AU2001271627A1 - No-flow flux adhesive compositions - Google Patents
No-flow flux adhesive compositionsInfo
- Publication number
- AU2001271627A1 AU2001271627A1 AU2001271627A AU7162701A AU2001271627A1 AU 2001271627 A1 AU2001271627 A1 AU 2001271627A1 AU 2001271627 A AU2001271627 A AU 2001271627A AU 7162701 A AU7162701 A AU 7162701A AU 2001271627 A1 AU2001271627 A1 AU 2001271627A1
- Authority
- AU
- Australia
- Prior art keywords
- adhesive compositions
- anhydride
- flow flux
- epoxy resin
- flux adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Abandoned
Links
- 239000000853 adhesive Substances 0.000 title abstract 3
- 230000001070 adhesive effect Effects 0.000 title abstract 3
- 239000000203 mixture Substances 0.000 title abstract 3
- 230000004907 flux Effects 0.000 title 1
- 150000008064 anhydrides Chemical class 0.000 abstract 3
- 239000003822 epoxy resin Substances 0.000 abstract 2
- 229920000647 polyepoxide Polymers 0.000 abstract 2
- 239000003054 catalyst Substances 0.000 abstract 1
- 239000003795 chemical substances by application Substances 0.000 abstract 1
- 150000001875 compounds Chemical class 0.000 abstract 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 abstract 1
- 238000011065 in-situ storage Methods 0.000 abstract 1
- 229910000679 solder Inorganic materials 0.000 abstract 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
- H01L21/563—Encapsulation of active face of flip-chip device, e.g. underfilling or underencapsulation of flip-chip, encapsulation preform on chip or mounting substrate
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/42—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof
- C08G59/4284—Polycarboxylic acids; Anhydrides, halides or low molecular weight esters thereof together with other curing agents
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J163/00—Adhesives based on epoxy resins; Adhesives based on derivatives of epoxy resins
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
- H01L24/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
- H01L24/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73201—Location after the connecting process on the same surface
- H01L2224/73203—Bump and layer connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01019—Potassium [K]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01025—Manganese [Mn]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/01—Chemical elements
- H01L2924/01029—Copper [Cu]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/013—Alloys
- H01L2924/0132—Binary Alloys
- H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/102—Material of the semiconductor or solid state bodies
- H01L2924/1025—Semiconducting materials
- H01L2924/10251—Elemental semiconductors, i.e. Group IV
- H01L2924/10253—Silicon [Si]
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/11—Device type
- H01L2924/14—Integrated circuits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/31504—Composite [nonstructural laminate]
- Y10T428/31511—Of epoxy ether
- Y10T428/31515—As intermediate layer
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Polymers & Plastics (AREA)
- Medicinal Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Computer Hardware Design (AREA)
- Health & Medical Sciences (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Epoxy Resins (AREA)
- Adhesives Or Adhesive Processes (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US21628000P | 2000-07-06 | 2000-07-06 | |
US60216280 | 2000-07-06 | ||
PCT/US2001/020734 WO2002004541A2 (en) | 2000-07-06 | 2001-06-29 | No-flow flux adhesive compositions |
Publications (1)
Publication Number | Publication Date |
---|---|
AU2001271627A1 true AU2001271627A1 (en) | 2002-01-21 |
Family
ID=22806455
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
AU2001271627A Abandoned AU2001271627A1 (en) | 2000-07-06 | 2001-06-29 | No-flow flux adhesive compositions |
Country Status (8)
Country | Link |
---|---|
