AU2001286659A1 - Methods and apparatus for obtaining data for process operation, optimization, monitoring, and control - Google Patents
Methods and apparatus for obtaining data for process operation, optimization, monitoring, and controlInfo
- Publication number
- AU2001286659A1 AU2001286659A1 AU2001286659A AU8665901A AU2001286659A1 AU 2001286659 A1 AU2001286659 A1 AU 2001286659A1 AU 2001286659 A AU2001286659 A AU 2001286659A AU 8665901 A AU8665901 A AU 8665901A AU 2001286659 A1 AU2001286659 A1 AU 2001286659A1
- Authority
- AU
- Australia
- Prior art keywords
- optimization
- monitoring
- methods
- control
- process operation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- 238000000034 method Methods 0.000 title 1
- 238000012544 monitoring process Methods 0.000 title 1
- 238000005457 optimization Methods 0.000 title 1
- 238000011112 process operation Methods 0.000 title 1
Classifications
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
- G05B19/41865—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM] characterised by job scheduling, process planning, material flow
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B19/00—Programme-control systems
- G05B19/02—Programme-control systems electric
- G05B19/418—Total factory control, i.e. centrally controlling a plurality of machines, e.g. direct or distributed numerical control [DNC], flexible manufacturing systems [FMS], integrated manufacturing systems [IMS] or computer integrated manufacturing [CIM]
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/32—Operator till task planning
- G05B2219/32019—Dynamic reconfiguration to maintain optimal design, fabrication, assembly
-
- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05B—CONTROL OR REGULATING SYSTEMS IN GENERAL; FUNCTIONAL ELEMENTS OF SUCH SYSTEMS; MONITORING OR TESTING ARRANGEMENTS FOR SUCH SYSTEMS OR ELEMENTS
- G05B2219/00—Program-control systems
- G05B2219/30—Nc systems
- G05B2219/45—Nc applications
- G05B2219/45031—Manufacturing semiconductor wafers
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/02—Total factory control, e.g. smart factories, flexible manufacturing systems [FMS] or integrated manufacturing systems [IMS]
Landscapes
- Engineering & Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Quality & Reliability (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Automation & Control Theory (AREA)
- Arrangements For Transmission Of Measured Signals (AREA)
- Drying Of Semiconductors (AREA)
- Testing And Monitoring For Control Systems (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US09/643,614 US6691068B1 (en) | 2000-08-22 | 2000-08-22 | Methods and apparatus for obtaining data for process operation, optimization, monitoring, and control |
US09643614 | 2000-08-22 | ||
PCT/US2001/026315 WO2002017030A2 (en) | 2000-08-22 | 2001-08-22 | Methods and apparatus for obtaining data for process operation, optimization, monitoring, and control |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001286659A1 true AU2001286659A1 (en) | 2002-03-04 |
Family
ID=24581572
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001286659A Withdrawn AU2001286659A1 (en) | 2000-08-22 | 2001-08-22 | Methods and apparatus for obtaining data for process operation, optimization, monitoring, and control |
