JPH11170295A - Resin sealed molded product and its manufacture - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a resin seal molded product of superior surface hard ness having embedded electric and electronic parts inside and decorations formed on its surface, and also provide a manufacturing method advantageous industri ally. SOLUTION: A sheet 10 is made to adhere integrally on the surface of a resin seal molded product having electric and electronic parts embedded in thermoplastic resin, and decorations 16 formed of characters, symbols, figures, colors or the combination of them are formed on one face of the sheet, while a hard coat film is formed on the other face, and the face on which decorations are formed is just bonded with resin of a molded product. The resin seal molded product is manufactured by the injection molding method.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a resin molded article and a method for producing the same. More specifically, a resin-encapsulated molded product in which electric / electronic components are embedded in a thermoplastic resin, in particular, has excellent surface hardness, and is formed of letters, symbols, figures, patterns, patterns, colors, or a combination thereof on the surface of the molded product. The present invention relates to a decorated resin-sealed molded product and a method for producing the same.

[0002]

2. Description of the Related Art Conventionally, as a technique for protecting electric and electronic parts such as ICs, diodes, and capacitors from a mechanical and electric external environment, a method of sealing with a resin which is inexpensive and excellent in mass productivity is known. A stop has been made. Examples of the resin sealing method include a casting method using a thermosetting resin, an immersion method, a transfer molding method, a fluid immersion method using a powder resin, and an injection molding method using a thermoplastic resin. However, most of thermoplastic resins are inferior in weather resistance and are not suitable for long-term outdoor use for a long period of time.In addition, the surface hardness is low and the scratch resistance is poor. There were restrictions. In addition, the molded article sealed with resin has electric and electronic parts embedded therein, but has a disadvantage that the contents (the inside) are difficult to understand.

As a method for improving the scratch resistance of a molded article,
There is a method in which a hard coat agent is applied to the surface of a molded article to form a coating thereon to improve the surface hardness. For this purpose, epoxy resin, acrylic resin, amino resin, and polysiloxane hard disks are used. Coating agents are used. Furthermore, in order to specify or identify the contents of electric and electronic components, decoration operations are performed on the surface of the resin-encapsulated molded product by printing, marking, labeling, or the like in a later process.
As described above, the formation of the hard coat film for improving the surface hardness of the resin-encapsulated molded product, the decorating operation, and the like are usually performed by post-processing (separate) after the production of the resin-encapsulated molded product.

[0004]

The post (separate) processing can improve the surface hardness of the molded product or provide decoration. However, from the viewpoint of industrial production of resin-encapsulated molded products. Has the following problems and is not always preferable.

[0005] First, in the method of forming a hard coat film by applying a hard coat agent, when the hard coat agent is dissolved in a solvent and applied, a crack is generated on the surface of a molded article by the solvent, or the solvent is removed by heat treatment. When drying or proceeding the curing reaction, the molded product may be deformed,
Problems such as deterioration of the product appearance due to contamination by dust may occur. For this reason, facilities such as an annealing treatment facility and a dedicated coating room are required, and it is inevitable that the process becomes complicated and the cost increases. In addition, after (separate)
Also in the method of decorating in a process, a washing facility, a printing facility, a laser marking facility, and the like are separately required, and it is unavoidable that the cost is increased as described above. Therefore, it has been desired to provide a molded article which has solved these disadvantages at once, and to provide an industrially advantageous method in which the manufacturing process is simplified.

[0006] Under such circumstances, the present inventor has provided a resin-sealed molded product of an electric / electronic component having a surface decorated and excellent in surface hardness, and its industrial use. As a result of intensive study for the purpose of providing an advantageous production method, a thermoplastic resin sheet or film having a hard coat film on one side, which is decorated on one side and has an improved surface hardness on the other side, The present inventors have found that the above-mentioned problems can be solved at once by integrally welding them to the surface of a resin-sealed molded product of an electric / electronic component, and have completed the present invention.

[0007]

In order to solve the above-mentioned problems, the present invention relates to a resin-encapsulated molded product in which electric / electronic parts are embedded in a thermoplastic resin. A sheet or film is integrally welded to one surface of the thermoplastic resin sheet or film, and one surface of the thermoplastic resin sheet or film is decorated with letters, symbols, figures, patterns, colors, or a combination thereof, and the other surface is provided. , A resin-encapsulated molded product characterized by being formed with a hard-coat film formed thereon, arranged so that the hard-coated film is on the outside, and welded integrally with the resin of the encapsulated molded product.