US (1) | US6528169B2 (zh) |
EP (1) | EP1299447B1 (zh) |
JP (1) | JP2004502846A (zh) |
CN (1) | CN1449418A (zh) |
AT (1) | ATE274539T1 (zh) |
AU (1) | AU2001271627A1 (zh) |
DE (1) | DE60105164T2 (zh) |
WO (1) | WO2002004541A2 (zh) |
Families Citing this family (32)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US6971163B1 (en) * | 1998-04-22 | 2005-12-06 | Dow Corning Corporation | Adhesive and encapsulating material with fluxing properties |
US7323360B2 (en) | 2001-10-26 | 2008-01-29 | Intel Corporation | Electronic assemblies with filled no-flow underfill |
US6620512B2 (en) * | 2001-12-21 | 2003-09-16 | Intel Corporation | Anhydride polymers for use as curing agents in epoxy resin-based underfill material |
EP1561355B1 (en) * | 2002-11-05 | 2016-03-09 | Telefonaktiebolaget LM Ericsson (publ) | Collective notification of node reset to subset of connections in radio access network |
US6882058B2 (en) * | 2002-11-05 | 2005-04-19 | Henkel Corporation | Organic acid containing compositions and methods for use thereof |
US20040101688A1 (en) * | 2002-11-22 | 2004-05-27 | Slawomir Rubinsztajn | Curable epoxy compositions, methods and articles made therefrom |
US20050181214A1 (en) * | 2002-11-22 | 2005-08-18 | John Robert Campbell | Curable epoxy compositions, methods and articles made therefrom |
US20040102529A1 (en) * | 2002-11-22 | 2004-05-27 | Campbell John Robert | Functionalized colloidal silica, dispersions and methods made thereby |
US20060147719A1 (en) * | 2002-11-22 | 2006-07-06 | Slawomir Rubinsztajn | Curable composition, underfill, and method |
US6902954B2 (en) * | 2003-03-31 | 2005-06-07 | Intel Corporation | Temperature sustaining flip chip assembly process |
JP2004307859A (ja) * | 2003-04-05 | 2004-11-04 | Rohm & Haas Electronic Materials Llc | 電子デバイス製造 |
US7004375B2 (en) * | 2003-05-23 | 2006-02-28 | National Starch And Chemical Investment Holding Corporation | Pre-applied fluxing underfill composition having pressure sensitive adhesive properties |
US7047633B2 (en) * | 2003-05-23 | 2006-05-23 | National Starch And Chemical Investment Holding, Corporation | Method of using pre-applied underfill encapsulant |
US20060142424A1 (en) * | 2003-05-23 | 2006-06-29 | Jayesh Shah | Foamable underfill encapsulant |
US20040245611A1 (en) * | 2003-05-23 | 2004-12-09 | Paul Morganelli | Pre-applied thermoplastic reinforcement for electronic components |
US20040235996A1 (en) * | 2003-05-23 | 2004-11-25 | Jayesh Shah | Foamable underfill encapsulant |
US20040238925A1 (en) * | 2003-05-23 | 2004-12-02 | Paul Morganelli | Pre-applied thermoplastic reinforcement for electronic components |
US20040232530A1 (en) * | 2003-05-23 | 2004-11-25 | Paul Morganelli | Pre-applied thermoplastic reinforcement for electronic components |
US6978540B2 (en) * | 2003-05-23 | 2005-12-27 | National Starch And Chemical Investment Holding Corporation | Method for pre-applied thermoplastic reinforcement of electronic components |
JP4396879B2 (ja) * | 2003-06-06 | 2010-01-13 | インターメタリックス株式会社 | 粘着層形成方法 |
US7279223B2 (en) * | 2003-12-16 | 2007-10-09 | General Electric Company | Underfill composition and packaged solid state device |
US20060025509A1 (en) * | 2004-07-29 | 2006-02-02 | Ruzhi Zhang | Fluxing no-flow underfill composition containing benzoxazines |
EP1628508A1 (fr) * | 2004-08-19 | 2006-02-22 | Valtronic S.A. | Procédé de réalisation d'un module électronique |
US20060177966A1 (en) * | 2005-02-09 | 2006-08-10 | Jayesh Shah | Package or pre-applied foamable underfill for lead-free process |
JP5503830B2 (ja) * | 2005-07-07 | 2014-05-28 | 積水化学工業株式会社 | エポキシ系接着剤組成物及び接合方法 |
DE102005060348A1 (de) * | 2005-09-28 | 2007-03-29 | Osram Opto Semiconductors Gmbh | Epoxidharzsystem sowie aus dem Epoxidharzsystem herstellbarer Formstoff und optoelektronisches Bauelement mit dem Formstoff |
CN101490187A (zh) * | 2006-05-16 | 2009-07-22 | 洛德公司 | 用于电子组件的可固化的防护剂 |
CN102084482B (zh) * | 2008-03-19 | 2013-05-29 | 汉高公司 | 以浸渍工艺使用施加于焊接触点上的助熔底部填充组合物制造半导体包装物或线路组件的方法 |