Country Status (7)
Country | Link |
---|---|
US (1) | US6691068B1 (ja) |
EP (1) | EP1311917A2 (ja) |
JP (1) | JP5184733B2 (ja) |
KR (2) | KR100854354B1 (ja) |
CN (1) | CN100371839C (ja) |
AU (1) | AU2001286659A1 (ja) |
WO (1) | WO2002017030A2 (ja) |
Families Citing this family (103)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6244121B1 (en) * | 1998-03-06 | 2001-06-12 | Applied Materials, Inc. | Sensor device for non-intrusive diagnosis of a semiconductor processing system |
JP4776783B2 (ja) * | 1999-05-07 | 2011-09-21 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
DE10015619A1 (de) * | 2000-03-29 | 2001-10-04 | Endress Hauser Gmbh Co | Programmierbares Feldgerät |
US7127362B2 (en) * | 2000-08-22 | 2006-10-24 | Mundt Randall S | Process tolerant methods and apparatus for obtaining data |
JP4149807B2 (ja) * | 2000-12-15 | 2008-09-17 | ジョンソンディバーシー・インコーポレーテッド | 洗浄プロセスを監視する装置 |
US7960670B2 (en) | 2005-05-03 | 2011-06-14 | Kla-Tencor Corporation | Methods of and apparatuses for measuring electrical parameters of a plasma process |
US7282889B2 (en) * | 2001-04-19 | 2007-10-16 | Onwafer Technologies, Inc. | Maintenance unit for a sensor apparatus |
TW594455B (en) | 2001-04-19 | 2004-06-21 | Onwafer Technologies Inc | Methods and apparatus for obtaining data for process operation, optimization, monitoring, and control |
US6971036B2 (en) | 2001-04-19 | 2005-11-29 | Onwafer Technologies | Methods and apparatus for low power delay control |
US6789034B2 (en) | 2001-04-19 | 2004-09-07 | Onwafer Technologies, Inc. | Data collection methods and apparatus with parasitic correction |
US6671660B2 (en) | 2001-04-19 | 2003-12-30 | Onwafer Technologies, Inc. | Methods and apparatus for power control |
US6902947B2 (en) * | 2001-05-07 | 2005-06-07 | Applied Materials, Inc. | Integrated method for release and passivation of MEMS structures |
JPWO2002095556A1 (ja) * | 2001-05-18 | 2004-09-09 | 富士通株式会社 | 待機モードを有する装置、プログラム、及び待機モードを有する装置の制御方法 |
US6889568B2 (en) | 2002-01-24 | 2005-05-10 | Sensarray Corporation | Process condition sensing wafer and data analysis system |
US7757574B2 (en) * | 2002-01-24 | 2010-07-20 | Kla-Tencor Corporation | Process condition sensing wafer and data analysis system |
US20050224899A1 (en) * | 2002-02-06 | 2005-10-13 | Ramsey Craig C | Wireless substrate-like sensor |
US20050233770A1 (en) * | 2002-02-06 | 2005-10-20 | Ramsey Craig C | Wireless substrate-like sensor |
US7289230B2 (en) * | 2002-02-06 | 2007-10-30 | Cyberoptics Semiconductors, Inc. | Wireless substrate-like sensor |
US20050224902A1 (en) * | 2002-02-06 | 2005-10-13 | Ramsey Craig C | Wireless substrate-like sensor |
US6868353B1 (en) * | 2002-03-04 | 2005-03-15 | Advanced Micro Devices, Inc. | Method and apparatus for determining wafer quality profiles |
US20050028049A1 (en) * | 2002-04-19 | 2005-02-03 | Kameshwar Poolla | Sensor methods and apparatus |
US7085622B2 (en) * | 2002-04-19 | 2006-08-01 | Applied Material, Inc. | Vision system |
US7233841B2 (en) * | 2002-04-19 | 2007-06-19 | Applied Materials, Inc. | Vision system |
US20030209518A1 (en) * | 2002-05-08 | 2003-11-13 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method of detecting abnormal chamber conditions in etcher |