Further, in the present invention, when producing a resin-encapsulated molded product produced by injection molding using a thermoplastic resin as a raw material, a character, a symbol, a figure, a pattern, or a pattern is formed on one surface of a thermoplastic resin sheet or film. , A color or a combination thereof is applied, and a hard coat agent is applied to the other surface and cured to form a hard coat film, and the hard coat film is formed on the surface of the mold cavity for injection molding. After the support member is advanced into the mold cavity in which the support member is provided so that the support member can move forward and backward, and the electric and electronic components are supported and fixed in the mold cavity, the molten resin is placed in the mold cavity. After filling and filling the molten resin, the resin is cooled and solidified, then the mold is opened and the resin is opened. Characterized by releasing the stop moldings from the mold, to provide a method of manufacturing a resin-seal-molded product.

[0009]

BEST MODE FOR CARRYING OUT THE INVENTION Hereinafter, the present invention will be described in detail.
In the present invention, as the thermoplastic resin sheet or film (hereinafter, sometimes simply referred to as “sheet”),
Although not particularly limited, olefin resins such as polyethylene and polypropylene, polystyrene, HIPS, and AS
Resin, ABS resin, styrene resin such as styrene-maleic anhydride copolymer, polyvinyl chloride, vinyl chloride
Vinyl chloride resin such as vinyl acetate copolymer, polyester resin such as polyethylene terephthalate and polybutylene terephthalate, polycarbonate resin, polyamide resin, polyphenylene ether, polyoxymethylene, polymethyl methacrylate, polyether imide, polyphenylene Engineering plastics such as salefide, and blends thereof.

The thickness of the sheet is not particularly limited and can be selected in a wide range as long as it can be mounted (arranged) on the cavity surface of the mold for injection molding and can be brought into close contact therewith. Although it varies depending on the type of resin for sheet production, the use and size of the sealing molded product, it is usually about 0.01 to 2.0 mm, preferably 0.1 to 2.0 mm.
It can be selected in the range of 1 to 1.0 mm.

One surface of the sheet is decorated with characters, symbols, figures, patterns, colors, and combinations thereof. As a method of decorating the sheet, printing, painting, vapor deposition, plating, drawing, and the like can be used. For printing,
Offset printing, gravure printing, screen printing, etc. are mentioned, spray painting method and dip coating method are used for painting, and metal materials are usually used for vapor deposition and plating, and paints and black ink are used for drawing. And so on.
In order to prevent the decorated surface from peeling or bleeding when welding with the molten resin, an anchor coating agent may be applied to the sheet surface in advance, or a protective coating may be formed after decoration is applied. it can.

A hard coat film is formed on the other surface of the sheet (the surface that is not decorated). By forming this hard coat film, the surface hardness of the resin-encapsulated molded product can be improved. In order to form a hard coat film, a method of applying a hard coat agent to the other surface of the sheet and curing the same can be used. Examples of the hard coat agent include an epoxy resin, an acrylic resin, an amino resin, and a polysiloxane. These hard coat agents are dissolved in an appropriate solvent, applied to the other surface of the sheet by means such as spray coating or dip coating, and cured by means such as heating the applied surface or irradiating ultraviolet rays. Thereby, a hard coat film is formed to improve the hardness of the other surface of the sheet. The thickness of the hard coat film is selected in a range from several microns to several tens of microns.

The sheet may be provided with at least one of weather resistance, antistatic performance and antifogging performance. In order to impart these functions to the sheet, (1) a stabilizer for improving the weather resistance, an antistatic agent for improving the antistatic property, and an antifogging agent for improving the antifogging property are added to the thermoplastic resin. (2) When forming the hard coat film, simultaneously weather resistance, antistatic properties,
A method of forming a film to which a component for improving the anti-fogging property or the like is added can be used.

Attached (placed) to the mold cavity surface of the sheet
In order to do so, the decorative surface of the sheet is welded to the molding resin, and the surface on which the hard coat film is formed is mounted so as to be in contact with the mold cavity surface. In order to attach the sheet to the mold cavity surface, (1) a method using static electricity, (2) a method using vacuum suction, (3) a method of fixing with a pin provided on the mold, (4) sticking an iron piece to the sheet tab Any method may be used, such as mounting, fixing a magnet by embedding a magnet in a corresponding position on a mold cavity surface, and the like.

