WO2003045673B1 - Informational polymer film insert molding - Google Patents

Informational polymer film insert molding

Info

Publication number
WO2003045673B1
WO2003045673B1 PCT/US2002/037865 US0237865W WO03045673B1 WO 2003045673 B1 WO2003045673 B1 WO 2003045673B1 US 0237865 W US0237865 W US 0237865W WO 03045673 B1 WO03045673 B1 WO 03045673B1
Authority
WO
WIPO (PCT)
Prior art keywords
indicia
film
wafer container
layer
marked
Prior art date
Application number
PCT/US2002/037865
Other languages
French (fr)
Other versions
WO2003045673A1 (en
Inventor
Sanjiv M Bhatt
Shawn D Eggum
Original Assignee
Entegris Inc
Sanjiv M Bhatt
Shawn D Eggum
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Entegris Inc, Sanjiv M Bhatt, Shawn D Eggum filed Critical Entegris Inc
Priority to KR10-2004-7007896A priority Critical patent/KR20040055815A/en
Priority to EP02784600A priority patent/EP1458557A1/en
Priority to JP2003547154A priority patent/JP2005510416A/en
Priority to AU2002346532A priority patent/AU2002346532A1/en
Publication of WO2003045673A1 publication Critical patent/WO2003045673A1/en
Publication of WO2003045673B1 publication Critical patent/WO2003045673B1/en

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14688—Coating articles provided with a decoration
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29B—PREPARATION OR PRETREATMENT OF THE MATERIAL TO BE SHAPED; MAKING GRANULES OR PREFORMS; RECOVERY OF PLASTICS OR OTHER CONSTITUENTS OF WASTE MATERIAL CONTAINING PLASTICS
    • B29B13/00—Conditioning or physical treatment of the material to be shaped
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C37/00—Component parts, details, accessories or auxiliary operations, not covered by group B29C33/00 or B29C35/00
    • B29C37/0025—Applying surface layers, e.g. coatings, decorative layers, printed layers, to articles during shaping, e.g. in-mould printing
    • B29C37/0028—In-mould coating, e.g. by introducing the coating material into the mould after forming the article
    • B29C37/0032—In-mould coating, e.g. by introducing the coating material into the mould after forming the article the coating being applied upon the mould surface before introducing the moulding compound, e.g. applying a gelcoat
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14778—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles the article consisting of a material with particular properties, e.g. porous, brittle
    • B29C45/14811—Multilayered articles
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14688—Coating articles provided with a decoration
    • B29C2045/14713—Coating articles provided with a decoration decorations in contact with injected material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14688—Coating articles provided with a decoration
    • B29C2045/14737—Coating articles provided with a decoration decorations printed on the insert by a digital imaging technique
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C2045/14852—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles incorporating articles with a data carrier, e.g. chips
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2715/00—Condition, form or state of preformed parts, e.g. inserts
    • B29K2715/006—Glues or adhesives, e.g. hot melts or thermofusible adhesives
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
    • B29K2995/002—Coloured
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0018—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds having particular optical properties, e.g. fluorescent or phosphorescent
    • B29K2995/0026—Transparent
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29K—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS OR TO MATERIALS FOR MOULDS, REINFORCEMENTS, FILLERS OR PREFORMED PARTS, e.g. INSERTS
    • B29K2995/00—Properties of moulding materials, reinforcements, fillers, preformed parts or moulds
    • B29K2995/0037—Other properties
    • B29K2995/0087—Wear resistance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29L—INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULAR ARTICLES
    • B29L2009/00—Layered products

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Laminated Bodies (AREA)
  • Details Of Rigid Or Semi-Rigid Containers (AREA)

Abstract

A system and method for using a thin polymer film member (34) to bond indicia (36) in the molding process for manufacturing wafer containers (10) and other plastic articles for use in the semi-conductor manufacturing industry, and particularly such articles for use in semiconductor fabrication clean room environments. The system and method enables multicolored indicia and unique electronically readable indicia to be blonded to the article, while also providing a protective containment barrier to inhibit process contamination stemming from the indicia and to protect the indicia from physical damage.