US6828542B2 (en) | 2002-06-07 | 2004-12-07 | Brion Technologies, Inc. | System and method for lithography process monitoring and control |
US6830650B2 (en) * | 2002-07-12 | 2004-12-14 | Advanced Energy Industries, Inc. | Wafer probe for measuring plasma and surface characteristics in plasma processing environments |
US20050011611A1 (en) * | 2002-07-12 | 2005-01-20 | Mahoney Leonard J. | Wafer probe for measuring plasma and surface characteristics in plasma processing environments |
US6907364B2 (en) * | 2002-09-16 | 2005-06-14 | Onwafer Technologies, Inc. | Methods and apparatus for deriving thermal flux data for processing a workpiece |
US7212950B2 (en) * | 2002-09-18 | 2007-05-01 | Onwafer Technologies, Inc. | Methods and apparatus for equipment matching and characterization |
JP3916549B2 (ja) * | 2002-10-31 | 2007-05-16 | 東京エレクトロン株式会社 | プロセスモニタ及び半導体製造装置 |
US6807503B2 (en) | 2002-11-04 | 2004-10-19 | Brion Technologies, Inc. | Method and apparatus for monitoring integrated circuit fabrication |
US7135852B2 (en) * | 2002-12-03 | 2006-11-14 | Sensarray Corporation | Integrated process condition sensing wafer and data analysis system |
US7151366B2 (en) * | 2002-12-03 | 2006-12-19 | Sensarray Corporation | Integrated process condition sensing wafer and data analysis system |
US6985787B2 (en) * | 2002-12-31 | 2006-01-10 | Tokyo Electron Limited | Method and apparatus for monitoring parts in a material processing system |
US6898558B2 (en) * | 2002-12-31 | 2005-05-24 | Tokyo Electron Limited | Method and apparatus for monitoring a material processing system |
US7109728B2 (en) * | 2003-02-25 | 2006-09-19 | Agilent Technologies, Inc. | Probe based information storage for probes used for opens detection in in-circuit testing |
US7272801B1 (en) * | 2003-03-13 | 2007-09-18 | Coventor, Inc. | System and method for process-flexible MEMS design and simulation |
US7053355B2 (en) | 2003-03-18 | 2006-05-30 | Brion Technologies, Inc. | System and method for lithography process monitoring and control |
US7016754B2 (en) * | 2003-05-08 | 2006-03-21 | Onwafer Technologies, Inc. | Methods of and apparatus for controlling process profiles |
JP4008899B2 (ja) * | 2003-09-08 | 2007-11-14 | 株式会社東芝 | 半導体装置の製造システムおよび半導体装置の製造方法 |
TWI268429B (en) * | 2003-11-29 | 2006-12-11 | Onwafer Technologies Inc | Systems, maintenance units and substrate processing systems for wirelessly charging and wirelessly communicating with sensor apparatus as well as methods for wirelessly charging and communicating with sensor apparatus |
US7020583B2 (en) * | 2004-01-30 | 2006-03-28 | Tokyo Electron Limited | Method and apparatus for determining chemistry of part's residual contamination |
JP3868427B2 (ja) * | 2004-02-23 | 2007-01-17 | 株式会社半導体理工学研究センター | プラズマプロセスのリアルタイムモニタ装置 |
US7415312B2 (en) * | 2004-05-25 | 2008-08-19 | Barnett Jr James R | Process module tuning |
US7171334B2 (en) * | 2004-06-01 | 2007-01-30 | Brion Technologies, Inc. | Method and apparatus for synchronizing data acquisition of a monitored IC fabrication process |
US20050284570A1 (en) * | 2004-06-24 | 2005-12-29 | Doran Daniel B | Diagnostic plasma measurement device having patterned sensors and features |
US7363195B2 (en) * | 2004-07-07 | 2008-04-22 | Sensarray Corporation | Methods of configuring a sensor network |