The thermoplastic resin for sealing in which the electric / electronic parts are embedded is not limited as long as it can be injection-molded, and the same kind of resin as the resin for sheet production is suitable.
Such thermoplastic resins include olefin resins such as polyethylene and polypropylene, polystyrene, H
IPS, AS resin, ABS resin, styrene resin such as styrene-maleic anhydride copolymer, polyvinyl chloride,
Vinyl chloride resins such as vinyl chloride-vinyl acetate copolymers, polyester resins such as polyethylene terephthalate and polybutylene terephthalate, polycarbonate resins, polyamide resins, polyphenylene ether,
Examples include engineering plastics such as polyoxymethylene, polymethyl methacrylate, polyetherimide, polyphenylene sulfide, and polyester-based liquid crystal polymers, and blends thereof.

These thermoplastic resins may be blended with various resin additives such as fillers such as glass fiber and talc, and other heat stabilizers. When the electric / electronic component sealed by the injection molding material is a hybrid IC,
Since there are many components that are likely to cause problems due to heat and pressure, such as ceramic substrates, printed circuits, IC chips, chip bonding wires and solder, thermoplastic resins have excellent fluidity and low melting enthalpy. And styrene resins are suitable.

The thermoplastic resin for the sheet and the thermoplastic resin for the sealing are compatible with each other even if they are of the same kind, closely related, or different from the viewpoint of the adhesiveness between them. It is desirable to combine things. When combining different materials having incompatibility, it is preferable to form an adhesive fusion layer on the sheet surface in contact with the injection molding resin in advance. As a material for forming the adhesive fusion layer, usually, 100 to
Hot-melt type resins that can be adhered by applying pressure in a temperature range of 200 ° C. are preferred.

Specific examples include hot-melt resins such as ethylene-vinyl acetate copolymer resins, vinyl chloride resins, polyolefin resins, polyamide resins, and polyester resins. These may be a single layer of a hot-melt resin or a laminate of two or more thin layers of a resin such as an ethylene-vinyl acetate copolymer resin and a polyamide resin. These materials for the adhesive fusion layer can be formed in a thin layer on one surface of the sheet by a method such as screen printing, a roll coater, or spraying.

In the present invention, the electric / electronic parts are I
C, diode, capacitor, transistor, LE
D, a bimetal, a solenoid coil, an antenna, a battery, and the like. These are mounted alone or in a hybrid form on a substrate made of ceramic, glass fiber reinforced epoxy resin, or the like, and used. The size of the electric / electronic component is not particularly limited as long as it is a component large enough to be supported in the mold cavity.

In order to manufacture the resin-sealed molded product according to the present invention, the electric / electronic parts are advanced (advanced) into the mold cavity.
The support member, which can be retracted (returned), is supported and fixed in the mold cavity. On the other hand, the decorated sheet made of characters, symbols, figures, patterns, colors, or a combination thereof is placed on the mold cavity surface such that the decorated surface comes into contact with the molten resin ( Mounting) and mold clamping. Subsequently, the first injection and filling of the molten resin is performed, and then the above-mentioned support member is retracted from the mold cavity, and the molten resin is additionally charged. In the first injection filling, it is preferable to keep the filling ratio of 90 to 95% of the mold cavity since the additional filling can be performed smoothly. Finally, after the molded article is cooled and solidified in the mold cavity, the mold is opened and the molded article is released from the mold.

Hereinafter, the present invention will be described in detail with reference to the drawings, but the present invention is not limited to the following description unless it exceeds the gist.

FIG. 1 is a perspective view of an example of a hybrid IC substrate sealed with a resin, and FIG. 2 is a perspective view of an example of a sheet that is integrally welded to the surface of a resin-sealed molded product.
FIG. 7 is a perspective view of an example of a resin-encapsulated molded product having excellent surface hardness. In the figure, 1 is a lead terminal, 2 is a hybrid IC board, 10 is a decorated sheet, 15 is a functional film, and 16 is decoration such as printing.

FIGS. 3 to 6 are process charts for explaining the procedure for manufacturing a resin-sealed molded product. FIG. 3 is a cross-sectional view illustrating a state where a hybrid IC substrate is supported in a mold cavity in a mold opened state. FIG. 3 shows that a lead terminal receiving groove 4 is formed on a dividing surface (parting surface) of an upper die 5 and a lower die 6, and the lead terminal 1 is fitted into the lead terminal receiving groove 4, and the mold cavity 3 is formed. Support member 11 advanced into
2 shows a state in which the hybrid IC substrate 2 is supported and the decorated sheet 10 is placed (mounted) on the mold cavity surface by applying a vacuum to the vacuum holes 7 provided in the upper mold 5.