Claims

AMENDED CLAIMS[received by the International Bureau on 20 May 2003 (20.05.03); original claim 1 replaced by new claim]
1. A wafer container including an enclosure portion having indicia marked thereon, the wafer container made by a process comprising the steps of:
forming a film member from polymer film material;
marking the film member with indicia;
positioning the film member on a shaping surface of a mold; and
molding polymer material over the shaping surface of the mold and the film member to form said enclosure portion, the film member being thereby permanently bonded with the enclosure portion.
2. ι The wafer container of claim 1, wherein said film portion is transparent polymer material and has an inner surface directly bonded to said enclosure portion, said indicia being marked on said inner surface so that said indicia are encapsulated between said film portion and said enclosure portion.
3. The wafer container of claim 2, wherein said inner surface and said indicia are coated with a layer of temperature and shear resistant ink.
4. The wafer container of claim 1, wherein said indicia are marked with temperature and shear resistant ink.
5. The wafer container of claim 1, wherein said film portion includes at least a pair of layers, a first layer having the indicia marked on a surface thereof, a second layer made from polymer film material, a surface of the second layer being bonded to the surface of the first layer marked with the indicia so that the indicia are encapsulated between the pair of layers.
6. The wafer container of claim 5, wherein one of said pair of layers is an inner tie layer for improving the bond strength between the film portion and the enclosure portion, wherein the other of said pair of layers is an outer layer, and wherein said tie layer is disposed between said enclosure portion and the outer layer.
7. The wafer container of claim 1, wherein said film portion is constructed substantially of a material selected from the group consisting of: polyester, polyimide, polyether imide, polyetheretherketone, perfluoroalkoxy resin, fluorinated ethylene propylene copolymer,
PCT/US2002/037865 2001-11-27 2002-11-26 Informational polymer film insert molding WO2003045673A1 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
KR10-2004-7007896A KR20040055815A (en) 2001-11-27 2002-11-26 Informational polymer film insert molding
EP02784600A EP1458557A1 (en) 2001-11-27 2002-11-26 Informational polymer film insert molding
JP2003547154A JP2005510416A (en) 2001-11-27 2002-11-26 Polymer film insert molding with information
AU2002346532A AU2002346532A1 (en) 2001-11-27 2002-11-26 Informational polymer film insert molding

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US33368101P 2001-11-27 2001-11-27
US33368701P 2001-11-27 2001-11-27
US60/333,687 2001-11-27
US60/333,681 2001-11-27

Publications (2)

Publication Number Publication Date
WO2003045673A1 WO2003045673A1 (en) 2003-06-05
WO2003045673B1 true WO2003045673B1 (en) 2003-07-10

Family

ID=26988847

Family Applications (1)

Application Number Title Priority Date Filing Date
PCT/US2002/037865 WO2003045673A1 (en) 2001-11-27 2002-11-26 Informational polymer film insert molding

Country Status (7)

Country Link
EP (1) EP1458557A1 (en)
JP (1) JP2005510416A (en)
KR (1) KR20040055815A (en)
CN (1) CN1617792A (en)
AU (1) AU2002346532A1 (en)
TW (1) TW200301209A (en)
WO (1) WO2003045673A1 (en)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP4828574B2 (en) * 2008-05-26 2011-11-30 ルネサスエレクトロニクス株式会社 Method of transporting semiconductor device
DE202013004180U1 (en) * 2013-05-03 2013-05-16 Mega-Tel Ag/Sa Matrix barcode on back-injected foil
CN104608318B (en) * 2015-02-04 2017-02-22 苏州康尼格电子科技股份有限公司 Circuit board packaging equipment and packaging method using same
JP7077079B2 (en) * 2018-03-14 2022-05-30 株式会社ディスコ Retention table
CN109166816B (en) * 2018-08-22 2021-01-22 德淮半导体有限公司 Wafer processing apparatus and operating method thereof

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4833306A (en) * 1988-05-18 1989-05-23 Fluoroware, Inc. Bar code remote recognition system for process carriers of wafer disks
US6428729B1 (en) * 1998-05-28 2002-08-06 Entegris, Inc. Composite substrate carrier
WO2000017839A1 (en) * 1998-09-22 2000-03-30 Oji-Yuka Synthetic Paper Co., Ltd. Transparent label
US6079565A (en) * 1998-12-28 2000-06-27 Flouroware, Inc. Clipless tray
US6355555B1 (en) * 2000-01-28 2002-03-12 Advanced Micro Devices, Inc. Method of fabricating copper-based semiconductor devices using a sacrificial dielectric layer

Also Published As

Publication number Publication date
AU2002346532A1 (en) 2003-06-10
TW200301209A (en) 2003-07-01
JP2005510416A (en) 2005-04-21
WO2003045673A1 (en) 2003-06-05
EP1458557A1 (en) 2004-09-22
KR20040055815A (en) 2004-06-29
CN1617792A (en) 2005-05-18

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