US7299148B2 (en) * | 2004-07-10 | 2007-11-20 | Onwafer Technologies, Inc. | Methods and apparatus for low distortion parameter measurements |
TWI336823B (en) * | 2004-07-10 | 2011-02-01 | Onwafer Technologies Inc | Methods of and apparatuses for maintenance, diagnosis, and optimization of processes |
US20060043063A1 (en) * | 2004-09-02 | 2006-03-02 | Mahoney Leonard J | Electrically floating diagnostic plasma probe with ion property sensors |
US7676342B2 (en) * | 2004-12-23 | 2010-03-09 | Asml Netherlands B.V. | Sensor assembly, digital serial bus and protocol, sensor network, and lithographic apparatus and system |
US20060171848A1 (en) * | 2005-01-31 | 2006-08-03 | Advanced Energy Industries, Inc. | Diagnostic plasma sensors for endpoint and end-of-life detection |
US7722434B2 (en) | 2005-03-29 | 2010-05-25 | Kla-Tencor Corporation | Apparatus for measurement of parameters in process equipment |
US20060234398A1 (en) * | 2005-04-15 | 2006-10-19 | International Business Machines Corporation | Single ic-chip design on wafer with an embedded sensor utilizing rf capabilities to enable real-time data transmission |
US7467065B2 (en) * | 2005-05-02 | 2008-12-16 | Home Diagnostics, Inc. | Computer interface for diagnostic meter |
US7482576B2 (en) * | 2005-05-03 | 2009-01-27 | Kla-Tencor Corporation | Apparatuses for and methods of monitoring optical radiation parameters for substrate processing operations |
US8604361B2 (en) * | 2005-12-13 | 2013-12-10 | Kla-Tencor Corporation | Component package for maintaining safe operating temperature of components |
CN101410690B (zh) * | 2006-02-21 | 2011-11-23 | 赛博光学半导体公司 | 半导体加工工具中的电容性距离感测 |
US7893697B2 (en) * | 2006-02-21 | 2011-02-22 | Cyberoptics Semiconductor, Inc. | Capacitive distance sensing in semiconductor processing tools |
US7555948B2 (en) * | 2006-05-01 | 2009-07-07 | Lynn Karl Wiese | Process condition measuring device with shielding |
US7540188B2 (en) * | 2006-05-01 | 2009-06-02 | Lynn Karl Wiese | Process condition measuring device with shielding |
US7638798B2 (en) * | 2006-08-24 | 2009-12-29 | Coherent, Inc. | Laminated wafer sensor system for UV dose measurement |
JP5236652B2 (ja) * | 2006-09-29 | 2013-07-17 | サイバーオプティクス セミコンダクタ インコーポレイテッド | 基板と一体化された粒子センサ |
US7698952B2 (en) * | 2006-10-03 | 2010-04-20 | Kla-Tencor Corporation | Pressure sensing device |
WO2008042903A2 (en) * | 2006-10-03 | 2008-04-10 | Kla-Tencor Technologies Corporation | Systems for sensing pressure/shear force |
JP2010519768A (ja) | 2007-02-23 | 2010-06-03 | ケーエルエー−テンカー・コーポレーション | プロセス条件測定デバイス |
US7778793B2 (en) * | 2007-03-12 | 2010-08-17 | Cyberoptics Semiconductor, Inc. | Wireless sensor for semiconductor processing systems |
US20080246493A1 (en) * | 2007-04-05 | 2008-10-09 | Gardner Delrae H | Semiconductor Processing System With Integrated Showerhead Distance Measuring Device |
US7398184B1 (en) * | 2007-04-09 | 2008-07-08 | Honeywell International Inc. | Analyzing equipment performance and optimizing operating costs |
US20090015268A1 (en) * | 2007-07-13 | 2009-01-15 | Gardner Delrae H | Device and method for compensating a capacitive sensor measurement for variations caused by environmental conditions in a semiconductor processing environment |