FIG. 4 is a cross-sectional view of a main part showing a state where the hybrid IC substrate is supported in the mold cavity and clamped, and FIG. 5 shows a state where the molten resin is injected and filled in the mold cavity. FIG. 6 is a sectional view of a main part showing a state where the support member 11 is retracted from the mold cavity and additionally filled with a molten resin. 3 to 6, the molten resin 13 injected from the resin passage (runner) 9 is filled into the mold cavity 3 from the submarine gate 8. A submarine gate 8 is provided in both the upper mold 5 and the lower mold 6 and a hybrid IC
Since the substrate 2 is supported by the support member 11, the hybrid IC substrate 2 is not moved up, down, left, or right by the molten resin pressure.

The resin-sealed molded product is cooled in the mold to a temperature at which the resin-sealed molded product is not deformed even when the molded product is taken out. By molding, a resin-encapsulated molded product is obtained. The resin-encapsulated molded product thus obtained is a molded product in which electric / electronic components are embedded at predetermined positions in the molded product, and a decorated sheet is welded to the surface of the molded product. Is obtained. According to the method of the present invention, the embedding of the electric / electronic component in the resin and the welding of the decorated sheet to the surface of the molded product can be simultaneously performed in one step. The process is greatly simplified.

[0026]

DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be described below in more detail with reference to embodiments. TH60R5VSE vertical injection molding machine manufactured by Nissei Plastic Industry Co., Ltd., injection molding die of the following specifications, hybrid IC,
A sheet having a thickness of 0.5 mm, a hard coat film formed on one side, and a printed decoration on the other side (Iupilon sheet CFI-1 manufactured by Mitsubishi Engineering-Plastics Co., Ltd.) is applied to a press machine. Prepare the mold cut in the shape of the mold cavity, and as the resin for injection molding,
A polyester liquid crystal polymer having excellent melt fluidity (manufactured by Mitsubishi Engineering-Plastics Corporation: Novaculate E322G30LM) was prepared.

As shown in the sectional view of the main part in FIG. 3, the injection mold has a lead terminal receiving groove 4 of the hybrid IC on a parting surface (parting surface) of the mold and can advance and retreat into the mold cavity. A support member 11, a protrusion pin 12, and a vacuum suction hole 7 for fixing a sheet are provided, and a passage (runner) 9 for molten resin and a submarine gate 8 are formed.

The injection mold is mounted on the injection molding machine, the mold is opened, and the hybrid IC is supported by the support member 11 stopped at the forward position in the mold cavity (FIG. 3) and then mold clamping (FIG. 4)
(See FIG. 5). When the first filling is almost completed, the supporting member 11 is retracted, and the gap portion occupied by the supporting member 11 is immediately filled with the molten liquid crystal polymer again (FIG. 6).
After the resin was cooled and solidified, the mold was opened, and at the same time as the mold was opened, the molded product was released from the mold by the protruding pin 12 to obtain a molded product in which the hybrid IC was embedded and sealed in the resin.

With respect to the hard coat film of the resin-encapsulated molded product, a Taber abrasion test, a steel wool abrasion test, and a sunshine weather test were performed. As a result, the haze was 2.5% in the Taber abrasion test, the haze was 1.5% in the steel wool abrasion test, and the YI was 5.8% in the sunshine weather test. The value was about 1/10 of that of the molded article having no coat film formed thereon, which was good. In addition, peeling of the sheet from the surface of the resin-encapsulated molded product, bleeding of the printing ink, and the like were not observed.

Further, a hybrid X-ray photographing apparatus (SOFTEX PRO-TESUT100, manufactured by Softex Corp.) is mounted on the hybrid IC embedded in the resin-sealed molded product.
As a result, no breakage of the element, no cutting of the circuit, no melting and peeling of the solder, etc. were observed. The molded article was cut in the thickness direction, and the state of embedding of the hybrid IC in the resin was visually observed. As a result, the hybrid IC was almost buried at the center position, and no trace of the movement was observed.

This resin-encapsulated molded product was subjected to the following thermal cycle test and moisture resistance test.
In each case, the surface and the inside of the hybrid IC components were not damaged and were kept in a normal state. (i) Cooling / heating cycle test: A cooling / heating cycle in which a resin-sealed molded product is held for 30 minutes in a thermostat adjusted to −40 ° C. for 30 minutes, and then held for 30 minutes in a thermostat adjusted to 125 ° C. Test repeated 1000 cycles. (ii) Moisture resistance test: A test in which a resin-encapsulated molded product is kept in a thermo-hygrostat adjusted to a temperature of 80 ° C. and a relative humidity of 90% for 1000 hours.

