AU2002224405A1 - Method and apparatus for providing communication between a defect source identifier and a tool data collection and control system - Google Patents
Method and apparatus for providing communication between a defect source identifier and a tool data collection and control systemInfo
- Publication number
- AU2002224405A1 AU2002224405A1 AU2002224405A AU2440502A AU2002224405A1 AU 2002224405 A1 AU2002224405 A1 AU 2002224405A1 AU 2002224405 A AU2002224405 A AU 2002224405A AU 2440502 A AU2440502 A AU 2440502A AU 2002224405 A1 AU2002224405 A1 AU 2002224405A1
- Authority
- AU
- Australia
- Prior art keywords
- control system
- data collection
- source identifier
- providing communication
- tool data
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 238000013480 data collection Methods 0.000 title 1
- 230000007547 defect Effects 0.000 title 1
- 238000000034 method Methods 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L22/00—Testing or measuring during manufacture or treatment; Reliability measurements, i.e. testing of parts without further processing to modify the parts as such; Structural arrangements therefor
- H01L22/20—Sequence of activities consisting of a plurality of measurements, corrections, marking or sorting steps
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q30/00—Commerce
- G06Q30/02—Marketing; Price estimation or determination; Fundraising
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06Q—INFORMATION AND COMMUNICATION TECHNOLOGY [ICT] SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES; SYSTEMS OR METHODS SPECIALLY ADAPTED FOR ADMINISTRATIVE, COMMERCIAL, FINANCIAL, MANAGERIAL OR SUPERVISORY PURPOSES, NOT OTHERWISE PROVIDED FOR
- G06Q50/00—Information and communication technology [ICT] specially adapted for implementation of business processes of specific business sectors, e.g. utilities or tourism
- G06Q50/04—Manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P90/00—Enabling technologies with a potential contribution to greenhouse gas [GHG] emissions mitigation
- Y02P90/30—Computing systems specially adapted for manufacturing
Landscapes
- Engineering & Computer Science (AREA)
- Business, Economics & Management (AREA)
- Strategic Management (AREA)
- Development Economics (AREA)
- Manufacturing & Machinery (AREA)
- Finance (AREA)
- Theoretical Computer Science (AREA)
- Accounting & Taxation (AREA)
- Economics (AREA)
- Marketing (AREA)
- Physics & Mathematics (AREA)
- General Business, Economics & Management (AREA)
- General Physics & Mathematics (AREA)
- Game Theory and Decision Science (AREA)
- Entrepreneurship & Innovation (AREA)
- Health & Medical Sciences (AREA)
- General Health & Medical Sciences (AREA)
- Human Resources & Organizations (AREA)
- Primary Health Care (AREA)
- Tourism & Hospitality (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
- General Factory Administration (AREA)
- Management, Administration, Business Operations System, And Electronic Commerce (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US24063100P | 2000-10-16 | 2000-10-16 | |
US60/240,631 | 2000-10-16 | ||
PCT/US2001/032440 WO2002033745A2 (en) | 2000-10-16 | 2001-10-16 | Method and apparatus for providing communication between a defect source identifier and a tool data collection and control system |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2002224405A1 true AU2002224405A1 (en) | 2002-04-29 |
Family
ID=22907299
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2002224405A Abandoned AU2002224405A1 (en) | 2000-10-16 | 2001-10-16 | Method and apparatus for providing communication between a defect source identifier and a tool data collection and control system |
Country Status (6)
Country | Link |
---|---|
US (2) | US20020046001A1 (en) |
EP (1) | EP1327262A2 (en) |
CN (1) | CN1205663C (en) |
AU (1) | AU2002224405A1 (en) |
TW (1) | TW521365B (en) |
WO (1) | WO2002033745A2 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6810337B1 (en) * | 2002-03-07 | 2004-10-26 | Bellsouth Intellectual Property Corporation | Systems and methods for tracking the age of air pressure and flow alarm conditions within a pressurized cable network |
EP3664131A3 (en) | 2002-03-12 | 2020-08-19 | Hamamatsu Photonics K. K. | Substrate dividing method |
US7401066B2 (en) * | 2002-03-21 | 2008-07-15 | Applied Materials, Inc. | Correlation of end-of-line data mining with process tool data mining |
US7129694B2 (en) * | 2002-05-23 | 2006-10-31 | Applied Materials, Inc. | Large substrate test system |
US20050004780A1 (en) * | 2003-07-03 | 2005-01-06 | Taiwan Semiconductor Manufacturing Co., Ltd | Virtual assistant for semiconductor tool maintenance |
TWI336823B (en) * | 2004-07-10 | 2011-02-01 | Onwafer Technologies Inc | Methods of and apparatuses for maintenance, diagnosis, and optimization of processes |
US7075323B2 (en) | 2004-07-29 | 2006-07-11 | Applied Materials, Inc. | Large substrate test system |
KR20070104331A (en) * | 2004-10-12 | 2007-10-25 | 케이엘에이-텐코 테크놀로지스 코퍼레이션 | Computer-implemented methods and systems for classifying defects on a specimen |
US7494893B1 (en) * | 2007-01-17 | 2009-02-24 | Pdf Solutions, Inc. | Identifying yield-relevant process parameters in integrated circuit device fabrication processes |