US9025126B2 (en) * | 2007-07-31 | 2015-05-05 | Nikon Corporation | Exposure apparatus adjusting method, exposure apparatus, and device fabricating method |
JP2009164425A (ja) * | 2008-01-08 | 2009-07-23 | Oki Semiconductor Co Ltd | リアルタイムモニタ装置及び動作方法 |
US8824691B2 (en) | 2008-02-01 | 2014-09-02 | Honeywell International Inc. | Apparatus and method for monitoring sound in a process system |
JP2009244174A (ja) * | 2008-03-31 | 2009-10-22 | Tokyo Electron Ltd | ウェハ型温度計、温度測定装置、熱処理装置および温度測定方法 |
US20090320143A1 (en) * | 2008-06-24 | 2009-12-24 | Microsoft Corporation | Sensor interface |
US8103367B2 (en) * | 2008-11-20 | 2012-01-24 | Fisher-Rosemount Systems, Inc. | Methods and apparatus to draw attention to information presented via electronic displays to process plant operators |
JP5465995B2 (ja) * | 2009-01-06 | 2014-04-09 | 株式会社日立国際電気 | 基板処理システム、収集ユニット、基板処理装置のデータ処理方法および基板処理装置 |
KR101124419B1 (ko) * | 2009-02-18 | 2012-03-20 | 포항공과대학교 산학협력단 | 마이크로파 플라즈마 생성을 위한 휴대용 전력 공급 장치 |
KR101037433B1 (ko) * | 2009-03-06 | 2011-05-30 | 전자부품연구원 | 지중 시설물 관리를 위한 무선 통신 시스템 |
US20110074341A1 (en) * | 2009-09-25 | 2011-03-31 | Kla- Tencor Corporation | Non-contact interface system |
US8889021B2 (en) * | 2010-01-21 | 2014-11-18 | Kla-Tencor Corporation | Process condition sensing device and method for plasma chamber |
IES20100241A2 (en) | 2010-04-21 | 2011-10-26 | Impedans Ltd | Sensing of process parameters |
US8537508B2 (en) * | 2010-07-20 | 2013-09-17 | Emprimus, Llc | Sensing and control electronics for a power grid protection system |
US9134186B2 (en) | 2011-02-03 | 2015-09-15 | Kla-Tencor Corporation | Process condition measuring device (PCMD) and method for measuring process conditions in a workpiece processing tool configured to process production workpieces |
US8681493B2 (en) | 2011-05-10 | 2014-03-25 | Kla-Tencor Corporation | Heat shield module for substrate-like metrology device |
CN102541006A (zh) * | 2011-12-27 | 2012-07-04 | 南京理学工程数据技术有限公司 | 远程工况采集方法 |
CN102662370A (zh) * | 2012-05-04 | 2012-09-12 | 安徽博源自动化仪表有限公司 | 一种远程监控系统及方法 |
US9356822B2 (en) * | 2012-10-30 | 2016-05-31 | Kla-Tencor Corporation | Automated interface apparatus and method for use in semiconductor wafer handling systems |
KR102109069B1 (ko) * | 2013-03-27 | 2020-05-12 | 윌코아게 | 디바이스들을 인라인 검사 및/또는 테스트하는 방법 및 그와 같은 방법을 수행하는 장치 |
KR102059716B1 (ko) | 2013-05-30 | 2019-12-26 | 케이엘에이 코포레이션 | 열 플럭스를 측정하기 위한 방법 및 시스템 |
JP2014029860A (ja) * | 2013-08-27 | 2014-02-13 | Advantest Corp | 電源装置および測定用デバイス |
CN103499950A (zh) * | 2013-09-11 | 2014-01-08 | 广西玉柴重工有限公司 | 一种用于工程机械的gps终端精细数据采集系统 |
CN104626151B (zh) * | 2013-11-13 | 2016-06-29 | 沈阳新松机器人自动化股份有限公司 | 一种机械手晶圆定心装置及方法 |
US10088836B2 (en) * | 2015-07-29 | 2018-10-02 | General Electric Company | Methods, systems, and apparatus for resource allocation in a manufacturing environment |
DE102015219564A1 (de) * | 2015-10-09 | 2017-04-13 | Robert Bosch Gmbh | Werkzeuganalyseeinrichtung und verfahren zur analyse einer bearbeitung eines werkstücks mit einem werkzeug |
KR20180093966A (ko) * | 2015-12-10 | 2018-08-22 | 아이오니어 엘엘씨 | 프로세스 동작의 파라미터들을 결정하기 위한 장치 및 방법 |
US10656045B2 (en) | 2017-01-17 | 2020-05-19 | Kathleen Mary Mutch | Apparatus for analyzing the performance of fluid distribution equipment |
CN107942958B (zh) * | 2017-10-13 | 2019-06-14 | 北京邮电大学 | 一种面向物联网的工业控制系统及方法 |
