AU2002224581A1 - Temperature-controlled thermal platform for automated testing - Google Patents

Temperature-controlled thermal platform for automated testing

Info

Publication number
AU2002224581A1
AU2002224581A1 AU2002224581A AU2458102A AU2002224581A1 AU 2002224581 A1 AU2002224581 A1 AU 2002224581A1 AU 2002224581 A AU2002224581 A AU 2002224581A AU 2458102 A AU2458102 A AU 2458102A AU 2002224581 A1 AU2002224581 A1 AU 2002224581A1
Authority
AU
Australia
Prior art keywords
temperature
automated testing
controlled thermal
thermal platform
platform
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2002224581A
Other languages
English (en)
Inventor
William M Stone
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Temptronic Corp
Original Assignee
Temptronic Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Temptronic Corp filed Critical Temptronic Corp
Publication of AU2002224581A1 publication Critical patent/AU2002224581A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
  • Testing Of Individual Semiconductor Devices (AREA)
  • Tests Of Electronic Circuits (AREA)
AU2002224581A 2000-07-21 2001-07-18 Temperature-controlled thermal platform for automated testing Abandoned AU2002224581A1 (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
US22001600P 2000-07-21 2000-07-21
US60/220,016 2000-07-21
US26783001P 2001-02-09 2001-02-09
US60/267,830 2001-02-09
PCT/US2001/022574 WO2002009156A1 (en) 2000-07-21 2001-07-18 Temperature-controlled thermal platform for automated testing

Publications (1)

Publication Number Publication Date
AU2002224581A1 true AU2002224581A1 (en) 2002-02-05

Family

ID=26914495

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2002224581A Abandoned AU2002224581A1 (en) 2000-07-21 2001-07-18 Temperature-controlled thermal platform for automated testing

Country Status (5)

Country Link
US (2) US6744270B2 (ja)
EP (1) EP1312106A1 (ja)
JP (1) JP2004507886A (ja)
AU (1) AU2002224581A1 (ja)
WO (1) WO2002009156A1 (ja)

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US7147214B2 (en) * 2000-01-24 2006-12-12 Ut-Battelle, Llc Humidifier for fuel cell using high conductivity carbon foam
JP2004507886A (ja) * 2000-07-21 2004-03-11 テンプトロニック　コーポレイション 温度制御された自動試験用熱プラットフォーム
US6891134B2 (en) * 2003-02-10 2005-05-10 Asml Netherlands B.V. Integrally formed bake plate unit for use in wafer fabrication system
JP2004257980A (ja) * 2003-02-27 2004-09-16 Mire Kk 半導体素子テスト用ハンドラ
US6971793B2 (en) * 2003-03-21 2005-12-06 Asm Assembly Automation Ltd. Test handler temperature monitoring system
JP2007512715A (ja) * 2003-11-26 2007-05-17 テンプトロニック コーポレイション 熱制御式チャックにおける電気的ノイズを低減する装置および方法
US20060066335A1 (en) * 2004-09-28 2006-03-30 Kang Seung H Semiconductor test device with heating circuit
US7061264B2 (en) * 2004-09-29 2006-06-13 Agere Systems, Inc. Test semiconductor device and method for determining Joule heating effects in such a device
JP4525571B2 (ja) * 2005-11-24 2010-08-18 住友電気工業株式会社 ウェハ保持体およびそれを搭載したヒータユニット、ウェハプローバ
US7461535B2 (en) * 2006-03-01 2008-12-09 Memsic, Inc. Multi-temperature programming for accelerometer
US8151872B2 (en) 2007-03-16 2012-04-10 Centipede Systems, Inc. Method and apparatus for controlling temperature
JP4598093B2 (ja) * 2008-02-15 2010-12-15 株式会社日立ハイテクノロジーズ 不良検査装置
US8087823B2 (en) * 2008-08-18 2012-01-03 International Business Machines Corporation Method for monitoring thermal control
US20100116788A1 (en) * 2008-11-12 2010-05-13 Lam Research Corporation Substrate temperature control by using liquid controlled multizone substrate support
US7888951B2 (en) * 2009-02-10 2011-02-15 Qualitau, Inc. Integrated unit for electrical/reliability testing with improved thermal control
US8779793B2 (en) * 2010-03-03 2014-07-15 Nvidia Corporation System and method for temperature cycling
US9335080B2 (en) 2011-10-17 2016-05-10 Temptronic Corporation Temperature system having an impurity filter
US9766285B2 (en) 2012-06-29 2017-09-19 Eles Semiconductor Equipment S.P.A. Test board with local thermal conditioning elements
ITMI20131086A1 (it) * 2013-06-28 2014-12-29 Eles Semiconductor Equipment S P A Scheda di test con elementi di condizionamento termico locali
ITMI20121157A1 (it) * 2012-06-29 2013-12-30 Eles Semiconductor Equipment S P A Test di dispositivi elettronici con riscaldatori disposti tra scheda di test e dispositivi elettronici da testare
KR101468984B1 (ko) * 2013-04-29 2014-12-05 (주) 예스티 엘이디 부품 테스트장치
KR20160025863A (ko) * 2014-08-28 2016-03-09 삼성전자주식회사 접속 구조물 및 이를 구비하는 테스트 핸들러와 이를 이용한 집적회로 소자의 검사 방법
CN107924204A (zh) * 2015-07-21 2018-04-17 三角设计公司 连续流体热界面材料施配
CN106990268B (zh) * 2017-04-21 2023-11-17 湖南人文科技学院 电化学综合测试仪