[0032]

The present invention has the following particularly advantageous effects, and its industrial value is extremely large. 1. The resin-encapsulated molded product according to the present invention has a hard coat film formed on its surface and is excellent in surface hardness (scratch resistance), so that it can be used in a wide range without any limitation. 2. Since the resin-encapsulated molded product according to the present invention is decorated with characters, symbols, figures, patterns, colors, or a combination thereof on the surface, it is easy to identify and classify electronic components, and it is easy to mount electronic components. It is easy to handle, as it can prevent incorrect parts. 3. When according to the method of the present invention, a sheet having a surface decorated with characters, symbols, figures, patterns, colors, or a combination thereof is integrally adhered to the surface of the molded product during the production of the resin-encapsulated molded product. Therefore, there is no need for a subsequent (separate) process for decorating the surface of the molded product as in the conventional case, and special equipment, and the method of the present invention is industrially extremely advantageous as compared with the conventional production method. . 4. According to the method of the present invention, in addition to the surface hardening of the sheet integrally adhered to the surface of the resin-encapsulated molded product, by adding various functions by simultaneously improving other performances, a function matching the purpose of use is provided. The resin-sealed molded product having the same can be industrially advantageously produced.

[Brief description of the drawings]

FIG. 1 is a perspective view of an example of a hybrid IC substrate sealed with a resin.

FIG. 2 is a perspective view of an example of a sheet that is integrally welded to a surface of a resin molded article.

FIG. 3 is a fragmentary cross-sectional view showing a state where a hybrid IC substrate is supported in a mold cavity in a mold opened state.

FIG. 4 is a cross-sectional view illustrating a state where a hybrid IC substrate is supported in a mold cavity and the mold is clamped.

FIG. 5 is a cross-sectional view of a main part showing a state in which a molten resin is injected and filled in a mold cavity.

FIG. 6 is a cross-sectional view of a main part showing a state where the support member is retracted from the mold cavity and the molten resin is additionally filled.

FIG. 7 is a perspective view of an example of a resin molded article according to the present invention.

[Explanation of symbols]

 1: lead terminal 2: hybrid IC substrate 3: mold cavity 4: lead terminal receiving groove 5: upper mold 6: lower mold 7: vacuum hole 8: submarine gate 9: resin passage (runner) 10: decoration Printed sheet 11: Support member 12: Protruding pin 13: Molten resin 14: Resin layer 15: Functional coating 16: Decoration such as printing

Claims (5)

[Claims] 1. A resin-encapsulated molded product in which electric / electronic components are embedded in a thermoplastic resin, wherein a sheet or a film is integrally welded to the surface of the resin-encapsulated molded product. One side of the sheet or film is decorated with letters, symbols, figures, patterns, colors or a combination of these, and the other side is formed with a hard coat film. A resin-encapsulated product characterized by being disposed and integrally welded with a resin for encapsulation. 2. The method according to claim 1, wherein the thermoplastic resin sheet or film is
The resin molded article according to claim 1, which is produced by adding an ultraviolet absorber. 3. The method according to claim 1, wherein the thermoplastic resin sheet or film is
The resin molded article according to claim 1, wherein the molded article is produced by adding a coloring agent. 4. In producing a resin-encapsulated molded product produced by injection molding using a thermoplastic resin as a raw material,
Text on one side of the thermoplastic resin sheet or film,
A decoration consisting of a symbol, a figure, a pattern, a color or a combination thereof is applied, and a hard coat agent is applied to the other surface and cured to form a hard coat film, and the hard coat film is formed. After being arranged so as to be in contact with the surface of the mold cavity for injection molding, the support member is advanced into the mold cavity provided to be able to advance and retreat, and after supporting and fixing the electric / electronic component in the mold cavity, Injecting and filling the molten resin into the mold cavity, then retreating the above support member from the mold cavity, additionally filling the molten resin, cooling and solidifying the resin, then opening the mold and sealing the resin A method for producing a resin-encapsulated molded product, comprising releasing the molded product from a mold. 5. A hard coat film formed on one surface of a thermoplastic resin sheet or film has weather resistance performance,
The method for producing a resin-sealed molded product according to claim 4, wherein the resin-encapsulated product is provided with at least one or more functionalities of antistatic performance and antifogging performance.