TWI662548B (zh) * | 2018-01-23 | 2019-06-11 | 緯創資通股份有限公司 | 資料管理電路 |
JP7066557B2 (ja) | 2018-07-12 | 2022-05-13 | 東京エレクトロン株式会社 | 温度測定センサ、温度測定システム、および、温度測定方法 |
US11169449B2 (en) | 2019-04-18 | 2021-11-09 | Samsung Electronics Co., Ltd. | Measuring apparatus for vacuum chamber and measuring system including the same |
DE102019110619A1 (de) * | 2019-04-24 | 2019-07-11 | Bayerische Motoren Werke Aktiengesellschaft | Verfahren zum Verfolgen eines Bauteils in einer mehrere Prozessanlagen umfassenden Fertigungslinie sowie Recheneinrichtung |
JP2024053414A (ja) * | 2022-10-03 | 2024-04-15 | 株式会社Screenホールディングス | センシング端末およびセンシング方法 |
Family Cites Families (37)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
USRE32369E (en) | 1980-11-17 | 1987-03-10 | Ball Corporation | Monolithic microwave integrated circuit with integral array antenna |
AU555481B2 (en) | 1983-06-14 | 1986-09-25 | Gte Valeron Corp. | Remote measuring apparatus |
US4745564B2 (en) * | 1986-02-07 | 2000-07-04 | Us Agriculture | Impact detection apparatus |
DE3729644C2 (de) * | 1987-09-04 | 1997-09-11 | Zeiss Carl Fa | Verfahren zur Bestimmung der Temperatur von Werkstücken in flexiblen Fertigungssystemen |
DE3743846A1 (de) * | 1987-12-23 | 1989-07-13 | Porsche Ag | Messwertaufnehmer |
EP0337669B1 (en) | 1988-04-12 | 1994-06-29 | Renishaw plc | Signal transmission system for machine tools, inspection machines, and the like |
GB8827288D0 (en) | 1988-11-22 | 1988-12-29 | Byron R S | Articles to be worn |
US5089979A (en) * | 1989-02-08 | 1992-02-18 | Basic Measuring Instruments | Apparatus for digital calibration of detachable transducers |
CN2071781U (zh) * | 1990-01-22 | 1991-02-20 | 沈阳工业大学 | 多坐标光栅数显表 |
JP3216205B2 (ja) * | 1992-03-27 | 2001-10-09 | 神鋼電機株式会社 | 半導体製造システムにおけるid認識装置 |
US5262944A (en) | 1992-05-15 | 1993-11-16 | Hewlett-Packard Company | Method for use of color and selective highlighting to indicate patient critical events in a centralized patient monitoring system |
US5300875A (en) * | 1992-06-08 | 1994-04-05 | Micron Technology, Inc. | Passive (non-contact) recharging of secondary battery cell(s) powering RFID transponder tags |
JP3250285B2 (ja) * | 1992-11-26 | 2002-01-28 | セイコーエプソン株式会社 | 情報計測手段を備えた被処理基板 |
US5457447A (en) * | 1993-03-31 | 1995-10-10 | Motorola, Inc. | Portable power source and RF tag utilizing same |
DE4327342A1 (de) | 1993-08-16 | 1995-02-23 | Aeg Sensorsysteme Gmbh | Mehrfach wiederverwendbarer Transportbehälter für Fördergüter |
US5444637A (en) * | 1993-09-28 | 1995-08-22 | Advanced Micro Devices, Inc. | Programmable semiconductor wafer for sensing, recording and retrieving fabrication process conditions to which the wafer is exposed |
US5526293A (en) * | 1993-12-17 | 1996-06-11 | Texas Instruments Inc. | System and method for controlling semiconductor wafer processing |
EP0997714A3 (en) * | 1994-08-31 | 2001-06-06 | Honeywell Inc. | Remote self-powered structure monitor |
US5625569A (en) * | 1995-01-23 | 1997-04-29 | Trimmer Engineering, Inc. | Low power flow measuring device |
JPH08306665A (ja) * | 1995-04-28 | 1996-11-22 | Ricoh Co Ltd | 真空装置内における物理量測定装置 |
US5839094A (en) * | 1995-06-30 | 1998-11-17 | Ada Technologies, Inc. | Portable data collection device with self identifying probe |