EP2401898A1 (en) * | 2009-02-25 | 2012-01-04 | 3M Innovative Properties Company | Article with gasket having moisture transmission resistivity and method |
JP5707110B2 (ja) * | 2010-11-26 | 2015-04-22 | デクセリアルズ株式会社 | 導電性接着材料、太陽電池モジュール及びその製造方法 |
FR3006493A1 (fr) * | 2013-06-04 | 2014-12-05 | Nexans | Cable electrique a moyenne ou haute tension |
CN104559892A (zh) * | 2014-11-17 | 2015-04-29 | 南京艾布纳密封技术有限公司 | 一种环氧树脂灌封胶及其制备方法 |
Family Cites Families (18)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3052650A (en) | 1953-03-27 | 1962-09-04 | Minnesota Mining & Mfg | Heat-curing epoxy resin compositions |
US2993920A (en) | 1958-09-23 | 1961-07-25 | Archer Daniels Midland Co | Resins and method of making the same |
DE1763034A1 (de) | 1968-03-26 | 1971-09-30 | Licentia Gmbh | Wicklungsisolation |
US4097449A (en) * | 1977-03-04 | 1978-06-27 | Gulf Oil Corporation | Handleable, thermosettable epoxide-polyanhydride compositions |
US5227243A (en) * | 1986-03-14 | 1993-07-13 | The Sherwin-Williams Company | Hydroxy addition polymer, anhydride addition polymer and cycloaliphatic polyepoxide |
DE8710581U1 (de) | 1987-08-01 | 1987-09-17 | Römer GmbH, 7910 Neu-Ulm | Schutzhelm u.a. für Arbeit oder Sport mit einer Gabelkinnberiemung |
JPH0725774B2 (ja) * | 1987-12-10 | 1995-03-22 | 日立化成工業株式会社 | 1―(2,3―ジカルボキシフエニル)―3―(3,4―ジカルボキシフエニル)―1,1,3,3―テトラメチルジシロキサン二無水物およびその製造方法 |
US5376403A (en) | 1990-02-09 | 1994-12-27 | Capote; Miguel A. | Electrically conductive compositions and methods for the preparation and use thereof |
US5128746A (en) | 1990-09-27 | 1992-07-07 | Motorola, Inc. | Adhesive and encapsulant material with fluxing properties |
JPH0520918A (ja) * | 1991-07-14 | 1993-01-29 | Sony Chem Corp | 導電ペースト |
KR19990036355A (ko) | 1995-08-11 | 1999-05-25 | 케네쓰 제이 커스텐 | 에폭시 수지 기재 땜납 페이스트 |
US5851311A (en) | 1996-03-29 | 1998-12-22 | Sophia Systems Co., Ltd. | Polymerizable flux composition for encapsulating the solder in situ |
US5985043A (en) | 1997-07-21 | 1999-11-16 | Miguel Albert Capote | Polymerizable fluxing agents and fluxing adhesive compositions therefrom |
US6288170B1 (en) | 1997-05-05 | 2001-09-11 | 3M Innovative Properties Company | Removable adhesive of polyepoxide, curing agent and microspheres |
US5985456A (en) | 1997-07-21 | 1999-11-16 | Miguel Albert Capote | Carboxyl-containing polyunsaturated fluxing adhesive for attaching integrated circuits |
US6017634A (en) | 1997-07-21 | 2000-01-25 | Miguel Albert Capote | Carboxyl-containing polyunsaturated fluxing agent and carboxyl-reactive neutralizing agent as adhesive |
US6103549A (en) | 1998-03-17 | 2000-08-15 | Advanced Micro Devices, Inc. | No clean flux for flip chip assembly |
US6971163B1 (en) | 1998-04-22 | 2005-12-06 | Dow Corning Corporation | Adhesive and encapsulating material with fluxing properties |
-
2001
- 2001-06-25 US US09/888,921 patent/US6528169B2/en not_active Expired - Lifetime
- 2001-06-29 CN CN01812253A patent/CN1449418A/zh active Pending
- 2001-06-29 AU AU2001271627A patent/AU2001271627A1/en not_active Abandoned
- 2001-06-29 DE DE2001605164 patent/DE60105164T2/de not_active Expired - Fee Related
- 2001-06-29 AT AT01950659T patent/ATE274539T1/de not_active IP Right Cessation
- 2001-06-29 JP JP2002509399A patent/JP2004502846A/ja active Pending
- 2001-06-29 EP EP20010950659 patent/EP1299447B1/en not_active Expired - Lifetime
- 2001-06-29 WO PCT/US2001/020734 patent/WO2002004541A2/en active IP Right Grant
Also Published As
Publication number | Publication date |
---|---|
CN1449418A (zh) | 2003-10-15 |
ATE274539T1 (de) | 2004-09-15 |
US20020032280A1 (en) | 2002-03-14 |
EP1299447B1 (en) | 2004-08-25 |
US6528169B2 (en) | 2003-03-04 |
EP1299447A2 (en) | 2003-04-09 |
JP2004502846A (ja) | 2004-01-29 |
DE60105164T2 (de) | 2005-09-08 |
WO2002004541A2 (en) | 2002-01-17 |
DE60105164D1 (de) | 2004-09-30 |
WO2002004541A3 (en) | 2002-06-06 |
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