR20040062643A/en
Priority to JP2003548277A priority patent/JP2005521236A/en
Priority to AU2002346528A priority patent/AU2002346528A1/en
Priority to EP02784595A priority patent/EP1567034A4/en
Publication of WO2003046950A2 publication Critical patent/WO2003046950A2/en
Publication of WO2003046950A3 publication Critical patent/WO2003046950A3/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6732—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls
    • H01L21/67323—Vertical carrier comprising wall type elements whereby the substrates are horizontally supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67326—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls
    • H01L21/6733—Horizontal carrier comprising wall type elements whereby the substrates are vertically supported, e.g. comprising sidewalls characterized by a material, a roughness, a coating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/67346—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders characterized by being specially adapted for supporting a single substrate or by comprising a stack of such individual supports
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67366—Closed carriers characterised by materials, roughness, coatings or the like

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Laminated Bodies (AREA)
  • Sheets, Magazines, And Separation Thereof (AREA)

Abstract

The present invention relates generally to a system and method for including a thin protective containment thermopolymer film (10), such as PEEK, in the molding process for handlers, transporters, carriers, trays and like devices utilized in the semiconductor processing industry. The thermoplastic film (10) of predetermined size and shape is selectively placed along a shaping surface (26) in a mold cavity (22) for alignment with a desired target surface of a moldable material. The film is permanently adhered to the moldable material. As a result, a compatible polymer film (10) can be selectively bonded only to those target surfaces where performance characteristics such as abrasion resistance, heat resistance, chemical resistance, outgassing containment, rigidity enhancement, hardness, creep reduction, fluid absorption containment, and the like is needed.
PCT/US2002/037860 2001-11-27 2002-11-26 Semiconductor component handling device having a performance film WO2003046950A2 (en)

Priority Applications (5)

Application Number Priority Date Filing Date Title
US10/496,754 US20050236110A1 (en) 2001-11-27 2002-11-26 Semiconductor component handling device having a performance film
KR10-2004-7007895A KR20040062643A (en) 2001-11-27 2002-11-26 Semiconductor component handling device having a performance film
JP2003548277A JP2005521236A (en) 2001-11-27 2002-11-26 Semiconductor parts handling equipment with performance film
AU2002346528A AU2002346528A1 (en) 2001-11-27 2002-11-26 Semiconductor component handling device having a performance film
EP02784595A EP1567034A4 (en) 2001-11-27 2002-11-26 Semiconductor component handling device having a performance film

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US33368901P 2001-11-27 2001-11-27
US60/333,689 2001-11-27

Publications (2)

Publication Number Publication Date
WO2003046950A2 WO2003046950A2 (en) 2003-06-05
WO2003046950A3 true WO2003046950A3 (en) 2005-06-02

Family

ID=23303851

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/037860 WO2003046950A2 (en) 2001-11-27 2002-11-26 Semiconductor component handling device having a performance film

Country Status (8)

Country Link
US (1) US20050236110A1 (en)
EP (1) EP1567034A4 (en)
JP (1) JP2005521236A (en)
KR (1) KR20040062643A (en)
CN (1) CN1636275A (en)
AU (1) AU2002346528A1 (en)
TW (1) TW200300996A (en)
WO (1) WO2003046950A2 (en)

Families Citing this family (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR20040062966A (en) * 2001-11-27 2004-07-09 엔테그리스, 아이엔씨. Semiconductor component handling device having an electrostatic dissipating film
JP5321988B2 (en) * 2010-05-11 2013-10-23 サムソン エレクトロ−メカニックス カンパニーリミテッド． Electronic device case in which antenna pattern frame is embedded, manufacturing mold and manufacturing method thereof
EP2386401A1 (en) 2010-05-11 2011-11-16 Samsung Electro-Mechanics Co., Ltd. Case of electronic device having antenna pattern embedde therein, and mold therefor and mthod of manufacturing thereof
EP2387106B1 (en) 2010-05-11 2013-01-23 Samsung Electro-Mechanics Co., Ltd. Case of electronic device having low frequency antenna pattern embedded therein, mold therefor and method of manufacturing thereof
US9079714B2 (en) * 2012-07-31 2015-07-14 Shenzhen China Star Optoelectronics Technology Co., Ltd Glass substrate cassette and pick-and-place system for glass substrate
EP3186827A4 (en) * 2014-08-28 2018-04-25 Entegris, Inc. Substrate container
DE112017002783T5 (en) 2016-06-01 2019-02-21 Entegris, Inc. Fluid circuit with integrated electrostatic discharge mitigation
CN115866862A (en) 2018-05-07 2023-03-28 恩特格里斯公司 Fluid circuit with integrated electrostatic discharge mitigation
EP3929969B1 (en) * 2020-06-22 2023-12-06 Siltronic AG Method for manufacturing a process container for semiconductor workpieces and process container
EP4068343A1 (en) 2021-04-01 2022-10-05 Siltronic AG Device for transporting semiconductor wafers

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5194327A (en) * 1990-04-20 1993-03-16 Teijin Limited Antistatic polyester film
US5593916A (en) * 1988-08-12 1997-01-14 Mitsui Toatsu Chemicals, Incorporated Processing of glass substrates using holding container and holding container
US6039186A (en) * 1997-04-16 2000-03-21 Fluoroware, Inc. Composite transport carrier
US6068137A (en) * 1997-09-16 2000-05-30 Sumitomo Metal Industries, Ltd. Semiconductor wafer carrier
US6079565A (en) * 1998-12-28 2000-06-27 Flouroware, Inc. Clipless tray
US6382419B1 (en) * 1999-04-20 2002-05-07 Shin-Etsu Polymer Co. Ltd. Wafer container box

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH088294B2 (en) * 1988-05-17 1996-01-29 三井東圧化学株式会社 IC wafer container
DE19924182B4 (en) * 1998-05-28 2008-04-17 Entegris, Inc., Chaska Carrier for semiconductor wafers to be processed, stored and / or transported
US6428729B1 (en) * 1998-05-28 2002-08-06 Entegris, Inc. Composite substrate carrier
KR20040062966A (en) * 2001-11-27 2004-07-09 엔테그리스, 아이엔씨. Semiconductor component handling device having an electrostatic dissipating film

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5593916A (en) * 1988-08-12 1997-01-14 Mitsui Toatsu Chemicals, Incorporated Processing of glass substrates using holding container and holding container
US5194327A (en) * 1990-04-20 1993-03-16 Teijin Limited Antistatic polyester film
US6039186A (en) * 1997-04-16 2000-03-21 Fluoroware, Inc. Composite transport carrier
US6068137A (en) * 1997-09-16 2000-05-30 Sumitomo Metal Industries, Ltd. Semiconductor wafer carrier
US6079565A (en) * 1998-12-28 2000-06-27 Flouroware, Inc. Clipless tray
US6382419B1 (en) * 1999-04-20 2002-05-07 Shin-Etsu Polymer Co. Ltd. Wafer container box

Also Published As

Publication number Publication date
CN1636275A (en) 2005-07-06
US20050236110A1 (en) 2005-10-27
EP1567034A4 (en) 2007-11-14
TW200300996A (en) 2003-06-16
AU2002346528A1 (en) 2003-06-10
EP1567034A2 (en) 2005-08-31
AU2002346528A8 (en) 2003-06-10
WO2003046950A2 (en) 2003-06-05
KR20040062643A (en) 2004-07-07
JP2005521236A (en) 2005-07-14

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