FR2743194B1 (fr) | 1995-12-29 | 1998-03-20 | Sgs Thomson Microelectronics | Identification de carte a pointes pour une fabrication assistee par ordinateur |
US5907820A (en) | 1996-03-22 | 1999-05-25 | Applied Materials, Inc. | System for acquiring and analyzing a two-dimensional array of data |
DE69627672D1 (de) | 1996-12-16 | 2003-05-28 | St Microelectronics Srl | Methode zur Feststellung der Auswirkungen von Plasmabehandlungen auf Halbleiterscheiben |
US5959309A (en) | 1997-04-07 | 1999-09-28 | Industrial Technology Research Institute | Sensor to monitor plasma induced charging damage |
US6275143B1 (en) * | 1997-05-09 | 2001-08-14 | Anatoli Stobbe | Security device having wireless energy transmission |
US5967661A (en) | 1997-06-02 | 1999-10-19 | Sensarray Corporation | Temperature calibration substrate |
US5989349A (en) | 1997-06-24 | 1999-11-23 | Applied Materials, Inc. | Diagnostic pedestal assembly for a semiconductor wafer processing system |
US5969639A (en) | 1997-07-28 | 1999-10-19 | Lockheed Martin Energy Research Corporation | Temperature measuring device |
US6418352B1 (en) | 1997-12-12 | 2002-07-09 | Brooks Automation Gmbh | Integrated material management module |
US5970313A (en) | 1997-12-19 | 1999-10-19 | Advanced Micro Devices, Inc. | Monitoring wafer temperature during thermal processing of wafers by measuring sheet resistance of a test wafer |
US6244121B1 (en) | 1998-03-06 | 2001-06-12 | Applied Materials, Inc. | Sensor device for non-intrusive diagnosis of a semiconductor processing system |
JPH11307606A (ja) * | 1998-04-20 | 1999-11-05 | Dainippon Screen Mfg Co Ltd | 基板熱処理装置の評価方法および評価装置 |
US6125686A (en) * | 1998-05-08 | 2000-10-03 | Pei Innovations Inc. | Impact measuring device for delicate and fragile articles |
TW386283B (en) | 1998-05-25 | 2000-04-01 | United Microelectronics Corp | A method of manufacturing the buried contact of an SRAM cell |
WO2000002236A2 (en) | 1998-07-07 | 2000-01-13 | Memc Electronic Materials, Inc. | Radio frequency identification system and method for tracking silicon wafers |
JP2000293829A (ja) * | 1999-02-02 | 2000-10-20 | Hitachi Ltd | 基板処理装置及び基板処理方法 |
-
2000
- 2000-08-22 US US09/643,614 patent/US6691068B1/en not_active Expired - Lifetime
-
2001
- 2001-08-22 AU AU2001286659A patent/AU2001286659A1/en not_active Withdrawn
- 2001-08-22 KR KR1020037002644A patent/KR100854354B1/ko active IP Right Grant
- 2001-08-22 CN CNB01816062XA patent/CN100371839C/zh not_active Expired - Lifetime
- 2001-08-22 JP JP2002521658A patent/JP5184733B2/ja not_active Expired - Lifetime
- 2001-08-22 EP EP01966119A patent/EP1311917A2/en not_active Ceased
- 2001-08-22 KR KR1020087008593A patent/KR100885472B1/ko active IP Right Grant
- 2001-08-22 WO PCT/US2001/026315 patent/WO2002017030A2/en active Application Filing
Also Published As
Publication number | Publication date |
---|---|
WO2002017030A3 (en) | 2003-01-09 |
US6691068B1 (en) | 2004-02-10 |
EP1311917A2 (en) | 2003-05-21 |
KR100854354B1 (ko) | 2008-08-26 |
JP2004507889A (ja) | 2004-03-11 |
CN100371839C (zh) | 2008-02-27 |
WO2002017030A2 (en) | 2002-02-28 |
WO2002017030B1 (en) | 2003-03-27 |
KR100885472B1 (ko) | 2009-02-24 |
KR20080035031A (ko) | 2008-04-22 |
KR20030048015A (ko) | 2003-06-18 |
JP5184733B2 (ja) | 2013-04-17 |
CN1479887A (zh) | 2004-03-03 |
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