JP6453805B2 (en) * | 2016-04-25 | 2019-01-16 | ファナック株式会社 | Production system for setting judgment values for variables related to product abnormalities |
US10031997B1 (en) * | 2016-11-29 | 2018-07-24 | Taiwan Semiconductor Manufacturing Co., Ltd. | Forecasting wafer defects using frequency domain analysis |
TWI632441B (en) | 2017-01-20 | 2018-08-11 | 財團法人工業技術研究院 | Prognostics method and device for processing apparatus |
US10360671B2 (en) * | 2017-07-11 | 2019-07-23 | Kla-Tencor Corporation | Tool health monitoring and matching |
Family Cites Families (25)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5233191A (en) | 1990-04-02 | 1993-08-03 | Hitachi, Ltd. | Method and apparatus of inspecting foreign matters during mass production start-up and mass production line in semiconductor production process |
US5412757A (en) * | 1990-11-28 | 1995-05-02 | Kabushiki Kaisha Toshiba | Fuzzy control system |
JPH06168863A (en) | 1991-03-01 | 1994-06-14 | Texas Instr Inc <Ti> | Apparatus and method for execution of monitoring and control of semiconductor manufacturing apparatus |
US5923430A (en) | 1993-06-17 | 1999-07-13 | Ultrapointe Corporation | Method for characterizing defects on semiconductor wafers |
US5544256A (en) | 1993-10-22 | 1996-08-06 | International Business Machines Corporation | Automated defect classification system |
KR960015001A (en) | 1994-10-07 | 1996-05-22 | 가나이 쓰토무 | Method and apparatus for manufacturing a semiconductor substrate and for inspecting pattern defects on an inspected object |
US5598341A (en) | 1995-03-10 | 1997-01-28 | Advanced Micro Devices, Inc. | Real-time in-line defect disposition and yield forecasting system |
US5539752A (en) | 1995-06-30 | 1996-07-23 | Advanced Micro Devices, Inc. | Method and system for automated analysis of semiconductor defect data |
US5761064A (en) | 1995-10-06 | 1998-06-02 | Advanced Micro Devices, Inc. | Defect management system for productivity and yield improvement |
JPH09199551A (en) | 1996-01-12 | 1997-07-31 | Mitsubishi Electric Corp | Inspection data analyzing/processing system for inline inspection |
DE69738979D1 (en) | 1996-03-19 | 2008-10-23 | Hitachi Ltd | PROCESS CONTROL SYSTEM |
US5949901A (en) | 1996-03-21 | 1999-09-07 | Nichani; Sanjay | Semiconductor device image inspection utilizing image subtraction and threshold imaging |
US5959459A (en) | 1996-12-10 | 1999-09-28 | International Business Machines Corporation | Defect monitor and method for automated contactless inline wafer inspection |
TW331650B (en) * | 1997-05-26 | 1998-05-11 | Taiwan Semiconductor Mfg Co Ltd | Integrated defect yield management system for semiconductor manufacturing |
US5966459A (en) | 1997-07-17 | 1999-10-12 | Advanced Micro Devices, Inc. | Automatic defect classification (ADC) reclassification engine |
US5862055A (en) | 1997-07-18 | 1999-01-19 | Advanced Micro Devices, Inc. | Automatic defect classification individual defect predicate value retention |
EP0932194A1 (en) | 1997-12-30 | 1999-07-28 | International Business Machines Corporation | Method and system for semiconductor wafer fabrication process real-time in-situ interactive supervision |
US6664897B2 (en) * | 1998-03-09 | 2003-12-16 | William R. Pape | Method and system for livestock data collection and management |
US6408219B2 (en) * | 1998-05-11 | 2002-06-18 | Applied Materials, Inc. | FAB yield enhancement system |
US6167448A (en) | 1998-06-11 | 2000-12-26 | Compaq Computer Corporation | Management event notification system using event notification messages written using a markup language |
US6466314B1 (en) * | 1998-09-17 | 2002-10-15 | Applied Materials, Inc. | Reticle design inspection system |
US6324527B1 (en) * | 1998-09-22 | 2001-11-27 | International Business Machines Corporation | Methodology for distinguishing the cost of products in a multiple part number, multiple technology, fully or partially loaded semiconductor fabricator |
US6469518B1 (en) | 2000-01-07 | 2002-10-22 | Advanced Micro Devices, Inc. | Method and apparatus for determining measurement frequency based on hardware age and usage |
US6458605B1 (en) * | 2001-06-28 | 2002-10-01 | Advanced Micro Devices, Inc. | Method and apparatus for controlling photolithography overlay registration |
US6562185B2 (en) * | 2001-09-18 | 2003-05-13 | Advanced Micro Devices, Inc. | Wafer based temperature sensors for characterizing chemical mechanical polishing processes |
-
2001
- 2001-07-13 US US09/905,514 patent/US20020046001A1/en not_active Abandoned
- 2001-10-15 US US09/978,300 patent/US6714884B2/en not_active Expired - Fee Related
- 2001-10-16 EP EP01987947A patent/EP1327262A2/en not_active Withdrawn
- 2001-10-16 AU AU2002224405A patent/AU2002224405A1/en not_active Abandoned
- 2001-10-16 TW TW090125615A patent/TW521365B/en not_active IP Right Cessation
- 2001-10-16 WO PCT/US2001/032440 patent/WO2002033745A2/en not_active Application Discontinuation
- 2001-10-16 CN CNB018030610A patent/CN1205663C/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
US20020046001A1 (en) | 2002-04-18 |
WO2002033745A2 (en) | 2002-04-25 |
EP1327262A2 (en) | 2003-07-16 |
US6714884B2 (en) | 2004-03-30 |
TW521365B (en) | 2003-02-21 |
CN1440569A (en) | 2003-09-03 |
WO2002033745A3 (en) | 2003-03-27 |
US20020069024A1 (en) | 2002-06-06 |
CN1205663C (en) | 2005-06-08 |
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