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DE234748C (ja)
JPS59150434A (ja) 1983-02-07 1984-08-28 Toshiba Corp 半導体装置の製造方法及び半導体製造装置
DD234748A1 (de) * 1985-02-14 1986-04-09 Erfurt Mikroelektronik Vorrichtung zum durchfuehren thermischer prozesse in der halbleiterfertigung
US4734872A (en) * 1985-04-30 1988-03-29 Temptronic Corporation Temperature control for device under test
JPH0752749B2 (ja) * 1986-02-19 1995-06-05 富士通株式会社 ウエハ−保持機構
US5198752A (en) * 1987-09-02 1993-03-30 Tokyo Electron Limited Electric probing-test machine having a cooling system
US4848090A (en) * 1988-01-27 1989-07-18 Texas Instruments Incorporated Apparatus for controlling the temperature of an integrated circuit package
JPH02148715A (ja) * 1988-11-29 1990-06-07 Canon Inc 半導体デバイスの連続形成装置
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JPH06349938A (ja) * 1993-06-11 1994-12-22 Tokyo Electron Ltd 真空処理装置
US5451884A (en) * 1993-08-04 1995-09-19 Transat Corp. Electronic component temperature test system with flat ring revolving carriage
EP0733130A4 (en) * 1993-12-17 1997-04-02 Brooks Automation Inc APPARATUS FOR HEATING OR COOLING TABLETS
JP2809595B2 (ja) 1994-11-28 1998-10-08 シーケーディ株式会社 板状物の熱処理装置及び熱処理方法
US5977785A (en) * 1996-05-28 1999-11-02 Burward-Hoy; Trevor Method and apparatus for rapidly varying the operating temperature of a semiconductor device in a testing environment
JPH1092914A (ja) * 1996-09-09 1998-04-10 Orion Mach Co Ltd 温度調節器
US6489793B2 (en) * 1996-10-21 2002-12-03 Delta Design, Inc. Temperature control of electronic devices using power following feedback
US5847927A (en) 1997-01-27 1998-12-08 Raytheon Company Electronic assembly with porous heat exchanger and orifice plate
JP3539662B2 (ja) * 1997-11-10 2004-07-07 オリオン機械株式会社 半導体ウェーハの温度調節プレート
US5983711A (en) * 1997-12-29 1999-11-16 Arizona Instrument Corporation Temperature controlled gravimetric moisture analyzer and method therefor
US6415858B1 (en) * 1997-12-31 2002-07-09 Temptronic Corporation Temperature control system for a workpiece chuck
US6070413A (en) 1998-07-01 2000-06-06 Temptronic Corporation Condensation-free apparatus and method for transferring low-temperature fluid
JP2000031253A (ja) * 1998-07-10 2000-01-28 Komatsu Ltd 基板処理装置及び方法
DE19983376T1 (de) * 1998-07-14 2001-06-28 Schlumberger Technologies Inc Vorrichtung, Verfahren und System einer auf Flüssigkeit beruhenden Temperaturwechselbeanspruchungsregelung elektronischer Bauelemente mit weitem Bereich und schnellem Ansprechen
US6445202B1 (en) * 1999-06-30 2002-09-03 Cascade Microtech, Inc. Probe station thermal chuck with shielding for capacitive current
US6399926B2 (en) * 2000-04-03 2002-06-04 Sigmameltec Ltd. Heat-treating apparatus capable of high temperature uniformity
US6545494B1 (en) * 2000-07-10 2003-04-08 Temptronic Corporation Apparatus and method for controlling temperature in a wafer using integrated temperature sensitive diode
US6552561B2 (en) * 2000-07-10 2003-04-22 Temptronic Corporation Apparatus and method for controlling temperature in a device under test using integrated temperature sensitive diode
JP2004507886A (ja) * 2000-07-21 2004-03-11 テンプトロニック　コーポレイション 温度制御された自動試験用熱プラットフォーム
US6518782B1 (en) * 2000-08-29 2003-02-11 Delta Design, Inc. Active power monitoring using externally located current sensors

Also Published As

Publication number Publication date
US6867611B2 (en) 2005-03-15
US20020047702A1 (en) 2002-04-25
US6744270B2 (en) 2004-06-01
EP1312106A1 (en) 2003-05-21
WO2002009156A1 (en) 2002-01-31
WO2002009156A8 (en) 2003-03-13
US20040174181A1 (en) 2004-09-09
JP2004507886A (ja) 2004-03-11

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